Characterization and Adhesion in Cu/Ru/$ SiO_{2} $/Si Multilayer Nano-scale Structure for Cu Metallization
Abstract In this study, we have characterized the microstructure, resistivity, and dynamic deformation behavior of Cu/Ru/$ SiO_{2} $ and Cu/$ SiO_{2} $ samples under scratch loading conditions. Cu/Ru/$ SiO_{2} $ samples showed higher elastic recovery and hardness when compared to the Cu/$ SiO_{2} $...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Chawla, N. [verfasserIn] |
|---|
| Format: |
Artikel |
|---|---|
| Sprache: |
Englisch |
| Erschienen: |
2012 |
|---|
| Schlagwörter: |
|---|
| Anmerkung: |
© ASM International 2012 |
|---|
| Übergeordnetes Werk: |
Enthalten in: Journal of materials engineering and performance - Springer US, 1992, 22(2012), 4 vom: 07. Sept., Seite 1085-1090 |
|---|---|
| Übergeordnetes Werk: |
volume:22 ; year:2012 ; number:4 ; day:07 ; month:09 ; pages:1085-1090 |
| Links: |
|---|
| DOI / URN: |
10.1007/s11665-012-0359-0 |
|---|
| Katalog-ID: |
OLC2053039914 |
|---|
| LEADER | 01000caa a22002652 4500 | ||
|---|---|---|---|
| 001 | OLC2053039914 | ||
| 003 | DE-627 | ||
| 005 | 20230401131435.0 | ||
| 007 | tu | ||
| 008 | 200820s2012 xx ||||| 00| ||eng c | ||
| 024 | 7 | |a 10.1007/s11665-012-0359-0 |2 doi | |
| 035 | |a (DE-627)OLC2053039914 | ||
| 035 | |a (DE-He213)s11665-012-0359-0-p | ||
| 040 | |a DE-627 |b ger |c DE-627 |e rakwb | ||
| 041 | |a eng | ||
| 082 | 0 | 4 | |a 620 |a 660 |a 670 |q VZ |
| 100 | 1 | |a Chawla, N. |e verfasserin |4 aut | |
| 245 | 1 | 0 | |a Characterization and Adhesion in Cu/Ru/$ SiO_{2} $/Si Multilayer Nano-scale Structure for Cu Metallization |
| 264 | 1 | |c 2012 | |
| 336 | |a Text |b txt |2 rdacontent | ||
| 337 | |a ohne Hilfsmittel zu benutzen |b n |2 rdamedia | ||
| 338 | |a Band |b nc |2 rdacarrier | ||
| 500 | |a © ASM International 2012 | ||
| 520 | |a Abstract In this study, we have characterized the microstructure, resistivity, and dynamic deformation behavior of Cu/Ru/$ SiO_{2} $ and Cu/$ SiO_{2} $ samples under scratch loading conditions. Cu/Ru/$ SiO_{2} $ samples showed higher elastic recovery and hardness when compared to the Cu/$ SiO_{2} $ samples. In the case of Cu/Ru/$ SiO_{2} $ samples, Ru acts as a glue layer between the Cu and the $ SiO_{2} $ substrate providing both strength and toughness against dynamic loading. Hence, the critical load for delamination is higher for Cu/Ru/$ SiO_{2} $ samples compared to Cu/$ SiO_{2} $ samples. Our results show that Cu/Ru/$ SiO_{2} $ thin films present significant potential to be used in Cu metallization. | ||
| 650 | 4 | |a advanced characterization | |
| 650 | 4 | |a coatings | |
| 650 | 4 | |a mechanical testing | |
| 700 | 1 | |a Venkatesh, S. H. |4 aut | |
| 700 | 1 | |a Singh, D. R. P. |4 aut | |
| 700 | 1 | |a Alford, T. L. |4 aut | |
| 773 | 0 | 8 | |i Enthalten in |t Journal of materials engineering and performance |d Springer US, 1992 |g 22(2012), 4 vom: 07. Sept., Seite 1085-1090 |w (DE-627)131147366 |w (DE-600)1129075-4 |w (DE-576)033027250 |x 1059-9495 |7 nnns |
| 773 | 1 | 8 | |g volume:22 |g year:2012 |g number:4 |g day:07 |g month:09 |g pages:1085-1090 |
| 856 | 4 | 1 | |u https://doi.org/10.1007/s11665-012-0359-0 |z lizenzpflichtig |3 Volltext |
| 912 | |a GBV_USEFLAG_A | ||
| 912 | |a SYSFLAG_A | ||
| 912 | |a GBV_OLC | ||
| 912 | |a SSG-OLC-TEC | ||
| 912 | |a GBV_ILN_70 | ||
| 951 | |a AR | ||
| 952 | |d 22 |j 2012 |e 4 |b 07 |c 09 |h 1085-1090 | ||
| author_variant |
n c nc s h v sh shv d r p s drp drps t l a tl tla |
|---|---|
| matchkey_str |
article:10599495:2012----::hrceiainnahsoicrso2iutlyraoclsr |
| hierarchy_sort_str |
2012 |
| publishDate |
2012 |
| allfields |
