Dimensionless Model of a Thermoelectric Cooling Device Operating at Real Heat Transfer Conditions: Maximum Cooling Capacity Mode
Abstract Real operating conditions of a thermoelectric cooling device are in the presence of thermal resistances between thermoelectric material and a heat medium or cooling object. They limit performance of a device and should be considered when modeling. Here we propose a dimensionless mathematica...
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| Autor*in: |
Melnikov, A. A. [verfasserIn] |
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| Format: |
Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2016 |
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| Schlagwörter: |
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| Anmerkung: |
© The Minerals, Metals & Materials Society 2016 |
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| Übergeordnetes Werk: |
Enthalten in: Journal of electronic materials - Springer US, 1972, 46(2016), 5 vom: 27. Sept., Seite 2737-2745 |
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| Übergeordnetes Werk: |
volume:46 ; year:2016 ; number:5 ; day:27 ; month:09 ; pages:2737-2745 |
| Links: |
|---|
| DOI / URN: |
10.1007/s11664-016-4952-0 |
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| Katalog-ID: |
OLC2042352713 |
|---|
| LEADER | 01000caa a22002652 4500 | ||
|---|---|---|---|
| 001 | OLC2042352713 | ||
| 003 | DE-627 | ||
| 005 | 20230401130224.0 | ||
| 007 | tu | ||
| 008 | 200820s2016 xx ||||| 00| ||eng c | ||
| 024 | 7 | |a 10.1007/s11664-016-4952-0 |2 doi | |
| 035 | |a (DE-627)OLC2042352713 | ||
| 035 | |a (DE-He213)s11664-016-4952-0-p | ||
| 040 | |a DE-627 |b ger |c DE-627 |e rakwb | ||
| 041 | |a eng | ||
| 082 | 0 | 4 | |a 670 |q VZ |
| 100 | 1 | |a Melnikov, A. A. |e verfasserin |0 (orcid)0000-0002-4640-3994 |4 aut | |
| 245 | 1 | 0 | |a Dimensionless Model of a Thermoelectric Cooling Device Operating at Real Heat Transfer Conditions: Maximum Cooling Capacity Mode |
| 264 | 1 | |c 2016 | |
| 336 | |a Text |b txt |2 rdacontent | ||
| 337 | |a ohne Hilfsmittel zu benutzen |b n |2 rdamedia | ||
| 338 | |a Band |b nc |2 rdacarrier | ||
| 500 | |a © The Minerals, Metals & Materials Society 2016 | ||
| 520 | |a Abstract Real operating conditions of a thermoelectric cooling device are in the presence of thermal resistances between thermoelectric material and a heat medium or cooling object. They limit performance of a device and should be considered when modeling. Here we propose a dimensionless mathematical steady state model, which takes them into account. Analytical equations for dimensionless cooling capacity, voltage, and coefficient of performance (COP) depending on dimensionless current are given. For improved accuracy a device can be modeled with use of numerical or combined analytical-numerical methods. The results of modeling are in acceptable accordance with experimental results. The case of zero temperature difference between hot and cold heat mediums at which the maximum cooling capacity mode appears is considered in detail. Optimal device parameters for maximal cooling capacity, such as fraction of thermal conductance on the cold side y, fraction of current relative to maximal j′ are estimated in range of 0.38–0.44 and 0.48–0.95, respectively, for dimensionless conductance K′ = 5–100. Also, a method for determination of thermal resistances of a thermoelectric cooling system is proposed. | ||
| 650 | 4 | |a Thermoelectrics | |
| 650 | 4 | |a thermoelectric theory | |
| 650 | 4 | |a thermoelectricity | |
| 650 | 4 | |a thermoelectric modeling | |
| 650 | 4 | |a optimal design | |
| 650 | 4 | |a thermoelectric module | |
| 650 | 4 | |a thermoelectric cooler | |
| 700 | 1 | |a Kostishin, V. G. |4 aut | |
| 700 | 1 | |a Alenkov, V. V. |4 aut | |
| 773 | 0 | 8 | |i Enthalten in |t Journal of electronic materials |d Springer US, 1972 |g 46(2016), 5 vom: 27. Sept., Seite 2737-2745 |w (DE-627)129398233 |w (DE-600)186069-0 |w (DE-576)014781387 |x 0361-5235 |7 nnns |
| 773 | 1 | 8 | |g volume:46 |g year:2016 |g number:5 |g day:27 |g month:09 |g pages:2737-2745 |
| 856 | 4 | 1 | |u https://doi.org/10.1007/s11664-016-4952-0 |z lizenzpflichtig |3 Volltext |
| 912 | |a GBV_USEFLAG_A | ||
| 912 | |a SYSFLAG_A | ||
| 912 | |a GBV_OLC | ||
| 912 | |a SSG-OLC-TEC | ||
| 912 | |a SSG-OLC-PHY | ||
| 912 | |a GBV_ILN_70 | ||
| 951 | |a AR | ||
| 952 | |d 46 |j 2016 |e 5 |b 27 |c 09 |h 2737-2745 | ||
| author_variant |
a a m aa aam v g k vg vgk v v a vv vva |
|---|---|
| matchkey_str |
article:03615235:2016----::iesolsmdlftemeeticoigeieprtnarahatasecni |
