Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates
Au-Ge-based alloys are interesting as novel high-temperature lead-free solders because of their low melting point, good thermal and electrical conductivity, and high corrosion resistance. In the present work, the wetting and soldering behavior of the eutectic Au-28Ge (at.%) alloy on Cu and Ni substr...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Leinenbach, C. [verfasserIn] |
|---|
| Format: |
Artikel |
|---|---|
| Sprache: |
Englisch |
| Erschienen: |
2011 |
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| Schlagwörter: |
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| Anmerkung: |
© TMS 2011 |
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| Übergeordnetes Werk: |
Enthalten in: Journal of electronic materials - Springer US, 1972, 40(2011), 7 vom: 23. Apr., Seite 1533-1541 |
|---|---|
| Übergeordnetes Werk: |
volume:40 ; year:2011 ; number:7 ; day:23 ; month:04 ; pages:1533-1541 |
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| DOI / URN: |
10.1007/s11664-011-1639-4 |
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OLC2042317721 |
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| 520 | |a Au-Ge-based alloys are interesting as novel high-temperature lead-free solders because of their low melting point, good thermal and electrical conductivity, and high corrosion resistance. In the present work, the wetting and soldering behavior of the eutectic Au-28Ge (at.%) alloy on Cu and Ni substrates have been investigated. Good wetting on both substrates with final contact angles of 13° to 14° was observed. In addition, solder joints with bond shear strength of 30 MPa to 35 MPa could be produced under controlled conditions. Cu substrates exhibit pronounced dissolution into the Au-Ge filler metal. On Ni substrates, the NiGe intermetallic compound was formed at the filler/substrate interface, which prevents dissolution of Ni into the solder. Using thin filler metal foils (25 μm), complete consumption of Ge in the reaction at the Ni interface was observed, leading to the formation of an almost pure Au layer in the soldering zone. | ||
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10.1007/s11664-011-1639-4 doi (DE-627)OLC2042317721 (DE-He213)s11664-011-1639-4-p DE-627 ger DE-627 rakwb eng 670 VZ Leinenbach, C. verfasserin aut Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates 2011 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © TMS 2011 Au-Ge-based alloys are interesting as novel high-temperature lead-free solders because of their low melting point, good thermal and electrical conductivity, and high corrosion resistance. In the present work, the wetting and soldering behavior of the eutectic Au-28Ge (at.%) alloy on Cu and Ni substrates have been investigated. Good wetting on both substrates with final contact angles of 13° to 14° was observed. In addition, solder joints with bond shear strength of 30 MPa to 35 MPa could be produced under controlled conditions. Cu substrates exhibit pronounced dissolution into the Au-Ge filler metal. On Ni substrates, the NiGe intermetallic compound was formed at the filler/substrate interface, which prevents dissolution of Ni into the solder. Using thin filler metal foils (25 μm), complete consumption of Ge in the reaction at the Ni interface was observed, leading to the formation of an almost pure Au layer in the soldering zone. High-temperature solder lead-free solder wetting soldering Valenza, F. aut Giuranno, D. aut Elsener, H. R. aut Jin, S. aut Novakovic, R. aut Enthalten in Journal of electronic materials Springer US, 1972 40(2011), 7 vom: 23. Apr., Seite 1533-1541 (DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 0361-5235 nnns volume:40 year:2011 number:7 day:23 month:04 pages:1533-1541 https://doi.org/10.1007/s11664-011-1639-4 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2006 GBV_ILN_2020 AR 40 2011 7 23 04 1533-1541 |
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10.1007/s11664-011-1639-4 doi (DE-627)OLC2042317721 (DE-He213)s11664-011-1639-4-p DE-627 ger DE-627 rakwb eng 670 VZ Leinenbach, C. verfasserin aut Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates 2011 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © TMS 2011 Au-Ge-based alloys are interesting as novel high-temperature lead-free solders because of their low melting point, good thermal and electrical conductivity, and high corrosion resistance. In the present work, the wetting and soldering behavior of the eutectic Au-28Ge (at.