Behavior of eutectic Sn–Bi powder in Cu nanoparticle joints during the thermal treatment
Abstract Ni-coated SiC chips and Cu substrates were joined by a paste of Cu nanoparticles and eutectic Sn–Bi powders as an alternative joint to conventional solders. The first thermal treatment of the joint was performed to melt eutectic Sn–Bi powders, while the second thermal treatment was conducte...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Tajima, S. [verfasserIn] |
|---|
| Format: |
Artikel |
|---|---|
| Sprache: |
Englisch |
| Erschienen: |
2017 |
|---|
| Schlagwörter: |
|---|
| Anmerkung: |
© Springer Science+Business Media New York 2017 |
|---|
| Übergeordnetes Werk: |
Enthalten in: Journal of materials science / Materials in electronics - Springer US, 1990, 28(2017), 12 vom: 26. Feb., Seite 8764-8770 |
|---|---|
| Übergeordnetes Werk: |
volume:28 ; year:2017 ; number:12 ; day:26 ; month:02 ; pages:8764-8770 |
| Links: |
|---|
| DOI / URN: |
10.1007/s10854-017-6602-6 |
|---|
| Katalog-ID: |
OLC2026323593 |
|---|
| LEADER | 01000caa a22002652 4500 | ||
|---|---|---|---|
| 001 | OLC2026323593 | ||
| 003 | DE-627 | ||
| 005 | 20230503130159.0 | ||
| 007 | tu | ||
| 008 | 200820s2017 xx ||||| 00| ||eng c | ||
| 024 | 7 | |a 10.1007/s10854-017-6602-6 |2 doi | |
| 035 | |a (DE-627)OLC2026323593 | ||
| 035 | |a (DE-He213)s10854-017-6602-6-p | ||
| 040 | |a DE-627 |b ger |c DE-627 |e rakwb | ||
| 041 | |a eng | ||
| 082 | 0 | 4 | |a 600 |a 670 |a 620 |q VZ |
| 100 | 1 | |a Tajima, S. |e verfasserin |4 aut | |
| 245 | 1 | 0 | |a Behavior of eutectic Sn–Bi powder in Cu nanoparticle joints during the thermal treatment |
| 264 | 1 | |c 2017 | |
| 336 | |a Text |b txt |2 rdacontent | ||
| 337 | |a ohne Hilfsmittel zu benutzen |b n |2 rdamedia | ||
| 338 | |a Band |b nc |2 rdacarrier | ||
| 500 | |a © Springer Science+Business Media New York 2017 | ||
| 520 | |a Abstract Ni-coated SiC chips and Cu substrates were joined by a paste of Cu nanoparticles and eutectic Sn–Bi powders as an alternative joint to conventional solders. The first thermal treatment of the joint was performed to melt eutectic Sn–Bi powders, while the second thermal treatment was conducted at 623 K for 5 min to eliminate the organic molecules around the Cu nanoparticles. The influence of the first thermal treatment conditions (423–473 K for 2–20 min) on the joint structure and strength was investigated. During the first thermal treatment conducted at 423 K for 20 min, or at 473 K for 2 min, Sn–Bi did not migrate to the nanoparticle area. During the second thermal treatment, Bi liquefied, migrated out of the powder, and segregated at the joint interfaces. This resulted in the formation of brittle interfaces and consequently a low bonding strength. In contrast, when the first thermal treatment was performed at 448 K for 20 min or 473 K for more than 5 min, liquefied Sn–Bi migrated out of the powder and segregated at the joint interfaces, where Bi subsequently reacted with the Ni layer at the interface to form $ Bi_{x} $$ Ni_{y} $ intermetallic compounds, which prevented the formation of a brittle interface and thus improved the bonding strength. | ||
| 650 | 4 | |a Thermal Treatment | |
| 650 | 4 | |a Bonding Strength | |
| 650 | 4 | |a Joint Interface | |
| 650 | 4 | |a Thermal Treatment Temperature | |
| 650 | 4 | |a Power Electronic Device | |
| 700 | 1 | |a Satoh, T. |4 aut | |
| 700 | 1 | |a Ishizaki, T. |4 aut | |
| 700 | 1 | |a Usui, M. |4 aut | |
| 773 | 0 | 8 | |i Enthalten in |t Journal of materials science / Materials in electronics |d Springer US, 1990 |g 28(2017), 12 vom: 26. Feb., Seite 8764-8770 |w (DE-627)130863289 |w (DE-600)1030929-9 |w (DE-576)023106719 |x 0957-4522 |7 nnns |
| 773 | 1 | 8 | |g volume:28 |g year:2017 |g number:12 |g day:26 |g month:02 |g pages:8764-8770 |
| 856 | 4 | 1 | |u https://doi.org/10.1007/s10854-017-6602-6 |z lizenzpflichtig |3 Volltext |
| 912 | |a GBV_USEFLAG_A | ||
| 912 | |a SYSFLAG_A | ||
| 912 | |a GBV_OLC | ||
| 912 | |a SSG-OLC-TEC | ||
| 912 | |a SSG-OLC-PHY | ||
| 912 | |a GBV_ILN_30 | ||
| 912 | |a GBV_ILN_70 | ||
| 912 | |a GBV_ILN_2004 | ||
