An analytical study on peeling of an adhesively bonded joint based on a viscoelastic Bernoulli–Euler beam model
Abstract Peeling of a thin film adhesively bonded to a rigid substrate is analytically studied using a Bernoulli–Euler beam theory for viscoelastic materials. The film (adherend) is modeled as a viscoelastic Bernoulli–Euler beam, and the normal and shear stresses on the film-adhesive interface are a...
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Gespeichert in:
| Autor*in: |
Gao, X.-L. [verfasserIn] |
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| Format: |
Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2015 |
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| Schlagwörter: |
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| Anmerkung: |
© Springer-Verlag Wien 2015 |
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| Übergeordnetes Werk: |
Enthalten in: Acta mechanica - Springer Vienna, 1965, 226(2015), 9 vom: 03. Mai, Seite 3059-3067 |
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| Übergeordnetes Werk: |
volume:226 ; year:2015 ; number:9 ; day:03 ; month:05 ; pages:3059-3067 |
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| DOI / URN: |
10.1007/s00707-015-1357-8 |
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OLC2030143928 |
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| 245 | 1 | 0 | |a An analytical study on peeling of an adhesively bonded joint based on a viscoelastic Bernoulli–Euler beam model |
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| 520 | |a Abstract Peeling of a thin film adhesively bonded to a rigid substrate is analytically studied using a Bernoulli–Euler beam theory for viscoelastic materials. The film (adherend) is modeled as a viscoelastic Bernoulli–Euler beam, and the normal and shear stresses on the film-adhesive interface are assumed to satisfy constant traction laws. Closed-form solutions are derived for the following two cases: (i) only the interfacial normal stress is present (mode I loading) and (ii) the interfacial shear stress is acting alone (mode II loading). The Boltzmann superposition integral is used to obtain the constitutive relations for the viscoelastic beam, and the methods of separation of variables and Laplace transforms are employed in the formulation. To illustrate the newly derived analytical solutions, sample cases are quantitatively studied. The three-parameter Kohlrausch–Williams–Watts model is adopted to compute the compliance. The numerical results show that both the vertical displacement under mode I loading and the horizontal displacement under mode II loading increase with time and/or temperature. | ||
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10.1007/s00707-015-1357-8 doi (DE-627)OLC2030143928 (DE-He213)s00707-015-1357-8-p DE-627 ger DE-627 rakwb eng 530 VZ Gao, X.-L. verfasserin aut An analytical study on peeling of an adhesively bonded joint based on a viscoelastic Bernoulli–Euler beam model 2015 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag Wien 2015 Abstract Peeling of a thin film adhesively bonded to a rigid substrate is analytically studied using a Bernoulli–Euler beam theory for viscoelastic materials. The film (adherend) is modeled as a viscoelastic Bernoulli–Euler beam, and the normal and shear stresses on the film-adhesive interface are assumed to satisfy constant traction laws. Closed-form solutions are derived for the following two cases: (i) only the interfacial normal stress is present (mode I loading) and (ii) the interfacial shear stress is acting alone (mode II loading). The Boltzmann superposition integral is used to obtain the constitutive relations for the viscoelastic beam, and the methods of separation of variables and Laplace transforms are employed in the formulation. To illustrate the newly derived analytical solutions, sample cases are quantitatively studied. The three-parameter Kohlrausch–Williams–Watts model is adopted to compute the compliance. The numerical results show that both the vertical displacement under mode I loading and the horizontal displacement under mode II loading increase with time and/or temperature. Timoshenko Beam Adhesive Joint Interfacial Shear Stress Cohesive Zone Model Peel Test Su, Y.-Y. aut Enthalten in Acta mechanica Springer Vienna, 1965 226(2015), 9 vom: 03. Mai, Seite 3059-3067 (DE-627)129511676 (DE-600)210328-X (DE-576)014919141 0001-5970 nnns volume:226 year:2015 number:9 day:03 month:05 pages:3059-3067 https://doi.org/10.1007/s00707-015-1357-8 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_22 GBV_ILN_59 GBV_ILN_70 GBV_ILN_4700 AR 226 2015 9 03 05 3059-3067 |
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10.1007/s00707-015-1357-8 doi (DE-627)OLC2030143928 (DE-He213)s00707-015-1357-8-p DE-627 ger DE-627 rakwb eng 530 VZ Gao, X.-L. verfasserin aut An analytical study on peeling of an adhesively bonded joint based on a viscoelastic Bernoulli–Euler beam model 2015 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag Wien 2015 Abstract Peeling of a thin film adhesively bonded to a rigid substrate is analytically studied using a Bernoulli–Euler beam theory for viscoelastic materials. The film (adherend) is modeled as a viscoelastic Bernoulli–Euler beam, and the normal and shear stresses on the film-adhesive interface are assumed to satisfy constant traction laws. Closed-form solutions are derived for the following two cases: (i) only the interfacial normal stress is present (mode I loading) and (ii) the interfacial shear stress is acting alone (mode II loading). The Boltzmann superposition integral is used to obtain the constitutive relations for the viscoelastic beam, and the methods of separation of variables and Laplace transforms are employed in the formulation. To illustrate the newly derived analytical solutions, sample cases are quantitatively studied. The three-parameter Kohlrausch–Williams–Watts model is adopted to compute the compliance. The numerical results show that both the vertical displacement under mode I loading and the horizontal displacement under mode II loading increase with time and/or temperature. Timoshenko Beam Adhesive Joint Interfacial Shear Stress Cohesive Zone Model Peel Test Su, Y.