%) alloy on Cu and Ni substrates have been investigated. Good wetting on both substrates with final contact angles of 13° to 14° was observed. In addition, solder joints with bond shear strength of 30 MPa to 35 MPa could be produced under controlled conditions. Cu substrates exhibit pronounced dissolution into the Au-Ge filler metal. On Ni substrates, the NiGe intermetallic compound was formed at the filler/substrate interface, which prevents dissolution of Ni into the solder. Using thin filler metal foils (25 μm), complete consumption of Ge in the reaction at the Ni interface was observed, leading to the formation of an almost pure Au layer in the soldering zone. High-temperature solder lead-free solder wetting soldering Valenza, F. aut Giuranno, D. aut Elsener, H. R. aut Jin, S. aut Novakovic, R. aut Enthalten in Journal of electronic materials Springer US, 1972 40(2011), 7 vom: 23. Apr., Seite 1533-1541 (DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 0361-5235 nnns volume:40 year:2011 number:7 day:23 month:04 pages:1533-1541 https://doi.org/10.1007/s11664-011-1639-4 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2006 GBV_ILN_2020 AR 40 2011 7 23 04 1533-1541 |
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10.1007/s11664-011-1639-4 doi (DE-627)OLC2042317721 (DE-He213)s11664-011-1639-4-p DE-627 ger DE-627 rakwb eng 670 VZ Leinenbach, C. verfasserin aut Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates 2011 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © TMS 2011 Au-Ge-based alloys are interesting as novel high-temperature lead-free solders because of their low melting point, good thermal and electrical conductivity, and high corrosion resistance. In the present work, the wetting and soldering behavior of the eutectic Au-28Ge (at.%) alloy on Cu and Ni substrates have been investigated. Good wetting on both substrates with final contact angles of 13° to 14° was observed. In addition, solder joints with bond shear strength of 30 MPa to 35 MPa could be produced under controlled conditions. Cu substrates exhibit pronounced dissolution into the Au-Ge filler metal. On Ni substrates, the NiGe intermetallic compound was formed at the filler/substrate interface, which prevents dissolution of Ni into the solder. Using thin filler metal foils (25 μm), complete consumption of Ge in the reaction at the Ni interface was observed, leading to the formation of an almost pure Au layer in the soldering zone. High-temperature solder lead-free solder wetting soldering Valenza, F. aut Giuranno, D. aut Elsener, H. R. aut Jin, S. aut Novakovic, R. aut Enthalten in Journal of electronic materials Springer US, 1972 40(2011), 7 vom: 23. Apr., Seite 1533-1541 (DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 0361-5235 nnns volume:40 year:2011 number:7 day:23 month:04 pages:1533-1541 https://doi.org/10.1007/s11664-011-1639-4 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2006 GBV_ILN_2020 AR 40 2011 7 23 04 1533-1541 |
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10.1007/s11664-011-1639-4 doi (DE-627)OLC2042317721 (DE-He213)s11664-011-1639-4-p DE-627 ger DE-627 rakwb eng 670 VZ Leinenbach, C. verfasserin aut Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates 2011 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © TMS 2011 Au-Ge-based alloys are interesting as novel high-temperature lead-free solders because of their low melting point, good thermal and electrical conductivity, and high corrosion resistance. In the present work, the wetting and soldering behavior of the eutectic Au-28Ge (at.%) alloy on Cu and Ni substrates have been investigated. Good wetting on both substrates with final contact angles of 13° to 14° was observed. In addition, solder joints with bond shear strength of 30 MPa to 35 MPa could be produced under controlled conditions. Cu substrates exhibit pronounced dissolution into the Au-Ge filler metal. On Ni substrates, the NiGe intermetallic compound was formed at the filler/substrate interface, which prevents dissolution of Ni into the solder. Using thin filler metal foils (25 μm), complete consumption of Ge in the reaction at the Ni interface was observed, leading to the formation of an almost pure Au layer in the soldering zone. High-temperature solder lead-free solder wetting soldering Valenza, F. aut Giuranno, D. aut Elsener, H. R. aut Jin, S. aut Novakovic, R. aut Enthalten in Journal of electronic materials Springer US, 1972 40(2011), 7 vom: 23. Apr., Seite 1533-1541 (DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 0361-5235 nnns volume:40 year:2011 number:7 day:23 month:04 pages:1533-1541 https://doi.org/10.1007/s11664-011-1639-4 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2006 GBV_ILN_2020 AR 40 2011 7 23 04 1533-1541 |
