Patterned crack-free PZT thick films for micro-electromechanical system applications
Abstract The fabrication and structuring of multilayer-thick film piezoelectric (PZT-lead zirconate titanate) structures, using composite sol-gel techniques and wet etching is described. The composite sol-gel technique involves producing a PZT powder/sol composite slurry which when spun down, yields...
Ausführliche Beschreibung
Autor*in: |
Dauchy, F. [verfasserIn] |
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Artikel |
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Sprache: |
Englisch |
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2007 |
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Anmerkung: |
© Springer-Verlag London Limited 2007 |
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Übergeordnetes Werk: |
Enthalten in: The international journal of advanced manufacturing technology - Springer-Verlag, 1985, 33(2007), 1-2 vom: 16. März, Seite 86-94 |
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Übergeordnetes Werk: |
volume:33 ; year:2007 ; number:1-2 ; day:16 ; month:03 ; pages:86-94 |
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DOI / URN: |
10.1007/s00170-007-0968-1 |
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Katalog-ID: |
OLC2026012415 |
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10.1007/s00170-007-0968-1 doi (DE-627)OLC2026012415 (DE-He213)s00170-007-0968-1-p DE-627 ger DE-627 rakwb eng 670 VZ Dauchy, F. verfasserin aut Patterned crack-free PZT thick films for micro-electromechanical system applications 2007 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag London Limited 2007 Abstract The fabrication and structuring of multilayer-thick film piezoelectric (PZT-lead zirconate titanate) structures, using composite sol-gel techniques and wet etching is described. The composite sol-gel technique involves producing a PZT powder/sol composite slurry which when spun down, yields films a few micrometres thick. Repeated layering and infiltration has been used to produce PZT films between 10 and 40 μm thick. Due to the low firing temperature (<720°C), it has also been possible to produce PZT films with embedded thin (ca. 100 nm thick) metal electrodes. The PZT thick films have also been structured using a wet etching technique. Examples of features and cavities with lateral dimensions in the order of tens of micrometres are presented. The ability to fabricate and structure thick functional films with embedded metal electrode structures offers the possibility to create novel micro-device structures suitable for use in micro-electromechanical systems (MEMS). Sol gel Thick film MEMS Multilayer Dorey, R. A. aut Enthalten in The international journal of advanced manufacturing technology Springer-Verlag, 1985 33(2007), 1-2 vom: 16. März, Seite 86-94 (DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 0268-3768 nnns volume:33 year:2007 number:1-2 day:16 month:03 pages:86-94 https://doi.org/10.1007/s00170-007-0968-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_20 GBV_ILN_21 GBV_ILN_26 GBV_ILN_70 GBV_ILN_150 GBV_ILN_2006 GBV_ILN_2018 GBV_ILN_2241 GBV_ILN_2333 GBV_ILN_4046 GBV_ILN_4277 GBV_ILN_4307 AR 33 2007 1-2 16 03 86-94 |
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10.1007/s00170-007-0968-1 doi (DE-627)OLC2026012415 (DE-He213)s00170-007-0968-1-p DE-627 ger DE-627 rakwb eng 670 VZ Dauchy, F. verfasserin aut Patterned crack-free PZT thick films for micro-electromechanical system applications 2007 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag London Limited 2007 Abstract The fabrication and structuring of multilayer-thick film piezoelectric (PZT-lead zirconate titanate) structures, using composite sol-gel techniques and wet etching is described. The composite sol-gel technique involves producing a PZT powder/sol composite slurry which when spun down, yields films a few micrometres thick. Repeated layering and infiltration has been used to produce PZT films between 10 and 40 μm thick. Due to the low firing temperature (<720°C), it has also been possible to produce PZT films with embedded thin (ca. 100 nm thick) metal electrodes. The PZT thick films have also been structured using a wet etching technique. Examples of features and cavities with lateral dimensions in the order of tens of micrometres are presented. The ability to fabricate and structure thick functional films with embedded metal electrode structures offers the possibility to create novel micro-device structures suitable for use in micro-electromechanical systems (MEMS). Sol gel Thick film MEMS Multilayer Dorey, R. A. aut Enthalten in The international journal of advanced manufacturing technology Springer-Verlag, 1985 33(2007), 1-2 vom: 16. März, Seite 86-94 (DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 0268-3768 nnns volume:33 year:2007 number:1-2 day:16 month:03 pages:86-94 https://doi.org/10.1007/s00170-007-0968-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_20 GBV_ILN_21 GBV_ILN_26 GBV_ILN_70 GBV_ILN_150 GBV_ILN_2006 GBV_ILN_2018 GBV_ILN_2241 GBV_ILN_2333 GBV_ILN_4046 GBV_ILN_4277 GBV_ILN_4307 AR 33 2007 1-2 16 03 86-94 |
