Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer
Abstract This paper deals with the thermoelasticity problem of bonded dissimilar half-planes with a functionally graded interlayer, weakened by a pair of two offset interfacial cracks. The material nonhomogeneity in the graded interlayer is represented by spatially varying thermoelastic moduli expre...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Choi, Hyung Jip [verfasserIn] |
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| Format: |
Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2014 |
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| Schlagwörter: |
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| Anmerkung: |
© Springer-Verlag Wien 2014 |
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| Übergeordnetes Werk: |
Enthalten in: Acta mechanica - Springer Vienna, 1965, 225(2014), 7 vom: 29. Jan., Seite 2111-2131 |
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| Übergeordnetes Werk: |
volume:225 ; year:2014 ; number:7 ; day:29 ; month:01 ; pages:2111-2131 |
| Links: |
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| DOI / URN: |
10.1007/s00707-013-1080-2 |
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| Katalog-ID: |
OLC203014102X |
|---|
| LEADER | 01000caa a22002652 4500 | ||
|---|---|---|---|
| 001 | OLC203014102X | ||
| 003 | DE-627 | ||
| 005 | 20230502143300.0 | ||
| 007 | tu | ||
| 008 | 200820s2014 xx ||||| 00| ||eng c | ||
| 024 | 7 | |a 10.1007/s00707-013-1080-2 |2 doi | |
| 035 | |a (DE-627)OLC203014102X | ||
| 035 | |a (DE-He213)s00707-013-1080-2-p | ||
| 040 | |a DE-627 |b ger |c DE-627 |e rakwb | ||
| 041 | |a eng | ||
| 082 | 0 | 4 | |a 530 |q VZ |
| 100 | 1 | |a Choi, Hyung Jip |e verfasserin |4 aut | |
| 245 | 1 | 0 | |a Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer |
| 264 | 1 | |c 2014 | |
| 336 | |a Text |b txt |2 rdacontent | ||
| 337 | |a ohne Hilfsmittel zu benutzen |b n |2 rdamedia | ||
| 338 | |a Band |b nc |2 rdacarrier | ||
| 500 | |a © Springer-Verlag Wien 2014 | ||
| 520 | |a Abstract This paper deals with the thermoelasticity problem of bonded dissimilar half-planes with a functionally graded interlayer, weakened by a pair of two offset interfacial cracks. The material nonhomogeneity in the graded interlayer is represented by spatially varying thermoelastic moduli expressed in terms of exponential functions. The cracks are assumed to be thermally insulated disturbing a steady-state uniform heat flow, and the solution is obtained within the framework of linear plane thermoelasticity. The Fourier integral transform method is employed, and the formulation of the current nonisothermal crack problem is reduced to two sets of Cauchy-type singular integral equations for temperature and thermal stress fields in the bonded system. In the numerical results, parametric studies are conducted so that the variations in mixed-mode thermal stress intensity factors are presented as a function of offset crack distance for various geometric and material combinations of the dissimilar homogeneous media bonded through the thermoelastically graded interlayer, elaborating thermally induced singular interaction of the two neighboring interfacial cracks. | ||
| 650 | 4 | |a Thermal Stress | |
| 650 | 4 | |a Stress Intensity Factor | |
| 650 | 4 | |a Interfacial Crack | |
| 650 | 4 | |a Thermal Stress Analysis | |
| 650 | 4 | |a Crack Interaction | |
| 773 | 0 | 8 | |i Enthalten in |t Acta mechanica |d Springer Vienna, 1965 |g 225(2014), 7 vom: 29. Jan., Seite 2111-2131 |w (DE-627)129511676 |w (DE-600)210328-X |w (DE-576)014919141 |x 0001-5970 |7 nnns |
| 773 | 1 | 8 | |g volume:225 |g year:2014 |g number:7 |g day:29 |g month:01 |g pages:2111-2131 |
| 856 | 4 | 1 | |u https://doi.org/10.1007/s00707-013-1080-2 |z lizenzpflichtig |3 Volltext |
| 912 | |a GBV_USEFLAG_A | ||
| 912 | |a SYSFLAG_A | ||
| 912 | |a GBV_OLC | ||
| 912 | |a SSG-OLC-TEC | ||
| 912 | |a SSG-OLC-PHY | ||
| 912 | |a GBV_ILN_22 | ||
| 912 | |a GBV_ILN_59 | ||
| 912 | |a GBV_ILN_70 | ||
| 912 | |a GBV_ILN_2020 | ||
| 912 | |a GBV_ILN_4700 | ||
| 951 | |a AR | ||
| 952 | |d 225 |j 2014 |e 7 |b 29 |c 01 |h 2111-2131 | ||
| author_variant |
h j c hj hjc |
|---|---|
| matchkey_str |
article:00015970:2014----::hrolsiitrcinfwofeitrailrcsnoddismlraflnsih |
| hierarchy_sort_str |
2014 |
| publishDate |
2014 |
| allfields |
