Multi-component microinjection moulding-trends and developments
Abstract With standard microinjection moulding becoming more and more established in practical manufacturing, special variants are attracting increasing attention. Especially, the approaches on multi-component microinjection moulding are worth mentioning: As handling and assembly are difficult proce...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Piotter, V. [verfasserIn] |
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| Format: |
Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2009 |
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| Schlagwörter: |
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| Anmerkung: |
© Springer-Verlag London Limited 2009 |
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| Übergeordnetes Werk: |
Enthalten in: The international journal of advanced manufacturing technology - Springer-Verlag, 1985, 47(2009), 1-4 vom: 05. März, Seite 63-71 |
|---|---|
| Übergeordnetes Werk: |
volume:47 ; year:2009 ; number:1-4 ; day:05 ; month:03 ; pages:63-71 |
| Links: |
|---|
| DOI / URN: |
10.1007/s00170-009-1985-z |
|---|
| Katalog-ID: |
OLC2026027005 |
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| 520 | |a Abstract With standard microinjection moulding becoming more and more established in practical manufacturing, special variants are attracting increasing attention. Especially, the approaches on multi-component microinjection moulding are worth mentioning: As handling and assembly are difficult procedures especially in microtechnology, methods to reduce mounting efforts are of high economic importance. By merging of shaping and mounting procedures in one step, economic progress as well as new material combinations can be obtained. An interesting approach for the fabrication of metal (or in principal, ceramic) microcomponents is the combination of insert injection moulding and metal deposition by electroforming. First, an electrically conductive base plate is produced by injection moulding of conductively filled polymers. In a second injection moulding step, microstructures consisting of insulating plastics are mounted on these plates. The quasi-infinite conductivity gradient allows controlled electroplating starting at the base plate only so that defect-free metal microcomponents can be achieved. As a further variant of microinjection moulding, the development of the so-called MicroPIM process facilitates a large-scale series fabrication technology for metal and ceramic microcomponents. Combined with multi-component technology, an interesting new approach for micromanufacturing is obtained, i.e. the realisation of magnetic/non-magnetic or conductive/non-conductive material combinations by two-component MicroPIM. But, also the combination of different mechanical properties like hard/tough pairings is possible. | ||
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10.1007/s00170-009-1985-z doi (DE-627)OLC2026027005 (DE-He213)s00170-009-1985-z-p DE-627 ger DE-627 rakwb eng 670 VZ Piotter, V. verfasserin aut Multi-component microinjection moulding-trends and developments 2009 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag London Limited 2009 Abstract With standard microinjection moulding becoming more and more established in practical manufacturing, special variants are attracting increasing attention. Especially, the approaches on multi-component microinjection moulding are worth mentioning: As handling and assembly are difficult procedures especially in microtechnology, methods to reduce mounting efforts are of high economic importance. By merging of shaping and mounting procedures in one step, economic progress as well as new material combinations can be obtained. An interesting approach for the fabrication of metal (or in principal, ceramic) microcomponents is the combination of insert injection moulding and metal deposition by electroforming. First, an electrically conductive base plate is produced by injection moulding of conductively filled polymers. In a second injection moulding step, microstructures consisting of insulating plastics are mounted on these plates. The quasi-infinite conductivity gradient allows controlled electroplating starting at the base plate only so that defect-free metal microcomponents can be achieved. As a further variant of microinjection moulding, the development of the so-called MicroPIM process facilitates a large-scale series fabrication technology for metal and ceramic microcomponents. Combined with multi-component technology, an interesting new approach for micromanufacturing is obtained, i.e. the realisation of magnetic/non-magnetic or conductive/non-conductive material combinations by two-component MicroPIM. But, also the combination of different mechanical properties like hard/tough pairings is possible. Microinjection moulding Two-component injection moulding Powder injection moulding Electroplating Galvanoforming Prokop, J. aut Ritzhaupt-Kleissl, H.-J. aut Ruh, A. aut Hausselt, J. aut Enthalten in The international journal of advanced manufacturing technology Springer-Verlag, 1985 47(2009), 1-4 vom: 05. März, Seite 63-71 (DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 0268-3768 nnns volume:47 year:2009 number:1-4 day:05 month:03 pages:63-71 https://doi.org/10.1007/s00170-009-1985-z lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_20 GBV_ILN_21 GBV_ILN_70 GBV_ILN_150 GBV_ILN_2006 GBV_ILN_2018 GBV_ILN_2241 GBV_ILN_2333 GBV_ILN_4046 GBV_ILN_4277 GBV_ILN_4307 AR 47 2009 1-4 05 03 63-71 |