| 912 | |a GBV_ILN_2015 | ||
| 912 | |a GBV_ILN_4046 | ||
| 912 | |a GBV_ILN_4323 | ||
| 951 | |a AR | ||
| 952 | |d 28 |j 2017 |e 12 |b 26 |c 02 |h 8764-8770 | ||
| author_variant |
s t st t s ts t i ti m u mu |
|---|---|
| matchkey_str |
article:09574522:2017----::eairfuetcniodrnuaoatceonsui |
| hierarchy_sort_str |
2017 |
| publishDate |
2017 |
| allfields |
10.1007/s10854-017-6602-6 doi (DE-627)OLC2026323593 (DE-He213)s10854-017-6602-6-p DE-627 ger DE-627 rakwb eng 600 670 620 VZ Tajima, S. verfasserin aut Behavior of eutectic Sn–Bi powder in Cu nanoparticle joints during the thermal treatment 2017 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer Science+Business Media New York 2017 Abstract Ni-coated SiC chips and Cu substrates were joined by a paste of Cu nanoparticles and eutectic Sn–Bi powders as an alternative joint to conventional solders. The first thermal treatment of the joint was performed to melt eutectic Sn–Bi powders, while the second thermal treatment was conducted at 623 K for 5 min to eliminate the organic molecules around the Cu nanoparticles. The influence of the first thermal treatment conditions (423–473 K for 2–20 min) on the joint structure and strength was investigated. During the first thermal treatment conducted at 423 K for 20 min, or at 473 K for 2 min, Sn–Bi did not migrate to the nanoparticle area. During the second thermal treatment, Bi liquefied, migrated out of the powder, and segregated at the joint interfaces. This resulted in the formation of brittle interfaces and consequently a low bonding strength. In contrast, when the first thermal treatment was performed at 448 K for 20 min or 473 K for more than 5 min, liquefied Sn–Bi migrated out of the powder and segregated at the joint interfaces, where Bi subsequently reacted with the Ni layer at the interface to form $ Bi_{x} $$ Ni_{y} $ intermetallic compounds, which prevented the formation of a brittle interface and thus improved the bonding strength. Thermal Treatment Bonding Strength Joint Interface Thermal Treatment Temperature Power Electronic Device Satoh, T. aut Ishizaki, T. aut Usui, M. aut Enthalten in Journal of materials science / Materials in electronics Springer US, 1990 28(2017), 12 vom: 26. Feb., Seite 8764-8770 (DE-627)130863289 (DE-600)1030929-9 (DE-576)023106719 0957-4522 nnns volume:28 year:2017 number:12 day:26 month:02 pages:8764-8770 https://doi.org/10.1007/s10854-017-6602-6 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_30 GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2015 GBV_ILN_4046 GBV_ILN_4323 AR 28 2017 12 26 02 8764-8770 |
| spelling |
10.1007/s10854-017-6602-6 doi (DE-627)OLC2026323593 (DE-He213)s10854-017-6602-6-p DE-627 ger DE-627 rakwb eng 600 670 620 VZ Tajima, S. verfasserin aut Behavior of eutectic Sn–Bi powder in Cu nanoparticle joints during the thermal treatment 2017 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer Science+Business Media New York 2017 Abstract Ni-coated SiC chips and Cu substrates were joined by a paste of Cu nanoparticles and eutectic Sn–Bi powders as an alternative joint to conventional solders. The first thermal treatment of the joint was performed to melt eutectic Sn–Bi powders, while the second thermal treatment was conducted at 623 K for 5 min to eliminate the organic molecules around the Cu nanoparticles. The influence of the first thermal treatment conditions (423–473 K for 2–20 min) on the joint structure and strength was investigated. During the first thermal treatment conducted at 423 K for 20 min, or at 473 K for 2 min, Sn–Bi did not migrate to the nanoparticle area. During the second thermal treatment, Bi liquefied, migrated out of the powder, and segregated at the joint interfaces. This resulted in the formation of brittle interfaces and consequently a low bonding strength. In contrast, when the first thermal treatment was performed at 448 K for 20 min or 473 K for more than 5 min, liquefied Sn–Bi migrated out of the powder and segregated at the joint interfaces, where Bi subsequently reacted with the Ni layer at the interface to form $ Bi_{x} $$ Ni_{y} $ intermetallic