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10.1007/s00170-007-0968-1 doi (DE-627)OLC2026012415 (DE-He213)s00170-007-0968-1-p DE-627 ger DE-627 rakwb eng 670 VZ Dauchy, F. verfasserin aut Patterned crack-free PZT thick films for micro-electromechanical system applications 2007 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag London Limited 2007 Abstract The fabrication and structuring of multilayer-thick film piezoelectric (PZT-lead zirconate titanate) structures, using composite sol-gel techniques and wet etching is described. The composite sol-gel technique involves producing a PZT powder/sol composite slurry which when spun down, yields films a few micrometres thick. Repeated layering and infiltration has been used to produce PZT films between 10 and 40 μm thick. Due to the low firing temperature (<720°C), it has also been possible to produce PZT films with embedded thin (ca. 100 nm thick) metal electrodes. The PZT thick films have also been structured using a wet etching technique. Examples of features and cavities with lateral dimensions in the order of tens of micrometres are presented. The ability to fabricate and structure thick functional films with embedded metal electrode structures offers the possibility to create novel micro-device structures suitable for use in micro-electromechanical systems (MEMS). Sol gel Thick film MEMS Multilayer Dorey, R. A. aut Enthalten in The international journal of advanced manufacturing technology Springer-Verlag, 1985 33(2007), 1-2 vom: 16. März, Seite 86-94 (DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 0268-3768 nnns volume:33 year:2007 number:1-2 day:16 month:03 pages:86-94 https://doi.org/10.1007/s00170-007-0968-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_20 GBV_ILN_21 GBV_ILN_26 GBV_ILN_70 GBV_ILN_150 GBV_ILN_2006 GBV_ILN_2018 GBV_ILN_2241 GBV_ILN_2333 GBV_ILN_4046 GBV_ILN_4277 GBV_ILN_4307 AR 33 2007 1-2 16 03 86-94 |
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10.1007/s00170-007-0968-1 doi (DE-627)OLC2026012415 (DE-He213)s00170-007-0968-1-p DE-627 ger DE-627 rakwb eng 670 VZ Dauchy, F. verfasserin aut Patterned crack-free PZT thick films for micro-electromechanical system applications 2007 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag London Limited 2007 Abstract The fabrication and structuring of multilayer-thick film piezoelectric (PZT-lead zirconate titanate) structures, using composite sol-gel techniques and wet etching is described. The composite sol-gel technique involves producing a PZT powder/sol composite slurry which when spun down, yields films a few micrometres thick. Repeated layering and infiltration has been used to produce PZT films between 10 and 40 μm thick. Due to the low firing temperature (<720°C), it has also been possible to produce PZT films with embedded thin (ca. 100 nm thick) metal electrodes. The PZT thick films have also been structured using a wet etching technique. Examples of features and cavities with lateral dimensions in the order of tens of micrometres are presented. The ability to fabricate and structure thick functional films with embedded metal electrode structures offers the possibility to create novel micro-device structures suitable for use in micro-electromechanical systems (MEMS). Sol gel Thick film MEMS Multilayer Dorey, R. A. aut Enthalten in The international journal of advanced manufacturing technology Springer-Verlag, 1985 33(2007), 1-2 vom: 16. März, Seite 86-94 (DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 0268-3768 nnns volume:33 year:2007 number:1-2 day:16 month:03 pages:86-94 https://doi.org/10.1007/s00170-007-0968-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_20 GBV_ILN_21 GBV_ILN_26 GBV_ILN_70 GBV_ILN_150 GBV_ILN_2006 GBV_ILN_2018 GBV_ILN_2241 GBV_ILN_2333 GBV_ILN_4046 GBV_ILN_4277 GBV_ILN_4307 AR 33 2007 1-2 16 03 86-94 |
