Development of a brazed diamond wire for slicing single-crystal SiC ingots
Abstract Fixed abrasive wires, electroplated wire saws, and resinoid wire saws are widely used to slice brittle materials. However, poor wear resistance becomes a crucial issue when these tools are used in hard brittle materials, such as single-crystal silicon carbide (SiC). This problem was address...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
He, Zhaobin [verfasserIn] |
|---|
| Format: |
Artikel |
|---|---|
| Sprache: |
Englisch |
| Erschienen: |
2016 |
|---|
| Schlagwörter: |
|---|
| Anmerkung: |
© Springer-Verlag London 2016 |
|---|
| Übergeordnetes Werk: |
Enthalten in: The international journal of advanced manufacturing technology - Springer London, 1985, 91(2016), 1-4 vom: 18. Nov., Seite 189-199 |
|---|---|
| Übergeordnetes Werk: |
volume:91 ; year:2016 ; number:1-4 ; day:18 ; month:11 ; pages:189-199 |
| Links: |
|---|
| DOI / URN: |
10.1007/s00170-016-9750-6 |
|---|
| Katalog-ID: |
OLC2026101124 |
|---|
| LEADER | 01000caa a22002652 4500 | ||
|---|---|---|---|
| 001 | OLC2026101124 | ||
| 003 | DE-627 | ||
| 005 | 20230323141228.0 | ||
| 007 | tu | ||
| 008 | 200820s2016 xx ||||| 00| ||eng c | ||
| 024 | 7 | |a 10.1007/s00170-016-9750-6 |2 doi | |
| 035 | |a (DE-627)OLC2026101124 | ||
| 035 | |a (DE-He213)s00170-016-9750-6-p | ||
| 040 | |a DE-627 |b ger |c DE-627 |e rakwb | ||
| 041 | |a eng | ||
| 082 | 0 | 4 | |a 670 |q VZ |
| 100 | 1 | |a He, Zhaobin |e verfasserin |4 aut | |
| 245 | 1 | 0 | |a Development of a brazed diamond wire for slicing single-crystal SiC ingots |
| 264 | 1 | |c 2016 | |
| 336 | |a Text |b txt |2 rdacontent | ||
| 337 | |a ohne Hilfsmittel zu benutzen |b n |2 rdamedia | ||
| 338 | |a Band |b nc |2 rdacarrier | ||
| 500 | |a © Springer-Verlag London 2016 | ||
| 520 | |a Abstract Fixed abrasive wires, electroplated wire saws, and resinoid wire saws are widely used to slice brittle materials. However, poor wear resistance becomes a crucial issue when these tools are used in hard brittle materials, such as single-crystal silicon carbide (SiC). This problem was addressed in this study through the development of brazed diamond wires. The production method and the slicing performance of brazed diamond wire were systematically investigated. A complete wire manufacturing line was developed to fabricate brazed diamond wire. Effect of brazing temperature on diamond grain graphitization damage was experimentally researched. The results indicated that the diamond grain graphitization damage was weakened or avoided with the optimized brazing temperature and holding time. Effect of brazing temperature on core wire mechanical property was evaluated by tensile strength, breaking twist strength, and repeated bending strength. Long brazed diamond wires were produced with optimized produce parameters for various brazing alloys. Sawing experiments on single-crystal SiC reveal that the slicing ability and slicing efficiency of the self-made brazed wire saws were better than those of commercial electroplated wire saws. | ||
| 650 | 4 | |a Brazed | |
| 650 | 4 | |a Diamond | |
| 650 | 4 | |a Wire | |
| 650 | 4 | |a Saws, single-crystal | |
| 650 | 4 | |a SiC | |
| 700 | 1 | |a Huang, Hui |4 aut | |
| 700 | 1 | |a Yin, Fang |4 aut | |
| 700 | 1 | |a Xu, Xipeng |4 aut | |
| 773 | 0 | 8 | |i Enthalten in |t The international journal of advanced manufacturing technology |d Springer London, 1985 |g 91(2016), 1-4 vom: 18. Nov., Seite 189-199 |w (DE-627)129185299 |w (DE-600)52651-4 |w (DE-576)014456192 |x 0268-3768 |7 nnns |
| 773 | 1 | 8 | |g volume:91 |g year:2016 |g number:1-4 |g day:18 |g month:11 |g pages:189-199 |
| 856 | 4 | 1 | |u https://doi.org/10.1007/s00170-016-9750-6 |z lizenzpflichtig |3 Volltext |
| 912 | |a GBV_USEFLAG_A | ||
| 912 | |a SYSFLAG_A | ||
| 912 | |a GBV_OLC | ||
| 912 | |a SSG-OLC-TEC | ||
| 912 | |a GBV_ILN_70 | ||
| 912 | |a GBV_ILN_2018 | ||
| 912 | |a GBV_ILN_2333 | ||
| 951 | |a AR | ||
| 952 | |d 91 |j 2016 |e 1-4 |b 18 |c 11 |h 189-199 | ||
| author_variant |
z h zh h h hh f y fy x x xx |
|---|---|
| matchkey_str |
article:02683768:2016----::eeomnoarzdimnwrfrlcnsn |
| hierarchy_sort_str |
2016 |
| publishDate |
2016 |
| allfields |