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10.1007/s00170-009-1985-z doi (DE-627)OLC2026027005 (DE-He213)s00170-009-1985-z-p DE-627 ger DE-627 rakwb eng 670 VZ Piotter, V. verfasserin aut Multi-component microinjection moulding-trends and developments 2009 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag London Limited 2009 Abstract With standard microinjection moulding becoming more and more established in practical manufacturing, special variants are attracting increasing attention. Especially, the approaches on multi-component microinjection moulding are worth mentioning: As handling and assembly are difficult procedures especially in microtechnology, methods to reduce mounting efforts are of high economic importance. By merging of shaping and mounting procedures in one step, economic progress as well as new material combinations can be obtained. An interesting approach for the fabrication of metal (or in principal, ceramic) microcomponents is the combination of insert injection moulding and metal deposition by electroforming. First, an electrically conductive base plate is produced by injection moulding of conductively filled polymers. In a second injection moulding step, microstructures consisting of insulating plastics are mounted on these plates. The quasi-infinite conductivity gradient allows controlled electroplating starting at the base plate only so that defect-free metal microcomponents can be achieved. As a further variant of microinjection moulding, the development of the so-called MicroPIM process facilitates a large-scale series fabrication technology for metal and ceramic microcomponents. Combined with multi-component technology, an interesting new approach for micromanufacturing is obtained, i.e. the realisation of magnetic/non-magnetic or conductive/non-conductive material combinations by two-component MicroPIM. But, also the combination of different mechanical properties like hard/tough pairings is possible. Microinjection moulding Two-component injection moulding Powder injection moulding Electroplating Galvanoforming Prokop, J. aut Ritzhaupt-Kleissl, H.-J. aut Ruh, A. aut Hausselt, J. aut Enthalten in The international journal of advanced manufacturing technology Springer-Verlag, 1985 47(2009), 1-4 vom: 05. März, Seite 63-71 (DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 0268-3768 nnns volume:47 year:2009 number:1-4 day:05 month:03 pages:63-71 https://doi.org/10.1007/s00170-009-1985-z lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_20 GBV_ILN_21 GBV_ILN_70 GBV_ILN_150 GBV_ILN_2006 GBV_ILN_2018 GBV_ILN_2241 GBV_ILN_2333 GBV_ILN_4046 GBV_ILN_4277 GBV_ILN_4307 AR 47 2009 1-4 05 03 63-71 |
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10.1007/s00170-009-1985-z doi (DE-627)OLC2026027005 (DE-He213)s00170-009-1985-z-p DE-627 ger DE-627 rakwb eng 670 VZ Piotter, V. verfasserin aut Multi-component microinjection moulding-trends and developments 2009 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag London Limited 2009 Abstract With standard microinjection moulding becoming more and more established in practical manufacturing, special variants are attracting increasing attention. Especially, the approaches on multi-component microinjection moulding are worth mentioning: As handling and assembly are difficult procedures especially in microtechnology, methods to reduce mounting efforts are of high economic importance. By merging of shaping and mounting procedures in one step, economic progress as well as new material combinations can be obtained. An interesting approach for the fabrication of metal (or in principal, ceramic) microcomponents is the combination of insert injection moulding and metal deposition by electroforming. First, an electrically conductive base plate is produced by injection moulding of conductively filled polymers. In a second injection moulding step, microstructures consisting of insulating plastics are mounted on these plates. The quasi-infinite conductivity gradient allows controlled electroplating starting at the base plate only so that defect-free metal microcomponents can be achieved. As a further variant of microinjection moulding, the development of the so-called MicroPIM process facilitates a large-scale series fabrication technology for metal and ceramic microcomponents. Combined with multi-component technology, an interesting new approach for micromanufacturing is obtained, i.e. the realisation of magnetic/non-magnetic or conductive/non-conductive material combinations by two-component MicroPIM. But, also the combination of different mechanical properties like hard/tough pairings is possible. Microinjection moulding Two-component injection moulding Powder injection moulding Electroplating Galvanoforming Prokop, J. aut Ritzhaupt-Kleissl, H.-J. aut Ruh, A. aut Hausselt, J. aut Enthalten in The international journal of advanced manufacturing technology Springer-Verlag, 1985 47(2009), 1-4 vom: 05. März, Seite 63-71 (DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 0268-3768 nnns volume:47 year:2009 number:1-4 day:05 month:03 pages:63-71 https://doi.org/10.1007/s00170-009-1985-z lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_20 GBV_ILN_21 GBV_ILN_70 GBV_ILN_150 GBV_ILN_2006 GBV_ILN_2018 GBV_ILN_2241 GBV_ILN_2333 GBV_ILN_4046 GBV_ILN_4277 GBV_ILN_4307 AR 47 2009 1-4 05 03 63-71 |