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10.1007/s00170-007-0968-1 doi (DE-627)OLC2026012415 (DE-He213)s00170-007-0968-1-p DE-627 ger DE-627 rakwb eng 670 VZ Dauchy, F. verfasserin aut Patterned crack-free PZT thick films for micro-electromechanical system applications 2007 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag London Limited 2007 Abstract The fabrication and structuring of multilayer-thick film piezoelectric (PZT-lead zirconate titanate) structures, using composite sol-gel techniques and wet etching is described. The composite sol-gel technique involves producing a PZT powder/sol composite slurry which when spun down, yields films a few micrometres thick. Repeated layering and infiltration has been used to produce PZT films between 10 and 40 μm thick. Due to the low firing temperature (<720°C), it has also been possible to produce PZT films with embedded thin (ca. 100 nm thick) metal electrodes. The PZT thick films have also been structured using a wet etching technique. Examples of features and cavities with lateral dimensions in the order of tens of micrometres are presented. The ability to fabricate and structure thick functional films with embedded metal electrode structures offers the possibility to create novel micro-device structures suitable for use in micro-electromechanical systems (MEMS). Sol gel Thick film MEMS Multilayer Dorey, R. A. aut Enthalten in The international journal of advanced manufacturing technology Springer-Verlag, 1985 33(2007), 1-2 vom: 16. März, Seite 86-94 (DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 0268-3768 nnns volume:33 year:2007 number:1-2 day:16 month:03 pages:86-94 https://doi.org/10.1007/s00170-007-0968-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_20 GBV_ILN_21 GBV_ILN_26 GBV_ILN_70 GBV_ILN_150 GBV_ILN_2006 GBV_ILN_2018 GBV_ILN_2241 GBV_ILN_2333 GBV_ILN_4046 GBV_ILN_4277 GBV_ILN_4307 AR 33 2007 1-2 16 03 86-94 |
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Abstract The fabrication and structuring of multilayer-thick film piezoelectric (PZT-lead zirconate titanate) structures, using composite sol-gel techniques and wet etching is described. The composite sol-gel technique involves producing a PZT powder/sol composite slurry which when spun down, yields films a few micrometres thick. Repeated layering and infiltration has been used to produce PZT films between 10 and 40 μm thick. Due to the low firing temperature (<720°C), it has also been possible to produce PZT films with embedded thin (ca. 100 nm thick) metal electrodes. The PZT thick films have also been structured using a wet etching technique. Examples of features and cavities with lateral dimensions in the order of tens of micrometres are presented. The ability to fabricate and structure thick functional films with embedded metal electrode structures offers the possibility to create novel micro-device structures suitable for use in micro-electromechanical systems (MEMS). © Springer-Verlag London Limited 2007 |
abstractGer |
Abstract The fabrication and structuring of multilayer-thick film piezoelectric (PZT-lead zirconate titanate) structures, using composite sol-gel techniques and wet etching is described. The composite sol-gel technique involves producing a PZT powder/sol composite slurry which when spun down, yields films a few micrometres thick. Repeated layering and infiltration has been used to produce PZT films between 10 and 40 μm thick. Due to the low firing temperature (<720°C), it has also been possible to produce PZT films with embedded thin (ca. 100 nm thick) metal electrodes. The PZT thick films have also been structured using a wet etching technique. Examples of features and cavities with lateral dimensions in the order of tens of micrometres are presented. The ability to fabricate and structure thick functional films with embedded metal electrode structures offers the possibility to create novel micro-device structures suitable for use in micro-electromechanical systems (MEMS). © Springer-Verlag London Limited 2007 |
abstract_unstemmed |
Abstract The fabrication and structuring of multilayer-thick film piezoelectric (PZT-lead zirconate titanate) structures, using composite sol-gel techniques and wet etching is described. The composite sol-gel technique involves producing a PZT powder/sol composite slurry which when spun down, yields films a few micrometres thick. Repeated layering and infiltration has been used to produce PZT films between 10 and 40 μm thick. Due to the low firing temperature (<720°C), it has also been possible to produce PZT films with embedded thin (ca. 100 nm thick) metal electrodes. The PZT thick films have also been structured using a wet etching technique. Examples of features and cavities with lateral dimensions in the order of tens of micrometres are presented. The ability to fabricate and structure thick functional films with embedded metal electrode structures offers the possibility to create novel micro-device structures suitable for use in micro-electromechanical systems (MEMS). © Springer-Verlag London Limited 2007 |
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title_short |
Patterned crack-free PZT thick films for micro-electromechanical system applications |
url |
https://doi.org/10.1007/s00170-007-0968-1 |
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Dorey, R. A. |
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up_date |
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