10.1007/s00170-016-9750-6 doi (DE-627)OLC2026101124 (DE-He213)s00170-016-9750-6-p DE-627 ger DE-627 rakwb eng 670 VZ He, Zhaobin verfasserin aut Development of a brazed diamond wire for slicing single-crystal SiC ingots 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag London 2016 Abstract Fixed abrasive wires, electroplated wire saws, and resinoid wire saws are widely used to slice brittle materials. However, poor wear resistance becomes a crucial issue when these tools are used in hard brittle materials, such as single-crystal silicon carbide (SiC). This problem was addressed in this study through the development of brazed diamond wires. The production method and the slicing performance of brazed diamond wire were systematically investigated. A complete wire manufacturing line was developed to fabricate brazed diamond wire. Effect of brazing temperature on diamond grain graphitization damage was experimentally researched. The results indicated that the diamond grain graphitization damage was weakened or avoided with the optimized brazing temperature and holding time. Effect of brazing temperature on core wire mechanical property was evaluated by tensile strength, breaking twist strength, and repeated bending strength. Long brazed diamond wires were produced with optimized produce parameters for various brazing alloys. Sawing experiments on single-crystal SiC reveal that the slicing ability and slicing efficiency of the self-made brazed wire saws were better than those of commercial electroplated wire saws. Brazed Diamond Wire Saws, single-crystal SiC Huang, Hui aut Yin, Fang aut Xu, Xipeng aut Enthalten in The international journal of advanced manufacturing technology Springer London, 1985 91(2016), 1-4 vom: 18. Nov., Seite 189-199 (DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 0268-3768 nnns volume:91 year:2016 number:1-4 day:18 month:11 pages:189-199 https://doi.org/10.1007/s00170-016-9750-6 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 GBV_ILN_2018 GBV_ILN_2333 AR 91 2016 1-4 18 11 189-199 |
| spelling |
10.1007/s00170-016-9750-6 doi (DE-627)OLC2026101124 (DE-He213)s00170-016-9750-6-p DE-627 ger DE-627 rakwb eng 670 VZ He, Zhaobin verfasserin aut Development of a brazed diamond wire for slicing single-crystal SiC ingots 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag London 2016 Abstract Fixed abrasive wires, electroplated wire saws, and resinoid wire saws are widely used to slice brittle materials. However, poor wear resistance becomes a crucial issue when these tools are used in hard brittle materials, such as single-crystal silicon carbide (SiC). This problem was addressed in this study through the development of brazed diamond wires. The production method and the slicing performance of brazed diamond wire were systematically investigated. A complete wire manufacturing line was developed to fabricate brazed diamond wire. Effect of brazing temperature on diamond grain graphitization damage was experimentally researched. The results indicated that the diamond grain graphitization damage was weakened or avoided with the optimized brazing temperature and holding time. Effect of brazing temperature on core wire mechanical property was evaluated by tensile strength, breaking twist strength, and repeated bending strength. Long brazed diamond wires were produced with optimized produce parameters for various brazing alloys. Sawing experiments on single-crystal SiC reveal that the slicing ability and slicing efficiency of the self-made brazed wire saws were better than those of commercial electroplated wire saws. Brazed Diamond Wire Saws, single-crystal SiC Huang, Hui aut Yin, Fang aut Xu, Xipeng aut Enthalten in The international journal of advanced manufacturing technology Springer London, 1985 91(2016), 1-4 vom: 18. Nov., Seite 189-199 (DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 0268-3768 nnns volume:91 year:2016 number:1-4 day:18 month:11 pages:189-199 https://doi.org/10.1007/s00170-016-9750-6 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 GBV_ILN_2018 GBV_ILN_2333 AR 91 2016 1-4 18 11 189-199 |
| allfields_unstemmed |