10.1007/s11665-012-0359-0 doi (DE-627)OLC2053039914 (DE-He213)s11665-012-0359-0-p DE-627 ger DE-627 rakwb eng 620 660 670 VZ Chawla, N. verfasserin aut Characterization and Adhesion in Cu/Ru/$ SiO_{2} $/Si Multilayer Nano-scale Structure for Cu Metallization 2012 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © ASM International 2012 Abstract In this study, we have characterized the microstructure, resistivity, and dynamic deformation behavior of Cu/Ru/$ SiO_{2} $ and Cu/$ SiO_{2} $ samples under scratch loading conditions. Cu/Ru/$ SiO_{2} $ samples showed higher elastic recovery and hardness when compared to the Cu/$ SiO_{2} $ samples. In the case of Cu/Ru/$ SiO_{2} $ samples, Ru acts as a glue layer between the Cu and the $ SiO_{2} $ substrate providing both strength and toughness against dynamic loading. Hence, the critical load for delamination is higher for Cu/Ru/$ SiO_{2} $ samples compared to Cu/$ SiO_{2} $ samples. Our results show that Cu/Ru/$ SiO_{2} $ thin films present significant potential to be used in Cu metallization. advanced characterization coatings mechanical testing Venkatesh, S. H. aut Singh, D. R. P. aut Alford, T. L. aut Enthalten in Journal of materials engineering and performance Springer US, 1992 22(2012), 4 vom: 07. Sept., Seite 1085-1090 (DE-627)131147366 (DE-600)1129075-4 (DE-576)033027250 1059-9495 nnns volume:22 year:2012 number:4 day:07 month:09 pages:1085-1090 https://doi.org/10.1007/s11665-012-0359-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 AR 22 2012 4 07 09 1085-1090 |
| spelling |
10.1007/s11665-012-0359-0 doi (DE-627)OLC2053039914 (DE-He213)s11665-012-0359-0-p DE-627 ger DE-627 rakwb eng 620 660 670 VZ Chawla, N. verfasserin aut Characterization and Adhesion in Cu/Ru/$ SiO_{2} $/Si Multilayer Nano-scale Structure for Cu Metallization 2012 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © ASM International 2012 Abstract In this study, we have characterized the microstructure, resistivity, and dynamic deformation behavior of Cu/Ru/$ SiO_{2} $ and Cu/$ SiO_{2} $ samples under scratch loading conditions. Cu/Ru/$ SiO_{2} $ samples showed higher elastic recovery and hardness when compared to the Cu/$ SiO_{2} $ samples. In the case of Cu/Ru/$ SiO_{2} $ samples, Ru acts as a glue layer between the Cu and the $ SiO_{2} $ substrate providing both strength and toughness against dynamic loading. Hence, the critical load for delamination is higher for Cu/Ru/$ SiO_{2} $ samples compared to Cu/$ SiO_{2} $ samples. Our results show that Cu/Ru/$ SiO_{2} $ thin films present significant potential to be used in Cu metallization. advanced characterization coatings mechanical testing Venkatesh, S. H. aut Singh, D. R. P. aut Alford, T. L. aut Enthalten in Journal of materials engineering and performance Springer US, 1992 22(2012), 4 vom: 07. Sept., Seite 1085-1090 (DE-627)131147366 (DE-600)1129075-4 (DE-576)033027250 1059-9495 nnns volume:22 year:2012 number:4 day:07 month:09 pages:1085-1090 https://doi.org/10.1007/s11665-012-0359-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 AR 22 2012 4 07 09 1085-1090 |
| allfields_unstemmed |
10.1007/s11665-012-0359-0 doi (DE-627)OLC2053039914 (DE-He213)s11665-012-0359-0-p DE-627 ger DE-627 rakwb eng 620 660 670 VZ Chawla, N. verfasserin aut Characterization and Adhesion in Cu/Ru/$ SiO_{2} $/Si Multilayer Nano-scale Structure for Cu Metallization 2012 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © ASM International 2012 Abstract In this study, we have characterized the microstructure, resistivity, and dynamic deformation behavior of Cu/Ru/$ SiO_{2} $ and Cu/$ SiO_{2} $ samples under scratch loading conditions. Cu/Ru/$ SiO_{2} $ samples showed higher elastic recovery and hardness when compared to the Cu/$ SiO_{2} $ samples. In the case of Cu/Ru/$ SiO_{2} $ samples, Ru