10.1007/s00707-013-1080-2 doi (DE-627)OLC203014102X (DE-He213)s00707-013-1080-2-p DE-627 ger DE-627 rakwb eng 530 VZ Choi, Hyung Jip verfasserin aut Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer 2014 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag Wien 2014 Abstract This paper deals with the thermoelasticity problem of bonded dissimilar half-planes with a functionally graded interlayer, weakened by a pair of two offset interfacial cracks. The material nonhomogeneity in the graded interlayer is represented by spatially varying thermoelastic moduli expressed in terms of exponential functions. The cracks are assumed to be thermally insulated disturbing a steady-state uniform heat flow, and the solution is obtained within the framework of linear plane thermoelasticity. The Fourier integral transform method is employed, and the formulation of the current nonisothermal crack problem is reduced to two sets of Cauchy-type singular integral equations for temperature and thermal stress fields in the bonded system. In the numerical results, parametric studies are conducted so that the variations in mixed-mode thermal stress intensity factors are presented as a function of offset crack distance for various geometric and material combinations of the dissimilar homogeneous media bonded through the thermoelastically graded interlayer, elaborating thermally induced singular interaction of the two neighboring interfacial cracks. Thermal Stress Stress Intensity Factor Interfacial Crack Thermal Stress Analysis Crack Interaction Enthalten in Acta mechanica Springer Vienna, 1965 225(2014), 7 vom: 29. Jan., Seite 2111-2131 (DE-627)129511676 (DE-600)210328-X (DE-576)014919141 0001-5970 nnns volume:225 year:2014 number:7 day:29 month:01 pages:2111-2131 https://doi.org/10.1007/s00707-013-1080-2 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_22 GBV_ILN_59 GBV_ILN_70 GBV_ILN_2020 GBV_ILN_4700 AR 225 2014 7 29 01 2111-2131 |
| spelling |
10.1007/s00707-013-1080-2 doi (DE-627)OLC203014102X (DE-He213)s00707-013-1080-2-p DE-627 ger DE-627 rakwb eng 530 VZ Choi, Hyung Jip verfasserin aut Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer 2014 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag Wien 2014 Abstract This paper deals with the thermoelasticity problem of bonded dissimilar half-planes with a functionally graded interlayer, weakened by a pair of two offset interfacial cracks. The material nonhomogeneity in the graded interlayer is represented by spatially varying thermoelastic moduli expressed in terms of exponential functions. The cracks are assumed to be thermally insulated disturbing a steady-state uniform heat flow, and the solution is obtained within the framework of linear plane thermoelasticity. The Fourier integral transform method is employed, and the formulation of the current nonisothermal crack problem is reduced to two sets of Cauchy-type singular integral equations for temperature and thermal stress fields in the bonded system. In the numerical results, parametric studies are conducted so that the variations in mixed-mode thermal stress intensity factors are presented as a function of offset crack distance for various geometric and material combinations of the dissimilar homogeneous media bonded through the thermoelastically graded interlayer, elaborating thermally induced singular interaction of the two neighboring interfacial cracks. Thermal Stress Stress Intensity Factor Interfacial Crack Thermal Stress Analysis Crack Interaction Enthalten in Acta mechanica Springer Vienna, 1965 225(2014), 7 vom: 29. Jan., Seite 2111-2131 (DE-627)129511676 (DE-600)210328-X (DE-576)014919141 0001-5970 nnns volume:225 year:2014 number:7 day:29 month:01 pages:2111-2131 https://doi.org/10.1007/s00707-013-1080-2 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_22 GBV_ILN_59 GBV_ILN_70 GBV_ILN_2020 GBV_ILN_4700 AR 225 2014 7 29 01 2111-2131 |
| allfields_unstemmed |
10.1007/s00707-013-1080-2 doi (DE-627)OLC203014102X (DE-He213)s00707-013-1080-2-p DE-627 ger DE-627 rakwb eng 530 VZ Choi, Hyung Jip verfasserin aut Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer 2014 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag Wien 2014 Abstract This paper deals with the thermoelasticity problem of bonded dissimilar half-planes with a functionally graded interlayer, weakened by a pair of two offset interfacial cracks. The material nonhomogeneity in the graded interlayer is represented by spatially varying thermoelastic moduli expressed in terms of exponential functions. The cracks are assumed to be thermally insulated disturbing a steady-state uniform heat flow, and the solution is obtained within the framework of linear plane thermoelasticity. The Fourier integral transform method is employed, and the formulation of the current nonisothermal crack problem is reduced to two sets of Cauchy-type singular integral equations for temperature and thermal stress fields in the bonded system. In the numerical results, parametric studies are conducted so that the variations in mixed-mode thermal stress intensity factors are presented as a function of offset crack distance for various geometric and material combinations of the dissimilar homogeneous media bonded through the thermoelastically graded interlayer, elaborating thermally induced singular interaction of the two neighboring interfacial cracks. Thermal Stress Stress Intensity Factor Interfacial Crack Thermal Stress Analysis Crack Interaction Enthalten in Acta mechanica Springer Vienna, 1965 225(2014), 7 vom: 29. Jan., Seite 2111-2131 (DE-627)129511676 (DE-600)210328-X (DE-576)014919141 0001-5970 nnns volume:225 year:2014 number:7 day:29 month:01 pages:2111-2131 https://doi.org/10.1007/s00707-013-1080-2 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_22 GBV_ILN_59 GBV_ILN_70 GBV_ILN_2020 GBV_ILN_4700 AR 225 2014 7 29 01 2111-2131 |