-Y. aut Enthalten in Acta mechanica Springer Vienna, 1965 226(2015), 9 vom: 03. Mai, Seite 3059-3067 (DE-627)129511676 (DE-600)210328-X (DE-576)014919141 0001-5970 nnns volume:226 year:2015 number:9 day:03 month:05 pages:3059-3067 https://doi.org/10.1007/s00707-015-1357-8 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_22 GBV_ILN_59 GBV_ILN_70 GBV_ILN_4700 AR 226 2015 9 03 05 3059-3067 |
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10.1007/s00707-015-1357-8 doi (DE-627)OLC2030143928 (DE-He213)s00707-015-1357-8-p DE-627 ger DE-627 rakwb eng 530 VZ Gao, X.-L. verfasserin aut An analytical study on peeling of an adhesively bonded joint based on a viscoelastic Bernoulli–Euler beam model 2015 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag Wien 2015 Abstract Peeling of a thin film adhesively bonded to a rigid substrate is analytically studied using a Bernoulli–Euler beam theory for viscoelastic materials. The film (adherend) is modeled as a viscoelastic Bernoulli–Euler beam, and the normal and shear stresses on the film-adhesive interface are assumed to satisfy constant traction laws. Closed-form solutions are derived for the following two cases: (i) only the interfacial normal stress is present (mode I loading) and (ii) the interfacial shear stress is acting alone (mode II loading). The Boltzmann superposition integral is used to obtain the constitutive relations for the viscoelastic beam, and the methods of separation of variables and Laplace transforms are employed in the formulation. To illustrate the newly derived analytical solutions, sample cases are quantitatively studied. The three-parameter Kohlrausch–Williams–Watts model is adopted to compute the compliance. The numerical results show that both the vertical displacement under mode I loading and the horizontal displacement under mode II loading increase with time and/or temperature. Timoshenko Beam Adhesive Joint Interfacial Shear Stress Cohesive Zone Model Peel Test Su, Y.-Y. aut Enthalten in Acta mechanica Springer Vienna, 1965 226(2015), 9 vom: 03. Mai, Seite 3059-3067 (DE-627)129511676 (DE-600)210328-X (DE-576)014919141 0001-5970 nnns volume:226 year:2015 number:9 day:03 month:05 pages:3059-3067 https://doi.org/10.1007/s00707-015-1357-8 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_22 GBV_ILN_59 GBV_ILN_70 GBV_ILN_4700 AR 226 2015 9 03 05 3059-3067 |
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10.1007/s00707-015-1357-8 doi (DE-627)OLC2030143928 (DE-He213)s00707-015-1357-8-p DE-627 ger DE-627 rakwb eng 530 VZ Gao, X.-L. verfasserin aut An analytical study on peeling of an adhesively bonded joint based on a viscoelastic Bernoulli–Euler beam model 2015 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag Wien 2015 Abstract Peeling of a thin film adhesively bonded to a rigid substrate is analytically studied using a Bernoulli–Euler beam theory for viscoelastic materials. The film (adherend) is modeled as a viscoelastic Bernoulli–Euler beam, and the normal and shear stresses on the film-adhesive interface are assumed to satisfy constant traction laws. Closed-form solutions are derived for the following two cases: (i) only the interfacial normal stress is present (mode I loading) and (ii) the interfacial shear stress is acting alone (mode II loading). The Boltzmann superposition integral is used to obtain the constitutive relations for the viscoelastic beam, and the methods of separation of variables and Laplace transforms are employed in the formulation. To illustrate the newly derived analytical solutions, sample cases are quantitatively studied. The three-parameter Kohlrausch–Williams–Watts model is adopted to compute the compliance. The numerical results show that both the vertical displacement under mode I loading and the horizontal displacement under mode II loading increase with time and/or temperature. Timoshenko Beam Adhesive Joint Interfacial Shear Stress Cohesive Zone Model Peel Test Su, Y.-Y. aut Enthalten in Acta mechanica Springer Vienna, 1965 226(2015), 9 vom: 03. Mai, Seite 3059-3067 (DE-627)129511676 (DE-600)210328-X (DE-576)014919141 0001-5970 nnns volume:226 year:2015 number:9 day:03 month:05 pages:3059-3067 https://doi.org/10.1007/s00707-015-1357-8 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_22 GBV_ILN_59 GBV_ILN_70 GBV_ILN_4700 AR 226 2015 9 03 05 3059-3067 |