| hierarchy_sort_str |
2016 |
| publishDate |
2016 |
| allfields |
10.1007/s11664-016-4952-0 doi (DE-627)OLC2042352713 (DE-He213)s11664-016-4952-0-p DE-627 ger DE-627 rakwb eng 670 VZ Melnikov, A. A. verfasserin (orcid)0000-0002-4640-3994 aut Dimensionless Model of a Thermoelectric Cooling Device Operating at Real Heat Transfer Conditions: Maximum Cooling Capacity Mode 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Minerals, Metals & Materials Society 2016 Abstract Real operating conditions of a thermoelectric cooling device are in the presence of thermal resistances between thermoelectric material and a heat medium or cooling object. They limit performance of a device and should be considered when modeling. Here we propose a dimensionless mathematical steady state model, which takes them into account. Analytical equations for dimensionless cooling capacity, voltage, and coefficient of performance (COP) depending on dimensionless current are given. For improved accuracy a device can be modeled with use of numerical or combined analytical-numerical methods. The results of modeling are in acceptable accordance with experimental results. The case of zero temperature difference between hot and cold heat mediums at which the maximum cooling capacity mode appears is considered in detail. Optimal device parameters for maximal cooling capacity, such as fraction of thermal conductance on the cold side y, fraction of current relative to maximal j′ are estimated in range of 0.38–0.44 and 0.48–0.95, respectively, for dimensionless conductance K′ = 5–100. Also, a method for determination of thermal resistances of a thermoelectric cooling system is proposed. Thermoelectrics thermoelectric theory thermoelectricity thermoelectric modeling optimal design thermoelectric module thermoelectric cooler Kostishin, V. G. aut Alenkov, V. V. aut Enthalten in Journal of electronic materials Springer US, 1972 46(2016), 5 vom: 27. Sept., Seite 2737-2745 (DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 0361-5235 nnns volume:46 year:2016 number:5 day:27 month:09 pages:2737-2745 https://doi.org/10.1007/s11664-016-4952-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 AR 46 2016 5 27 09 2737-2745 |
| spelling |
10.1007/s11664-016-4952-0 doi (DE-627)OLC2042352713 (DE-He213)s11664-016-4952-0-p DE-627 ger DE-627 rakwb eng 670 VZ Melnikov, A. A. verfasserin (orcid)0000-0002-4640-3994 aut Dimensionless Model of a Thermoelectric Cooling Device Operating at Real Heat Transfer Conditions: Maximum Cooling Capacity Mode 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Minerals, Metals & Materials Society 2016 Abstract Real operating conditions of a thermoelectric cooling device are in the presence of thermal resistances between thermoelectric material and a heat medium or cooling object. They limit performance of a device and should be considered when modeling. Here we propose a dimensionless mathematical steady state model, which takes them into account. Analytical equations for dimensionless cooling capacity, voltage, and coefficient of performance (COP) depending on dimensionless current are given. For improved accuracy a device can be modeled with use of numerical or combined analytical-numerical methods. The results of modeling are in acceptable accordance with experimental results. The case of zero temperature difference between hot and cold heat mediums at which the maximum cooling capacity mode appears is considered in detail. Optimal device parameters for maximal cooling capacity, such as fraction of thermal conductance on the cold side y, fraction of current relative to maximal j′ are estimated in range of 0.38–0.44 and 0.48–0.95, respectively, for dimensionless conductance K′ = 5–100. Also, a method for determination of thermal resistances of a thermoelectric cooling system is proposed. Thermoelectrics thermoelectric theory thermoelectricity thermoelectric modeling optimal design thermoelectric module thermoelectric cooler Kostishin, V. G. aut Alenkov, V. V. aut Enthalten in Journal of electronic materials Springer US, 1972 46(2016), 5 vom: 27. Sept., Seite 2737-2745 (DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 0361-5235 nnns volume:46 year:2016 number:5 day:27 month:09 pages:2737-2745 https://doi.org/10.1007/s11664-016-4952-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 AR 46 2016 5 27 09 2737-2745 |
| allfields_unstemmed |