| allfieldsGer |
10.1007/s00707-013-1080-2 doi (DE-627)OLC203014102X (DE-He213)s00707-013-1080-2-p DE-627 ger DE-627 rakwb eng 530 VZ Choi, Hyung Jip verfasserin aut Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer 2014 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag Wien 2014 Abstract This paper deals with the thermoelasticity problem of bonded dissimilar half-planes with a functionally graded interlayer, weakened by a pair of two offset interfacial cracks. The material nonhomogeneity in the graded interlayer is represented by spatially varying thermoelastic moduli expressed in terms of exponential functions. The cracks are assumed to be thermally insulated disturbing a steady-state uniform heat flow, and the solution is obtained within the framework of linear plane thermoelasticity. The Fourier integral transform method is employed, and the formulation of the current nonisothermal crack problem is reduced to two sets of Cauchy-type singular integral equations for temperature and thermal stress fields in the bonded system. In the numerical results, parametric studies are conducted so that the variations in mixed-mode thermal stress intensity factors are presented as a function of offset crack distance for various geometric and material combinations of the dissimilar homogeneous media bonded through the thermoelastically graded interlayer, elaborating thermally induced singular interaction of the two neighboring interfacial cracks. Thermal Stress Stress Intensity Factor Interfacial Crack Thermal Stress Analysis Crack Interaction Enthalten in Acta mechanica Springer Vienna, 1965 225(2014), 7 vom: 29. Jan., Seite 2111-2131 (DE-627)129511676 (DE-600)210328-X (DE-576)014919141 0001-5970 nnns volume:225 year:2014 number:7 day:29 month:01 pages:2111-2131 https://doi.org/10.1007/s00707-013-1080-2 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_22 GBV_ILN_59 GBV_ILN_70 GBV_ILN_2020 GBV_ILN_4700 AR 225 2014 7 29 01 2111-2131 |
| allfieldsSound |
10.1007/s00707-013-1080-2 doi (DE-627)OLC203014102X (DE-He213)s00707-013-1080-2-p DE-627 ger DE-627 rakwb eng 530 VZ Choi, Hyung Jip verfasserin aut Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer 2014 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag Wien 2014 Abstract This paper deals with the thermoelasticity problem of bonded dissimilar half-planes with a functionally graded interlayer, weakened by a pair of two offset interfacial cracks. The material nonhomogeneity in the graded interlayer is represented by spatially varying thermoelastic moduli expressed in terms of exponential functions. The cracks are assumed to be thermally insulated disturbing a steady-state uniform heat flow, and the solution is obtained within the framework of linear plane thermoelasticity. The Fourier integral transform method is employed, and the formulation of the current nonisothermal crack problem is reduced to two sets of Cauchy-type singular integral equations for temperature and thermal stress fields in the bonded system. In the numerical results, parametric studies are conducted so that the variations in mixed-mode thermal stress intensity factors are presented as a function of offset crack distance for various geometric and material combinations of the dissimilar homogeneous media bonded through the thermoelastically graded interlayer, elaborating thermally induced singular interaction of the two neighboring interfacial cracks. Thermal Stress Stress Intensity Factor Interfacial Crack Thermal Stress Analysis Crack Interaction Enthalten in Acta mechanica Springer Vienna, 1965 225(2014), 7 vom: 29. Jan., Seite 2111-2131 (DE-627)129511676 (DE-600)210328-X (DE-576)014919141 0001-5970 nnns volume:225 year:2014 number:7 day:29 month:01 pages:2111-2131 https://doi.org/10.1007/s00707-013-1080-2 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_22 GBV_ILN_59 GBV_ILN_70 GBV_ILN_2020 GBV_ILN_4700 AR 225 2014 7 29 01 2111-2131 |
| language |
English |
| source |
Enthalten in Acta mechanica 225(2014), 7 vom: 29. Jan., Seite 2111-2131 volume:225 year:2014 number:7 day:29 month:01 pages:2111-2131 |
| sourceStr |
Enthalten in Acta mechanica 225(2014), 7 vom: 29. Jan., Seite 2111-2131 volume:225 year:2014 number:7 day:29 month:01 pages:2111-2131 |