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10.1007/s11664-011-1639-4 doi (DE-627)OLC2042317721 (DE-He213)s11664-011-1639-4-p DE-627 ger DE-627 rakwb eng 670 VZ Leinenbach, C. verfasserin aut Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates 2011 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © TMS 2011 Au-Ge-based alloys are interesting as novel high-temperature lead-free solders because of their low melting point, good thermal and electrical conductivity, and high corrosion resistance. In the present work, the wetting and soldering behavior of the eutectic Au-28Ge (at.%) alloy on Cu and Ni substrates have been investigated. Good wetting on both substrates with final contact angles of 13° to 14° was observed. In addition, solder joints with bond shear strength of 30 MPa to 35 MPa could be produced under controlled conditions. Cu substrates exhibit pronounced dissolution into the Au-Ge filler metal. On Ni substrates, the NiGe intermetallic compound was formed at the filler/substrate interface, which prevents dissolution of Ni into the solder. Using thin filler metal foils (25 μm), complete consumption of Ge in the reaction at the Ni interface was observed, leading to the formation of an almost pure Au layer in the soldering zone. High-temperature solder lead-free solder wetting soldering Valenza, F. aut Giuranno, D. aut Elsener, H. R. aut Jin, S. aut Novakovic, R. aut Enthalten in Journal of electronic materials Springer US, 1972 40(2011), 7 vom: 23. Apr., Seite 1533-1541 (DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 0361-5235 nnns volume:40 year:2011 number:7 day:23 month:04 pages:1533-1541 https://doi.org/10.1007/s11664-011-1639-4 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2006 GBV_ILN_2020 AR 40 2011 7 23 04 1533-1541 |
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Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates |
| abstract |
Au-Ge-based alloys are interesting as novel high-temperature lead-free solders because of their low melting point, good thermal and electrical conductivity, and high corrosion resistance. In the present work, the wetting and soldering behavior of the eutectic Au-28Ge (at.%) alloy on Cu and Ni substrates have been investigated. Good wetting on both substrates with final contact angles of 13° to 14° was observed. In addition, solder joints with bond shear strength of 30 MPa to 35 MPa could be produced under controlled conditions. Cu substrates exhibit pronounced dissolution into the Au-Ge filler metal. On Ni substrates, the NiGe intermetallic compound was formed at the filler/substrate interface, which prevents dissolution of Ni into the solder. Using thin filler metal foils (25 μm), complete consumption of Ge in the reaction at the Ni interface was observed, leading to the formation of an almost pure Au layer in the soldering zone. © TMS 2011 |
| abstractGer |
Au-Ge-based alloys are interesting as novel high-temperature lead-free solders because of their low melting point, good thermal and electrical conductivity, and high corrosion resistance. In the present work, the wetting and soldering behavior of the eutectic Au-28Ge (at.%) alloy on Cu and Ni substrates have been investigated. Good wetting on both substrates with final contact angles of 13° to 14° was observed. In addition, solder joints with bond shear strength of 30 MPa to 35 MPa could be produced under controlled conditions. Cu substrates exhibit pronounced dissolution into the Au-Ge filler metal. On Ni substrates, the NiGe intermetallic compound was formed at the filler/substrate interface, which prevents dissolution of Ni into the solder. Using thin filler metal foils (25 μm), complete consumption of Ge in the reaction at the Ni interface was observed, leading to the formation of an almost pure Au layer in the soldering zone. © TMS 2011 |
| abstract_unstemmed |
Au-Ge-based alloys are interesting as novel high-temperature lead-free solders because of their low melting point, good thermal and electrical conductivity, and high corrosion resistance. In the present work, the wetting and soldering behavior of the eutectic Au-28Ge (at.%) alloy on Cu and Ni substrates have been investigated. Good wetting on both substrates with final contact angles of 13° to 14° was observed. In addition, solder joints with bond shear strength of 30 MPa to 35 MPa could be produced under controlled conditions. Cu substrates exhibit pronounced dissolution into the Au-Ge filler metal. On Ni substrates, the NiGe intermetallic compound was formed at the filler/substrate interface, which prevents dissolution of Ni into the solder. Using thin filler metal foils (25 μm), complete consumption of Ge in the reaction at the Ni interface was observed, leading to the formation of an almost pure Au layer in the soldering zone. © TMS 2011 |
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| title_short |
Wetting and Soldering Behavior of Eutectic Au-Ge Alloy on Cu and Ni Substrates |
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Valenza, F. Giuranno, D. Elsener, H. R. Jin, S. Novakovic, R. |
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