10.1007/s00170-016-9750-6 doi (DE-627)OLC2026101124 (DE-He213)s00170-016-9750-6-p DE-627 ger DE-627 rakwb eng 670 VZ He, Zhaobin verfasserin aut Development of a brazed diamond wire for slicing single-crystal SiC ingots 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag London 2016 Abstract Fixed abrasive wires, electroplated wire saws, and resinoid wire saws are widely used to slice brittle materials. However, poor wear resistance becomes a crucial issue when these tools are used in hard brittle materials, such as single-crystal silicon carbide (SiC). This problem was addressed in this study through the development of brazed diamond wires. The production method and the slicing performance of brazed diamond wire were systematically investigated. A complete wire manufacturing line was developed to fabricate brazed diamond wire. Effect of brazing temperature on diamond grain graphitization damage was experimentally researched. The results indicated that the diamond grain graphitization damage was weakened or avoided with the optimized brazing temperature and holding time. Effect of brazing temperature on core wire mechanical property was evaluated by tensile strength, breaking twist strength, and repeated bending strength. Long brazed diamond wires were produced with optimized produce parameters for various brazing alloys. Sawing experiments on single-crystal SiC reveal that the slicing ability and slicing efficiency of the self-made brazed wire saws were better than those of commercial electroplated wire saws. Brazed Diamond Wire Saws, single-crystal SiC Huang, Hui aut Yin, Fang aut Xu, Xipeng aut Enthalten in The international journal of advanced manufacturing technology Springer London, 1985 91(2016), 1-4 vom: 18. Nov., Seite 189-199 (DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 0268-3768 nnns volume:91 year:2016 number:1-4 day:18 month:11 pages:189-199 https://doi.org/10.1007/s00170-016-9750-6 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 GBV_ILN_2018 GBV_ILN_2333 AR 91 2016 1-4 18 11 189-199 |
| allfieldsGer |
10.1007/s00170-016-9750-6 doi (DE-627)OLC2026101124 (DE-He213)s00170-016-9750-6-p DE-627 ger DE-627 rakwb eng 670 VZ He, Zhaobin verfasserin aut Development of a brazed diamond wire for slicing single-crystal SiC ingots 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag London 2016 Abstract Fixed abrasive wires, electroplated wire saws, and resinoid wire saws are widely used to slice brittle materials. However, poor wear resistance becomes a crucial issue when these tools are used in hard brittle materials, such as single-crystal silicon carbide (SiC). This problem was addressed in this study through the development of brazed diamond wires. The production method and the slicing performance of brazed diamond wire were systematically investigated. A complete wire manufacturing line was developed to fabricate brazed diamond wire. Effect of brazing temperature on diamond grain graphitization damage was experimentally researched. The results indicated that the diamond grain graphitization damage was weakened or avoided with the optimized brazing temperature and holding time. Effect of brazing temperature on core wire mechanical property was evaluated by tensile strength, breaking twist strength, and repeated bending strength. Long brazed diamond wires were produced with optimized produce parameters for various brazing alloys. Sawing experiments on single-crystal SiC reveal that the slicing ability and slicing efficiency of the self-made brazed wire saws were better than those of commercial electroplated wire saws. Brazed Diamond Wire Saws, single-crystal SiC Huang, Hui aut Yin, Fang aut Xu, Xipeng aut Enthalten in The international journal of advanced manufacturing technology Springer London, 1985 91(2016), 1-4 vom: 18. Nov., Seite 189-199 (DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 0268-3768 nnns volume:91 year:2016 number:1-4 day:18 month:11 pages:189-199 https://doi.org/10.1007/s00170-016-9750-6 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 GBV_ILN_2018 GBV_ILN_2333 AR 91 2016 1-4 18 11 189-199 |
| allfieldsSound |
