Interfacial microstructure evolution in Pb-free solder systems
Abstract The Sn-3.5Ag and Sn-3.0Ag-0.5Cu ball-grid-array solder balls bonded onto Ni/Au metallization exhibited different interfacial morphology after both wetting and solid-state reactions. In contrast to the eutectic-SnPb solder system, both Pb-free systems showed higher solder-ball shear strength...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Lee, K. Y. [verfasserIn] |
|---|
| Format: |
Artikel |
|---|---|
| Sprache: |
Englisch |
| Erschienen: |
2003 |
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| Anmerkung: |
© TMS-The Minerals, Metals and Materials Society 2003 |
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| Übergeordnetes Werk: |
Enthalten in: Journal of electronic materials - Springer-Verlag, 1972, 32(2003), 8 vom: Aug., Seite 906-912 |
|---|---|
| Übergeordnetes Werk: |
volume:32 ; year:2003 ; number:8 ; month:08 ; pages:906-912 |
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| DOI / URN: |
10.1007/s11664-003-0208-x |
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| 520 | |a Abstract The Sn-3.5Ag and Sn-3.0Ag-0.5Cu ball-grid-array solder balls bonded onto Ni/Au metallization exhibited different interfacial morphology after both wetting and solid-state reactions. In contrast to the eutectic-SnPb solder system, both Pb-free systems showed higher solder-ball shear strength after annealing. Reprecipitation of Au as (Au,Ni)$ Sn_{4} $ at the interface, as shown in the eutectic-SnPb solder system, was not observed in both Pb-free solder systems. Instead, $ Ni_{3} $$ Sn_{4} $ and Cu-Sn-Ni-Au intermetallic compounds (IMCs) were found in the SnAg and SnAgCu systems, respectively. In the SnAgCu system, a thick, acicular-Cu-Sn-Ni IMC formed after wetting, but a faceted-Cu-Sn-Ni-Au phase was found with longer annealing. The growth of this interfacial phase in the Sn-3.0Ag-0.5Cu solder system was also slightly inhibited by the addition of Cu, with a formation energy of about 200 kJ/mol. | ||
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10.1007/s11664-003-0208-x doi (DE-627)OLC2042293032 (DE-He213)s11664-003-0208-x-p DE-627 ger DE-627 rakwb eng 670 VZ Lee, K. Y. verfasserin aut Interfacial microstructure evolution in Pb-free solder systems 2003 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © TMS-The Minerals, Metals and Materials Society 2003 Abstract The Sn-3.5Ag and Sn-3.0Ag-0.5Cu ball-grid-array solder balls bonded onto Ni/Au metallization exhibited different interfacial morphology after both wetting and solid-state reactions. In contrast to the eutectic-SnPb solder system, both Pb-free systems showed higher solder-ball shear strength after annealing. Reprecipitation of Au as (Au,Ni)$ Sn_{4} $ at the interface, as shown in the eutectic-SnPb solder system, was not observed in both Pb-free solder systems. Instead, $ Ni_{3} $$ Sn_{4} $ and Cu-Sn-Ni-Au intermetallic compounds (IMCs) were found in the SnAg and SnAgCu systems, respectively. In the SnAgCu system, a thick, acicular-Cu-Sn-Ni IMC formed after wetting, but a faceted-Cu-Sn-Ni-Au phase was found with longer annealing. The growth of this interfacial phase in the Sn-3.0Ag-0.5Cu solder system was also slightly inhibited by the addition of Cu, with a formation energy of about 200 kJ/mol. Li, M. aut Enthalten in Journal of electronic materials Springer-Verlag, 1972 32(2003), 8 vom: Aug., Seite 906-912 (DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 0361-5235 nnns volume:32 year:2003 number:8 month:08 pages:906-912 https://doi.org/10.1007/s11664-003-0208-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2006 GBV_ILN_2010 GBV_ILN_2020 GBV_ILN_4266 GBV_ILN_4319 AR 32 2003 8 08 906-912 |
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10.1007/s11664-003-0208-x doi (DE-627)OLC2042293032 (DE-He213)s11664-003-0208-x-p DE-627 ger DE-627 rakwb eng 670 VZ Lee, K. Y. verfasserin aut Interfacial microstructure evolution in Pb-free solder systems 2003 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © TMS-The Minerals, Metals and Materials Society 2003 Abstract The Sn-3.5Ag and Sn-3.0Ag-0.5Cu ball-grid-array solder balls bonded onto Ni/Au metallization exhibited different interfacial morphology after both wetting and solid-state reactions. In contrast to the eutectic-SnPb solder system, both Pb-free systems showed higher solder-ball shear strength after annealing. Reprecipitation of Au as (Au,Ni)$ Sn_{4} $ at the interface, as shown in the eutectic-SnPb solder system, was not observed in both Pb-free solder systems. Instead, $ Ni_{3} $$ Sn_{4} $ and Cu-Sn-Ni-Au intermetallic compounds (IMCs) were found in the SnAg and SnAgCu systems, respectively. In the SnAgCu system, a thick, acicular-Cu-Sn-Ni IMC formed after wetting, but a faceted-Cu-Sn-Ni-Au phase was found with longer annealing. The growth of this interfacial phase in the Sn-3.0Ag-0.5Cu solder system was also slightly inhibited by the addition of Cu, with a formation energy of about 200 kJ/mol. Li, M. aut Enthalten in Journal of electronic materials Springer-Verlag, 1972 32(2003), 8 vom: Aug., Seite 906-912 (DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 0361-5235 nnns volume:32 year:2003 number:8 month:08 pages:906-912 https://doi.org/10.1007/s11664-003-0208-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2006 GBV_ILN_2010 GBV_ILN_2020 GBV_ILN_4266 GBV_ILN_4319 AR 32 2003 8 08 906-912 |
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10.1007/s11664-003-0208-x doi (DE-627)OLC2042293032 (DE-He213)s11664-003-0208-x-p DE-627 ger DE-627 rakwb eng 670 VZ Lee, K. Y. verfasserin aut Interfacial microstructure evolution in Pb-free solder systems 2003 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © TMS-The Minerals, Metals and Materials Society 2003 Abstract The Sn-3.5Ag and Sn-3.0Ag-0.5Cu ball-grid-array solder balls bonded onto Ni/Au metallization exhibited different interfacial morphology after both wetting and solid-state reactions. In contrast to the eutectic-SnPb solder system, both Pb-free systems showed higher solder-ball shear strength after annealing. Reprecipitation of Au as (Au,Ni)$ Sn_{4} $ at the interface, as shown in the eutectic-SnPb solder system, was not observed in both Pb-free solder systems. Instead, $ Ni_{3} $$ Sn_{4} $ and Cu-Sn-Ni-Au intermetallic compounds (IMCs) were found in the SnAg and SnAgCu systems, respectively. In the SnAgCu system, a thick, acicular-Cu-Sn-Ni IMC formed after wetting, but a faceted-Cu-Sn-Ni-Au phase was found with longer annealing. The growth of this interfacial phase in the Sn-3.0Ag-0.5Cu solder system was also slightly inhibited by the addition of Cu, with a formation energy of about 200 kJ/mol. Li, M. aut Enthalten in Journal of electronic materials Springer-Verlag, 1972 32(2003), 8 vom: Aug., Seite 906-912 (DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 0361-5235 nnns volume:32 year:2003 number:8 month:08 pages:906-912 https://doi.org/10.1007/s11664-003-0208-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2006 GBV_ILN_2010 GBV_ILN_2020 GBV_ILN_4266 GBV_ILN_4319 AR 32 2003 8 08 906-912 |
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10.1007/s11664-003-0208-x doi (DE-627)OLC2042293032 (DE-He213)s11664-003-0208-x-p DE-627 ger DE-627 rakwb eng 670 VZ Lee, K. Y. verfasserin aut Interfacial microstructure evolution in Pb-free solder systems 2003 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © TMS-The Minerals, Metals and Materials Society 2003 Abstract The Sn-3.5Ag and Sn-3.0Ag-0.5Cu ball-grid-array solder balls bonded onto Ni/Au metallization exhibited different interfacial morphology after both wetting and solid-state reactions. In contrast to the eutectic-SnPb solder system, both Pb-free systems showed higher solder-ball shear strength after annealing. Reprecipitation of Au as (Au,Ni)$ Sn_{4} $ at the interface, as shown in the eutectic-SnPb solder system, was not observed in both Pb-free solder systems. Instead, $ Ni_{3} $$ Sn_{4} $ and Cu-Sn-Ni-Au intermetallic compounds (IMCs) were found in the SnAg and SnAgCu systems, respectively. In the SnAgCu system, a thick, acicular-Cu-Sn-Ni IMC formed after wetting, but a faceted-Cu-Sn-Ni-Au phase was found with longer annealing. The growth of this interfacial phase in the Sn-3.0Ag-0.5Cu solder system was also slightly inhibited by the addition of Cu, with a formation energy of about 200 kJ/mol. Li, M. aut Enthalten in Journal of electronic materials Springer-Verlag, 1972 32(2003), 8 vom: Aug., Seite 906-912 (DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 0361-5235 nnns volume:32 year:2003 number:8 month:08 pages:906-912 https://doi.org/10.1007/s11664-003-0208-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2006 GBV_ILN_2010 GBV_ILN_2020 GBV_ILN_4266 GBV_ILN_4319 AR 32 2003 8 08 906-912 |
