Optoelectronic Device Integration and Packaging - Development of Packaging Technologies for High-Speed (>40 Gb-s) Optical Modules

Gespeichert in:

Autor*in:	Choi, K.-S. [verfasserIn] Kwon, Y.-H. Choe, J.-S. Chung, Y.-D. Kang, Y.-S. Kim, J. Ahn, B.-T. Moon, J.-T.

Format:	Artikel

Erschienen:	2006

Umfang:	8

Übergeordnetes Werk:	Enthalten in: IEEE journal of selected topics in quantum electronics - New York, NY : IEEE, 1995, 12(2006), 5, Seite 1017-1024
Übergeordnetes Werk:	volume:12 ; year:2006 ; number:5 ; pages:1017-1024 ; extent:8

Katalog-ID:	OLC1747065498

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spelling	sw061023 (DE-627)OLC1747065498 (DE-599)GBVOLC1747065498 DE-627 ger DE-627 rakwb 530 620 Choi, K.-S. verfasserin aut Optoelectronic Device Integration and Packaging - Development of Packaging Technologies for High-Speed (>40 Gb-s) Optical Modules 2006 8 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Kwon, Y.-H. oth Choe, J.-S. oth Chung, Y.-D. oth Kang, Y.-S. oth Kim, J. oth Ahn, B.-T. oth Moon, J.-T. oth Enthalten in IEEE journal of selected topics in quantum electronics New York, NY : IEEE, 1995 12(2006), 5, Seite 1017-1024 (DE-627)184666007 (DE-600)1232977-0 (DE-576)046708901 1077-260X nnns volume:12 year:2006 number:5 pages:1017-1024 extent:8 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_21 GBV_ILN_23 GBV_ILN_31 GBV_ILN_70 GBV_ILN_170 GBV_ILN_2006 GBV_ILN_2009 GBV_ILN_2014 GBV_ILN_2021 GBV_ILN_4266 GBV_ILN_4317 AR 12 2006 5 1017-1024 8
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allfieldsGer	sw061023 (DE-627)OLC1747065498 (DE-599)GBVOLC1747065498 DE-627 ger DE-627 rakwb 530 620 Choi, K.-S. verfasserin aut Optoelectronic Device Integration and Packaging - Development of Packaging Technologies for High-Speed (>40 Gb-s) Optical Modules 2006 8 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Kwon, Y.-H. oth Choe, J.-S. oth Chung, Y.-D. oth Kang, Y.-S. oth Kim, J. oth Ahn, B.-T. oth Moon, J.-T. oth Enthalten in IEEE journal of selected topics in quantum electronics New York, NY : IEEE, 1995 12(2006), 5, Seite 1017-1024 (DE-627)184666007 (DE-600)1232977-0 (DE-576)046708901 1077-260X nnns volume:12 year:2006 number:5 pages:1017-1024 extent:8 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_21 GBV_ILN_23 GBV_ILN_31 GBV_ILN_70 GBV_ILN_170 GBV_ILN_2006 GBV_ILN_2009 GBV_ILN_2014 GBV_ILN_2021 GBV_ILN_4266 GBV_ILN_4317 AR 12 2006 5 1017-1024 8
allfieldsSound	sw061023 (DE-627)OLC1747065498 (DE-599)GBVOLC1747065498 DE-627 ger DE-627 rakwb 530 620 Choi, K.-S. verfasserin aut Optoelectronic Device Integration and Packaging - Development of Packaging Technologies for High-Speed (>40 Gb-s) Optical Modules 2006 8 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Kwon, Y.-H. oth Choe, J.-S. oth Chung, Y.-D. oth Kang, Y.-S. oth Kim, J. oth Ahn, B.-T. oth Moon, J.-T. oth Enthalten in IEEE journal of selected topics in quantum electronics New York, NY : IEEE, 1995 12(2006), 5, Seite 1017-1024 (DE-627)184666007 (DE-600)1232977-0 (DE-576)046708901 1077-260X nnns volume:12 year:2006 number:5 pages:1017-1024 extent:8 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_21 GBV_ILN_23 GBV_ILN_31 GBV_ILN_70 GBV_ILN_170 GBV_ILN_2006 GBV_ILN_2009 GBV_ILN_2014 GBV_ILN_2021 GBV_ILN_4266 GBV_ILN_4317 AR 12 2006 5 1017-1024 8
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