| format_phy_str_mv |
Article |
| institution |
findex.gbv.de |
| topic_facet |
Thermal Stress Stress Intensity Factor Interfacial Crack Thermal Stress Analysis Crack Interaction |
| dewey-raw |
530 |
| isfreeaccess_bool |
false |
| container_title |
Acta mechanica |
| authorswithroles_txt_mv |
Choi, Hyung Jip @@aut@@ |
| publishDateDaySort_date |
2014-01-29T00:00:00Z |
| hierarchy_top_id |
129511676 |
| dewey-sort |
3530 |
| id |
OLC203014102X |
| language_de |
englisch |
| fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">OLC203014102X</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230502143300.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">200820s2014 xx ||||| 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/s00707-013-1080-2</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC203014102X</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-He213)s00707-013-1080-2-p</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">530</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Choi, Hyung Jip</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2014</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© Springer-Verlag Wien 2014</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract This paper deals with the thermoelasticity problem of bonded dissimilar half-planes with a functionally graded interlayer, weakened by a pair of two offset interfacial cracks. The material nonhomogeneity in the graded interlayer is represented by spatially varying thermoelastic moduli expressed in terms of exponential functions. The cracks are assumed to be thermally insulated disturbing a steady-state uniform heat flow, and the solution is obtained within the framework of linear plane thermoelasticity. The Fourier integral transform method is employed, and the formulation of the current nonisothermal crack problem is reduced to two sets of Cauchy-type singular integral equations for temperature and thermal stress fields in the bonded system. In the numerical results, parametric studies are conducted so that the variations in mixed-mode thermal stress intensity factors are presented as a function of offset crack distance for various geometric and material combinations of the dissimilar homogeneous media bonded through the thermoelastically graded interlayer, elaborating thermally induced singular interaction of the two neighboring interfacial cracks.</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thermal Stress</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Stress Intensity Factor</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Interfacial Crack</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thermal Stress Analysis</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Crack Interaction</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Acta mechanica</subfield><subfield code="d">Springer Vienna, 1965</subfield><subfield code="g">225(2014), 7 vom: 29. Jan., Seite 2111-2131</subfield><subfield code="w">(DE-627)129511676</subfield><subfield code="w">(DE-600)210328-X</subfield><subfield code="w">(DE-576)014919141</subfield><subfield code="x">0001-5970</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:225</subfield><subfield code="g">year:2014</subfield><subfield code="g">number:7</subfield><subfield code="g">day:29</subfield><subfield code="g">month:01</subfield><subfield code="g">pages:2111-2131</subfield></datafield><datafield tag="856" ind1="4" ind2="1"><subfield code="u">https://doi.org/10.1007/s00707-013-1080-2</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-TEC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-PHY</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_22</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_59</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2020</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4700</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">225</subfield><subfield code="j">2014</subfield><subfield code="e">7</subfield><subfield code="b">29</subfield><subfield code="c">01</subfield><subfield code="h">2111-2131</subfield></datafield></record></collection>
|
| author |
Choi, Hyung Jip |
| spellingShingle |
Choi, Hyung Jip ddc 530 misc Thermal Stress misc Stress Intensity Factor misc Interfacial Crack misc Thermal Stress Analysis misc Crack Interaction Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer |
| authorStr |
Choi, Hyung Jip |
| ppnlink_with_tag_str_mv |
@@773@@(DE-627)129511676 |
| format |
Article |
| dewey-ones |
530 - Physics |
| delete_txt_mv |
keep |
| author_role |
aut |
| collection |
OLC |
| remote_str |
false |
| illustrated |
Not Illustrated |
| issn |
0001-5970 |
| topic_title |
530 VZ Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer Thermal Stress Stress Intensity Factor Interfacial Crack Thermal Stress Analysis Crack Interaction |