compounds, which prevented the formation of a brittle interface and thus improved the bonding strength. Thermal Treatment Bonding Strength Joint Interface Thermal Treatment Temperature Power Electronic Device Satoh, T. aut Ishizaki, T. aut Usui, M. aut Enthalten in Journal of materials science / Materials in electronics Springer US, 1990 28(2017), 12 vom: 26. Feb., Seite 8764-8770 (DE-627)130863289 (DE-600)1030929-9 (DE-576)023106719 0957-4522 nnns volume:28 year:2017 number:12 day:26 month:02 pages:8764-8770 https://doi.org/10.1007/s10854-017-6602-6 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_30 GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2015 GBV_ILN_4046 GBV_ILN_4323 AR 28 2017 12 26 02 8764-8770 |
| allfields_unstemmed |
10.1007/s10854-017-6602-6 doi (DE-627)OLC2026323593 (DE-He213)s10854-017-6602-6-p DE-627 ger DE-627 rakwb eng 600 670 620 VZ Tajima, S. verfasserin aut Behavior of eutectic Sn–Bi powder in Cu nanoparticle joints during the thermal treatment 2017 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer Science+Business Media New York 2017 Abstract Ni-coated SiC chips and Cu substrates were joined by a paste of Cu nanoparticles and eutectic Sn–Bi powders as an alternative joint to conventional solders. The first thermal treatment of the joint was performed to melt eutectic Sn–Bi powders, while the second thermal treatment was conducted at 623 K for 5 min to eliminate the organic molecules around the Cu nanoparticles. The influence of the first thermal treatment conditions (423–473 K for 2–20 min) on the joint structure and strength was investigated. During the first thermal treatment conducted at 423 K for 20 min, or at 473 K for 2 min, Sn–Bi did not migrate to the nanoparticle area. During the second thermal treatment, Bi liquefied, migrated out of the powder, and segregated at the joint interfaces. This resulted in the formation of brittle interfaces and consequently a low bonding strength. In contrast, when the first thermal treatment was performed at 448 K for 20 min or 473 K for more than 5 min, liquefied Sn–Bi migrated out of the powder and segregated at the joint interfaces, where Bi subsequently reacted with the Ni layer at the interface to form $ Bi_{x} $$ Ni_{y} $ intermetallic compounds, which prevented the formation of a brittle interface and thus improved the bonding strength. Thermal Treatment Bonding Strength Joint Interface Thermal Treatment Temperature Power Electronic Device Satoh, T. aut Ishizaki, T. aut Usui, M. aut Enthalten in Journal of materials science / Materials in electronics Springer US, 1990 28(2017), 12 vom: 26. Feb., Seite 8764-8770 (DE-627)130863289 (DE-600)1030929-9 (DE-576)023106719 0957-4522 nnns volume:28 year:2017 number:12 day:26 month:02 pages:8764-8770 https://doi.org/10.1007/s10854-017-6602-6 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_30 GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2015 GBV_ILN_4046 GBV_ILN_4323 AR 28 2017 12 26 02 8764-8770 |
| allfieldsGer |
10.1007/s10854-017-6602-6 doi (DE-627)OLC2026323593 (DE-He213)s10854-017-6602-6-p DE-627 ger DE-627 rakwb eng 600 670 620 VZ Tajima, S. verfasserin aut Behavior of eutectic Sn–Bi powder in Cu nanoparticle joints during the thermal treatment 2017 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer Science+Business Media New York 2017 Abstract Ni-coated SiC chips and Cu substrates were joined by a paste of Cu nanoparticles and eutectic Sn–Bi powders as an alternative joint to conventional solders. The first thermal treatment of the joint was performed to melt eutectic Sn–Bi powders, while the second thermal treatment was conducted at 623 K for 5 min to eliminate the organic molecules around the Cu nanoparticles. The influence of the first thermal treatment conditions (423–473 K for 2–20 min) on the joint structure and strength was investigated. During the first thermal treatment conducted at 423 K for 20 min, or at 473 K for 2 min, Sn–Bi did not migrate to the nanoparticle area. During the second thermal treatment, Bi liquefied, migrated out of the powder, and segregated at the joint