Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits
Gespeichert in:
| Autor*in: |
Kamiya, Shoji [verfasserIn] |
|---|
| Format: |
Artikel |
|---|
| Erschienen: |
2013 |
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| Umfang: |
5 |
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| Übergeordnetes Werk: |
Enthalten in: Surface & coatings technology - Lausanne : Elsevier Sequoia, 1986, 215(2013) vom: 25. Jan., Seite 280-284 |
|---|---|
| Übergeordnetes Werk: |
volume:215 ; year:2013 ; day:25 ; month:01 ; pages:280-284 ; extent:5 |
| Katalog-ID: |
OLC191154652X |
|---|
| LEADER | 01000caa a22002652 4500 | ||
|---|---|---|---|
| 001 | OLC191154652X | ||
| 003 | DE-627 | ||
| 005 | 20220222230956.0 | ||
| 007 | tu | ||
| 008 | 130130s2013 xx ||||| 00| ||und c | ||
| 028 | 5 | 2 | |a sw130128_1 |
| 035 | |a (DE-627)OLC191154652X | ||
| 035 | |a (DE-599)GBVOLC191154652X | ||
| 040 | |a DE-627 |b ger |c DE-627 |e rakwb | ||
| 082 | 0 | 4 | |a 620 |a 670 |
| 084 | |a 52.78 |2 bkl | ||
| 084 | |a 51.20 |2 bkl | ||
| 100 | 1 | |a Kamiya, Shoji |e verfasserin |4 aut | |
| 245 | 1 | 0 | |a Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits |
| 264 | 1 | |c 2013 | |
| 300 | |a 5 | ||
| 336 | |a Text |b txt |2 rdacontent | ||
| 337 | |a ohne Hilfsmittel zu benutzen |b n |2 rdamedia | ||
| 338 | |a Band |b nc |2 rdacarrier | ||
| 700 | 1 | |a Shishido, Nobuyuki |4 oth | |
| 700 | 1 | |a Watanabe, Shinsuke |4 oth | |
| 700 | 1 | |a Sato, Hisashi |4 oth | |
| 700 | 1 | |a Koiwa, Kozo |4 oth | |
| 700 | 1 | |a Omiya, Masaki |4 oth | |
| 700 | 1 | |a Nishida, Masahiro |4 oth | |
| 700 | 1 | |a Suzuki, Takashi |4 oth | |
| 700 | 1 | |a Nakamura, Tomoji |4 oth | |
| 700 | 1 | |a Nokuo, Takeshi |4 oth | |
| 700 | 1 | |a Nagasawa, Tadahiro |4 oth | |
| 773 | 0 | 8 | |i Enthalten in |t Surface & coatings technology |d Lausanne : Elsevier Sequoia, 1986 |g 215(2013) vom: 25. Jan., Seite 280-284 |w (DE-627)129382892 |w (DE-600)165803-7 |w (DE-576)014769298 |x 0257-8972 |7 nnns |
| 773 | 1 | 8 | |g volume:215 |g year:2013 |g day:25 |g month:01 |g pages:280-284 |g extent:5 |
| 912 | |a GBV_USEFLAG_A | ||
| 912 | |a SYSFLAG_A | ||
| 912 | |a GBV_OLC | ||
| 912 | |a SSG-OLC-TEC | ||
| 912 | |a GBV_ILN_70 | ||
| 912 | |a GBV_ILN_2020 | ||
| 936 | b | k | |a 52.78 |q AVZ |
| 936 | b | k | |a 51.20 |q AVZ |
| 951 | |a AR | ||
| 952 | |d 215 |j 2013 |b 25 |c 1 |h 280-284 |g 5 | ||
| author_variant |
s k sk |
|---|---|
| matchkey_str |
article:02578972:2013----::risaedeinteghapnocpewrnsrcue |
| hierarchy_sort_str |
2013 |
| bklnumber |
52.78 51.20 |
| publishDate |
2013 |
| allfields |
sw130128_1 (DE-627)OLC191154652X (DE-599)GBVOLC191154652X DE-627 ger DE-627 rakwb 620 670 52.78 bkl 51.20 bkl Kamiya, Shoji verfasserin aut Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits 2013 5 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Shishido, Nobuyuki oth Watanabe, Shinsuke oth Sato, Hisashi oth Koiwa, Kozo oth Omiya, Masaki oth Nishida, Masahiro oth Suzuki, Takashi oth Nakamura, Tomoji oth Nokuo, Takeshi oth Nagasawa, Tadahiro oth Enthalten in Surface & coatings technology Lausanne : Elsevier Sequoia, 1986 215(2013) vom: 25. Jan., Seite 280-284 (DE-627)129382892 (DE-600)165803-7 (DE-576)014769298 0257-8972 nnns volume:215 year:2013 day:25 month:01 pages:280-284 extent:5 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 GBV_ILN_2020 52.78 AVZ 51.20 AVZ AR 215 2013 25 1 280-284 5 |
| spelling |
sw130128_1 (DE-627)OLC191154652X (DE-599)GBVOLC191154652X DE-627 ger DE-627 rakwb 620 670 52.78 bkl 51.20 bkl Kamiya, Shoji verfasserin aut Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits 2013 5 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Shishido, Nobuyuki oth Watanabe, Shinsuke oth Sato, Hisashi oth Koiwa, Kozo oth Omiya, Masaki oth Nishida, Masahiro oth Suzuki, Takashi oth Nakamura, Tomoji oth Nokuo, Takeshi oth Nagasawa, Tadahiro oth Enthalten in Surface & coatings technology Lausanne : Elsevier Sequoia, 1986 215(2013) vom: 25. Jan., Seite 280-284 (DE-627)129382892 (DE-600)165803-7 (DE-576)014769298 0257-8972 nnns volume:215 year:2013 day:25 month:01 pages:280-284 extent:5 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 GBV_ILN_2020 52.78 AVZ 51.20 AVZ AR 215 2013 25 1 280-284 5 |