10.1007/s00170-016-9750-6 doi (DE-627)OLC2026101124 (DE-He213)s00170-016-9750-6-p DE-627 ger DE-627 rakwb eng 670 VZ He, Zhaobin verfasserin aut Development of a brazed diamond wire for slicing single-crystal SiC ingots 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag London 2016 Abstract Fixed abrasive wires, electroplated wire saws, and resinoid wire saws are widely used to slice brittle materials. However, poor wear resistance becomes a crucial issue when these tools are used in hard brittle materials, such as single-crystal silicon carbide (SiC). This problem was addressed in this study through the development of brazed diamond wires. The production method and the slicing performance of brazed diamond wire were systematically investigated. A complete wire manufacturing line was developed to fabricate brazed diamond wire. Effect of brazing temperature on diamond grain graphitization damage was experimentally researched. The results indicated that the diamond grain graphitization damage was weakened or avoided with the optimized brazing temperature and holding time. Effect of brazing temperature on core wire mechanical property was evaluated by tensile strength, breaking twist strength, and repeated bending strength. Long brazed diamond wires were produced with optimized produce parameters for various brazing alloys. Sawing experiments on single-crystal SiC reveal that the slicing ability and slicing efficiency of the self-made brazed wire saws were better than those of commercial electroplated wire saws. Brazed Diamond Wire Saws, single-crystal SiC Huang, Hui aut Yin, Fang aut Xu, Xipeng aut Enthalten in The international journal of advanced manufacturing technology Springer London, 1985 91(2016), 1-4 vom: 18. Nov., Seite 189-199 (DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 0268-3768 nnns volume:91 year:2016 number:1-4 day:18 month:11 pages:189-199 https://doi.org/10.1007/s00170-016-9750-6 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 GBV_ILN_2018 GBV_ILN_2333 AR 91 2016 1-4 18 11 189-199 |
| language |
English |
| source |
Enthalten in The international journal of advanced manufacturing technology 91(2016), 1-4 vom: 18. Nov., Seite 189-199 volume:91 year:2016 number:1-4 day:18 month:11 pages:189-199 |
| sourceStr |
Enthalten in The international journal of advanced manufacturing technology 91(2016), 1-4 vom: 18. Nov., Seite 189-199 volume:91 year:2016 number:1-4 day:18 month:11 pages:189-199 |
| format_phy_str_mv |
Article |
| institution |
findex.gbv.de |
| topic_facet |
Brazed Diamond Wire Saws, single-crystal SiC |
| dewey-raw |
670 |
| isfreeaccess_bool |
false |
| container_title |
The international journal of advanced manufacturing technology |
| authorswithroles_txt_mv |
He, Zhaobin @@aut@@ Huang, Hui @@aut@@ Yin, Fang @@aut@@ Xu, Xipeng @@aut@@ |
| publishDateDaySort_date |
2016-11-18T00:00:00Z |
| hierarchy_top_id |
129185299 |
| dewey-sort |
3670 |
| id |
OLC2026101124 |
| language_de |
englisch |
| fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">OLC2026101124</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230323141228.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">200820s2016 xx ||||| 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/s00170-016-9750-6</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC2026101124</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-He213)s00170-016-9750-6-p</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">670</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">He, Zhaobin</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Development of a brazed diamond wire for slicing single-crystal SiC ingots</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2016</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© Springer-Verlag London 2016</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract Fixed abrasive wires, electroplated wire saws, and resinoid wire saws are widely used to slice brittle materials. However, poor wear resistance becomes a crucial issue when these tools are used in hard brittle materials, such as single-crystal silicon carbide (SiC). This problem was addressed in this study through the development of brazed diamond wires. The production method and the slicing performance of brazed diamond wire were systematically investigated. A complete wire manufacturing line was developed to fabricate brazed diamond wire. Effect of brazing temperature on diamond grain graphitization damage was experimentally researched. The results indicated that the diamond grain graphitization damage was weakened or avoided with the optimized brazing temperature and holding time. Effect of brazing temperature on core wire mechanical property was evaluated by tensile strength, breaking twist strength, and repeated bending strength. Long brazed diamond wires were produced with optimized produce parameters for various brazing alloys. Sawing experiments on single-crystal SiC reveal that the slicing ability and slicing efficiency of the self-made brazed wire saws were better than those of commercial electroplated wire saws.