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10.1007/s00170-009-1985-z doi (DE-627)OLC2026027005 (DE-He213)s00170-009-1985-z-p DE-627 ger DE-627 rakwb eng 670 VZ Piotter, V. verfasserin aut Multi-component microinjection moulding-trends and developments 2009 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag London Limited 2009 Abstract With standard microinjection moulding becoming more and more established in practical manufacturing, special variants are attracting increasing attention. Especially, the approaches on multi-component microinjection moulding are worth mentioning: As handling and assembly are difficult procedures especially in microtechnology, methods to reduce mounting efforts are of high economic importance. By merging of shaping and mounting procedures in one step, economic progress as well as new material combinations can be obtained. An interesting approach for the fabrication of metal (or in principal, ceramic) microcomponents is the combination of insert injection moulding and metal deposition by electroforming. First, an electrically conductive base plate is produced by injection moulding of conductively filled polymers. In a second injection moulding step, microstructures consisting of insulating plastics are mounted on these plates. The quasi-infinite conductivity gradient allows controlled electroplating starting at the base plate only so that defect-free metal microcomponents can be achieved. As a further variant of microinjection moulding, the development of the so-called MicroPIM process facilitates a large-scale series fabrication technology for metal and ceramic microcomponents. Combined with multi-component technology, an interesting new approach for micromanufacturing is obtained, i.e. the realisation of magnetic/non-magnetic or conductive/non-conductive material combinations by two-component MicroPIM. But, also the combination of different mechanical properties like hard/tough pairings is possible. Microinjection moulding Two-component injection moulding Powder injection moulding Electroplating Galvanoforming Prokop, J. aut Ritzhaupt-Kleissl, H.-J. aut Ruh, A. aut Hausselt, J. aut Enthalten in The international journal of advanced manufacturing technology Springer-Verlag, 1985 47(2009), 1-4 vom: 05. März, Seite 63-71 (DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 0268-3768 nnns volume:47 year:2009 number:1-4 day:05 month:03 pages:63-71 https://doi.org/10.1007/s00170-009-1985-z lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_20 GBV_ILN_21 GBV_ILN_70 GBV_ILN_150 GBV_ILN_2006 GBV_ILN_2018 GBV_ILN_2241 GBV_ILN_2333 GBV_ILN_4046 GBV_ILN_4277 GBV_ILN_4307 AR 47 2009 1-4 05 03 63-71 |
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10.1007/s00170-009-1985-z doi (DE-627)OLC2026027005 (DE-He213)s00170-009-1985-z-p DE-627 ger DE-627 rakwb eng 670 VZ Piotter, V. verfasserin aut Multi-component microinjection moulding-trends and developments 2009 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag London Limited 2009 Abstract With standard microinjection moulding becoming more and more established in practical manufacturing, special variants are attracting increasing attention. Especially, the approaches on multi-component microinjection moulding are worth mentioning: As handling and assembly are difficult procedures especially in microtechnology, methods to reduce mounting efforts are of high economic importance. By merging of shaping and mounting procedures in one step, economic progress as well as new material combinations can be obtained. An interesting approach for the fabrication of metal (or in principal, ceramic) microcomponents is the combination of insert injection moulding and metal deposition by electroforming. First, an electrically conductive base plate is produced by injection moulding of conductively filled polymers. In a second injection moulding step, microstructures consisting of insulating plastics are mounted on these plates. The quasi-infinite conductivity gradient allows controlled electroplating starting at the base plate only so that defect-free metal microcomponents can be achieved. As a further variant of microinjection moulding, the development of the so-called MicroPIM process facilitates a large-scale series fabrication technology for metal and ceramic microcomponents. Combined with multi-component technology, an interesting new approach for micromanufacturing is obtained, i.e. the realisation of magnetic/non-magnetic or conductive/non-conductive material combinations by two-component MicroPIM. But, also the combination of different mechanical properties like hard/tough pairings is possible. Microinjection moulding Two-component injection moulding Powder injection moulding Electroplating Galvanoforming Prokop, J. aut Ritzhaupt-Kleissl, H.-J. aut Ruh, A. aut Hausselt, J. aut Enthalten in The international journal of advanced manufacturing technology Springer-Verlag, 1985 47(2009), 1-4 vom: 05. März, Seite 63-71 (DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 0268-3768 nnns volume:47 year:2009 number:1-4 day:05 month:03 pages:63-71 https://doi.org/10.1007/s00170-009-1985-z lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_20 GBV_ILN_21 GBV_ILN_70 GBV_ILN_150 GBV_ILN_2006 GBV_ILN_2018 GBV_ILN_2241 GBV_ILN_2333 GBV_ILN_4046 GBV_ILN_4277 GBV_ILN_4307 AR 47 2009 1-4 05 03 63-71 |
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ddc 670 misc Microinjection moulding misc Two-component injection moulding misc Powder injection moulding misc Electroplating misc Galvanoforming |
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ddc 670 misc Microinjection moulding misc Two-component injection moulding misc Powder injection moulding misc Electroplating misc Galvanoforming |
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Multi-component microinjection moulding-trends and developments |
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Multi-component microinjection moulding-trends and developments |
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Piotter, V. |
