Facial fabrication of paper-based flexible electronics with flash foam stamp lithography
Abstract Paper-based flexible electronics/circuit have a bright potential in displays, transistor and sensors due to low cost and disposability. Here we presented a facile microfabrication method for paper-based flexible electronics with flash foam stamp lithography (FFSL), which can be implemented...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Yao, XinHua [verfasserIn] |
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| Format: |
Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2016 |
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| Schlagwörter: |
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| Anmerkung: |
© Springer-Verlag Berlin Heidelberg 2016 |
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| Übergeordnetes Werk: |
Enthalten in: Microsystem technologies - Springer Berlin Heidelberg, 1994, 23(2016), 10 vom: 19. Nov., Seite 4419-4426 |
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| Übergeordnetes Werk: |
volume:23 ; year:2016 ; number:10 ; day:19 ; month:11 ; pages:4419-4426 |
| Links: |
|---|
| DOI / URN: |
10.1007/s00542-016-3207-6 |
|---|
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OLC2034949935 |
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| 520 | |a Abstract Paper-based flexible electronics/circuit have a bright potential in displays, transistor and sensors due to low cost and disposability. Here we presented a facile microfabrication method for paper-based flexible electronics with flash foam stamp lithography (FFSL), which can be implemented in resource-limited laboratory. Only two steps are needed. Firstly, negative patterns of circuit are stamped on the paper with polydimethylsiloxane (PDMS) ink to form hydrophobic barriers after PDMS is solidified. Then the patterned paper is immersed in the conductive ink to absorb ink and acquire circuits. In this paper we present foldable, waterproof and multi-layer paper-based flexible electronics can be easily fabricated. Also as FFSL can be also directly used in fabrication of microfluidic paper-based analytical devices (μPADs), this method has a promising potential in fabricating electrodes of μPADs. | ||
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10.1007/s00542-016-3207-6 doi (DE-627)OLC2034949935 (DE-He213)s00542-016-3207-6-p DE-627 ger DE-627 rakwb eng 620 VZ 510 VZ Yao, XinHua verfasserin aut Facial fabrication of paper-based flexible electronics with flash foam stamp lithography 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag Berlin Heidelberg 2016 Abstract Paper-based flexible electronics/circuit have a bright potential in displays, transistor and sensors due to low cost and disposability. Here we presented a facile microfabrication method for paper-based flexible electronics with flash foam stamp lithography (FFSL), which can be implemented in resource-limited laboratory. Only two steps are needed. Firstly, negative patterns of circuit are stamped on the paper with polydimethylsiloxane (PDMS) ink to form hydrophobic barriers after PDMS is solidified. Then the patterned paper is immersed in the conductive ink to absorb ink and acquire circuits. In this paper we present foldable, waterproof and multi-layer paper-based flexible electronics can be easily fabricated. Also as FFSL can be also directly used in fabrication of microfluidic paper-based analytical devices (μPADs), this method has a promising potential in fabricating electrodes of μPADs. PDMS Print Circuit Board Conductive Line Hydrophobic Barrier Hydrophilic Channel Jia, Tian aut Xie, ChaoQi aut Fu, JianZhong aut He, Yong aut Enthalten in Microsystem technologies Springer Berlin Heidelberg, 1994 23(2016), 10 vom: 19. Nov., Seite 4419-4426 (DE-627)182644278 (DE-600)1223008-X (DE-576)045302146 0946-7076 nnns volume:23 year:2016 number:10 day:19 month:11 pages:4419-4426 https://doi.org/10.1007/s00542-016-3207-6 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-MAT SSG-OPC-MAT GBV_ILN_70 GBV_ILN_267 GBV_ILN_2018 GBV_ILN_4277 AR 23 2016 10 19 11 4419-4426 |
