Advanced thermal simulation of SiGe:C HBTs including back-end-of-line

Gespeichert in:

Autor*in:	d'Alessandro, Vincenzo [verfasserIn] Magnani, Alessandro Codecasa, Lorenzo Rinaldi, Niccolò Aufinger, Klaus

Format:	Artikel
Sprache:	Englisch

Erschienen:	2016

Übergeordnetes Werk:	Enthalten in: Microelectronics reliability - Amsterdam [u.a.] : Elsevier, 1964, (2016)
Übergeordnetes Werk:	year:2016

Links:	Volltext

DOI / URN:	10.1016/j.microrel.2016.06.005

Katalog-ID:	OLC1977236200

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allfieldsGer	10.1016/j.microrel.2016.06.005 doi PQ20160719 (DE-627)OLC1977236200 (DE-599)GBVOLC1977236200 (PRQ)crossref_primary_10_1016_j_microrel_2016_06_0050 (KEY)0027825420160000000000000000advancedthermalsimulationofsigechbtsincludingbacke DE-627 ger DE-627 rakwb eng 620 DNB 53.55 bkl 53.52 bkl 50.16 bkl d'Alessandro, Vincenzo verfasserin aut Advanced thermal simulation of SiGe:C HBTs including back-end-of-line 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier Magnani, Alessandro oth Codecasa, Lorenzo oth Rinaldi, Niccolò oth Aufinger, Klaus oth Enthalten in Microelectronics reliability Amsterdam [u.a.] : Elsevier, 1964 (2016) (DE-627)129596949 (DE-600)240853-3 (DE-576)015090116 0026-2714 nnns year:2016 http://dx.doi.org/10.1016/j.microrel.2016.06.005 Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 53.55 AVZ 53.52 AVZ 50.16 AVZ AR 2016
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