| allfields_unstemmed |
sw130128_1 (DE-627)OLC191154652X (DE-599)GBVOLC191154652X DE-627 ger DE-627 rakwb 620 670 52.78 bkl 51.20 bkl Kamiya, Shoji verfasserin aut Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits 2013 5 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Shishido, Nobuyuki oth Watanabe, Shinsuke oth Sato, Hisashi oth Koiwa, Kozo oth Omiya, Masaki oth Nishida, Masahiro oth Suzuki, Takashi oth Nakamura, Tomoji oth Nokuo, Takeshi oth Nagasawa, Tadahiro oth Enthalten in Surface & coatings technology Lausanne : Elsevier Sequoia, 1986 215(2013) vom: 25. Jan., Seite 280-284 (DE-627)129382892 (DE-600)165803-7 (DE-576)014769298 0257-8972 nnns volume:215 year:2013 day:25 month:01 pages:280-284 extent:5 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 GBV_ILN_2020 52.78 AVZ 51.20 AVZ AR 215 2013 25 1 280-284 5 |
| allfieldsGer |
sw130128_1 (DE-627)OLC191154652X (DE-599)GBVOLC191154652X DE-627 ger DE-627 rakwb 620 670 52.78 bkl 51.20 bkl Kamiya, Shoji verfasserin aut Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits 2013 5 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Shishido, Nobuyuki oth Watanabe, Shinsuke oth Sato, Hisashi oth Koiwa, Kozo oth Omiya, Masaki oth Nishida, Masahiro oth Suzuki, Takashi oth Nakamura, Tomoji oth Nokuo, Takeshi oth Nagasawa, Tadahiro oth Enthalten in Surface & coatings technology Lausanne : Elsevier Sequoia, 1986 215(2013) vom: 25. Jan., Seite 280-284 (DE-627)129382892 (DE-600)165803-7 (DE-576)014769298 0257-8972 nnns volume:215 year:2013 day:25 month:01 pages:280-284 extent:5 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 GBV_ILN_2020 52.78 AVZ 51.20 AVZ AR 215 2013 25 1 280-284 5 |
| allfieldsSound |
sw130128_1 (DE-627)OLC191154652X (DE-599)GBVOLC191154652X DE-627 ger DE-627 rakwb 620 670 52.78 bkl 51.20 bkl Kamiya, Shoji verfasserin aut Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits 2013 5 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Shishido, Nobuyuki oth Watanabe, Shinsuke oth Sato, Hisashi oth Koiwa, Kozo oth Omiya, Masaki oth Nishida, Masahiro oth Suzuki, Takashi oth Nakamura, Tomoji oth Nokuo, Takeshi oth Nagasawa, Tadahiro oth Enthalten in Surface & coatings technology Lausanne : Elsevier Sequoia, 1986 215(2013) vom: 25. Jan., Seite 280-284 (DE-627)129382892 (DE-600)165803-7 (DE-576)014769298 0257-8972 nnns volume:215 year:2013 day:25 month:01 pages:280-284 extent:5 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 GBV_ILN_2020 52.78 AVZ 51.20 AVZ AR 215 2013 25 1 280-284 5 |
| source |
Enthalten in Surface & coatings technology 215(2013) vom: 25. Jan., Seite 280-284 volume:215 year:2013 day:25 month:01 pages:280-284 extent:5 |
| sourceStr |
Enthalten in Surface & coatings technology 215(2013) vom: 25. Jan., Seite 280-284 volume:215 year:2013 day:25 month:01 pages:280-284 extent:5 |
| format_phy_str_mv |
Article |
| institution |
findex.gbv.de |
| dewey-raw |
620 |
| isfreeaccess_bool |
false |
| container_title |
Surface & coatings technology |
| authorswithroles_txt_mv |
Kamiya, Shoji @@aut@@ Shishido, Nobuyuki @@oth@@ Watanabe, Shinsuke @@oth@@ Sato, Hisashi @@oth@@ Koiwa, Kozo @@oth@@ Omiya, Masaki @@oth@@ Nishida, Masahiro @@oth@@ Suzuki, Takashi @@oth@@ Nakamura, Tomoji @@oth@@ Nokuo, Takeshi @@oth@@ Nagasawa, Tadahiro @@oth@@ |
| publishDateDaySort_date |
2013-01-25T00:00:00Z |
| hierarchy_top_id |
129382892 |
| dewey-sort |
3620 |
| id |
OLC191154652X |
| fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">OLC191154652X</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20220222230956.