Analyses of thermal expansion behavior of intergranular two-phase composites
Abstract Both analytical modeling and numerical simulations were performed to analyze residual thermal stresses and coefficients of thermal expansion (CTEs) of intergranular two-phase composites in a two-dimensional sense. A composite-circle model was adopted for analytical modeling. Model microstru...
Ausführliche Beschreibung
Autor*in: |
Hsueh, C. H. [verfasserIn] |
---|
Format: |
Artikel |
---|---|
Sprache: |
Englisch |
Erschienen: |
2001 |
---|
Schlagwörter: |
---|
Anmerkung: |
© Kluwer Academic Publishers 2001 |
---|
Übergeordnetes Werk: |
Enthalten in: Journal of materials science - Kluwer Academic Publishers, 1966, 36(2001), 1 vom: Jan., Seite 255-261 |
---|---|
Übergeordnetes Werk: |
volume:36 ; year:2001 ; number:1 ; month:01 ; pages:255-261 |
Links: |
---|
DOI / URN: |
10.1023/A:1004890415316 |
---|
Katalog-ID: |
OLC2046264207 |
---|
LEADER | 01000caa a22002652 4500 | ||
---|---|---|---|
001 | OLC2046264207 | ||
003 | DE-627 | ||
005 | 20230503123012.0 | ||
007 | tu | ||
008 | 200820s2001 xx ||||| 00| ||eng c | ||
024 | 7 | |a 10.1023/A:1004890415316 |2 doi | |
035 | |a (DE-627)OLC2046264207 | ||
035 | |a (DE-He213)A:1004890415316-p | ||
040 | |a DE-627 |b ger |c DE-627 |e rakwb | ||
041 | |a eng | ||
082 | 0 | 4 | |a 670 |q VZ |
100 | 1 | |a Hsueh, C. H. |e verfasserin |4 aut | |
245 | 1 | 0 | |a Analyses of thermal expansion behavior of intergranular two-phase composites |
264 | 1 | |c 2001 | |
336 | |a Text |b txt |2 rdacontent | ||
337 | |a ohne Hilfsmittel zu benutzen |b n |2 rdamedia | ||
338 | |a Band |b nc |2 rdacarrier | ||
500 | |a © Kluwer Academic Publishers 2001 | ||
520 | |a Abstract Both analytical modeling and numerical simulations were performed to analyze residual thermal stresses and coefficients of thermal expansion (CTEs) of intergranular two-phase composites in a two-dimensional sense. A composite-circle model was adopted for analytical modeling. Model microstructures consisting of square-array, hexagon-array, and brick wall-array of grains with an intergranular phase as well as an actual microstructure of random-array grains with an intergranular phase were adopted for numerical simulations. The results showed that in predicting CTEs, the simple analytical model represents the two-dimensional composite well except that with brick wall-array grains, which induced significant anisotropic CTEs in the composite. The residual thermal stresses in composites were also discussed. | ||
650 | 4 | |a Polymer | |
650 | 4 | |a Microstructure | |
650 | 4 | |a Thermal Expansion | |
650 | 4 | |a Thermal Stress | |
650 | 4 | |a Residual Thermal Stress | |
700 | 1 | |a Becher, P. F. |4 aut | |
700 | 1 | |a Sun, E. Y. |4 aut | |
773 | 0 | 8 | |i Enthalten in |t Journal of materials science |d Kluwer Academic Publishers, 1966 |g 36(2001), 1 vom: Jan., Seite 255-261 |w (DE-627)129546372 |w (DE-600)218324-9 |w (DE-576)014996774 |x 0022-2461 |7 nnns |
773 | 1 | 8 | |g volume:36 |g year:2001 |g number:1 |g month:01 |g pages:255-261 |
856 | 4 | 1 | |u https://doi.org/10.1023/A:1004890415316 |z lizenzpflichtig |3 Volltext |
912 | |a GBV_USEFLAG_A | ||
912 | |a SYSFLAG_A | ||
912 | |a GBV_OLC | ||
912 | |a SSG-OLC-TEC | ||
912 | |a GBV_ILN_11 | ||
912 | |a GBV_ILN_20 | ||
912 | |a GBV_ILN_23 | ||
912 | |a GBV_ILN_30 | ||
912 | |a GBV_ILN_32 | ||
912 | |a GBV_ILN_40 | ||
912 | |a GBV_ILN_62 | ||
912 | |a GBV_ILN_65 | ||
912 | |a GBV_ILN_70 | ||
912 | |a GBV_ILN_2004 | ||
912 | |a GBV_ILN_2006 | ||
912 | |a GBV_ILN_2015 | ||
912 | |a GBV_ILN_2020 | ||
912 | |a GBV_ILN_2021 | ||
912 | |a GBV_ILN_4046 | ||
912 | |a GBV_ILN_4305 | ||
912 | |a GBV_ILN_4306 | ||
912 | |a GBV_ILN_4316 | ||
912 | |a GBV_ILN_4319 | ||
912 | |a GBV_ILN_4323 | ||
951 | |a AR | ||
952 | |d 36 |j 2001 |e 1 |c 01 |h 255-261 |
author_variant |
c h h ch chh p f b pf pfb e y s ey eys |
---|---|
matchkey_str |
article:00222461:2001----::nlssfhraepnineairfnegaua |
hierarchy_sort_str |
2001 |
publishDate |
2001 |
allfields |
10.1023/A:1004890415316 doi (DE-627)OLC2046264207 (DE-He213)A:1004890415316-p DE-627 ger DE-627 rakwb eng 670 VZ Hsueh, C. H. verfasserin aut Analyses of thermal expansion behavior of intergranular two-phase composites 2001 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Kluwer Academic Publishers 2001 Abstract Both analytical modeling and numerical simulations were performed to analyze residual thermal stresses and coefficients of thermal expansion (CTEs) of intergranular two-phase composites in a two-dimensional sense. A composite-circle model was adopted for analytical modeling. Model microstructures consisting of square-array, hexagon-array, and brick wall-array of grains with an intergranular phase as well as an actual microstructure of