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10.1007/s00707-015-1357-8 doi (DE-627)OLC2030143928 (DE-He213)s00707-015-1357-8-p DE-627 ger DE-627 rakwb eng 530 VZ Gao, X.-L. verfasserin aut An analytical study on peeling of an adhesively bonded joint based on a viscoelastic Bernoulli–Euler beam model 2015 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag Wien 2015 Abstract Peeling of a thin film adhesively bonded to a rigid substrate is analytically studied using a Bernoulli–Euler beam theory for viscoelastic materials. The film (adherend) is modeled as a viscoelastic Bernoulli–Euler beam, and the normal and shear stresses on the film-adhesive interface are assumed to satisfy constant traction laws. Closed-form solutions are derived for the following two cases: (i) only the interfacial normal stress is present (mode I loading) and (ii) the interfacial shear stress is acting alone (mode II loading). The Boltzmann superposition integral is used to obtain the constitutive relations for the viscoelastic beam, and the methods of separation of variables and Laplace transforms are employed in the formulation. To illustrate the newly derived analytical solutions, sample cases are quantitatively studied. The three-parameter Kohlrausch–Williams–Watts model is adopted to compute the compliance. The numerical results show that both the vertical displacement under mode I loading and the horizontal displacement under mode II loading increase with time and/or temperature. Timoshenko Beam Adhesive Joint Interfacial Shear Stress Cohesive Zone Model Peel Test Su, Y.-Y. aut Enthalten in Acta mechanica Springer Vienna, 1965 226(2015), 9 vom: 03. Mai, Seite 3059-3067 (DE-627)129511676 (DE-600)210328-X (DE-576)014919141 0001-5970 nnns volume:226 year:2015 number:9 day:03 month:05 pages:3059-3067 https://doi.org/10.1007/s00707-015-1357-8 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_22 GBV_ILN_59 GBV_ILN_70 GBV_ILN_4700 AR 226 2015 9 03 05 3059-3067 |
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an analytical study on peeling of an adhesively bonded joint based on a viscoelastic bernoulli–euler beam model |
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An analytical study on peeling of an adhesively bonded joint based on a viscoelastic Bernoulli–Euler beam model |
| abstract |
Abstract Peeling of a thin film adhesively bonded to a rigid substrate is analytically studied using a Bernoulli–Euler beam theory for viscoelastic materials. The film (adherend) is modeled as a viscoelastic Bernoulli–Euler beam, and the normal and shear stresses on the film-adhesive interface are assumed to satisfy constant traction laws. Closed-form solutions are derived for the following two cases: (i) only the interfacial normal stress is present (mode I loading) and (ii) the interfacial shear stress is acting alone (mode II loading). The Boltzmann superposition integral is used to obtain the constitutive relations for the viscoelastic beam, and the methods of separation of variables and Laplace transforms are employed in the formulation. To illustrate the newly derived analytical solutions, sample cases are quantitatively studied. The three-parameter Kohlrausch–Williams–Watts model is adopted to compute the compliance. The numerical results show that both the vertical displacement under mode I loading and the horizontal displacement under mode II loading increase with time and/or temperature. © Springer-Verlag Wien 2015 |
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Abstract Peeling of a thin film adhesively bonded to a rigid substrate is analytically studied using a Bernoulli–Euler beam theory for viscoelastic materials. The film (adherend) is modeled as a viscoelastic Bernoulli–Euler beam, and the normal and shear stresses on the film-adhesive interface are assumed to satisfy constant traction laws. Closed-form solutions are derived for the following two cases: (i) only the interfacial normal stress is present (mode I loading) and (ii) the interfacial shear stress is acting alone (mode II loading). The Boltzmann superposition integral is used to obtain the constitutive relations for the viscoelastic beam, and the methods of separation of variables and Laplace transforms are employed in the formulation. To illustrate the newly derived analytical solutions, sample cases are quantitatively studied. The three-parameter Kohlrausch–Williams–Watts model is adopted to compute the compliance. The numerical results show that both the vertical displacement under mode I loading and the horizontal displacement under mode II loading increase with time and/or temperature. © Springer-Verlag Wien 2015 |
| abstract_unstemmed |
Abstract Peeling of a thin film adhesively bonded to a rigid substrate is analytically studied using a Bernoulli–Euler beam theory for viscoelastic materials. The film (adherend) is modeled as a viscoelastic Bernoulli–Euler beam, and the normal and shear stresses on the film-adhesive interface are assumed to satisfy constant traction laws. Closed-form solutions are derived for the following two cases: (i) only the interfacial normal stress is present (mode I loading) and (ii) the interfacial shear stress is acting alone (mode II loading). The Boltzmann superposition integral is used to obtain the constitutive relations for the viscoelastic beam, and the methods of separation of variables and Laplace transforms are employed in the formulation. To illustrate the newly derived analytical solutions, sample cases are quantitatively studied. The three-parameter Kohlrausch–Williams–Watts model is adopted to compute the compliance. The numerical results show that both the vertical displacement under mode I loading and the horizontal displacement under mode II loading increase with time and/or temperature. © Springer-Verlag Wien 2015 |
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| title_short |
An analytical study on peeling of an adhesively bonded joint based on a viscoelastic Bernoulli–Euler beam model |
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https://doi.org/10.1007/s00707-015-1357-8 |
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Su, Y.-Y. |
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