The shearing behavior and microstructure of Sn–4Ag–0.5Cu solder joints on a Ni–P–carbon nanotubes composite coating

Gespeichert in:

Autor*in:	Gu, X. [verfasserIn] Chan, Y.C. Yang, D. Wu, B.Y.

Format:	Artikel

Erschienen:	2009

Umfang:	5

Übergeordnetes Werk:	Enthalten in: Journal of alloys and compounds - Lausanne : Elsevier Sequoia, 1991, 468(2009), 1, Seite 553-557
Übergeordnetes Werk:	volume:468 ; year:2009 ; number:1 ; pages:553-557 ; extent:5

Katalog-ID:	OLC1807294102

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