Measurement of Thermoelectric Properties of Phenylacetylene-Capped Silicon Nanoparticles and Their Potential in Fabrication of Thermoelectric Materials
Silicon is a highly attractive material for the fabrication of thermoelectric materials. Nanostructured silicon materials, such as silicon nanowires (SiNWs), show great potential as they show low thermal conductivities due to efficient phonon scattering but similar electrical conductivities to bulk...
Ausführliche Beschreibung
Autor*in: |
Ashby, Shane P. [verfasserIn] |
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Format: |
Artikel |
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Sprache: |
Englisch |
Erschienen: |
2012 |
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Schlagwörter: |
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Anmerkung: |
© TMS 2012 |
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Übergeordnetes Werk: |
Enthalten in: Journal of electronic materials - Springer US, 1972, 42(2012), 7 vom: 08. Nov., Seite 1495-1498 |
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Übergeordnetes Werk: |
volume:42 ; year:2012 ; number:7 ; day:08 ; month:11 ; pages:1495-1498 |
Links: |
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DOI / URN: |
10.1007/s11664-012-2297-x |
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Katalog-ID: |
OLC2042325732 |
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520 | |a Silicon is a highly attractive material for the fabrication of thermoelectric materials. Nanostructured silicon materials, such as silicon nanowires (SiNWs), show great potential as they show low thermal conductivities due to efficient phonon scattering but similar electrical conductivities to bulk silicon. Silicon nanoparticles (SiNPs) are easier to synthesize and show a greater number of surface defects, which suggests that more efficient phonon scattering can be achieved, but these materials also show low electrical conductivity due to defects within the materials unless pressed at high temperatures (1100°C). Conjugated capping layers show the potential to bridge these defects, giving higher conductivity without the need for this process. Phenylacetylene-capped SiNPs are synthesized via the micelle reduction method and pressed into a pellet. Measurements of the electrical conductivity, Seebeck coefficient, and thermal conductivity were taken. The results show that the material produced from these particles shows a relatively high Seebeck coefficient (3228.84 μV $ K^{−1} $) which would have a positive effect on the figure of merit (ZT). A respectable electrical conductivity (18.1 S $ m^{−1} $) and a low thermal conductivity (0.1 W $ m^{−1} $ $ K^{−1} $) confirm the potential of using conjugated molecules as a way of cross-linking between nanoparticles in a bulk material fabricated from SiNPs. These results give a figure of merit of 0.57, which is comparable to better established thermoelectric materials. | ||
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10.1007/s11664-012-2297-x doi (DE-627)OLC2042325732 (DE-He213)s11664-012-2297-x-p DE-627 ger DE-627 rakwb eng 670 VZ Ashby, Shane P. verfasserin aut Measurement of Thermoelectric Properties of Phenylacetylene-Capped Silicon Nanoparticles and Their Potential in Fabrication of Thermoelectric Materials 2012 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © TMS 2012 Silicon is a highly attractive material for the fabrication of thermoelectric materials. Nanostructured silicon materials, such as silicon nanowires (SiNWs), show great potential as they show low thermal conductivities due to efficient phonon scattering but similar electrical conductivities to bulk silicon. Silicon nanoparticles (SiNPs) are easier to synthesize and show a greater number of surface defects, which suggests that more efficient phonon scattering can be achieved, but these materials also show low electrical conductivity due to defects within the materials unless pressed at high temperatures (1100°C). Conjugated capping layers show the potential to bridge these defects, giving higher conductivity without the need for this process. Phenylacetylene-capped SiNPs are synthesized via the micelle reduction method and pressed into a pellet. Measurements of the electrical conductivity, Seebeck coefficient, and thermal conductivity were taken. The results show that the material produced from these particles shows a relatively high Seebeck coefficient (3228.84 μV $ K^{−1} $) which would have a positive effect on the figure of merit (ZT). A respectable electrical conductivity (18.1 S $ m^{−1} $) and a low thermal conductivity (0.1 W $ m^{−1} $ $ K^{−1} $) confirm the potential of using conjugated molecules as a way of cross-linking between nanoparticles in a bulk material fabricated from SiNPs. These results give a figure of merit of 0.57, which is comparable to better established thermoelectric materials. Thermoelectric silicon phenylacetylene nanoparticles Seebeck coefficient García-Cañadas, Jorge aut Min, Gao aut Chao, Yimin aut Enthalten in Journal of electronic materials Springer US, 1972 42(2012), 7 vom: 08. Nov., Seite 1495-1498 (DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 0361-5235 nnns volume:42 year:2012 number:7 day:08 month:11 pages:1495-1498 https://doi.org/10.1007/s11664-012-2297-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 GBV_ILN_2004 AR 42 2012 7 08 11 1495-1498 |
