Phase Field Modeling of Joint Formation During Isothermal Solidification in 3DIC Micro Packaging
Abstract In this paper, a computational multi-phase field approach is utilized to study the formation of the Cu/Sn/Cu micro-joint in 3-Dimensional Integrated Circuits (3DICs). The method considers the evolution of the system during isothermal solidification at 250 °C for the case of two different in...
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Gespeichert in:
| Autor*in: |
Attari, Vahid [verfasserIn] |
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| Format: |
Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2016 |
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| Schlagwörter: |
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| Anmerkung: |
© ASM International 2016 |
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| Übergeordnetes Werk: |
Enthalten in: Journal of phase equilibria and diffusion - Springer US, 2004, 37(2016), 4 vom: 16. Juni, Seite 469-480 |
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| Übergeordnetes Werk: |
volume:37 ; year:2016 ; number:4 ; day:16 ; month:06 ; pages:469-480 |
| Links: |
|---|
| DOI / URN: |
10.1007/s11669-016-0475-x |
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OLC202676607X |
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| 520 | |a Abstract In this paper, a computational multi-phase field approach is utilized to study the formation of the Cu/Sn/Cu micro-joint in 3-Dimensional Integrated Circuits (3DICs). The method considers the evolution of the system during isothermal solidification at 250 °C for the case of two different interlayer thicknesses (5 and 10 µm). The Cu/Sn/Cu interconnection structure is important for the micro packaging in the 3DIC systems. The thermodynamics and kinetics of growth of η-$ Cu_{6} $$ Sn_{5} $ and ɛ-$ Cu_{3} $Sn interfacial intermetallics (IMCs) are investigated by coupling the multi-phase field method with CALPHAD approach. The interaction of the phases is addressed by assuming a metastable condition for the Cu/Sn reacting system. The simulations start with the nucleation and rapid growth of the η-$ Cu_{6} $$ Sn_{5} $ IMCs at the initial stage, the nucleation and growth of ɛ-$ Cu_{3} $Sn IMCs at the intermediate stage ending with the full consumption of Sn layer and the domination of ɛ-$ Cu_{3} $Sn IMCs at the later stages. In addition, comparing different diffusion rates through the grain boundary of η phases show that their morphology is the direct consequence of balance of kinetic forces. This work provides a valuable understanding of the dominant mechanisms for mass transport in the Cu/Sn/Cu low volume interconnections. The results show that the phase field modeling is successful in addressing the morphological evolution and growth of IMC layers in the 3DIC joint formation. | ||
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10.1007/s11669-016-0475-x doi (DE-627)OLC202676607X (DE-He213)s11669-016-0475-x-p DE-627 ger DE-627 rakwb eng 620 660 670 VZ 51.10$jMetallphysik bkl Attari, Vahid verfasserin aut Phase Field Modeling of Joint Formation During Isothermal Solidification in 3DIC Micro Packaging 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © ASM International 2016 Abstract In this paper, a computational multi-phase field approach is utilized to study the formation of the Cu/Sn/Cu micro-joint in 3-Dimensional Integrated Circuits (3DICs). The method considers the evolution of the system during isothermal solidification at 250 °C for the case of two different interlayer thicknesses (5 and 10 µm). The Cu/Sn/Cu interconnection structure is important for the micro packaging in the 3DIC systems. The thermodynamics and kinetics of growth of η-$ Cu_{6} $$ Sn_{5} $ and ɛ-$ Cu_{3} $Sn interfacial intermetallics (IMCs) are investigated by coupling the multi-phase field method with CALPHAD approach. The interaction of the phases is addressed by assuming a metastable condition for the Cu/Sn reacting system. The simulations start with the nucleation and rapid growth of the η-$ Cu_{6} $$ Sn_{5} $ IMCs at the initial stage, the nucleation and growth of ɛ-$ Cu_{3} $Sn IMCs at the intermediate stage ending with the full consumption of Sn layer and the domination of ɛ-$ Cu_{3} $Sn IMCs at the later stages. In addition, comparing different diffusion rates through the grain boundary of η phases show that their morphology is the direct consequence of balance of kinetic forces. This work provides a valuable understanding of the dominant mechanisms for mass transport in the Cu/Sn/Cu low volume interconnections. The results show that the phase field modeling is successful in addressing the morphological evolution and growth of IMC layers in the 3DIC joint formation. 3DIC micro-packaging technology chemical equilibrium morphology phase field modeling phase transformation Arroyave, Raymundo aut Enthalten in Journal of phase equilibria and diffusion Springer US, 2004 37(2016), 4 vom: 16. Juni, Seite 469-480 (DE-627)393353648 (DE-600)2140016-7 (DE-576)113026102 1547-7037 nnns volume:37 year:2016 number:4 day:16 month:06 pages:469-480 https://doi.org/10.1007/s11669-016-0475-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-PHY SSG-OLC-PHA SSG-OLC-DE-84 GBV_ILN_30 GBV_ILN_70 51.10$jMetallphysik VZ 106417843 (DE-625)106417843 AR 37 2016 4 16 06 469-480 |