interfaces. This resulted in the formation of brittle interfaces and consequently a low bonding strength. In contrast, when the first thermal treatment was performed at 448 K for 20 min or 473 K for more than 5 min, liquefied Sn–Bi migrated out of the powder and segregated at the joint interfaces, where Bi subsequently reacted with the Ni layer at the interface to form $ Bi_{x} $$ Ni_{y} $ intermetallic compounds, which prevented the formation of a brittle interface and thus improved the bonding strength. Thermal Treatment Bonding Strength Joint Interface Thermal Treatment Temperature Power Electronic Device Satoh, T. aut Ishizaki, T. aut Usui, M. aut Enthalten in Journal of materials science / Materials in electronics Springer US, 1990 28(2017), 12 vom: 26. Feb., Seite 8764-8770 (DE-627)130863289 (DE-600)1030929-9 (DE-576)023106719 0957-4522 nnns volume:28 year:2017 number:12 day:26 month:02 pages:8764-8770 https://doi.org/10.1007/s10854-017-6602-6 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_30 GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2015 GBV_ILN_4046 GBV_ILN_4323 AR 28 2017 12 26 02 8764-8770 |
| allfieldsSound |
10.1007/s10854-017-6602-6 doi (DE-627)OLC2026323593 (DE-He213)s10854-017-6602-6-p DE-627 ger DE-627 rakwb eng 600 670 620 VZ Tajima, S. verfasserin aut Behavior of eutectic Sn–Bi powder in Cu nanoparticle joints during the thermal treatment 2017 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer Science+Business Media New York 2017 Abstract Ni-coated SiC chips and Cu substrates were joined by a paste of Cu nanoparticles and eutectic Sn–Bi powders as an alternative joint to conventional solders. The first thermal treatment of the joint was performed to melt eutectic Sn–Bi powders, while the second thermal treatment was conducted at 623 K for 5 min to eliminate the organic molecules around the Cu nanoparticles. The influence of the first thermal treatment conditions (423–473 K for 2–20 min) on the joint structure and strength was investigated. During the first thermal treatment conducted at 423 K for 20 min, or at 473 K for 2 min, Sn–Bi did not migrate to the nanoparticle area. During the second thermal treatment, Bi liquefied, migrated out of the powder, and segregated at the joint interfaces. This resulted in the formation of brittle interfaces and consequently a low bonding strength. In contrast, when the first thermal treatment was performed at 448 K for 20 min or 473 K for more than 5 min, liquefied Sn–Bi migrated out of the powder and segregated at the joint interfaces, where Bi subsequently reacted with the Ni layer at the interface to form $ Bi_{x} $$ Ni_{y} $ intermetallic compounds, which prevented the formation of a brittle interface and thus improved the bonding strength. Thermal Treatment Bonding Strength Joint Interface Thermal Treatment Temperature Power Electronic Device Satoh, T. aut Ishizaki, T. aut Usui, M. aut Enthalten in Journal of materials science / Materials in electronics Springer US, 1990 28(2017), 12 vom: 26. Feb., Seite 8764-8770 (DE-627)130863289 (DE-600)1030929-9 (DE-576)023106719 0957-4522 nnns volume:28 year:2017 number:12 day:26 month:02 pages:8764-8770 https://doi.org/10.1007/s10854-017-6602-6 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_30 GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2015 GBV_ILN_4046 GBV_ILN_4323 AR 28 2017 12 26 02 8764-8770 |
| language |
English |
| source |
Enthalten in Journal of materials science / Materials in electronics 28(2017), 12 vom: 26. Feb., Seite 8764-8770 volume:28 year:2017 number:12 day:26 month:02 pages:8764-8770 |
| sourceStr |
Enthalten in Journal of materials science / Materials in electronics 28(2017), 12 vom: 26. Feb., Seite 8764-8770 volume:28 year:2017 number:12 day:26 month:02 pages:8764-8770 |
| format_phy_str_mv |
Article |
| institution |
findex.gbv.de |
| topic_facet |
Thermal Treatment Bonding Strength Joint Interface Thermal Treatment Temperature Power Electronic Device |
| dewey-raw |
600 |
| isfreeaccess_bool |
false |
| container_title |
Journal of materials science / Materials in electronics |
| authorswithroles_txt_mv |