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10.1007/s11664-012-2297-x doi (DE-627)OLC2042325732 (DE-He213)s11664-012-2297-x-p DE-627 ger DE-627 rakwb eng 670 VZ Ashby, Shane P. verfasserin aut Measurement of Thermoelectric Properties of Phenylacetylene-Capped Silicon Nanoparticles and Their Potential in Fabrication of Thermoelectric Materials 2012 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © TMS 2012 Silicon is a highly attractive material for the fabrication of thermoelectric materials. Nanostructured silicon materials, such as silicon nanowires (SiNWs), show great potential as they show low thermal conductivities due to efficient phonon scattering but similar electrical conductivities to bulk silicon. Silicon nanoparticles (SiNPs) are easier to synthesize and show a greater number of surface defects, which suggests that more efficient phonon scattering can be achieved, but these materials also show low electrical conductivity due to defects within the materials unless pressed at high temperatures (1100°C). Conjugated capping layers show the potential to bridge these defects, giving higher conductivity without the need for this process. Phenylacetylene-capped SiNPs are synthesized via the micelle reduction method and pressed into a pellet. Measurements of the electrical conductivity, Seebeck coefficient, and thermal conductivity were taken. The results show that the material produced from these particles shows a relatively high Seebeck coefficient (3228.84 μV $ K^{−1} $) which would have a positive effect on the figure of merit (ZT). A respectable electrical conductivity (18.1 S $ m^{−1} $) and a low thermal conductivity (0.1 W $ m^{−1} $ $ K^{−1} $) confirm the potential of using conjugated molecules as a way of cross-linking between nanoparticles in a bulk material fabricated from SiNPs. These results give a figure of merit of 0.57, which is comparable to better established thermoelectric materials. Thermoelectric silicon phenylacetylene nanoparticles Seebeck coefficient García-Cañadas, Jorge aut Min, Gao aut Chao, Yimin aut Enthalten in Journal of electronic materials Springer US, 1972 42(2012), 7 vom: 08. Nov., Seite 1495-1498 (DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 0361-5235 nnns volume:42 year:2012 number:7 day:08 month:11 pages:1495-1498 https://doi.org/10.1007/s11664-012-2297-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 GBV_ILN_2004 AR 42 2012 7 08 11 1495-1498 |
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10.1007/s11664-012-2297-x doi (DE-627)OLC2042325732 (DE-He213)s11664-012-2297-x-p DE-627 ger DE-627 rakwb eng 670 VZ Ashby, Shane P. verfasserin aut Measurement of Thermoelectric Properties of Phenylacetylene-Capped Silicon Nanoparticles and Their Potential in Fabrication of Thermoelectric Materials 2012 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © TMS 2012 Silicon is a highly attractive material for the fabrication of thermoelectric materials. Nanostructured silicon materials, such as silicon nanowires (SiNWs), show great potential as they show low thermal conductivities due to efficient phonon scattering but similar electrical conductivities to bulk silicon. Silicon nanoparticles (SiNPs) are easier to synthesize and show a greater number of surface defects, which suggests that more efficient phonon scattering can be achieved, but these materials also show low electrical conductivity due to defects within the materials unless pressed at high temperatures (1100°C). Conjugated capping layers show the potential to bridge these defects, giving higher conductivity without the need for this process. Phenylacetylene-capped SiNPs are synthesized via the micelle reduction method and pressed into a pellet. Measurements of the electrical conductivity, Seebeck coefficient, and thermal conductivity were taken. The results show that the material produced from these particles shows a relatively high Seebeck coefficient (3228.84 μV $ K^{−1} $) which would have a positive effect on the figure of merit (ZT). A respectable electrical conductivity (18.1 S $ m^{−1} $) and a low thermal conductivity (0.1 W $ m^{−1} $ $ K^{−1} $) confirm the potential of using conjugated molecules as a way of cross-linking between nanoparticles in a bulk material fabricated from SiNPs. These results give a figure of merit of 0.57, which is comparable to better established thermoelectric materials. Thermoelectric silicon phenylacetylene nanoparticles Seebeck coefficient García-Cañadas, Jorge aut Min, Gao aut Chao, Yimin aut Enthalten in Journal of electronic materials Springer US, 1972 42(2012), 7 vom: 08. Nov., Seite 1495-1498 (DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 0361-5235 nnns volume:42 year:2012 number:7 day:08 month:11 pages:1495-1498 https://doi.org/10.1007/s11664-012-2297-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 GBV_ILN_2004 AR 42 2012 7 08 11 1495-1498 |