random-array grains with an intergranular phase were adopted for numerical simulations. The results showed that in predicting CTEs, the simple analytical model represents the two-dimensional composite well except that with brick wall-array grains, which induced significant anisotropic CTEs in the composite. The residual thermal stresses in composites were also discussed. Polymer Microstructure Thermal Expansion Thermal Stress Residual Thermal Stress Becher, P. F. aut Sun, E. Y. aut Enthalten in Journal of materials science Kluwer Academic Publishers, 1966 36(2001), 1 vom: Jan., Seite 255-261 (DE-627)129546372 (DE-600)218324-9 (DE-576)014996774 0022-2461 nnns volume:36 year:2001 number:1 month:01 pages:255-261 https://doi.org/10.1023/A:1004890415316 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_11 GBV_ILN_20 GBV_ILN_23 GBV_ILN_30 GBV_ILN_32 GBV_ILN_40 GBV_ILN_62 GBV_ILN_65 GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2006 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_4046 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4316 GBV_ILN_4319 GBV_ILN_4323 AR 36 2001 1 01 255-261 |
spelling |
10.1023/A:1004890415316 doi (DE-627)OLC2046264207 (DE-He213)A:1004890415316-p DE-627 ger DE-627 rakwb eng 670 VZ Hsueh, C. H. verfasserin aut Analyses of thermal expansion behavior of intergranular two-phase composites 2001 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Kluwer Academic Publishers 2001 Abstract Both analytical modeling and numerical simulations were performed to analyze residual thermal stresses and coefficients of thermal expansion (CTEs) of intergranular two-phase composites in a two-dimensional sense. A composite-circle model was adopted for analytical modeling. Model microstructures consisting of square-array, hexagon-array, and brick wall-array of grains with an intergranular phase as well as an actual microstructure of random-array grains with an intergranular phase were adopted for numerical simulations. The results showed that in predicting CTEs, the simple analytical model represents the two-dimensional composite well except that with brick wall-array grains, which induced significant anisotropic CTEs in the composite. The residual thermal stresses in composites were also discussed. Polymer Microstructure Thermal Expansion Thermal Stress Residual Thermal Stress Becher, P. F. aut Sun, E. Y. aut Enthalten in Journal of materials science Kluwer Academic Publishers, 1966 36(2001), 1 vom: Jan., Seite 255-261 (DE-627)129546372 (DE-600)218324-9 (DE-576)014996774 0022-2461 nnns volume:36 year:2001 number:1 month:01 pages:255-261 https://doi.org/10.1023/A:1004890415316 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_11 GBV_ILN_20 GBV_ILN_23 GBV_ILN_30 GBV_ILN_32 GBV_ILN_40 GBV_ILN_62 GBV_ILN_65 GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2006 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_4046 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4316 GBV_ILN_4319 GBV_ILN_4323 AR 36 2001 1 01 255-261 |
allfields_unstemmed |
10.1023/A:1004890415316 doi (DE-627)OLC2046264207 (DE-He213)A:1004890415316-p DE-627 ger DE-627 rakwb eng 670 VZ Hsueh, C. H. verfasserin aut Analyses of thermal expansion behavior of intergranular two-phase composites 2001 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Kluwer Academic Publishers 2001 Abstract Both analytical modeling and numerical simulations were performed to analyze residual thermal stresses and coefficients of thermal expansion (CTEs) of intergranular two-phase composites in a two-dimensional sense. A composite-circle model was adopted for analytical modeling. Model microstructures consisting of square-array, hexagon-array, and brick wall-array of grains with an intergranular phase as well as an actual microstructure of random-array grains with an intergranular phase were adopted for numerical simulations. The results showed that in predicting CTEs, the simple analytical model represents the two-dimensional composite well except that with brick wall-array grains, which induced significant anisotropic CTEs in the composite. The residual thermal stresses in composites were also discussed. Polymer Microstructure Thermal Expansion Thermal Stress Residual Thermal Stress Becher, P. F. aut Sun, E. Y. aut Enthalten in Journal of materials science Kluwer Academic Publishers, 1966 36(2001), 1 vom: Jan., Seite 255-261 (DE-627)129546372 (DE-600)218324-9 (DE-576)014996774 0022-2461 nnns volume:36 year:2001 number:1 month:01 pages:255-261 https://doi.org/10.1023/A:1004890415316 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_11 GBV_ILN_20 GBV_ILN_23 GBV_ILN_30 GBV_ILN_32 GBV_ILN_40 GBV_ILN_62 GBV_ILN_65 GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2006 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_4046 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4316 GBV_ILN_4319 GBV_ILN_4323 AR 36 2001 1 01 255-261 |