Tajima, S. @@aut@@ Satoh, T. @@aut@@ Ishizaki, T. @@aut@@ Usui, M. @@aut@@ |
| publishDateDaySort_date |
2017-02-26T00:00:00Z |
| hierarchy_top_id |
130863289 |
| dewey-sort |
3600 |
| id |
OLC2026323593 |
| language_de |
englisch |
| fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">OLC2026323593</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230503130159.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">200820s2017 xx ||||| 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/s10854-017-6602-6</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC2026323593</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-He213)s10854-017-6602-6-p</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">600</subfield><subfield code="a">670</subfield><subfield code="a">620</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Tajima, S.</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Behavior of eutectic Sn–Bi powder in Cu nanoparticle joints during the thermal treatment</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2017</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© Springer Science+Business Media New York 2017</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract Ni-coated SiC chips and Cu substrates were joined by a paste of Cu nanoparticles and eutectic Sn–Bi powders as an alternative joint to conventional solders. The first thermal treatment of the joint was performed to melt eutectic Sn–Bi powders, while the second thermal treatment was conducted at 623 K for 5 min to eliminate the organic molecules around the Cu nanoparticles. The influence of the first thermal treatment conditions (423–473 K for 2–20 min) on the joint structure and strength was investigated. During the first thermal treatment conducted at 423 K for 20 min, or at 473 K for 2 min, Sn–Bi did not migrate to the nanoparticle area. During the second thermal treatment, Bi liquefied, migrated out of the powder, and segregated at the joint interfaces. This resulted in the formation of brittle interfaces and consequently a low bonding strength. In contrast, when the first thermal treatment was performed at 448 K for 20 min or 473 K for more than 5 min, liquefied Sn–Bi migrated out of the powder and segregated at the joint interfaces, where Bi subsequently reacted with the Ni layer at the interface to form $ Bi_{x} $$ Ni_{y} $ intermetallic compounds, which prevented the formation of a brittle interface and thus improved the bonding strength.</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thermal Treatment</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Bonding Strength</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Joint Interface</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thermal Treatment Temperature</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Power Electronic Device</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Satoh, T.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Ishizaki, T.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Usui, M.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Journal of materials science / Materials in electronics</subfield><subfield code="d">Springer US, 1990</subfield><subfield code="g">28(2017), 12 vom: 26. Feb., Seite 8764-8770</subfield><subfield code="w">(DE-627)130863289</subfield><subfield code="w">(DE-600)1030929-9</subfield><subfield code="w">(DE-576)023106719</subfield><subfield code="x">0957-4522</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:28</subfield><subfield code="g">year:2017</subfield><subfield code="g">number:12</subfield><subfield code="g">day:26</subfield><subfield code="g">month:02</subfield><subfield code="g">pages:8764-8770</subfield></datafield><datafield tag="856" ind1="4" ind2="1"><subfield code="u">https://doi.org/10.1007/s10854-017-6602-6</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-TEC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-PHY</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_30</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2004</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2015</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4046</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4323</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">28</subfield><subfield code="j">2017</subfield><subfield code="e">12</subfield><subfield code="b">26</subfield><subfield code="c">02</subfield><subfield code="h">8764-8770</subfield></datafield></record></collection>