</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Brazed</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Diamond</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Wire</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Saws, single-crystal</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">SiC</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Huang, Hui</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Yin, Fang</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Xu, Xipeng</subfield><subfield code="4">aut</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">The international journal of advanced manufacturing technology</subfield><subfield code="d">Springer London, 1985</subfield><subfield code="g">91(2016), 1-4 vom: 18. Nov., Seite 189-199</subfield><subfield code="w">(DE-627)129185299</subfield><subfield code="w">(DE-600)52651-4</subfield><subfield code="w">(DE-576)014456192</subfield><subfield code="x">0268-3768</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:91</subfield><subfield code="g">year:2016</subfield><subfield code="g">number:1-4</subfield><subfield code="g">day:18</subfield><subfield code="g">month:11</subfield><subfield code="g">pages:189-199</subfield></datafield><datafield tag="856" ind1="4" ind2="1"><subfield code="u">https://doi.org/10.1007/s00170-016-9750-6</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-TEC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2018</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2333</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">91</subfield><subfield code="j">2016</subfield><subfield code="e">1-4</subfield><subfield code="b">18</subfield><subfield code="c">11</subfield><subfield code="h">189-199</subfield></datafield></record></collection>
|
| author |
He, Zhaobin |
| spellingShingle |
He, Zhaobin ddc 670 misc Brazed misc Diamond misc Wire misc Saws, single-crystal misc SiC Development of a brazed diamond wire for slicing single-crystal SiC ingots |
| authorStr |
He, Zhaobin |
| ppnlink_with_tag_str_mv |
@@773@@(DE-627)129185299 |
| format |
Article |
| dewey-ones |
670 - Manufacturing |
| delete_txt_mv |
keep |
| author_role |
aut aut aut aut |
| collection |
OLC |
| remote_str |
false |
| illustrated |
Not Illustrated |
| issn |
0268-3768 |
| topic_title |
670 VZ Development of a brazed diamond wire for slicing single-crystal SiC ingots Brazed Diamond Wire Saws, single-crystal SiC |
| topic |
ddc 670 misc Brazed misc Diamond misc Wire misc Saws, single-crystal misc SiC |
| topic_unstemmed |
ddc 670 misc Brazed misc Diamond misc Wire misc Saws, single-crystal misc SiC |
| topic_browse |
ddc 670 misc Brazed misc Diamond misc Wire misc Saws, single-crystal misc SiC |
| format_facet |
Aufsätze Gedruckte Aufsätze |
| format_main_str_mv |
Text Zeitschrift/Artikel |
| carriertype_str_mv |
nc |
| hierarchy_parent_title |
The international journal of advanced manufacturing technology |
| hierarchy_parent_id |
129185299 |
| dewey-tens |
670 - Manufacturing |
| hierarchy_top_title |
The international journal of advanced manufacturing technology |
| isfreeaccess_txt |
false |
| familylinks_str_mv |
(DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 |
| title |
Development of a brazed diamond wire for slicing single-crystal SiC ingots |
| ctrlnum |
(DE-627)OLC2026101124 (DE-He213)s00170-016-9750-6-p |
| title_full |
Development of a brazed diamond wire for slicing single-crystal SiC ingots |
| author_sort |
He, Zhaobin |
| journal |
The international journal of advanced manufacturing technology |
| journalStr |
The international journal of advanced manufacturing technology |
| lang_code |
eng |
| isOA_bool |
false |
| dewey-hundreds |
600 - Technology |
| recordtype |
marc |
| publishDateSort |
2016 |
| contenttype_str_mv |
txt |
| container_start_page |
189 |
| author_browse |
He, Zhaobin Huang, Hui Yin, Fang Xu, Xipeng |
| container_volume |
91 |
| class |
670 VZ |
| format_se |
Aufsätze |
| author-letter |
He, Zhaobin |
| doi_str_mv |
10.1007/s00170-016-9750-6 |
