Study on Stiffness and Conditioning Effects of CMP Pad Based on Physical Die-Level CMP Model

Gespeichert in:

Autor*in:	Fan, W [verfasserIn] Boning, D Charns, L Miyauchi, H Tano, H Tsuji, S

Format:	Artikel

Erschienen:	2010

Systematik:	VA 4000

Übergeordnetes Werk:	Enthalten in: Journal of the Electrochemical Society - Pennington, NJ : Electrochemical Society, 1948, 157(2010), 5, Seite H526
Übergeordnetes Werk:	volume:157 ; year:2010 ; number:5 ; pages:H526

Katalog-ID:	OLC1842489666

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Study on Stiffness and Conditioning Effects of CMP Pad Based on Physical Die-Level CMP Model

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