|
| author |
Tajima, S. |
| spellingShingle |
Tajima, S. ddc 600 misc Thermal Treatment misc Bonding Strength misc Joint Interface misc Thermal Treatment Temperature misc Power Electronic Device Behavior of eutectic Sn–Bi powder in Cu nanoparticle joints during the thermal treatment |
| authorStr |
Tajima, S. |
| ppnlink_with_tag_str_mv |
@@773@@(DE-627)130863289 |
| format |
Article |
| dewey-ones |
600 - Technology 670 - Manufacturing 620 - Engineering & allied operations |
| delete_txt_mv |
keep |
| author_role |
aut aut aut aut |
| collection |
OLC |
| remote_str |
false |
| illustrated |
Not Illustrated |
| issn |
0957-4522 |
| topic_title |
600 670 620 VZ Behavior of eutectic Sn–Bi powder in Cu nanoparticle joints during the thermal treatment Thermal Treatment Bonding Strength Joint Interface Thermal Treatment Temperature Power Electronic Device |
| topic |
ddc 600 misc Thermal Treatment misc Bonding Strength misc Joint Interface misc Thermal Treatment Temperature misc Power Electronic Device |
| topic_unstemmed |
ddc 600 misc Thermal Treatment misc Bonding Strength misc Joint Interface misc Thermal Treatment Temperature misc Power Electronic Device |
| topic_browse |
ddc 600 misc Thermal Treatment misc Bonding Strength misc Joint Interface misc Thermal Treatment Temperature misc Power Electronic Device |
| format_facet |
Aufsätze Gedruckte Aufsätze |
| format_main_str_mv |
Text Zeitschrift/Artikel |
| carriertype_str_mv |
nc |
| hierarchy_parent_title |
Journal of materials science / Materials in electronics |
| hierarchy_parent_id |
130863289 |
| dewey-tens |
600 - Technology 670 - Manufacturing 620 - Engineering |
| hierarchy_top_title |
Journal of materials science / Materials in electronics |
| isfreeaccess_txt |
false |
| familylinks_str_mv |
(DE-627)130863289 (DE-600)1030929-9 (DE-576)023106719 |
| title |
Behavior of eutectic Sn–Bi powder in Cu nanoparticle joints during the thermal treatment |
| ctrlnum |
(DE-627)OLC2026323593 (DE-He213)s10854-017-6602-6-p |
| title_full |
Behavior of eutectic Sn–Bi powder in Cu nanoparticle joints during the thermal treatment |
| author_sort |
Tajima, S. |
| journal |
Journal of materials science / Materials in electronics |
| journalStr |
Journal of materials science / Materials in electronics |
| lang_code |
eng |
| isOA_bool |
false |
| dewey-hundreds |
600 - Technology |
| recordtype |
marc |
| publishDateSort |
2017 |
| contenttype_str_mv |
txt |
| container_start_page |
8764 |
| author_browse |
Tajima, S. Satoh, T. Ishizaki, T. Usui, M. |
| container_volume |
28 |
| class |
600 670 620 VZ |
| format_se |
Aufsätze |
| author-letter |
Tajima, S. |
| doi_str_mv |
10.1007/s10854-017-6602-6 |
| dewey-full |
600 670 620 |
| title_sort |
behavior of eutectic sn–bi powder in cu nanoparticle joints during the thermal treatment |
| title_auth |
Behavior of eutectic Sn–Bi powder in Cu nanoparticle joints during the thermal treatment |
| abstract |
Abstract Ni-coated SiC chips and Cu substrates were joined by a paste of Cu nanoparticles and eutectic Sn–Bi powders as an alternative joint to conventional solders. The first thermal treatment of the joint was performed to melt eutectic Sn–Bi powders, while the second thermal treatment was conducted at 623 K for 5 min to eliminate the organic molecules around the Cu nanoparticles. The influence of the first thermal treatment conditions (423–473 K for 2–20 min) on the joint structure and strength was investigated. During the first thermal treatment conducted at 423 K for 20 min, or at 473 K for 2 min, Sn–Bi did not migrate to the nanoparticle area. During the second thermal treatment, Bi liquefied, migrated out of the powder, and segregated at the joint interfaces. This resulted in the formation of brittle interfaces and consequently a low bonding strength. In contrast, when the first thermal treatment was performed at 448 K for 20 min or 473 K for more than 5 min, liquefied Sn–Bi migrated out of the powder and segregated at the joint interfaces, where Bi subsequently reacted with the Ni layer at the interface to form $ Bi_{x} $$ Ni_{y} $ intermetallic compounds, which prevented the formation of a brittle interface and thus improved the bonding strength. © Springer Science+Business Media New York 2017 |