10.1007/s11664-016-4952-0 doi (DE-627)OLC2042352713 (DE-He213)s11664-016-4952-0-p DE-627 ger DE-627 rakwb eng 670 VZ Melnikov, A. A. verfasserin (orcid)0000-0002-4640-3994 aut Dimensionless Model of a Thermoelectric Cooling Device Operating at Real Heat Transfer Conditions: Maximum Cooling Capacity Mode 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Minerals, Metals & Materials Society 2016 Abstract Real operating conditions of a thermoelectric cooling device are in the presence of thermal resistances between thermoelectric material and a heat medium or cooling object. They limit performance of a device and should be considered when modeling. Here we propose a dimensionless mathematical steady state model, which takes them into account. Analytical equations for dimensionless cooling capacity, voltage, and coefficient of performance (COP) depending on dimensionless current are given. For improved accuracy a device can be modeled with use of numerical or combined analytical-numerical methods. The results of modeling are in acceptable accordance with experimental results. The case of zero temperature difference between hot and cold heat mediums at which the maximum cooling capacity mode appears is considered in detail. Optimal device parameters for maximal cooling capacity, such as fraction of thermal conductance on the cold side y, fraction of current relative to maximal j′ are estimated in range of 0.38–0.44 and 0.48–0.95, respectively, for dimensionless conductance K′ = 5–100. Also, a method for determination of thermal resistances of a thermoelectric cooling system is proposed. Thermoelectrics thermoelectric theory thermoelectricity thermoelectric modeling optimal design thermoelectric module thermoelectric cooler Kostishin, V. G. aut Alenkov, V. V. aut Enthalten in Journal of electronic materials Springer US, 1972 46(2016), 5 vom: 27. Sept., Seite 2737-2745 (DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 0361-5235 nnns volume:46 year:2016 number:5 day:27 month:09 pages:2737-2745 https://doi.org/10.1007/s11664-016-4952-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 AR 46 2016 5 27 09 2737-2745 |
| allfieldsGer |
10.1007/s11664-016-4952-0 doi (DE-627)OLC2042352713 (DE-He213)s11664-016-4952-0-p DE-627 ger DE-627 rakwb eng 670 VZ Melnikov, A. A. verfasserin (orcid)0000-0002-4640-3994 aut Dimensionless Model of a Thermoelectric Cooling Device Operating at Real Heat Transfer Conditions: Maximum Cooling Capacity Mode 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Minerals, Metals & Materials Society 2016 Abstract Real operating conditions of a thermoelectric cooling device are in the presence of thermal resistances between thermoelectric material and a heat medium or cooling object. They limit performance of a device and should be considered when modeling. Here we propose a dimensionless mathematical steady state model, which takes them into account. Analytical equations for dimensionless cooling capacity, voltage, and coefficient of performance (COP) depending on dimensionless current are given. For improved accuracy a device can be modeled with use of numerical or combined analytical-numerical methods. The results of modeling are in acceptable accordance with experimental results. The case of zero temperature difference between hot and cold heat mediums at which the maximum cooling capacity mode appears is considered in detail. Optimal device parameters for maximal cooling capacity, such as fraction of thermal conductance on the cold side y, fraction of current relative to maximal j′ are estimated in range of 0.38–0.44 and 0.48–0.95, respectively, for dimensionless conductance K′ = 5–100. Also, a method for determination of thermal resistances of a thermoelectric cooling system is proposed. Thermoelectrics thermoelectric theory thermoelectricity thermoelectric modeling optimal design thermoelectric module thermoelectric cooler Kostishin, V. G. aut Alenkov, V. V. aut Enthalten in Journal of electronic materials Springer US, 1972 46(2016), 5 vom: 27. Sept., Seite 2737-2745 (DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 0361-5235 nnns volume:46 year:2016 number:5 day:27 month:09 pages:2737-2745 https://doi.org/10.1007/s11664-016-4952-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 AR 46 2016 5 27 09 2737-2745 |
| allfieldsSound |