| dewey-full |
670 |
| title_sort |
development of a brazed diamond wire for slicing single-crystal sic ingots |
| title_auth |
Development of a brazed diamond wire for slicing single-crystal SiC ingots |
| abstract |
Abstract Fixed abrasive wires, electroplated wire saws, and resinoid wire saws are widely used to slice brittle materials. However, poor wear resistance becomes a crucial issue when these tools are used in hard brittle materials, such as single-crystal silicon carbide (SiC). This problem was addressed in this study through the development of brazed diamond wires. The production method and the slicing performance of brazed diamond wire were systematically investigated. A complete wire manufacturing line was developed to fabricate brazed diamond wire. Effect of brazing temperature on diamond grain graphitization damage was experimentally researched. The results indicated that the diamond grain graphitization damage was weakened or avoided with the optimized brazing temperature and holding time. Effect of brazing temperature on core wire mechanical property was evaluated by tensile strength, breaking twist strength, and repeated bending strength. Long brazed diamond wires were produced with optimized produce parameters for various brazing alloys. Sawing experiments on single-crystal SiC reveal that the slicing ability and slicing efficiency of the self-made brazed wire saws were better than those of commercial electroplated wire saws. © Springer-Verlag London 2016 |
| abstractGer |
Abstract Fixed abrasive wires, electroplated wire saws, and resinoid wire saws are widely used to slice brittle materials. However, poor wear resistance becomes a crucial issue when these tools are used in hard brittle materials, such as single-crystal silicon carbide (SiC). This problem was addressed in this study through the development of brazed diamond wires. The production method and the slicing performance of brazed diamond wire were systematically investigated. A complete wire manufacturing line was developed to fabricate brazed diamond wire. Effect of brazing temperature on diamond grain graphitization damage was experimentally researched. The results indicated that the diamond grain graphitization damage was weakened or avoided with the optimized brazing temperature and holding time. Effect of brazing temperature on core wire mechanical property was evaluated by tensile strength, breaking twist strength, and repeated bending strength. Long brazed diamond wires were produced with optimized produce parameters for various brazing alloys. Sawing experiments on single-crystal SiC reveal that the slicing ability and slicing efficiency of the self-made brazed wire saws were better than those of commercial electroplated wire saws. © Springer-Verlag London 2016 |
| abstract_unstemmed |
Abstract Fixed abrasive wires, electroplated wire saws, and resinoid wire saws are widely used to slice brittle materials. However, poor wear resistance becomes a crucial issue when these tools are used in hard brittle materials, such as single-crystal silicon carbide (SiC). This problem was addressed in this study through the development of brazed diamond wires. The production method and the slicing performance of brazed diamond wire were systematically investigated. A complete wire manufacturing line was developed to fabricate brazed diamond wire. Effect of brazing temperature on diamond grain graphitization damage was experimentally researched. The results indicated that the diamond grain graphitization damage was weakened or avoided with the optimized brazing temperature and holding time. Effect of brazing temperature on core wire mechanical property was evaluated by tensile strength, breaking twist strength, and repeated bending strength. Long brazed diamond wires were produced with optimized produce parameters for various brazing alloys. Sawing experiments on single-crystal SiC reveal that the slicing ability and slicing efficiency of the self-made brazed wire saws were better than those of commercial electroplated wire saws. © Springer-Verlag London 2016 |
| collection_details |
GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 GBV_ILN_2018 GBV_ILN_2333 |
| container_issue |
1-4 |
| title_short |
Development of a brazed diamond wire for slicing single-crystal SiC ingots |
| url |