| abstractGer |
Abstract Ni-coated SiC chips and Cu substrates were joined by a paste of Cu nanoparticles and eutectic Sn–Bi powders as an alternative joint to conventional solders. The first thermal treatment of the joint was performed to melt eutectic Sn–Bi powders, while the second thermal treatment was conducted at 623 K for 5 min to eliminate the organic molecules around the Cu nanoparticles. The influence of the first thermal treatment conditions (423–473 K for 2–20 min) on the joint structure and strength was investigated. During the first thermal treatment conducted at 423 K for 20 min, or at 473 K for 2 min, Sn–Bi did not migrate to the nanoparticle area. During the second thermal treatment, Bi liquefied, migrated out of the powder, and segregated at the joint interfaces. This resulted in the formation of brittle interfaces and consequently a low bonding strength. In contrast, when the first thermal treatment was performed at 448 K for 20 min or 473 K for more than 5 min, liquefied Sn–Bi migrated out of the powder and segregated at the joint interfaces, where Bi subsequently reacted with the Ni layer at the interface to form $ Bi_{x} $$ Ni_{y} $ intermetallic compounds, which prevented the formation of a brittle interface and thus improved the bonding strength. © Springer Science+Business Media New York 2017 |
| abstract_unstemmed |
Abstract Ni-coated SiC chips and Cu substrates were joined by a paste of Cu nanoparticles and eutectic Sn–Bi powders as an alternative joint to conventional solders. The first thermal treatment of the joint was performed to melt eutectic Sn–Bi powders, while the second thermal treatment was conducted at 623 K for 5 min to eliminate the organic molecules around the Cu nanoparticles. The influence of the first thermal treatment conditions (423–473 K for 2–20 min) on the joint structure and strength was investigated. During the first thermal treatment conducted at 423 K for 20 min, or at 473 K for 2 min, Sn–Bi did not migrate to the nanoparticle area. During the second thermal treatment, Bi liquefied, migrated out of the powder, and segregated at the joint interfaces. This resulted in the formation of brittle interfaces and consequently a low bonding strength. In contrast, when the first thermal treatment was performed at 448 K for 20 min or 473 K for more than 5 min, liquefied Sn–Bi migrated out of the powder and segregated at the joint interfaces, where Bi subsequently reacted with the Ni layer at the interface to form $ Bi_{x} $$ Ni_{y} $ intermetallic compounds, which prevented the formation of a brittle interface and thus improved the bonding strength. © Springer Science+Business Media New York 2017 |
| collection_details |
GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_30 GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2015 GBV_ILN_4046 GBV_ILN_4323 |
| container_issue |
12 |
| title_short |
Behavior of eutectic Sn–Bi powder in Cu nanoparticle joints during the thermal treatment |
| url |
https://doi.org/10.1007/s10854-017-6602-6 |
| remote_bool |
false |
| author2 |
Satoh, T. Ishizaki, T. Usui, M. |
| author2Str |
Satoh, T. Ishizaki, T. Usui, M. |
| ppnlink |
130863289 |
| mediatype_str_mv |
n |
| isOA_txt |
false |
| hochschulschrift_bool |
false |
| doi_str |
10.1007/s10854-017-6602-6 |
| up_date |
2024-07-04T03:41:09.006Z |
| _version_ |
1803618320660824064 |