10.1007/s11664-016-4952-0 doi (DE-627)OLC2042352713 (DE-He213)s11664-016-4952-0-p DE-627 ger DE-627 rakwb eng 670 VZ Melnikov, A. A. verfasserin (orcid)0000-0002-4640-3994 aut Dimensionless Model of a Thermoelectric Cooling Device Operating at Real Heat Transfer Conditions: Maximum Cooling Capacity Mode 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Minerals, Metals & Materials Society 2016 Abstract Real operating conditions of a thermoelectric cooling device are in the presence of thermal resistances between thermoelectric material and a heat medium or cooling object. They limit performance of a device and should be considered when modeling. Here we propose a dimensionless mathematical steady state model, which takes them into account. Analytical equations for dimensionless cooling capacity, voltage, and coefficient of performance (COP) depending on dimensionless current are given. For improved accuracy a device can be modeled with use of numerical or combined analytical-numerical methods. The results of modeling are in acceptable accordance with experimental results. The case of zero temperature difference between hot and cold heat mediums at which the maximum cooling capacity mode appears is considered in detail. Optimal device parameters for maximal cooling capacity, such as fraction of thermal conductance on the cold side y, fraction of current relative to maximal j′ are estimated in range of 0.38–0.44 and 0.48–0.95, respectively, for dimensionless conductance K′ = 5–100. Also, a method for determination of thermal resistances of a thermoelectric cooling system is proposed. Thermoelectrics thermoelectric theory thermoelectricity thermoelectric modeling optimal design thermoelectric module thermoelectric cooler Kostishin, V. G. aut Alenkov, V. V. aut Enthalten in Journal of electronic materials Springer US, 1972 46(2016), 5 vom: 27. Sept., Seite 2737-2745 (DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 0361-5235 nnns volume:46 year:2016 number:5 day:27 month:09 pages:2737-2745 https://doi.org/10.1007/s11664-016-4952-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 AR 46 2016 5 27 09 2737-2745 |
| language |
English |
| source |
Enthalten in Journal of electronic materials 46(2016), 5 vom: 27. Sept., Seite 2737-2745 volume:46 year:2016 number:5 day:27 month:09 pages:2737-2745 |
| sourceStr |
Enthalten in Journal of electronic materials 46(2016), 5 vom: 27. Sept., Seite 2737-2745 volume:46 year:2016 number:5 day:27 month:09 pages:2737-2745 |
| format_phy_str_mv |
Article |
| institution |
findex.gbv.de |
| topic_facet |
Thermoelectrics thermoelectric theory thermoelectricity thermoelectric modeling optimal design thermoelectric module thermoelectric cooler |
| dewey-raw |
670 |
| isfreeaccess_bool |
false |
| container_title |
Journal of electronic materials |
| authorswithroles_txt_mv |
Melnikov, A. A. @@aut@@ Kostishin, V. G. @@aut@@ Alenkov, V. V. @@aut@@ |
| publishDateDaySort_date |
2016-09-27T00:00:00Z |
| hierarchy_top_id |
129398233 |
| dewey-sort |
3670 |
| id |
OLC2042352713 |
| language_de |
englisch |
| fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">OLC2042352713</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230401130224.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">200820s2016 xx ||||| 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/s11664-016-4952-0</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC2042352713</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-He213)s11664-016-4952-0-p</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">670</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Melnikov, A. A.</subfield><subfield code="e">verfasserin</subfield><subfield code="0">(orcid)0000-0002-4640-3994</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Dimensionless Model of a Thermoelectric Cooling Device Operating at Real Heat Transfer Conditions: Maximum Cooling Capacity Mode</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2016</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© The Minerals, Metals & Materials Society 2016</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract Real operating conditions of a thermoelectric cooling device are in the presence of thermal resistances between thermoelectric material and a heat medium or cooling object. They limit performance of a device and should be considered when modeling. Here we propose a dimensionless mathematical steady state model, which takes them into account. Analytical equations for dimensionless cooling capacity, voltage, and coefficient of performance (COP) depending on dimensionless current are given. For improved accuracy a device can be modeled with use of numerical or combined analytical-numerical methods. The results of modeling are in acceptable accordance with experimental results. The case of zero temperature difference between hot and cold heat mediums at which the maximum cooling capacity mode appears is considered in detail. Optimal device parameters for maximal cooling capacity, such as fraction of thermal conductance on the cold side y, fraction of current relative to maximal j′ are estimated in range of 0.38–0.44 and 0.48–0.95, respectively, for dimensionless conductance K′ = 5–100. Also, a method for determination of thermal resistances of a thermoelectric cooling system is proposed.