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">130130s2013 xx ||||| 00| ||und c</controlfield><datafield tag="028" ind1="5" ind2="2"><subfield code="a">sw130128_1</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC191154652X</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)GBVOLC191154652X</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">620</subfield><subfield code="a">670</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">52.78</subfield><subfield code="2">bkl</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">51.20</subfield><subfield code="2">bkl</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Kamiya, Shoji</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2013</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">5</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Shishido, Nobuyuki</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Watanabe, Shinsuke</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Sato, Hisashi</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Koiwa, Kozo</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Omiya, Masaki</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Nishida, Masahiro</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Suzuki, Takashi</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Nakamura, Tomoji</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Nokuo, Takeshi</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Nagasawa, Tadahiro</subfield><subfield code="4">oth</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Surface & coatings technology</subfield><subfield code="d">Lausanne : Elsevier Sequoia, 1986</subfield><subfield code="g">215(2013) vom: 25. Jan., Seite 280-284</subfield><subfield code="w">(DE-627)129382892</subfield><subfield code="w">(DE-600)165803-7</subfield><subfield code="w">(DE-576)014769298</subfield><subfield code="x">0257-8972</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:215</subfield><subfield code="g">year:2013</subfield><subfield code="g">day:25</subfield><subfield code="g">month:01</subfield><subfield code="g">pages:280-284</subfield><subfield code="g">extent:5</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-TEC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2020</subfield></datafield><datafield tag="936" ind1="b" ind2="k"><subfield code="a">52.78</subfield><subfield code="q">AVZ</subfield></datafield><datafield tag="936" ind1="b" ind2="k"><subfield code="a">51.20</subfield><subfield code="q">AVZ</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">215</subfield><subfield code="j">2013</subfield><subfield code="b">25</subfield><subfield code="c">1</subfield><subfield code="h">280-284</subfield><subfield code="g">5</subfield></datafield></record></collection>
|
| author |
Kamiya, Shoji |
| spellingShingle |
Kamiya, Shoji ddc 620 bkl 52.78 bkl 51.20 Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits |
| authorStr |
Kamiya, Shoji |
| ppnlink_with_tag_str_mv |
@@773@@(DE-627)129382892 |
| format |
Article |
| dewey-ones |
620 - Engineering & allied operations 670 - Manufacturing |
| delete_txt_mv |
keep |
| author_role |
aut |
| collection |
OLC |
| remote_str |
false |
| illustrated |
Not Illustrated |
| issn |
0257-8972 |
| topic_title |
620 670 52.78 bkl 51.20 bkl Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits |
| topic |
ddc 620 bkl 52.78 bkl 51.20 |
| topic_unstemmed |
ddc 620 bkl 52.78 bkl 51.20 |
| topic_browse |
ddc 620 bkl 52.78 bkl 51.20 |
| format_facet |
Aufsätze Gedruckte Aufsätze |
| format_main_str_mv |
Text Zeitschrift/Artikel |
| carriertype_str_mv |
nc |
| author2_variant |
n s ns s w sw h s hs k k kk m o mo m n mn t s ts t n tn t n tn t n tn |
| hierarchy_parent_title |
Surface & coatings technology |
| hierarchy_parent_id |
129382892 |
| dewey-tens |
620 - Engineering 670 - Manufacturing |
| hierarchy_top_title |
Surface & coatings technology |
| isfreeaccess_txt |
false |
| familylinks_str_mv |
(DE-627)129382892 (DE-600)165803-7 (DE-576)014769298 |
| title |
Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits |
| ctrlnum |
(DE-627)OLC191154652X (DE-599)GBVOLC191154652X |
| title_full |
Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits |
| author_sort |
Kamiya, Shoji |
| journal |
Surface & coatings technology |
| journalStr |
Surface & coatings technology |
| isOA_bool |
false |
| dewey-hundreds |
600 - Technology |
| recordtype |
marc |
| publishDateSort |
2013 |
| contenttype_str_mv |
txt |
| container_start_page |
280 |
| author_browse |
Kamiya, Shoji |
| container_volume |
215 |
| physical |
5 |
| class |
620 670 52.78 bkl 51.20 bkl |
| format_se |
Aufsätze |
| author-letter |