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10.1007/s11664-003-0208-x doi (DE-627)OLC2042293032 (DE-He213)s11664-003-0208-x-p DE-627 ger DE-627 rakwb eng 670 VZ Lee, K. Y. verfasserin aut Interfacial microstructure evolution in Pb-free solder systems 2003 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © TMS-The Minerals, Metals and Materials Society 2003 Abstract The Sn-3.5Ag and Sn-3.0Ag-0.5Cu ball-grid-array solder balls bonded onto Ni/Au metallization exhibited different interfacial morphology after both wetting and solid-state reactions. In contrast to the eutectic-SnPb solder system, both Pb-free systems showed higher solder-ball shear strength after annealing. Reprecipitation of Au as (Au,Ni)$ Sn_{4} $ at the interface, as shown in the eutectic-SnPb solder system, was not observed in both Pb-free solder systems. Instead, $ Ni_{3} $$ Sn_{4} $ and Cu-Sn-Ni-Au intermetallic compounds (IMCs) were found in the SnAg and SnAgCu systems, respectively. In the SnAgCu system, a thick, acicular-Cu-Sn-Ni IMC formed after wetting, but a faceted-Cu-Sn-Ni-Au phase was found with longer annealing. The growth of this interfacial phase in the Sn-3.0Ag-0.5Cu solder system was also slightly inhibited by the addition of Cu, with a formation energy of about 200 kJ/mol. Li, M. aut Enthalten in Journal of electronic materials Springer-Verlag, 1972 32(2003), 8 vom: Aug., Seite 906-912 (DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 0361-5235 nnns volume:32 year:2003 number:8 month:08 pages:906-912 https://doi.org/10.1007/s11664-003-0208-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2006 GBV_ILN_2010 GBV_ILN_2020 GBV_ILN_4266 GBV_ILN_4319 AR 32 2003 8 08 906-912 |
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Abstract The Sn-3.5Ag and Sn-3.0Ag-0.5Cu ball-grid-array solder balls bonded onto Ni/Au metallization exhibited different interfacial morphology after both wetting and solid-state reactions. In contrast to the eutectic-SnPb solder system, both Pb-free systems showed higher solder-ball shear strength after annealing. Reprecipitation of Au as (Au,Ni)$ Sn_{4} $ at the interface, as shown in the eutectic-SnPb solder system, was not observed in both Pb-free solder systems. Instead, $ Ni_{3} $$ Sn_{4} $ and Cu-Sn-Ni-Au intermetallic compounds (IMCs) were found in the SnAg and SnAgCu systems, respectively. In the SnAgCu system, a thick, acicular-Cu-Sn-Ni IMC formed after wetting, but a faceted-Cu-Sn-Ni-Au phase was found with longer annealing. The growth of this interfacial phase in the Sn-3.0Ag-0.5Cu solder system was also slightly inhibited by the addition of Cu, with a formation energy of about 200 kJ/mol. © TMS-The Minerals, Metals and Materials Society 2003 |
| abstractGer |
Abstract The Sn-3.5Ag and Sn-3.0Ag-0.5Cu ball-grid-array solder balls bonded onto Ni/Au metallization exhibited different interfacial morphology after both wetting and solid-state reactions. In contrast to the eutectic-SnPb solder system, both Pb-free systems showed higher solder-ball shear strength after annealing. Reprecipitation of Au as (Au,Ni)$ Sn_{4} $ at the interface, as shown in the eutectic-SnPb solder system, was not observed in both Pb-free solder systems. Instead, $ Ni_{3} $$ Sn_{4} $ and Cu-Sn-Ni-Au intermetallic compounds (IMCs) were found in the SnAg and SnAgCu systems, respectively. In the SnAgCu system, a thick, acicular-Cu-Sn-Ni IMC formed after wetting, but a faceted-Cu-Sn-Ni-Au phase was found with longer annealing. The growth of this interfacial phase in the Sn-3.0Ag-0.5Cu solder system was also slightly inhibited by the addition of Cu, with a formation energy of about 200 kJ/mol. © TMS-The Minerals, Metals and Materials Society 2003 |
| abstract_unstemmed |
Abstract The Sn-3.5Ag and Sn-3.0Ag-0.5Cu ball-grid-array solder balls bonded onto Ni/Au metallization exhibited different interfacial morphology after both wetting and solid-state reactions. In contrast to the eutectic-SnPb solder system, both Pb-free systems showed higher solder-ball shear strength after annealing. Reprecipitation of Au as (Au,Ni)$ Sn_{4} $ at the interface, as shown in the eutectic-SnPb solder system, was not observed in both Pb-free solder systems. Instead, $ Ni_{3} $$ Sn_{4} $ and Cu-Sn-Ni-Au intermetallic compounds (IMCs) were found in the SnAg and SnAgCu systems, respectively. In the SnAgCu system, a thick, acicular-Cu-Sn-Ni IMC formed after wetting, but a faceted-Cu-Sn-Ni-Au phase was found with longer annealing. The growth of this interfacial phase in the Sn-3.0Ag-0.5Cu solder system was also slightly inhibited by the addition of Cu, with a formation energy of about 200 kJ/mol. © TMS-The Minerals, Metals and Materials Society 2003 |
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Interfacial microstructure evolution in Pb-free solder systems |
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