</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thermoelectrics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermoelectric theory</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermoelectricity</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermoelectric modeling</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">optimal design</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermoelectric module</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermoelectric cooler</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Kostishin, V. G.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Alenkov, V. V.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Journal of electronic materials</subfield><subfield code="d">Springer US, 1972</subfield><subfield code="g">46(2016), 5 vom: 27. Sept., Seite 2737-2745</subfield><subfield code="w">(DE-627)129398233</subfield><subfield code="w">(DE-600)186069-0</subfield><subfield code="w">(DE-576)014781387</subfield><subfield code="x">0361-5235</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:46</subfield><subfield code="g">year:2016</subfield><subfield code="g">number:5</subfield><subfield code="g">day:27</subfield><subfield code="g">month:09</subfield><subfield code="g">pages:2737-2745</subfield></datafield><datafield tag="856" ind1="4" ind2="1"><subfield code="u">https://doi.org/10.1007/s11664-016-4952-0</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-TEC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-PHY</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">46</subfield><subfield code="j">2016</subfield><subfield code="e">5</subfield><subfield code="b">27</subfield><subfield code="c">09</subfield><subfield code="h">2737-2745</subfield></datafield></record></collection>
|
| author |
Melnikov, A. A. |
| spellingShingle |
Melnikov, A. A. ddc 670 misc Thermoelectrics misc thermoelectric theory misc thermoelectricity misc thermoelectric modeling misc optimal design misc thermoelectric module misc thermoelectric cooler Dimensionless Model of a Thermoelectric Cooling Device Operating at Real Heat Transfer Conditions: Maximum Cooling Capacity Mode |
| authorStr |
Melnikov, A. A. |
| ppnlink_with_tag_str_mv |
@@773@@(DE-627)129398233 |
| format |
Article |
| dewey-ones |
670 - Manufacturing |
| delete_txt_mv |
keep |
| author_role |
aut aut aut |
| collection |
OLC |
| remote_str |
false |
| illustrated |
Not Illustrated |
| issn |
0361-5235 |
| topic_title |
670 VZ Dimensionless Model of a Thermoelectric Cooling Device Operating at Real Heat Transfer Conditions: Maximum Cooling Capacity Mode Thermoelectrics thermoelectric theory thermoelectricity thermoelectric modeling optimal design thermoelectric module thermoelectric cooler |
| topic |
ddc 670 misc Thermoelectrics misc thermoelectric theory misc thermoelectricity misc thermoelectric modeling misc optimal design misc thermoelectric module misc thermoelectric cooler |
| topic_unstemmed |
ddc 670 misc Thermoelectrics misc thermoelectric theory misc thermoelectricity misc thermoelectric modeling misc optimal design misc thermoelectric module misc thermoelectric cooler |
| topic_browse |
ddc 670 misc Thermoelectrics misc thermoelectric theory misc thermoelectricity misc thermoelectric modeling misc optimal design misc thermoelectric module misc thermoelectric cooler |
| format_facet |
Aufsätze Gedruckte Aufsätze |
| format_main_str_mv |
Text Zeitschrift/Artikel |
| carriertype_str_mv |
nc |
| hierarchy_parent_title |
Journal of electronic materials |
| hierarchy_parent_id |
129398233 |
| dewey-tens |
670 - Manufacturing |
| hierarchy_top_title |
Journal of electronic materials |
| isfreeaccess_txt |
false |
| familylinks_str_mv |
(DE-627)129398233 (DE-600)186069-0 (DE-576)014781387 |
| title |
Dimensionless Model of a Thermoelectric Cooling Device Operating at Real Heat Transfer Conditions: Maximum Cooling Capacity Mode |
| ctrlnum |
(DE-627)OLC2042352713 (DE-He213)s11664-016-4952-0-p |
| title_full |
Dimensionless Model of a Thermoelectric Cooling Device Operating at Real Heat Transfer Conditions: Maximum Cooling Capacity Mode |
| author_sort |
Melnikov, A. A. |
| journal |
Journal of electronic materials |
| journalStr |
Journal of electronic materials |
| lang_code |
eng |
| isOA_bool |
false |
| dewey-hundreds |
600 - Technology |
| recordtype |
marc |
| publishDateSort |
2016 |
