Non-destructive detection methods for discontinuities of interconnection structures
Purpose – The purpose of this paper is to demonstrate the non-destructive methods for detection and localization of interconnection structure discontinuities based on the signal analysis in the frequency and time domain. Design/methodology/approach – The paper deals with the discontinuity characteri...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Blecha, Tomas [verfasserIn] |
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| Format: |
Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2016 |
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| Rechteinformationen: |
Nutzungsrecht: © Emerald Group Publishing Limited |
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| Schlagwörter: |
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| Übergeordnetes Werk: |
Enthalten in: Microelectronics international - Bradford : MCB Univ. Press, 1995, 33(2016), 1, Seite 23-35 |
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| Übergeordnetes Werk: |
volume:33 ; year:2016 ; number:1 ; pages:23-35 |
| Links: |
|---|
| DOI / URN: |
10.1108/MI-09-2014-0040 |
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OLC1971012939 |
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| 520 | |a Purpose – The purpose of this paper is to demonstrate the non-destructive methods for detection and localization of interconnection structure discontinuities based on the signal analysis in the frequency and time domain. Design/methodology/approach – The paper deals with the discontinuity characterization of interconnection structures created on substrates used for electronics, and methods for their detection and localization, based on the frequency analysis of transmitted signals. Used analyses are based on the theoretical approach for the solution of discontinuity electrical parameters and are the base for diagnostic methods of discontinuity identification. Findings – The measurement results of reflection parameters, frequency spectrums of transmitted signals and characteristic impedance values are presented on test samples containing multiple line cracks and their width reduction. Practical implications – Obtained results can be used practically, not only for the detection of transmission lines discontinuities on printed circuit boards but also in other applications, such as the quality assessment of bonded joints. Originality/value – Developed methods allow the quick identification and localization of particular discontinuities without the destruction of tested devices. | ||
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| 650 | 4 | |a Printed circuit boards | |
| 650 | 4 | |a Electronics industry | |
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10.1108/MI-09-2014-0040 doi PQ20160212 (DE-627)OLC1971012939 (DE-599)GBVOLC1971012939 (PRQ)e1208-34d3db1de4390647d51ef2069093d5c5ccc468575b1bb6739372c6e2cca8be640 (KEY)0123848520160000033000100023nondestructivedetectionmethodsfordiscontinuitiesof DE-627 ger DE-627 rakwb eng 620 DNB Blecha, Tomas verfasserin aut Non-destructive detection methods for discontinuities of interconnection structures 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Purpose – The purpose of this paper is to demonstrate the non-destructive methods for detection and localization of interconnection structure discontinuities based on the signal analysis in the frequency and time domain. Design/methodology/approach – The paper deals with the discontinuity characterization of interconnection structures created on substrates used for electronics, and methods for their detection and localization, based on the frequency analysis of transmitted signals. Used analyses are based on the theoretical approach for the solution of discontinuity electrical parameters and are the base for diagnostic methods of discontinuity identification. Findings – The measurement results of reflection parameters, frequency spectrums of transmitted signals and characteristic impedance values are presented on test samples containing multiple line cracks and their width reduction. Practical implications – Obtained results can be used practically, not only for the detection of transmission lines discontinuities on printed circuit boards but also in other applications, such as the quality assessment of bonded joints. Originality/value – Developed methods allow the quick identification and localization of particular discontinuities without the destruction of tested devices. Nutzungsrecht: © Emerald Group Publishing Limited Electrical & electronic engineering Engineering Microelectronics Screen printing Localization Printed circuit boards Electronics industry Enthalten in Microelectronics international Bradford : MCB Univ. Press, 1995 33(2016), 1, Seite 23-35 (DE-627)184669642 (DE-600)1233920-9 (DE-576)9184669640 1356-5362 nnns volume:33 year:2016 number:1 pages:23-35 http://dx.doi.org/10.1108/MI-09-2014-0040 Volltext http://search.proquest.com/docview/1754017998 GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 AR 33 2016 1 23-35 |
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Non-destructive detection methods for discontinuities of interconnection structures |
| abstract |
Purpose – The purpose of this paper is to demonstrate the non-destructive methods for detection and localization of interconnection structure discontinuities based on the signal analysis in the frequency and time domain. Design/methodology/approach – The paper deals with the discontinuity characterization of interconnection structures created on substrates used for electronics, and methods for their detection and localization, based on the frequency analysis of transmitted signals. Used analyses are based on the theoretical approach for the solution of discontinuity electrical parameters and are the base for diagnostic methods of discontinuity identification. Findings – The measurement results of reflection parameters, frequency spectrums of transmitted signals and characteristic impedance values are presented on test samples containing multiple line cracks and their width reduction. Practical implications – Obtained results can be used practically, not only for the detection of transmission lines discontinuities on printed circuit boards but also in other applications, such as the quality assessment of bonded joints. Originality/value – Developed methods allow the quick identification and localization of particular discontinuities without the destruction of tested devices. |
| abstractGer |
Purpose – The purpose of this paper is to demonstrate the non-destructive methods for detection and localization of interconnection structure discontinuities based on the signal analysis in the frequency and time domain. Design/methodology/approach – The paper deals with the discontinuity characterization of interconnection structures created on substrates used for electronics, and methods for their detection and localization, based on the frequency analysis of transmitted signals. Used analyses are based on the theoretical approach for the solution of discontinuity electrical parameters and are the base for diagnostic methods of discontinuity identification. Findings – The measurement results of reflection parameters, frequency spectrums of transmitted signals and characteristic impedance values are presented on test samples containing multiple line cracks and their width reduction. Practical implications – Obtained results can be used practically, not only for the detection of transmission lines discontinuities on printed circuit boards but also in other applications, such as the quality assessment of bonded joints. Originality/value – Developed methods allow the quick identification and localization of particular discontinuities without the destruction of tested devices. |
| abstract_unstemmed |
Purpose – The purpose of this paper is to demonstrate the non-destructive methods for detection and localization of interconnection structure discontinuities based on the signal analysis in the frequency and time domain. Design/methodology/approach – The paper deals with the discontinuity characterization of interconnection structures created on substrates used for electronics, and methods for their detection and localization, based on the frequency analysis of transmitted signals. Used analyses are based on the theoretical approach for the solution of discontinuity electrical parameters and are the base for diagnostic methods of discontinuity identification. Findings – The measurement results of reflection parameters, frequency spectrums of transmitted signals and characteristic impedance values are presented on test samples containing multiple line cracks and their width reduction. Practical implications – Obtained results can be used practically, not only for the detection of transmission lines discontinuities on printed circuit boards but also in other applications, such as the quality assessment of bonded joints. Originality/value – Developed methods allow the quick identification and localization of particular discontinuities without the destruction of tested devices. |
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Non-destructive detection methods for discontinuities of interconnection structures |
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http://dx.doi.org/10.1108/MI-09-2014-0040 http://search.proquest.com/docview/1754017998 |
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10.1108/MI-09-2014-0040 |
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2024-07-03T17:48:48.256Z |
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