Augmented Reality Aided Assembly Design and Planning

Gespeichert in:

Autor*in:	Ong, S.K. [verfasserIn] Pang, Y. Nee, A.Y.C.

Format:	Artikel

Erschienen:	2007

Umfang:	4

Übergeordnetes Werk:	Enthalten in: CIRP annals ... - Oxford : Elsevier, 1975, 56(2007), 1, Seite 49-52
Übergeordnetes Werk:	volume:56 ; year:2007 ; number:1 ; pages:49-52 ; extent:4

Katalog-ID:	OLC1772379409

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