Effect of the evolution of phenol–formaldehyde resin on the high-temperature bonding

Gespeichert in:

Autor*in:	Wang, Jigang [verfasserIn] Jiang, Nan Jiang, Haiyun

Format:	Artikel

Erschienen:	2009

Umfang:	6

Übergeordnetes Werk:	Enthalten in: International journal of adhesion & adhesives - Oxford : Elsevier, 1980, 29(2009), 7, Seite 718-723
Übergeordnetes Werk:	volume:29 ; year:2009 ; number:7 ; pages:718-723 ; extent:6

Katalog-ID:	OLC1821487184

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