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10.1007/s00542-016-3207-6 doi (DE-627)OLC2034949935 (DE-He213)s00542-016-3207-6-p DE-627 ger DE-627 rakwb eng 620 VZ 510 VZ Yao, XinHua verfasserin aut Facial fabrication of paper-based flexible electronics with flash foam stamp lithography 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag Berlin Heidelberg 2016 Abstract Paper-based flexible electronics/circuit have a bright potential in displays, transistor and sensors due to low cost and disposability. Here we presented a facile microfabrication method for paper-based flexible electronics with flash foam stamp lithography (FFSL), which can be implemented in resource-limited laboratory. Only two steps are needed. Firstly, negative patterns of circuit are stamped on the paper with polydimethylsiloxane (PDMS) ink to form hydrophobic barriers after PDMS is solidified. Then the patterned paper is immersed in the conductive ink to absorb ink and acquire circuits. In this paper we present foldable, waterproof and multi-layer paper-based flexible electronics can be easily fabricated. Also as FFSL can be also directly used in fabrication of microfluidic paper-based analytical devices (μPADs), this method has a promising potential in fabricating electrodes of μPADs. PDMS Print Circuit Board Conductive Line Hydrophobic Barrier Hydrophilic Channel Jia, Tian aut Xie, ChaoQi aut Fu, JianZhong aut He, Yong aut Enthalten in Microsystem technologies Springer Berlin Heidelberg, 1994 23(2016), 10 vom: 19. Nov., Seite 4419-4426 (DE-627)182644278 (DE-600)1223008-X (DE-576)045302146 0946-7076 nnns volume:23 year:2016 number:10 day:19 month:11 pages:4419-4426 https://doi.org/10.1007/s00542-016-3207-6 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-MAT SSG-OPC-MAT GBV_ILN_70 GBV_ILN_267 GBV_ILN_2018 GBV_ILN_4277 AR 23 2016 10 19 11 4419-4426 |
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10.1007/s00542-016-3207-6 doi (DE-627)OLC2034949935 (DE-He213)s00542-016-3207-6-p DE-627 ger DE-627 rakwb eng 620 VZ 510 VZ Yao, XinHua verfasserin aut Facial fabrication of paper-based flexible electronics with flash foam stamp lithography 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag Berlin Heidelberg 2016 Abstract Paper-based flexible electronics/circuit have a bright potential in displays, transistor and sensors due to low cost and disposability. Here we presented a facile microfabrication method for paper-based flexible electronics with flash foam stamp lithography (FFSL), which can be implemented in resource-limited laboratory. Only two steps are needed. Firstly, negative patterns of circuit are stamped on the paper with polydimethylsiloxane (PDMS) ink to form hydrophobic barriers after PDMS is solidified. Then the patterned paper is immersed in the conductive ink to absorb ink and acquire circuits. In this paper we present foldable, waterproof and multi-layer paper-based flexible electronics can be easily fabricated. Also as FFSL can be also directly used in fabrication of microfluidic paper-based analytical devices (μPADs), this method has a promising potential in fabricating electrodes of μPADs. PDMS Print Circuit Board Conductive Line Hydrophobic Barrier Hydrophilic Channel Jia, Tian aut Xie, ChaoQi aut Fu, JianZhong aut He, Yong aut Enthalten in Microsystem technologies Springer Berlin Heidelberg, 1994 23(2016), 10 vom: 19. Nov., Seite 4419-4426 (DE-627)182644278 (DE-600)1223008-X (DE-576)045302146 0946-7076 nnns volume:23 year:2016 number:10 day:19 month:11 pages:4419-4426 https://doi.org/10.1007/s00542-016-3207-6 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-MAT SSG-OPC-MAT GBV_ILN_70 GBV_ILN_267 GBV_ILN_2018 GBV_ILN_4277 AR 23 2016 10 19 11 4419-4426 |
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10.1007/s00542-016-3207-6 doi (DE-627)OLC2034949935 (DE-He213)s00542-016-3207-6-p DE-627 ger DE-627 rakwb eng 620 VZ 510 VZ Yao, XinHua verfasserin aut Facial fabrication of paper-based flexible electronics with flash foam stamp lithography 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Springer-Verlag Berlin Heidelberg 2016 Abstract Paper-based flexible electronics/circuit have a bright potential in displays, transistor and sensors due to low cost and disposability. Here we presented a facile microfabrication method for paper-based flexible electronics with flash foam stamp lithography (FFSL), which can be implemented in resource-limited laboratory. Only two steps are needed. Firstly, negative patterns of circuit are stamped on the paper with polydimethylsiloxane (PDMS) ink to form hydrophobic barriers after PDMS is solidified. Then the patterned paper is immersed in the conductive ink to absorb