Formation of Sn–Bi solder alloys by sequential electrodeposition and reflow
Abstract Eutectic Sn–Bi alloy is gaining considerable attention in the electronic packaging industry because of its favorable properties such as low melting temperature, good wettability, and good mechanical properties. Miniaturization of electronic devices requires small solder bumps, a few tens of...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Goh, Yingxin [verfasserIn] |
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| Format: |
Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2013 |
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| Schlagwörter: |
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| Anmerkung: |
© Springer Science+Business Media New York 2013 |
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| Übergeordnetes Werk: |
Enthalten in: Journal of materials science / Materials in electronics - Springer US, 1990, 24(2013), 6 vom: 04. Jan., Seite 2052-2057 |
|---|---|
| Übergeordnetes Werk: |
volume:24 ; year:2013 ; number:6 ; day:04 ; month:01 ; pages:2052-2057 |
| Links: |
|---|
| DOI / URN: |
10.1007/s10854-012-1055-4 |
|---|
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OLC2026269149 |
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| 520 | |a Abstract Eutectic Sn–Bi alloy is gaining considerable attention in the electronic packaging industry because of its favorable properties such as low melting temperature, good wettability, and good mechanical properties. Miniaturization of electronic devices requires small solder bumps, a few tens of micrometers in diameter. Electrodeposition is a reliable technique for the deposition of small volume of solder. This work focuses on the formation of eutectic Sn–Bi solder by reflowing a metal stack containing sequentially electrodeposited Sn and Bi layers. The effects of layering sequence on the composition and microstructure of the resulting alloy is investigated. Irrespective of the layering sequence, a homogeneous microstructure is achieved after reflow. The microstructure of the reflowed samples is the same as that of a metallurgically processed Sn–Bi alloy. Near-eutectic alloy with the composition Sn–54.6 wt% Bi is obtained by the sequential electrodeposition method. | ||
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10.1007/s10854-012-1055-4 doi (DE-627)OLC2026269149 (DE-He213)s10854-012-1055-4-p DE-627 ger DE-627 rakwb eng 600 670 620 VZ Goh, Yingxin verfasserin aut Formation of Sn–Bi solder alloys by sequential electrodeposition and reflow 2013 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer Science+Business Media New York 2013 Abstract Eutectic Sn–Bi alloy is gaining considerable attention in the electronic packaging industry because of its favorable properties such as low melting temperature, good wettability, and good mechanical properties. Miniaturization of electronic devices requires small solder bumps, a few tens of micrometers in diameter. Electrodeposition is a reliable technique for the deposition of small volume of solder. This work focuses on the formation of eutectic Sn–Bi solder by reflowing a metal stack containing sequentially electrodeposited Sn and Bi layers. The effects of layering sequence on the composition and microstructure of the resulting alloy is investigated. Irrespective of the layering sequence, a homogeneous microstructure is achieved after reflow. The microstructure of the reflowed samples is the same as that of a metallurgically processed Sn–Bi alloy. Near-eutectic alloy with the composition Sn–54.6 wt% Bi is obtained by the sequential electrodeposition method. Solder Joint Solder Alloy Solder Bump Methane Sulfonic Acid Cu6Sn5 Phase Lee, Seen Fang aut Haseeb, A. S. Md. Abdul aut Enthalten in Journal of materials science / Materials in electronics Springer US, 1990 24(2013), 6 vom: 04. Jan., Seite 2052-2057 (DE-627)130863289 (DE-600)1030929-9 (DE-576)023106719 0957-4522 nnns volume:24 year:2013 number:6 day:04 month:01 pages:2052-2057 https://doi.org/10.1007/s10854-012-1055-4 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_20 GBV_ILN_30 GBV_ILN_32 GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2015 GBV_ILN_4046 GBV_ILN_4305 GBV_ILN_4323 AR 24 2013 6 04 01 2052-2057 |
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10.1007/s10854-012-1055-4 doi (DE-627)OLC2026269149 (DE-He213)s10854-012-1055-4-p DE-627 ger DE-627 rakwb eng 600 670 620 VZ Goh, Yingxin verfasserin aut Formation of Sn–Bi solder alloys by sequential electrodeposition and reflow 2013 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer Science+Business Media New York 2013 Abstract Eutectic Sn–Bi alloy is gaining considerable attention in the electronic packaging industry because of its favorable properties such as low melting temperature, good wettability, and good mechanical properties. Miniaturization of electronic devices requires small solder bumps, a few tens of micrometers in diameter. Electrodeposition is a reliable technique for the deposition of small volume of solder. This work focuses on the formation of eutectic Sn–Bi solder by reflowing a metal stack containing sequentially electrodeposited Sn and Bi layers. The effects of layering sequence on the composition and microstructure of the resulting alloy is investigated. Irrespective of the layering sequence, a homogeneous microstructure is achieved after reflow. The microstructure of the reflowed samples is the same as that of a metallurgically processed Sn–Bi alloy. Near-eutectic alloy with the composition Sn–54.6 wt% Bi is obtained by the sequential electrodeposition method. Solder Joint Solder Alloy Solder Bump Methane Sulfonic Acid Cu6Sn5 Phase Lee, Seen Fang aut Haseeb, A. S. Md. Abdul aut Enthalten in Journal of materials science / Materials in electronics Springer US, 1990 24(2013), 6 vom: 04. Jan., Seite 2052-2057 (DE-627)130863289 (DE-600)1030929-9 (DE-576)023106719 0957-4522 nnns volume:24 year:2013 number:6 day:04 month:01 pages:2052-2057 https://doi.org/10.1007/s10854-012-1055-4 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_20 GBV_ILN_30 GBV_ILN_32 GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2015 GBV_ILN_4046 GBV_ILN_4305 GBV_ILN_4323 AR 24 2013 6 04 01 2052-2057 |