Kamiya, Shoji |
| dewey-full |
620 670 |
| title_sort |
grain-scale adhesion strength mapping of copper wiring structures in integrated circuits |
| title_auth |
Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits |
| collection_details |
GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 GBV_ILN_2020 |
| title_short |
Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits |
| remote_bool |
false |
| author2 |
Shishido, Nobuyuki Watanabe, Shinsuke Sato, Hisashi Koiwa, Kozo Omiya, Masaki Nishida, Masahiro Suzuki, Takashi Nakamura, Tomoji Nokuo, Takeshi Nagasawa, Tadahiro |
| author2Str |
Shishido, Nobuyuki Watanabe, Shinsuke Sato, Hisashi Koiwa, Kozo Omiya, Masaki Nishida, Masahiro Suzuki, Takashi Nakamura, Tomoji Nokuo, Takeshi Nagasawa, Tadahiro |
| ppnlink |
129382892 |
| mediatype_str_mv |
n |
| isOA_txt |
false |
| hochschulschrift_bool |
false |
| author2_role |
oth oth oth oth oth oth oth oth oth oth |
| up_date |
2024-07-03T18:31:29.415Z |
| _version_ |
1803583739044823040 |
| fullrecord_marcxml |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">OLC191154652X</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20220222230956.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">130130s2013 xx ||||| 00| ||und c</controlfield><datafield tag="028" ind1="5" ind2="2"><subfield code="a">sw130128_1</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC191154652X</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)GBVOLC191154652X</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">620</subfield><subfield code="a">670</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">52.78</subfield><subfield code="2">bkl</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">51.20</subfield><subfield code="2">bkl</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Kamiya, Shoji</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Grain-scale adhesion strength mapping of copper wiring structures in integrated circuits</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2013</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">5</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Shishido, Nobuyuki</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Watanabe, Shinsuke</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Sato, Hisashi</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Koiwa, Kozo</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Omiya, Masaki</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Nishida, Masahiro</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Suzuki, Takashi</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Nakamura, Tomoji</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Nokuo, Takeshi</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Nagasawa, Tadahiro</subfield><subfield code="4">oth</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Surface & coatings technology</subfield><subfield code="d">Lausanne : Elsevier Sequoia, 1986</subfield><subfield code="g">215(2013) vom: 25. Jan., Seite 280-284</subfield><subfield code="w">(DE-627)129382892</subfield><subfield code="w">(DE-600)165803-7</subfield><subfield code="w">(DE-576)014769298</subfield><subfield code="x">0257-8972</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:215</subfield><subfield code="g">year:2013</subfield><subfield code="g">day:25</subfield><subfield code="g">month:01</subfield><subfield code="g">pages:280-284</subfield><subfield code="g">extent:5</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-TEC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2020</subfield></datafield><datafield tag="936" ind1="b" ind2="k"><subfield code="a">52.78</subfield><subfield code="q">AVZ</subfield></datafield><datafield tag="936" ind1="b" ind2="k"><subfield code="a">51.20</subfield><subfield code="q">AVZ</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">215</subfield><subfield code="j">2013</subfield><subfield code="b">25</subfield><subfield code="c">1</subfield><subfield code="h">280-284</subfield><subfield code="g">5</subfield></datafield></record></collection>
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| score |
7.3987713 |