https://doi.org/10.1007/s00170-016-9750-6 |
| remote_bool |
false |
| author2 |
Huang, Hui Yin, Fang Xu, Xipeng |
| author2Str |
Huang, Hui Yin, Fang Xu, Xipeng |
| ppnlink |
129185299 |
| mediatype_str_mv |
n |
| isOA_txt |
false |
| hochschulschrift_bool |
false |
| doi_str |
10.1007/s00170-016-9750-6 |
| up_date |
2024-07-04T03:06:41.785Z |
| _version_ |
1803616153029836800 |
| fullrecord_marcxml |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">OLC2026101124</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230323141228.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">200820s2016 xx ||||| 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/s00170-016-9750-6</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC2026101124</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-He213)s00170-016-9750-6-p</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">670</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">He, Zhaobin</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Development of a brazed diamond wire for slicing single-crystal SiC ingots</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2016</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© Springer-Verlag London 2016</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract Fixed abrasive wires, electroplated wire saws, and resinoid wire saws are widely used to slice brittle materials. However, poor wear resistance becomes a crucial issue when these tools are used in hard brittle materials, such as single-crystal silicon carbide (SiC). This problem was addressed in this study through the development of brazed diamond wires. The production method and the slicing performance of brazed diamond wire were systematically investigated. A complete wire manufacturing line was developed to fabricate brazed diamond wire. Effect of brazing temperature on diamond grain graphitization damage was experimentally researched. The results indicated that the diamond grain graphitization damage was weakened or avoided with the optimized brazing temperature and holding time. Effect of brazing temperature on core wire mechanical property was evaluated by tensile strength, breaking twist strength, and repeated bending strength. Long brazed diamond wires were produced with optimized produce parameters for various brazing alloys. Sawing experiments on single-crystal SiC reveal that the slicing ability and slicing efficiency of the self-made brazed wire saws were better than those of commercial electroplated wire saws.</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Brazed</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Diamond</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Wire</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Saws, single-crystal</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">SiC</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Huang, Hui</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Yin, Fang</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Xu, Xipeng</subfield><subfield code="4">aut</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">The international journal of advanced manufacturing technology</subfield><subfield code="d">Springer London, 1985</subfield><subfield code="g">91(2016), 1-4 vom: 18. Nov., Seite 189-199</subfield><subfield code="w">(DE-627)129185299</subfield><subfield code="w">(DE-600)52651-4</subfield><subfield code="w">(DE-576)014456192</subfield><subfield code="x">0268-3768</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:91</subfield><subfield code="g">year:2016</subfield><subfield code="g">number:1-4</subfield><subfield code="g">day:18</subfield><subfield code="g">month:11</subfield><subfield code="g">pages:189-199</subfield></datafield><datafield tag="856" ind1="4" ind2="1"><subfield code="u">https://doi.org/10.1007/s00170-016-9750-6</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-TEC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2018</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2333</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">91</subfield><subfield code="j">2016</subfield><subfield code="e">1-4</subfield><subfield code="b">18</subfield><subfield code="c">11</subfield><subfield code="h">189-199</subfield></datafield></record></collection>
|
| score |
7.4012156 |