Temperature insensitive bending sensor based on microbending FBG cladding mode recoupling

Gespeichert in:

Autor*in:	Sun, An [verfasserIn] Wu, Zhishen

Format:	Artikel

Erschienen:	2012

Umfang:	3

Übergeordnetes Werk:	Enthalten in: Microwave and optical technology letters - New York, NY [u.a.] : Wiley, 1988, 54(2012), 7 vom: Juli, Seite 1674-1677
Übergeordnetes Werk:	volume:54 ; year:2012 ; number:7 ; month:07 ; pages:1674-1677 ; extent:3

Katalog-ID:	OLC1893838013

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