allfieldsGer |
10.1023/A:1004890415316 doi (DE-627)OLC2046264207 (DE-He213)A:1004890415316-p DE-627 ger DE-627 rakwb eng 670 VZ Hsueh, C. H. verfasserin aut Analyses of thermal expansion behavior of intergranular two-phase composites 2001 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Kluwer Academic Publishers 2001 Abstract Both analytical modeling and numerical simulations were performed to analyze residual thermal stresses and coefficients of thermal expansion (CTEs) of intergranular two-phase composites in a two-dimensional sense. A composite-circle model was adopted for analytical modeling. Model microstructures consisting of square-array, hexagon-array, and brick wall-array of grains with an intergranular phase as well as an actual microstructure of random-array grains with an intergranular phase were adopted for numerical simulations. The results showed that in predicting CTEs, the simple analytical model represents the two-dimensional composite well except that with brick wall-array grains, which induced significant anisotropic CTEs in the composite. The residual thermal stresses in composites were also discussed. Polymer Microstructure Thermal Expansion Thermal Stress Residual Thermal Stress Becher, P. F. aut Sun, E. Y. aut Enthalten in Journal of materials science Kluwer Academic Publishers, 1966 36(2001), 1 vom: Jan., Seite 255-261 (DE-627)129546372 (DE-600)218324-9 (DE-576)014996774 0022-2461 nnns volume:36 year:2001 number:1 month:01 pages:255-261 https://doi.org/10.1023/A:1004890415316 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_11 GBV_ILN_20 GBV_ILN_23 GBV_ILN_30 GBV_ILN_32 GBV_ILN_40 GBV_ILN_62 GBV_ILN_65 GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2006 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_4046 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4316 GBV_ILN_4319 GBV_ILN_4323 AR 36 2001 1 01 255-261 |
allfieldsSound |
10.1023/A:1004890415316 doi (DE-627)OLC2046264207 (DE-He213)A:1004890415316-p DE-627 ger DE-627 rakwb eng 670 VZ Hsueh, C. H. verfasserin aut Analyses of thermal expansion behavior of intergranular two-phase composites 2001 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Kluwer Academic Publishers 2001 Abstract Both analytical modeling and numerical simulations were performed to analyze residual thermal stresses and coefficients of thermal expansion (CTEs) of intergranular two-phase composites in a two-dimensional sense. A composite-circle model was adopted for analytical modeling. Model microstructures consisting of square-array, hexagon-array, and brick wall-array of grains with an intergranular phase as well as an actual microstructure of random-array grains with an intergranular phase were adopted for numerical simulations. The results showed that in predicting CTEs, the simple analytical model represents the two-dimensional composite well except that with brick wall-array grains, which induced significant anisotropic CTEs in the composite. The residual thermal stresses in composites were also discussed. Polymer Microstructure Thermal Expansion Thermal Stress Residual Thermal Stress Becher, P. F. aut Sun, E. Y. aut Enthalten in Journal of materials science Kluwer Academic Publishers, 1966 36(2001), 1 vom: Jan., Seite 255-261 (DE-627)129546372 (DE-600)218324-9 (DE-576)014996774 0022-2461 nnns volume:36 year:2001 number:1 month:01 pages:255-261 https://doi.org/10.1023/A:1004890415316 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_11 GBV_ILN_20 GBV_ILN_23 GBV_ILN_30 GBV_ILN_32 GBV_ILN_40 GBV_ILN_62 GBV_ILN_65 GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2006 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_4046 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4316 GBV_ILN_4319 GBV_ILN_4323 AR 36 2001 1 01 255-261 |
language |
English |
source |
Enthalten in Journal of materials science 36(2001), 1 vom: Jan., Seite 255-261 volume:36 year:2001 number:1 month:01 pages:255-261 |
sourceStr |
Enthalten in Journal of materials science 36(2001), 1 vom: Jan., Seite 255-261 volume:36 year:2001 number:1 month:01 pages:255-261 |
format_phy_str_mv |
Article |
institution |
findex.gbv.de |
topic_facet |
Polymer Microstructure Thermal Expansion Thermal Stress Residual Thermal Stress |
dewey-raw |
670 |
isfreeaccess_bool |
false |
container_title |
Journal of materials science |
authorswithroles_txt_mv |
Hsueh, C. H. @@aut@@ Becher, P. F. @@aut@@ Sun, E. Y. @@aut@@ |
publishDateDaySort_date |
2001-01-01T00:00:00Z |
hierarchy_top_id |
129546372 |
dewey-sort |
3670 |
id |
OLC2046264207 |
language_de |
englisch |
fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">OLC2046264207</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230503123012.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">200820s2001 xx ||||| 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1023/A:1004890415316</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC2046264207</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-He213)A:1004890415316-p</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">670</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Hsueh, C. H.</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Analyses of thermal expansion behavior of intergranular two-phase composites</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2001</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© Kluwer Academic Publishers 2001</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract Both analytical modeling and numerical simulations were performed to analyze residual thermal stresses and coefficients of thermal expansion (CTEs) of intergranular two-phase composites in a two-dimensional sense. A composite-circle model was adopted for analytical modeling. Model microstructures consisting of square-array, hexagon-array, and brick wall-array of grains with an intergranular phase as well as an actual microstructure of random-array grains with an intergranular phase were adopted for numerical simulations. The results showed that in predicting CTEs, the simple analytical model represents the two-dimensional composite well except that with brick wall-array grains, which induced significant anisotropic CTEs in the composite. The residual thermal stresses in composites were also discussed.</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Polymer</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microstructure</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thermal Expansion</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thermal Stress</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Residual Thermal Stress</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Becher, P. F.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Sun, E. Y.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Journal of materials science</subfield><subfield code="d">Kluwer Academic Publishers, 1966</subfield><subfield code="g">36(2001), 1 vom: Jan., Seite 255-261</subfield><subfield code="w">(DE-627)129546372</subfield><subfield code="w">(DE-600)218324-9</subfield><subfield code="w">(DE-576)014996774</subfield><subfield code="x">0022-2461</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:36</subfield><subfield code="g">year:2001</subfield><subfield code="g">number:1</subfield><subfield code="g">month:01</subfield><subfield code="g">pages:255-261</subfield></datafield><datafield tag="856" ind1="4" ind2="1"><subfield code="u">https://doi.org/10.1023/A:1004890415316</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-TEC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_11</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_20</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_23</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_30</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_32</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_40</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_62</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_65</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2004</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2006</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2015</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2020</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2021</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4046</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4305</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4306</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4316</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4319</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4323</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">36</subfield><subfield code="j">2001</subfield><subfield code="e">1</subfield><subfield code="c">01</subfield><subfield code="h">255-261</subfield></datafield></record></collection>
|
author |
Hsueh, C. H. |
spellingShingle |
Hsueh, C. H. ddc 670 misc Polymer misc Microstructure misc Thermal Expansion misc Thermal Stress misc Residual Thermal Stress Analyses of thermal expansion behavior of intergranular two-phase composites |
authorStr |
Hsueh, C. H. |
ppnlink_with_tag_str_mv |
@@773@@(DE-627)129546372 |
format |
Article |
dewey-ones |
670 - Manufacturing |
delete_txt_mv |
keep |
author_role |
aut aut aut |
collection |
OLC |
remote_str |
false |
illustrated |
Not Illustrated |
issn |
0022-2461 |
topic_title |