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10.1007/s11664-012-2297-x doi (DE-627)OLC2042325732 (DE-He213)s11664-012-2297-x-p DE-627 ger DE-627 rakwb eng 670 VZ Ashby, Shane P. verfasserin aut Measurement of Thermoelectric Properties of Phenylacetylene-Capped Silicon Nanoparticles and Their Potential in Fabrication of Thermoelectric Materials 2012 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © TMS 2012 Silicon is a highly attractive material for the fabrication of thermoelectric materials. Nanostructured silicon materials, such as silicon nanowires (SiNWs), show great potential as they show low thermal conductivities due to efficient phonon scattering but similar electrical conductivities to bulk silicon. Silicon nanoparticles (SiNPs) are easier to synthesize and show a greater number of surface defects, which suggests that more efficient phonon scattering can be achieved, but these materials also show low electrical conductivity due to defects within the materials unless pressed at high temperatures (1100°C). Conjugated capping layers show the potential to bridge these defects, giving higher conductivity without the need for this process. Phenylacetylene-capped SiNPs are synthesized via the micelle reduction method and pressed into a pellet. Measurements of the electrical conductivity, Seebeck coefficient, and thermal conductivity were taken. The results show that the material produced from these particles shows a relatively high Seebeck coefficient (3228.84 μV $ K^{−1} $) which would have a positive effect on the figure of merit (ZT). A respectable electrical conductivity (18.1 S $ m^{−1} $) and a low thermal conductivity (0.1 W $ m^{−1} $ $ K^{−1} $) confirm the potential of using conjugated molecules as a way of cross-linking between nanoparticles in a bulk material fabricated from SiNPs. These results give a figure of merit of 0.57, which is comparable to better established thermoelectric materials. Thermoelectric silicon phenylacetylene nanoparticles Seebeck coefficient García-Cañadas, Jorge aut Min, Gao aut Chao, Yimin aut Enthalten in Journal of electronic materials Springer US, 1972 42(2012), 7 vom: 08. Nov., Seite 1495-1498 (DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 0361-5235 nnns volume:42 year:2012 number:7 day:08 month:11 pages:1495-1498 https://doi.org/10.1007/s11664-012-2297-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 GBV_ILN_2004 AR 42 2012 7 08 11 1495-1498 |
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10.1007/s11664-012-2297-x doi (DE-627)OLC2042325732 (DE-He213)s11664-012-2297-x-p DE-627 ger DE-627 rakwb eng 670 VZ Ashby, Shane P. verfasserin aut Measurement of Thermoelectric Properties of Phenylacetylene-Capped Silicon Nanoparticles and Their Potential in Fabrication of Thermoelectric Materials 2012 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © TMS 2012 Silicon is a highly attractive material for the fabrication of thermoelectric materials. Nanostructured silicon materials, such as silicon nanowires (SiNWs), show great potential as they show low thermal conductivities due to efficient phonon scattering but similar electrical conductivities to bulk silicon. Silicon nanoparticles (SiNPs) are easier to synthesize and show a greater number of surface defects, which suggests that more efficient phonon scattering can be achieved, but these materials also show low electrical conductivity due to defects within the materials unless pressed at high temperatures (1100°C). Conjugated capping layers show the potential to bridge these defects, giving higher conductivity without the need for this process. Phenylacetylene-capped SiNPs are synthesized via the micelle reduction method and pressed into a pellet. Measurements of the electrical conductivity, Seebeck coefficient, and thermal conductivity were taken. The results show that the material produced from these particles shows a relatively high Seebeck coefficient (3228.84 μV $ K^{−1} $) which would have a positive effect on the figure of merit (ZT). A respectable electrical conductivity (18.1 S $ m^{−1} $) and a low thermal conductivity (0.1 W $ m^{−1} $ $ K^{−1} $) confirm the potential of using conjugated molecules as a way of cross-linking between nanoparticles in a bulk material fabricated from SiNPs. These results give a figure of merit of 0.57, which is comparable to better established thermoelectric materials. Thermoelectric silicon phenylacetylene nanoparticles Seebeck coefficient García-Cañadas, Jorge aut Min, Gao aut Chao, Yimin aut Enthalten in Journal of electronic materials Springer US, 1972 42(2012), 7 vom: 08. Nov., Seite 1495-1498 (DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 0361-5235 nnns volume:42 year:2012 number:7 day:08 month:11 pages:1495-1498 https://doi.org/10.1007/s11664-012-2297-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 GBV_ILN_2004 AR 42 2012 7 08 11 1495-1498 |
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measurement of thermoelectric properties of phenylacetylene-capped silicon nanoparticles and their potential in fabrication of thermoelectric materials |
title_auth |
Measurement of Thermoelectric Properties of Phenylacetylene-Capped Silicon Nanoparticles and Their Potential in Fabrication of Thermoelectric Materials |
abstract |