| contenttype_str_mv |
txt |
| container_start_page |
2737 |
| author_browse |
Melnikov, A. A. Kostishin, V. G. Alenkov, V. V. |
| container_volume |
46 |
| class |
670 VZ |
| format_se |
Aufsätze |
| author-letter |
Melnikov, A. A. |
| doi_str_mv |
10.1007/s11664-016-4952-0 |
| normlink |
(ORCID)0000-0002-4640-3994 |
| normlink_prefix_str_mv |
(orcid)0000-0002-4640-3994 |
| dewey-full |
670 |
| title_sort |
dimensionless model of a thermoelectric cooling device operating at real heat transfer conditions: maximum cooling capacity mode |
| title_auth |
Dimensionless Model of a Thermoelectric Cooling Device Operating at Real Heat Transfer Conditions: Maximum Cooling Capacity Mode |
| abstract |
Abstract Real operating conditions of a thermoelectric cooling device are in the presence of thermal resistances between thermoelectric material and a heat medium or cooling object. They limit performance of a device and should be considered when modeling. Here we propose a dimensionless mathematical steady state model, which takes them into account. Analytical equations for dimensionless cooling capacity, voltage, and coefficient of performance (COP) depending on dimensionless current are given. For improved accuracy a device can be modeled with use of numerical or combined analytical-numerical methods. The results of modeling are in acceptable accordance with experimental results. The case of zero temperature difference between hot and cold heat mediums at which the maximum cooling capacity mode appears is considered in detail. Optimal device parameters for maximal cooling capacity, such as fraction of thermal conductance on the cold side y, fraction of current relative to maximal j′ are estimated in range of 0.38–0.44 and 0.48–0.95, respectively, for dimensionless conductance K′ = 5–100. Also, a method for determination of thermal resistances of a thermoelectric cooling system is proposed. © The Minerals, Metals & Materials Society 2016 |
| abstractGer |
Abstract Real operating conditions of a thermoelectric cooling device are in the presence of thermal resistances between thermoelectric material and a heat medium or cooling object. They limit performance of a device and should be considered when modeling. Here we propose a dimensionless mathematical steady state model, which takes them into account. Analytical equations for dimensionless cooling capacity, voltage, and coefficient of performance (COP) depending on dimensionless current are given. For improved accuracy a device can be modeled with use of numerical or combined analytical-numerical methods. The results of modeling are in acceptable accordance with experimental results. The case of zero temperature difference between hot and cold heat mediums at which the maximum cooling capacity mode appears is considered in detail. Optimal device parameters for maximal cooling capacity, such as fraction of thermal conductance on the cold side y, fraction of current relative to maximal j′ are estimated in range of 0.38–0.44 and 0.48–0.95, respectively, for dimensionless conductance K′ = 5–100. Also, a method for determination of thermal resistances of a thermoelectric cooling system is proposed. © The Minerals, Metals & Materials Society 2016 |
| abstract_unstemmed |
Abstract Real operating conditions of a thermoelectric cooling device are in the presence of thermal resistances between thermoelectric material and a heat medium or cooling object. They limit performance of a device and should be considered when modeling. Here we propose a dimensionless mathematical steady state model, which takes them into account. Analytical equations for dimensionless cooling capacity, voltage, and coefficient of performance (COP) depending on dimensionless current are given. For improved accuracy a device can be modeled with use of numerical or combined analytical-numerical methods. The results of modeling are in acceptable accordance with experimental results. The case of zero temperature difference between hot and cold heat mediums at which the maximum cooling capacity mode appears is considered in detail. Optimal device parameters for maximal cooling capacity, such as fraction of thermal conductance on the cold side y, fraction of current relative to maximal j′ are estimated in range of 0.38–0.44 and 0.48–0.95, respectively, for dimensionless conductance K′ = 5–100. Also, a method for determination of thermal resistances of a thermoelectric cooling system is proposed. © The Minerals, Metals & Materials Society 2016 |
| collection_details |
GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_70 |
| container_issue |
5 |
| title_short |