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10.1007/s11669-016-0475-x doi (DE-627)OLC202676607X (DE-He213)s11669-016-0475-x-p DE-627 ger DE-627 rakwb eng 620 660 670 VZ 51.10$jMetallphysik bkl Attari, Vahid verfasserin aut Phase Field Modeling of Joint Formation During Isothermal Solidification in 3DIC Micro Packaging 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © ASM International 2016 Abstract In this paper, a computational multi-phase field approach is utilized to study the formation of the Cu/Sn/Cu micro-joint in 3-Dimensional Integrated Circuits (3DICs). The method considers the evolution of the system during isothermal solidification at 250 °C for the case of two different interlayer thicknesses (5 and 10 µm). The Cu/Sn/Cu interconnection structure is important for the micro packaging in the 3DIC systems. The thermodynamics and kinetics of growth of η-$ Cu_{6} $$ Sn_{5} $ and ɛ-$ Cu_{3} $Sn interfacial intermetallics (IMCs) are investigated by coupling the multi-phase field method with CALPHAD approach. The interaction of the phases is addressed by assuming a metastable condition for the Cu/Sn reacting system. The simulations start with the nucleation and rapid growth of the η-$ Cu_{6} $$ Sn_{5} $ IMCs at the initial stage, the nucleation and growth of ɛ-$ Cu_{3} $Sn IMCs at the intermediate stage ending with the full consumption of Sn layer and the domination of ɛ-$ Cu_{3} $Sn IMCs at the later stages. In addition, comparing different diffusion rates through the grain boundary of η phases show that their morphology is the direct consequence of balance of kinetic forces. This work provides a valuable understanding of the dominant mechanisms for mass transport in the Cu/Sn/Cu low volume interconnections. The results show that the phase field modeling is successful in addressing the morphological evolution and growth of IMC layers in the 3DIC joint formation. 3DIC micro-packaging technology chemical equilibrium morphology phase field modeling phase transformation Arroyave, Raymundo aut Enthalten in Journal of phase equilibria and diffusion Springer US, 2004 37(2016), 4 vom: 16. Juni, Seite 469-480 (DE-627)393353648 (DE-600)2140016-7 (DE-576)113026102 1547-7037 nnns volume:37 year:2016 number:4 day:16 month:06 pages:469-480 https://doi.org/10.1007/s11669-016-0475-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-PHY SSG-OLC-PHA SSG-OLC-DE-84 GBV_ILN_30 GBV_ILN_70 51.10$jMetallphysik VZ 106417843 (DE-625)106417843 AR 37 2016 4 16 06 469-480 |
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10.1007/s11669-016-0475-x doi (DE-627)OLC202676607X (DE-He213)s11669-016-0475-x-p DE-627 ger DE-627 rakwb eng 620 660 670 VZ 51.10$jMetallphysik bkl Attari, Vahid verfasserin aut Phase Field Modeling of Joint Formation During Isothermal Solidification in 3DIC Micro Packaging 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © ASM International 2016 Abstract In this paper, a computational multi-phase field approach is utilized to study the formation of the Cu/Sn/Cu micro-joint in 3-Dimensional Integrated Circuits (3DICs). The method considers the evolution of the system during isothermal solidification at 250 °C for the case of two different interlayer thicknesses (5 and 10 µm). The Cu/Sn/Cu interconnection structure is important for the micro packaging in the 3DIC systems. The thermodynamics and kinetics of growth of η-$ Cu_{6} $$ Sn_{5} $ and ɛ-$ Cu_{3} $Sn interfacial intermetallics (IMCs) are investigated by coupling the multi-phase field method with CALPHAD approach. The interaction of the phases is addressed by assuming a metastable condition for the Cu/Sn reacting system. The simulations start with the nucleation and rapid growth of the η-$ Cu_{6} $$ Sn_{5} $ IMCs at the initial stage, the nucleation and growth of ɛ-$ Cu_{3} $Sn IMCs at the intermediate stage ending with the full consumption of Sn layer and the domination of ɛ-$ Cu_{3} $Sn IMCs at the later stages. In addition, comparing different diffusion rates through the grain boundary of η phases show that their morphology is the direct consequence of balance of kinetic forces. This work provides a valuable understanding of the dominant mechanisms for mass transport in the Cu/Sn/Cu low volume interconnections. The results show that the phase field modeling is successful in addressing the morphological evolution and growth of IMC layers in the 3DIC joint formation. 3DIC micro-packaging technology chemical equilibrium morphology phase field modeling phase transformation Arroyave, Raymundo aut Enthalten in Journal of phase equilibria and diffusion Springer US, 2004 37(2016), 4 vom: 16. Juni, Seite 469-480 (DE-627)393353648 (DE-600)2140016-7 (DE-576)113026102 1547-7037 nnns volume:37 year:2016 number:4 day:16 month:06 pages:469-480 https://doi.org/10.1007/s11669-016-0475-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-PHY SSG-OLC-PHA SSG-OLC-DE-84 GBV_ILN_30 GBV_ILN_70 51.10$jMetallphysik VZ 106417843 (DE-625)106417843 AR 37 2016 4 16 06 469-480 |
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Phase Field Modeling of Joint Formation During Isothermal Solidification in 3DIC Micro Packaging |
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Phase Field Modeling of Joint Formation During Isothermal Solidification in 3DIC Micro Packaging |
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Attari, Vahid |
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Journal of phase equilibria and diffusion |