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The international journal of advanced manufacturing technology |
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Piotter, V. Prokop, J. Ritzhaupt-Kleissl, H.-J. Ruh, A. Hausselt, J. |
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multi-component microinjection moulding-trends and developments |
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Multi-component microinjection moulding-trends and developments |
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Abstract With standard microinjection moulding becoming more and more established in practical manufacturing, special variants are attracting increasing attention. Especially, the approaches on multi-component microinjection moulding are worth mentioning: As handling and assembly are difficult procedures especially in microtechnology, methods to reduce mounting efforts are of high economic importance. By merging of shaping and mounting procedures in one step, economic progress as well as new material combinations can be obtained. An interesting approach for the fabrication of metal (or in principal, ceramic) microcomponents is the combination of insert injection moulding and metal deposition by electroforming. First, an electrically conductive base plate is produced by injection moulding of conductively filled polymers. In a second injection moulding step, microstructures consisting of insulating plastics are mounted on these plates. The quasi-infinite conductivity gradient allows controlled electroplating starting at the base plate only so that defect-free metal microcomponents can be achieved. As a further variant of microinjection moulding, the development of the so-called MicroPIM process facilitates a large-scale series fabrication technology for metal and ceramic microcomponents. Combined with multi-component technology, an interesting new approach for micromanufacturing is obtained, i.e. the realisation of magnetic/non-magnetic or conductive/non-conductive material combinations by two-component MicroPIM. But, also the combination of different mechanical properties like hard/tough pairings is possible. © Springer-Verlag London Limited 2009 |
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Abstract With standard microinjection moulding becoming more and more established in practical manufacturing, special variants are attracting increasing attention. Especially, the approaches on multi-component microinjection moulding are worth mentioning: As handling and assembly are difficult procedures especially in microtechnology, methods to reduce mounting efforts are of high economic importance. By merging of shaping and mounting procedures in one step, economic progress as well as new material combinations can be obtained. An interesting approach for the fabrication of metal (or in principal, ceramic) microcomponents is the combination of insert injection moulding and metal deposition by electroforming. First, an electrically conductive base plate is produced by injection moulding of conductively filled polymers. In a second injection moulding step, microstructures consisting of insulating plastics are mounted on these plates. The quasi-infinite conductivity gradient allows controlled electroplating starting at the base plate only so that defect-free metal microcomponents can be achieved. As a further variant of microinjection moulding, the development of the so-called MicroPIM process facilitates a large-scale series fabrication technology for metal and ceramic microcomponents. Combined with multi-component technology, an interesting new approach for micromanufacturing is obtained, i.e. the realisation of magnetic/non-magnetic or conductive/non-conductive material combinations by two-component MicroPIM. But, also the combination of different mechanical properties like hard/tough pairings is possible. © Springer-Verlag London Limited 2009 |
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Abstract With standard microinjection moulding becoming more and more established in practical manufacturing, special variants are attracting increasing attention. Especially, the approaches on multi-component microinjection moulding are worth mentioning: As handling and assembly are difficult procedures especially in microtechnology, methods to reduce mounting efforts are of high economic importance. By merging of shaping and mounting procedures in one step, economic progress as well as new material combinations can be obtained. An interesting approach for the fabrication of metal (or in principal, ceramic) microcomponents is the combination of insert injection moulding and metal deposition by electroforming. First, an electrically conductive base plate is produced by injection moulding of conductively filled polymers. In a second injection moulding step, microstructures consisting of insulating plastics are mounted on these plates. The quasi-infinite conductivity gradient allows controlled electroplating starting at the base plate only so that defect-free metal microcomponents can be achieved. As a further variant of microinjection moulding, the development of the so-called MicroPIM process facilitates a large-scale series fabrication technology for metal and ceramic microcomponents. Combined with multi-component technology, an interesting new approach for micromanufacturing is obtained, i.e. the realisation of magnetic/non-magnetic or conductive/non-conductive material combinations by two-component MicroPIM. But, also the combination of different mechanical properties like hard/tough pairings is possible. © Springer-Verlag London Limited 2009 |
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