Dimensionless Model of a Thermoelectric Cooling Device Operating at Real Heat Transfer Conditions: Maximum Cooling Capacity Mode |
| url |
https://doi.org/10.1007/s11664-016-4952-0 |
| remote_bool |
false |
| author2 |
Kostishin, V. G. Alenkov, V. V. |
| author2Str |
Kostishin, V. G. Alenkov, V. V. |
| ppnlink |
129398233 |
| mediatype_str_mv |
n |
| isOA_txt |
false |
| hochschulschrift_bool |
false |
| doi_str |
10.1007/s11664-016-4952-0 |
| up_date |
2024-07-03T14:51:13.653Z |
| _version_ |
1803569881320259584 |
| fullrecord_marcxml |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">OLC2042352713</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230401130224.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">200820s2016 xx ||||| 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/s11664-016-4952-0</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC2042352713</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-He213)s11664-016-4952-0-p</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">670</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Melnikov, A. A.</subfield><subfield code="e">verfasserin</subfield><subfield code="0">(orcid)0000-0002-4640-3994</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Dimensionless Model of a Thermoelectric Cooling Device Operating at Real Heat Transfer Conditions: Maximum Cooling Capacity Mode</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2016</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© The Minerals, Metals & Materials Society 2016</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract Real operating conditions of a thermoelectric cooling device are in the presence of thermal resistances between thermoelectric material and a heat medium or cooling object. They limit performance of a device and should be considered when modeling. Here we propose a dimensionless mathematical steady state model, which takes them into account. Analytical equations for dimensionless cooling capacity, voltage, and coefficient of performance (COP) depending on dimensionless current are given. For improved accuracy a device can be modeled with use of numerical or combined analytical-numerical methods. The results of modeling are in acceptable accordance with experimental results. The case of zero temperature difference between hot and cold heat mediums at which the maximum cooling capacity mode appears is considered in detail. Optimal device parameters for maximal cooling capacity, such as fraction of thermal conductance on the cold side y, fraction of current relative to maximal j′ are estimated in range of 0.38–0.44 and 0.48–0.95, respectively, for dimensionless conductance K′ = 5–100. Also, a method for determination of thermal resistances of a thermoelectric cooling system is proposed.</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thermoelectrics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermoelectric theory</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermoelectricity</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermoelectric modeling</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">optimal design</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermoelectric module</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">thermoelectric cooler</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Kostishin, V. G.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Alenkov, V. V.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Journal of electronic materials</subfield><subfield code="d">Springer US, 1972</subfield><subfield code="g">46(2016), 5 vom: 27. Sept., Seite 2737-2745</subfield><subfield code="w">(DE-627)129398233</subfield><subfield code="w">(DE-600)186069-0</subfield><subfield code="w">(DE-576)014781387</subfield><subfield code="x">0361-5235</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:46</subfield><subfield code="g">year:2016</subfield><subfield code="g">number:5</subfield><subfield code="g">day:27</subfield><subfield code="g">month:09</subfield><subfield code="g">pages:2737-2745</subfield></datafield><datafield tag="856" ind1="4" ind2="1"><subfield code="u">https://doi.org/10.1007/s11664-016-4952-0</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-TEC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-PHY</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">46</subfield><subfield code="j">2016</subfield><subfield code="e">5</subfield><subfield code="b">27</subfield><subfield code="c">09</subfield><subfield code="h">2737-2745</subfield></datafield></record></collection>
|
| score |
7.399579 |