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Journal of phase equilibria and diffusion |
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Attari, Vahid Arroyave, Raymundo |
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phase field modeling of joint formation during isothermal solidification in 3dic micro packaging |
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Phase Field Modeling of Joint Formation During Isothermal Solidification in 3DIC Micro Packaging |
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Abstract In this paper, a computational multi-phase field approach is utilized to study the formation of the Cu/Sn/Cu micro-joint in 3-Dimensional Integrated Circuits (3DICs). The method considers the evolution of the system during isothermal solidification at 250 °C for the case of two different interlayer thicknesses (5 and 10 µm). The Cu/Sn/Cu interconnection structure is important for the micro packaging in the 3DIC systems. The thermodynamics and kinetics of growth of η-$ Cu_{6} $$ Sn_{5} $ and ɛ-$ Cu_{3} $Sn interfacial intermetallics (IMCs) are investigated by coupling the multi-phase field method with CALPHAD approach. The interaction of the phases is addressed by assuming a metastable condition for the Cu/Sn reacting system. The simulations start with the nucleation and rapid growth of the η-$ Cu_{6} $$ Sn_{5} $ IMCs at the initial stage, the nucleation and growth of ɛ-$ Cu_{3} $Sn IMCs at the intermediate stage ending with the full consumption of Sn layer and the domination of ɛ-$ Cu_{3} $Sn IMCs at the later stages. In addition, comparing different diffusion rates through the grain boundary of η phases show that their morphology is the direct consequence of balance of kinetic forces. This work provides a valuable understanding of the dominant mechanisms for mass transport in the Cu/Sn/Cu low volume interconnections. The results show that the phase field modeling is successful in addressing the morphological evolution and growth of IMC layers in the 3DIC joint formation. © ASM International 2016 |
| abstractGer |
Abstract In this paper, a computational multi-phase field approach is utilized to study the formation of the Cu/Sn/Cu micro-joint in 3-Dimensional Integrated Circuits (3DICs). The method considers the evolution of the system during isothermal solidification at 250 °C for the case of two different interlayer thicknesses (5 and 10 µm). The Cu/Sn/Cu interconnection structure is important for the micro packaging in the 3DIC systems. The thermodynamics and kinetics of growth of η-$ Cu_{6} $$ Sn_{5} $ and ɛ-$ Cu_{3} $Sn interfacial intermetallics (IMCs) are investigated by coupling the multi-phase field method with CALPHAD approach. The interaction of the phases is addressed by assuming a metastable condition for the Cu/Sn reacting system. The simulations start with the nucleation and rapid growth of the η-$ Cu_{6} $$ Sn_{5} $ IMCs at the initial stage, the nucleation and growth of ɛ-$ Cu_{3} $Sn IMCs at the intermediate stage ending with the full consumption of Sn layer and the domination of ɛ-$ Cu_{3} $Sn IMCs at the later stages. In addition, comparing different diffusion rates through the grain boundary of η phases show that their morphology is the direct consequence of balance of kinetic forces. This work provides a valuable understanding of the dominant mechanisms for mass transport in the Cu/Sn/Cu low volume interconnections. The results show that the phase field modeling is successful in addressing the morphological evolution and growth of IMC layers in the 3DIC joint formation. © ASM International 2016 |
| abstract_unstemmed |
Abstract In this paper, a computational multi-phase field approach is utilized to study the formation of the Cu/Sn/Cu micro-joint in 3-Dimensional Integrated Circuits (3DICs). The method considers the evolution of the system during isothermal solidification at 250 °C for the case of two different interlayer thicknesses (5 and 10 µm). The Cu/Sn/Cu interconnection structure is important for the micro packaging in the 3DIC systems. The thermodynamics and kinetics of growth of η-$ Cu_{6} $$ Sn_{5} $ and ɛ-$ Cu_{3} $Sn interfacial intermetallics (IMCs) are investigated by coupling the multi-phase field method with CALPHAD approach. The interaction of the phases is addressed by assuming a metastable condition for the Cu/Sn reacting system. The simulations start with the nucleation and rapid growth of the η-$ Cu_{6} $$ Sn_{5} $ IMCs at the initial stage, the nucleation and growth of ɛ-$ Cu_{3} $Sn IMCs at the intermediate stage ending with the full consumption of Sn layer and the domination of ɛ-$ Cu_{3} $Sn IMCs at the later stages. In addition, comparing different diffusion rates through the grain boundary of η phases show that their morphology is the direct consequence of balance of kinetic forces. This work provides a valuable understanding of the dominant mechanisms for mass transport in the Cu/Sn/Cu low volume interconnections. The results show that the phase field modeling is successful in addressing the morphological evolution and growth of IMC layers in the 3DIC joint formation. © ASM International 2016 |
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Phase Field Modeling of Joint Formation During Isothermal Solidification in 3DIC Micro Packaging |
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