| fullrecord_marcxml |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">OLC2026323593</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230503130159.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">200820s2017 xx ||||| 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/s10854-017-6602-6</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC2026323593</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-He213)s10854-017-6602-6-p</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">600</subfield><subfield code="a">670</subfield><subfield code="a">620</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Tajima, S.</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Behavior of eutectic Sn–Bi powder in Cu nanoparticle joints during the thermal treatment</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2017</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© Springer Science+Business Media New York 2017</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract Ni-coated SiC chips and Cu substrates were joined by a paste of Cu nanoparticles and eutectic Sn–Bi powders as an alternative joint to conventional solders. The first thermal treatment of the joint was performed to melt eutectic Sn–Bi powders, while the second thermal treatment was conducted at 623 K for 5 min to eliminate the organic molecules around the Cu nanoparticles. The influence of the first thermal treatment conditions (423–473 K for 2–20 min) on the joint structure and strength was investigated. During the first thermal treatment conducted at 423 K for 20 min, or at 473 K for 2 min, Sn–Bi did not migrate to the nanoparticle area. During the second thermal treatment, Bi liquefied, migrated out of the powder, and segregated at the joint interfaces. This resulted in the formation of brittle interfaces and consequently a low bonding strength. In contrast, when the first thermal treatment was performed at 448 K for 20 min or 473 K for more than 5 min, liquefied Sn–Bi migrated out of the powder and segregated at the joint interfaces, where Bi subsequently reacted with the Ni layer at the interface to form $ Bi_{x} $$ Ni_{y} $ intermetallic compounds, which prevented the formation of a brittle interface and thus improved the bonding strength.</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thermal Treatment</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Bonding Strength</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Joint Interface</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thermal Treatment Temperature</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Power Electronic Device</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Satoh, T.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Ishizaki, T.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Usui, M.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Journal of materials science / Materials in electronics</subfield><subfield code="d">Springer US, 1990</subfield><subfield code="g">28(2017), 12 vom: 26. Feb., Seite 8764-8770</subfield><subfield code="w">(DE-627)130863289</subfield><subfield code="w">(DE-600)1030929-9</subfield><subfield code="w">(DE-576)023106719</subfield><subfield code="x">0957-4522</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:28</subfield><subfield code="g">year:2017</subfield><subfield code="g">number:12</subfield><subfield code="g">day:26</subfield><subfield code="g">month:02</subfield><subfield code="g">pages:8764-8770</subfield></datafield><datafield tag="856" ind1="4" ind2="1"><subfield code="u">https://doi.org/10.1007/s10854-017-6602-6</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-TEC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-PHY</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_30</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2004</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2015</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4046</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4323</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">28</subfield><subfield code="j">2017</subfield><subfield code="e">12</subfield><subfield code="b">26</subfield><subfield code="c">02</subfield><subfield code="h">8764-8770</subfield></datafield></record></collection>
|
| score |
7.4011335 |