| topic |
ddc 530 misc Thermal Stress misc Stress Intensity Factor misc Interfacial Crack misc Thermal Stress Analysis misc Crack Interaction |
| topic_unstemmed |
ddc 530 misc Thermal Stress misc Stress Intensity Factor misc Interfacial Crack misc Thermal Stress Analysis misc Crack Interaction |
| topic_browse |
ddc 530 misc Thermal Stress misc Stress Intensity Factor misc Interfacial Crack misc Thermal Stress Analysis misc Crack Interaction |
| format_facet |
Aufsätze Gedruckte Aufsätze |
| format_main_str_mv |
Text Zeitschrift/Artikel |
| carriertype_str_mv |
nc |
| hierarchy_parent_title |
Acta mechanica |
| hierarchy_parent_id |
129511676 |
| dewey-tens |
530 - Physics |
| hierarchy_top_title |
Acta mechanica |
| isfreeaccess_txt |
false |
| familylinks_str_mv |
(DE-627)129511676 (DE-600)210328-X (DE-576)014919141 |
| title |
Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer |
| ctrlnum |
(DE-627)OLC203014102X (DE-He213)s00707-013-1080-2-p |
| title_full |
Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer |
| author_sort |
Choi, Hyung Jip |
| journal |
Acta mechanica |
| journalStr |
Acta mechanica |
| lang_code |
eng |
| isOA_bool |
false |
| dewey-hundreds |
500 - Science |
| recordtype |
marc |
| publishDateSort |
2014 |
| contenttype_str_mv |
txt |
| container_start_page |
2111 |
| author_browse |
Choi, Hyung Jip |
| container_volume |
225 |
| class |
530 VZ |
| format_se |
Aufsätze |
| author-letter |
Choi, Hyung Jip |
| doi_str_mv |
10.1007/s00707-013-1080-2 |
| dewey-full |
530 |
| title_sort |
thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer |
| title_auth |
Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer |
| abstract |
Abstract This paper deals with the thermoelasticity problem of bonded dissimilar half-planes with a functionally graded interlayer, weakened by a pair of two offset interfacial cracks. The material nonhomogeneity in the graded interlayer is represented by spatially varying thermoelastic moduli expressed in terms of exponential functions. The cracks are assumed to be thermally insulated disturbing a steady-state uniform heat flow, and the solution is obtained within the framework of linear plane thermoelasticity. The Fourier integral transform method is employed, and the formulation of the current nonisothermal crack problem is reduced to two sets of Cauchy-type singular integral equations for temperature and thermal stress fields in the bonded system. In the numerical results, parametric studies are conducted so that the variations in mixed-mode thermal stress intensity factors are presented as a function of offset crack distance for various geometric and material combinations of the dissimilar homogeneous media bonded through the thermoelastically graded interlayer, elaborating thermally induced singular interaction of the two neighboring interfacial cracks. © Springer-Verlag Wien 2014 |
| abstractGer |
Abstract This paper deals with the thermoelasticity problem of bonded dissimilar half-planes with a functionally graded interlayer, weakened by a pair of two offset interfacial cracks. The material nonhomogeneity in the graded interlayer is represented by spatially varying thermoelastic moduli expressed in terms of exponential functions. The cracks are assumed to be thermally insulated disturbing a steady-state uniform heat flow, and the solution is obtained within the framework of linear plane thermoelasticity. The Fourier integral transform method is employed, and the formulation of the current nonisothermal crack problem is reduced to two sets of Cauchy-type singular integral equations for temperature and thermal stress fields in the bonded system. In the numerical results, parametric studies are conducted so that the variations in mixed-mode thermal stress intensity factors are presented as a function of offset crack distance for various geometric and material combinations of the dissimilar homogeneous media bonded through the thermoelastically graded interlayer, elaborating thermally induced singular interaction of the two neighboring interfacial cracks. © Springer-Verlag Wien 2014 |
| abstract_unstemmed |
Abstract This paper deals with the thermoelasticity problem of bonded dissimilar half-planes with a functionally graded interlayer, weakened by a pair of two offset interfacial cracks. The material nonhomogeneity in the graded interlayer is represented by spatially varying thermoelastic moduli expressed in terms of exponential functions. The cracks are assumed to be thermally insulated disturbing a steady-state uniform heat flow, and the solution is obtained within the framework of linear plane thermoelasticity. The Fourier integral transform method is employed, and the formulation of the current nonisothermal crack problem is reduced to two sets of Cauchy-type singular integral equations for temperature and thermal stress fields in the bonded system. In the numerical results, parametric studies are conducted so that the variations in mixed-mode thermal stress intensity factors are presented as a function of offset crack distance for various geometric and material combinations of the dissimilar homogeneous media bonded through the thermoelastically graded interlayer, elaborating thermally induced singular interaction of the two neighboring interfacial cracks. © Springer-Verlag Wien 2014 |