Silicon is a highly attractive material for the fabrication of thermoelectric materials. Nanostructured silicon materials, such as silicon nanowires (SiNWs), show great potential as they show low thermal conductivities due to efficient phonon scattering but similar electrical conductivities to bulk silicon. Silicon nanoparticles (SiNPs) are easier to synthesize and show a greater number of surface defects, which suggests that more efficient phonon scattering can be achieved, but these materials also show low electrical conductivity due to defects within the materials unless pressed at high temperatures (1100°C). Conjugated capping layers show the potential to bridge these defects, giving higher conductivity without the need for this process. Phenylacetylene-capped SiNPs are synthesized via the micelle reduction method and pressed into a pellet. Measurements of the electrical conductivity, Seebeck coefficient, and thermal conductivity were taken. The results show that the material produced from these particles shows a relatively high Seebeck coefficient (3228.84 μV $ K^{−1} $) which would have a positive effect on the figure of merit (ZT). A respectable electrical conductivity (18.1 S $ m^{−1} $) and a low thermal conductivity (0.1 W $ m^{−1} $ $ K^{−1} $) confirm the potential of using conjugated molecules as a way of cross-linking between nanoparticles in a bulk material fabricated from SiNPs. These results give a figure of merit of 0.57, which is comparable to better established thermoelectric materials. © TMS 2012 |
abstractGer |
Silicon is a highly attractive material for the fabrication of thermoelectric materials. Nanostructured silicon materials, such as silicon nanowires (SiNWs), show great potential as they show low thermal conductivities due to efficient phonon scattering but similar electrical conductivities to bulk silicon. Silicon nanoparticles (SiNPs) are easier to synthesize and show a greater number of surface defects, which suggests that more efficient phonon scattering can be achieved, but these materials also show low electrical conductivity due to defects within the materials unless pressed at high temperatures (1100°C). Conjugated capping layers show the potential to bridge these defects, giving higher conductivity without the need for this process. Phenylacetylene-capped SiNPs are synthesized via the micelle reduction method and pressed into a pellet. Measurements of the electrical conductivity, Seebeck coefficient, and thermal conductivity were taken. The results show that the material produced from these particles shows a relatively high Seebeck coefficient (3228.84 μV $ K^{−1} $) which would have a positive effect on the figure of merit (ZT). A respectable electrical conductivity (18.1 S $ m^{−1} $) and a low thermal conductivity (0.1 W $ m^{−1} $ $ K^{−1} $) confirm the potential of using conjugated molecules as a way of cross-linking between nanoparticles in a bulk material fabricated from SiNPs. These results give a figure of merit of 0.57, which is comparable to better established thermoelectric materials. © TMS 2012 |
abstract_unstemmed |
Silicon is a highly attractive material for the fabrication of thermoelectric materials. Nanostructured silicon materials, such as silicon nanowires (SiNWs), show great potential as they show low thermal conductivities due to efficient phonon scattering but similar electrical conductivities to bulk silicon. Silicon nanoparticles (SiNPs) are easier to synthesize and show a greater number of surface defects, which suggests that more efficient phonon scattering can be achieved, but these materials also show low electrical conductivity due to defects within the materials unless pressed at high temperatures (1100°C). Conjugated capping layers show the potential to bridge these defects, giving higher conductivity without the need for this process. Phenylacetylene-capped SiNPs are synthesized via the micelle reduction method and pressed into a pellet. Measurements of the electrical conductivity, Seebeck coefficient, and thermal conductivity were taken. The results show that the material produced from these particles shows a relatively high Seebeck coefficient (3228.84 μV $ K^{−1} $) which would have a positive effect on the figure of merit (ZT). A respectable electrical conductivity (18.1 S $ m^{−1} $) and a low thermal conductivity (0.1 W $ m^{−1} $ $ K^{−1} $) confirm the potential of using conjugated molecules as a way of cross-linking between nanoparticles in a bulk material fabricated from SiNPs. These results give a figure of merit of 0.57, which is comparable to better established thermoelectric materials. © TMS 2012 |
collection_details |
GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 GBV_ILN_2004 |
container_issue |
7 |
title_short |
Measurement of Thermoelectric Properties of Phenylacetylene-Capped Silicon Nanoparticles and Their Potential in Fabrication of Thermoelectric Materials |
url |
https://doi.org/10.1007/s11664-012-2297-x |
remote_bool |
false |
author2 |
García-Cañadas, Jorge Min, Gao Chao, Yimin |
author2Str |
García-Cañadas, Jorge Min, Gao Chao, Yimin |
ppnlink |
129398233 |
mediatype_str_mv |
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isOA_txt |
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hochschulschrift_bool |
false |
doi_str |
10.1007/s11664-012-2297-x |
up_date |
2024-07-03T14:44:00.545Z |
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1803569427169411072 |
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