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10.1007/s10854-012-1055-4 doi (DE-627)OLC2026269149 (DE-He213)s10854-012-1055-4-p DE-627 ger DE-627 rakwb eng 600 670 620 VZ Goh, Yingxin verfasserin aut Formation of Sn–Bi solder alloys by sequential electrodeposition and reflow 2013 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer Science+Business Media New York 2013 Abstract Eutectic Sn–Bi alloy is gaining considerable attention in the electronic packaging industry because of its favorable properties such as low melting temperature, good wettability, and good mechanical properties. Miniaturization of electronic devices requires small solder bumps, a few tens of micrometers in diameter. Electrodeposition is a reliable technique for the deposition of small volume of solder. This work focuses on the formation of eutectic Sn–Bi solder by reflowing a metal stack containing sequentially electrodeposited Sn and Bi layers. The effects of layering sequence on the composition and microstructure of the resulting alloy is investigated. Irrespective of the layering sequence, a homogeneous microstructure is achieved after reflow. The microstructure of the reflowed samples is the same as that of a metallurgically processed Sn–Bi alloy. Near-eutectic alloy with the composition Sn–54.6 wt% Bi is obtained by the sequential electrodeposition method. Solder Joint Solder Alloy Solder Bump Methane Sulfonic Acid Cu6Sn5 Phase Lee, Seen Fang aut Haseeb, A. S. Md. Abdul aut Enthalten in Journal of materials science / Materials in electronics Springer US, 1990 24(2013), 6 vom: 04. Jan., Seite 2052-2057 (DE-627)130863289 (DE-600)1030929-9 (DE-576)023106719 0957-4522 nnns volume:24 year:2013 number:6 day:04 month:01 pages:2052-2057 https://doi.org/10.1007/s10854-012-1055-4 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_20 GBV_ILN_30 GBV_ILN_32 GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2015 GBV_ILN_4046 GBV_ILN_4305 GBV_ILN_4323 AR 24 2013 6 04 01 2052-2057 |
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Goh, Yingxin Lee, Seen Fang Haseeb, A. S. Md. Abdul |
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Goh, Yingxin |
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formation of sn–bi solder alloys by sequential electrodeposition and reflow |
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Formation of Sn–Bi solder alloys by sequential electrodeposition and reflow |
| abstract |
Abstract Eutectic Sn–Bi alloy is gaining considerable attention in the electronic packaging industry because of its favorable properties such as low melting temperature, good wettability, and good mechanical properties. Miniaturization of electronic devices requires small solder bumps, a few tens of micrometers in diameter. Electrodeposition is a reliable technique for the deposition of small volume of solder. This work focuses on the formation of eutectic Sn–Bi solder by reflowing a metal stack containing sequentially electrodeposited Sn and Bi layers. The effects of layering sequence on the composition and microstructure of the resulting alloy is investigated. Irrespective of the layering sequence, a homogeneous microstructure is achieved after reflow. The microstructure of the reflowed samples is the same as that of a metallurgically processed Sn–Bi alloy. Near-eutectic alloy with the composition Sn–54.6 wt% Bi is obtained by the sequential electrodeposition method. © Springer Science+Business Media New York 2013 |
| abstractGer |
Abstract Eutectic Sn–Bi alloy is gaining considerable attention in the electronic packaging industry because of its favorable properties such as low melting temperature, good wettability, and good mechanical properties. Miniaturization of electronic devices requires small solder bumps, a few tens of micrometers in diameter. Electrodeposition is a reliable technique for the deposition of small volume of solder. This work focuses on the formation of eutectic Sn–Bi solder by reflowing a metal stack containing sequentially electrodeposited Sn and Bi layers. The effects of layering sequence on the composition and microstructure of the resulting alloy is investigated. Irrespective of the layering sequence, a homogeneous microstructure is achieved after reflow. The microstructure of the reflowed samples is the same as that of a metallurgically processed Sn–Bi alloy. Near-eutectic alloy with the composition Sn–54.6 wt% Bi is obtained by the sequential electrodeposition method. © Springer Science+Business Media New York 2013 |
| abstract_unstemmed |
Abstract Eutectic Sn–Bi alloy is gaining considerable attention in the electronic packaging industry because of its favorable properties such as low melting temperature, good wettability, and good mechanical properties. Miniaturization of electronic devices requires small solder bumps, a few tens of micrometers in diameter. Electrodeposition is a reliable technique for the deposition of small volume of solder. This work focuses on the formation of eutectic Sn–Bi solder by reflowing a metal stack containing sequentially electrodeposited Sn and Bi layers. The effects of layering sequence on the composition and microstructure of the resulting alloy is investigated. Irrespective of the layering sequence, a homogeneous microstructure is achieved after reflow. The microstructure of the reflowed samples is the same as that of a metallurgically processed Sn–Bi alloy. Near-eutectic alloy with the composition Sn–54.6 wt% Bi is obtained by the sequential electrodeposition method. © Springer Science+Business Media New York 2013 |
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Formation of Sn–Bi solder alloys by sequential electrodeposition and reflow |
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