| collection_details |
GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_22 GBV_ILN_59 GBV_ILN_70 GBV_ILN_2020 GBV_ILN_4700 |
| container_issue |
7 |
| title_short |
Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer |
| url |
https://doi.org/10.1007/s00707-013-1080-2 |
| remote_bool |
false |
| ppnlink |
129511676 |
| mediatype_str_mv |
n |
| isOA_txt |
false |
| hochschulschrift_bool |
false |
| doi_str |
10.1007/s00707-013-1080-2 |
| up_date |
2024-07-04T01:23:00.865Z |
| _version_ |
1803609629906698240 |
| fullrecord_marcxml |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">OLC203014102X</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230502143300.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">200820s2014 xx ||||| 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/s00707-013-1080-2</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC203014102X</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-He213)s00707-013-1080-2-p</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">530</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Choi, Hyung Jip</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2014</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© Springer-Verlag Wien 2014</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract This paper deals with the thermoelasticity problem of bonded dissimilar half-planes with a functionally graded interlayer, weakened by a pair of two offset interfacial cracks. The material nonhomogeneity in the graded interlayer is represented by spatially varying thermoelastic moduli expressed in terms of exponential functions. The cracks are assumed to be thermally insulated disturbing a steady-state uniform heat flow, and the solution is obtained within the framework of linear plane thermoelasticity. The Fourier integral transform method is employed, and the formulation of the current nonisothermal crack problem is reduced to two sets of Cauchy-type singular integral equations for temperature and thermal stress fields in the bonded system. In the numerical results, parametric studies are conducted so that the variations in mixed-mode thermal stress intensity factors are presented as a function of offset crack distance for various geometric and material combinations of the dissimilar homogeneous media bonded through the thermoelastically graded interlayer, elaborating thermally induced singular interaction of the two neighboring interfacial cracks.</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thermal Stress</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Stress Intensity Factor</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Interfacial Crack</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thermal Stress Analysis</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Crack Interaction</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Acta mechanica</subfield><subfield code="d">Springer Vienna, 1965</subfield><subfield code="g">225(2014), 7 vom: 29. Jan., Seite 2111-2131</subfield><subfield code="w">(DE-627)129511676</subfield><subfield code="w">(DE-600)210328-X</subfield><subfield code="w">(DE-576)014919141</subfield><subfield code="x">0001-5970</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:225</subfield><subfield code="g">year:2014</subfield><subfield code="g">number:7</subfield><subfield code="g">day:29</subfield><subfield code="g">month:01</subfield><subfield code="g">pages:2111-2131</subfield></datafield><datafield tag="856" ind1="4" ind2="1"><subfield code="u">https://doi.org/10.1007/s00707-013-1080-2</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-TEC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-PHY</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_22</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_59</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2020</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4700</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">225</subfield><subfield code="j">2014</subfield><subfield code="e">7</subfield><subfield code="b">29</subfield><subfield code="c">01</subfield><subfield code="h">2111-2131</subfield></datafield></record></collection>
|
| score |
7.3979883 |