670 VZ Analyses of thermal expansion behavior of intergranular two-phase composites Polymer Microstructure Thermal Expansion Thermal Stress Residual Thermal Stress |
topic |
ddc 670 misc Polymer misc Microstructure misc Thermal Expansion misc Thermal Stress misc Residual Thermal Stress |
topic_unstemmed |
ddc 670 misc Polymer misc Microstructure misc Thermal Expansion misc Thermal Stress misc Residual Thermal Stress |
topic_browse |
ddc 670 misc Polymer misc Microstructure misc Thermal Expansion misc Thermal Stress misc Residual Thermal Stress |
format_facet |
Aufsätze Gedruckte Aufsätze |
format_main_str_mv |
Text Zeitschrift/Artikel |
carriertype_str_mv |
nc |
hierarchy_parent_title |
Journal of materials science |
hierarchy_parent_id |
129546372 |
dewey-tens |
670 - Manufacturing |
hierarchy_top_title |
Journal of materials science |
isfreeaccess_txt |
false |
familylinks_str_mv |
(DE-627)129546372 (DE-600)218324-9 (DE-576)014996774 |
title |
Analyses of thermal expansion behavior of intergranular two-phase composites |
ctrlnum |
(DE-627)OLC2046264207 (DE-He213)A:1004890415316-p |
title_full |
Analyses of thermal expansion behavior of intergranular two-phase composites |
author_sort |
Hsueh, C. H. |
journal |
Journal of materials science |
journalStr |
Journal of materials science |
lang_code |
eng |
isOA_bool |
false |
dewey-hundreds |
600 - Technology |
recordtype |
marc |
publishDateSort |
2001 |
contenttype_str_mv |
txt |
container_start_page |
255 |
author_browse |
Hsueh, C. H. Becher, P. F. Sun, E. Y. |
container_volume |
36 |
class |
670 VZ |
format_se |
Aufsätze |
author-letter |
Hsueh, C. H. |
doi_str_mv |
10.1023/A:1004890415316 |
dewey-full |
670 |
title_sort |
analyses of thermal expansion behavior of intergranular two-phase composites |
title_auth |
Analyses of thermal expansion behavior of intergranular two-phase composites |
abstract |
Abstract Both analytical modeling and numerical simulations were performed to analyze residual thermal stresses and coefficients of thermal expansion (CTEs) of intergranular two-phase composites in a two-dimensional sense. A composite-circle model was adopted for analytical modeling. Model microstructures consisting of square-array, hexagon-array, and brick wall-array of grains with an intergranular phase as well as an actual microstructure of random-array grains with an intergranular phase were adopted for numerical simulations. The results showed that in predicting CTEs, the simple analytical model represents the two-dimensional composite well except that with brick wall-array grains, which induced significant anisotropic CTEs in the composite. The residual thermal stresses in composites were also discussed. © Kluwer Academic Publishers 2001 |
abstractGer |
Abstract Both analytical modeling and numerical simulations were performed to analyze residual thermal stresses and coefficients of thermal expansion (CTEs) of intergranular two-phase composites in a two-dimensional sense. A composite-circle model was adopted for analytical modeling. Model microstructures consisting of square-array, hexagon-array, and brick wall-array of grains with an intergranular phase as well as an actual microstructure of random-array grains with an intergranular phase were adopted for numerical simulations. The results showed that in predicting CTEs, the simple analytical model represents the two-dimensional composite well except that with brick wall-array grains, which induced significant anisotropic CTEs in the composite. The residual thermal stresses in composites were also discussed. © Kluwer Academic Publishers 2001 |
abstract_unstemmed |
Abstract Both analytical modeling and numerical simulations were performed to analyze residual thermal stresses and coefficients of thermal expansion (CTEs) of intergranular two-phase composites in a two-dimensional sense. A composite-circle model was adopted for analytical modeling. Model microstructures consisting of square-array, hexagon-array, and brick wall-array of grains with an intergranular phase as well as an actual microstructure of random-array grains with an intergranular phase were adopted for numerical simulations. The results showed that in predicting CTEs, the simple analytical model represents the two-dimensional composite well except that with brick wall-array grains, which induced significant anisotropic CTEs in the composite. The residual thermal stresses in composites were also discussed. © Kluwer Academic Publishers 2001 |
collection_details |
GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_11 GBV_ILN_20 GBV_ILN_23 GBV_ILN_30 GBV_ILN_32 GBV_ILN_40 GBV_ILN_62 GBV_ILN_65 GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2006 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_4046 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4316 GBV_ILN_4319 GBV_ILN_4323 |
container_issue |
1 |