ink and acquire circuits. In this paper we present foldable, waterproof and multi-layer paper-based flexible electronics can be easily fabricated. Also as FFSL can be also directly used in fabrication of microfluidic paper-based analytical devices (μPADs), this method has a promising potential in fabricating electrodes of μPADs. PDMS Print Circuit Board Conductive Line Hydrophobic Barrier Hydrophilic Channel Jia, Tian aut Xie, ChaoQi aut Fu, JianZhong aut He, Yong aut Enthalten in Microsystem technologies Springer Berlin Heidelberg, 1994 23(2016), 10 vom: 19. Nov., Seite 4419-4426 (DE-627)182644278 (DE-600)1223008-X (DE-576)045302146 0946-7076 nnns volume:23 year:2016 number:10 day:19 month:11 pages:4419-4426 https://doi.org/10.1007/s00542-016-3207-6 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-MAT SSG-OPC-MAT GBV_ILN_70 GBV_ILN_267 GBV_ILN_2018 GBV_ILN_4277 AR 23 2016 10 19 11 4419-4426 |
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Abstract Paper-based flexible electronics/circuit have a bright potential in displays, transistor and sensors due to low cost and disposability. Here we presented a facile microfabrication method for paper-based flexible electronics with flash foam stamp lithography (FFSL), which can be implemented in resource-limited laboratory. Only two steps are needed. Firstly, negative patterns of circuit are stamped on the paper with polydimethylsiloxane (PDMS) ink to form hydrophobic barriers after PDMS is solidified. Then the patterned paper is immersed in the conductive ink to absorb ink and acquire circuits. In this paper we present foldable, waterproof and multi-layer paper-based flexible electronics can be easily fabricated. Also as FFSL can be also directly used in fabrication of microfluidic paper-based analytical devices (μPADs), this method has a promising potential in fabricating electrodes of μPADs. © Springer-Verlag Berlin Heidelberg 2016 |
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Abstract Paper-based flexible electronics/circuit have a bright potential in displays, transistor and sensors due to low cost and disposability. Here we presented a facile microfabrication method for paper-based flexible electronics with flash foam stamp lithography (FFSL), which can be implemented in resource-limited laboratory. Only two steps are needed. Firstly, negative patterns of circuit are stamped on the paper with polydimethylsiloxane (PDMS) ink to form hydrophobic barriers after PDMS is solidified. Then the patterned paper is immersed in the conductive ink to absorb ink and acquire circuits. In this paper we present foldable, waterproof and multi-layer paper-based flexible electronics can be easily fabricated. Also as FFSL can be also directly used in fabrication of microfluidic paper-based analytical devices (μPADs), this method has a promising potential in fabricating electrodes of μPADs. © Springer-Verlag Berlin Heidelberg 2016 |
| abstract_unstemmed |
Abstract Paper-based flexible electronics/circuit have a bright potential in displays, transistor and sensors due to low cost and disposability. Here we presented a facile microfabrication method for paper-based flexible electronics with flash foam stamp lithography (FFSL), which can be implemented in resource-limited laboratory. Only two steps are needed. Firstly, negative patterns of circuit are stamped on the paper with polydimethylsiloxane (PDMS) ink to form hydrophobic barriers after PDMS is solidified. Then the patterned paper is immersed in the conductive ink to absorb ink and acquire circuits. In this paper we present foldable, waterproof and multi-layer paper-based flexible electronics can be easily fabricated. Also as FFSL can be also directly used in fabrication of microfluidic paper-based analytical devices (μPADs), this method has a promising potential in fabricating electrodes of μPADs. © Springer-Verlag Berlin Heidelberg 2016 |
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Facial fabrication of paper-based flexible electronics with flash foam stamp lithography |
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https://doi.org/10.1007/s00542-016-3207-6 |
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Jia, Tian Xie, ChaoQi Fu, JianZhong He, Yong |
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Jia, Tian Xie, ChaoQi Fu, JianZhong He, Yong |
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