title_short |
Analyses of thermal expansion behavior of intergranular two-phase composites |
url |
https://doi.org/10.1023/A:1004890415316 |
remote_bool |
false |
author2 |
Becher, P. F. Sun, E. Y. |
author2Str |
Becher, P. F. Sun, E. Y. |
ppnlink |
129546372 |
mediatype_str_mv |
n |
isOA_txt |
false |
hochschulschrift_bool |
false |
doi_str |
10.1023/A:1004890415316 |
up_date |
2024-07-04T04:39:02.625Z |
_version_ |
1803621963009097728 |
fullrecord_marcxml |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">OLC2046264207</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230503123012.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">200820s2001 xx ||||| 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1023/A:1004890415316</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC2046264207</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-He213)A:1004890415316-p</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">670</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Hsueh, C. H.</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Analyses of thermal expansion behavior of intergranular two-phase composites</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2001</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© Kluwer Academic Publishers 2001</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract Both analytical modeling and numerical simulations were performed to analyze residual thermal stresses and coefficients of thermal expansion (CTEs) of intergranular two-phase composites in a two-dimensional sense. A composite-circle model was adopted for analytical modeling. Model microstructures consisting of square-array, hexagon-array, and brick wall-array of grains with an intergranular phase as well as an actual microstructure of random-array grains with an intergranular phase were adopted for numerical simulations. The results showed that in predicting CTEs, the simple analytical model represents the two-dimensional composite well except that with brick wall-array grains, which induced significant anisotropic CTEs in the composite. The residual thermal stresses in composites were also discussed.</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Polymer</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microstructure</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thermal Expansion</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Thermal Stress</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Residual Thermal Stress</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Becher, P. F.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Sun, E. Y.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Journal of materials science</subfield><subfield code="d">Kluwer Academic Publishers, 1966</subfield><subfield code="g">36(2001), 1 vom: Jan., Seite 255-261</subfield><subfield code="w">(DE-627)129546372</subfield><subfield code="w">(DE-600)218324-9</subfield><subfield code="w">(DE-576)014996774</subfield><subfield code="x">0022-2461</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:36</subfield><subfield code="g">year:2001</subfield><subfield code="g">number:1</subfield><subfield code="g">month:01</subfield><subfield code="g">pages:255-261</subfield></datafield><datafield tag="856" ind1="4" ind2="1"><subfield code="u">https://doi.org/10.1023/A:1004890415316</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-TEC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_11</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_20</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_23</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_30</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_32</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_40</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_62</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_65</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2004</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2006</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2015</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2020</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2021</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4046</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4305</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4306</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4316</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4319</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4323</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">36</subfield><subfield code="j">2001</subfield><subfield code="e">1</subfield><subfield code="c">01</subfield><subfield code="h">255-261</subfield></datafield></record></collection>
|
score |
7.3992023 |