acts as a glue layer between the Cu and the $ SiO_{2} $ substrate providing both strength and toughness against dynamic loading. Hence, the critical load for delamination is higher for Cu/Ru/$ SiO_{2} $ samples compared to Cu/$ SiO_{2} $ samples. Our results show that Cu/Ru/$ SiO_{2} $ thin films present significant potential to be used in Cu metallization. advanced characterization coatings mechanical testing Venkatesh, S. H. aut Singh, D. R. P. aut Alford, T. L. aut Enthalten in Journal of materials engineering and performance Springer US, 1992 22(2012), 4 vom: 07. Sept., Seite 1085-1090 (DE-627)131147366 (DE-600)1129075-4 (DE-576)033027250 1059-9495 nnns volume:22 year:2012 number:4 day:07 month:09 pages:1085-1090 https://doi.org/10.1007/s11665-012-0359-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 AR 22 2012 4 07 09 1085-1090 |
| allfieldsGer |
10.1007/s11665-012-0359-0 doi (DE-627)OLC2053039914 (DE-He213)s11665-012-0359-0-p DE-627 ger DE-627 rakwb eng 620 660 670 VZ Chawla, N. verfasserin aut Characterization and Adhesion in Cu/Ru/$ SiO_{2} $/Si Multilayer Nano-scale Structure for Cu Metallization 2012 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © ASM International 2012 Abstract In this study, we have characterized the microstructure, resistivity, and dynamic deformation behavior of Cu/Ru/$ SiO_{2} $ and Cu/$ SiO_{2} $ samples under scratch loading conditions. Cu/Ru/$ SiO_{2} $ samples showed higher elastic recovery and hardness when compared to the Cu/$ SiO_{2} $ samples. In the case of Cu/Ru/$ SiO_{2} $ samples, Ru acts as a glue layer between the Cu and the $ SiO_{2} $ substrate providing both strength and toughness against dynamic loading. Hence, the critical load for delamination is higher for Cu/Ru/$ SiO_{2} $ samples compared to Cu/$ SiO_{2} $ samples. Our results show that Cu/Ru/$ SiO_{2} $ thin films present significant potential to be used in Cu metallization. advanced characterization coatings mechanical testing Venkatesh, S. H. aut Singh, D. R. P. aut Alford, T. L. aut Enthalten in Journal of materials engineering and performance Springer US, 1992 22(2012), 4 vom: 07. Sept., Seite 1085-1090 (DE-627)131147366 (DE-600)1129075-4 (DE-576)033027250 1059-9495 nnns volume:22 year:2012 number:4 day:07 month:09 pages:1085-1090 https://doi.org/10.1007/s11665-012-0359-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 AR 22 2012 4 07 09 1085-1090 |
| allfieldsSound |
10.1007/s11665-012-0359-0 doi (DE-627)OLC2053039914 (DE-He213)s11665-012-0359-0-p DE-627 ger DE-627 rakwb eng 620 660 670 VZ Chawla, N. verfasserin aut Characterization and Adhesion in Cu/Ru/$ SiO_{2} $/Si Multilayer Nano-scale Structure for Cu Metallization 2012 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © ASM International 2012 Abstract In this study, we have characterized the microstructure, resistivity, and dynamic deformation behavior of Cu/Ru/$ SiO_{2} $ and Cu/$ SiO_{2} $ samples under scratch loading conditions. Cu/Ru/$ SiO_{2} $ samples showed higher elastic recovery and hardness when compared to the Cu/$ SiO_{2} $ samples. In the case of Cu/Ru/$ SiO_{2} $ samples, Ru acts as a glue layer between the Cu and the $ SiO_{2} $ substrate providing both strength and toughness against dynamic loading. Hence, the critical load for delamination is higher for Cu/Ru/$ SiO_{2} $ samples compared to Cu/$ SiO_{2} $ samples. Our results show that Cu/Ru/$ SiO_{2} $ thin films present significant potential to be used in Cu metallization. advanced characterization coatings mechanical testing Venkatesh, S. H. aut Singh, D. R. P. aut Alford, T. L. aut Enthalten in Journal of materials engineering and performance Springer US, 1992 22(2012), 4 vom: 07. Sept., Seite 1085-1090 (DE-627)131147366 (DE-600)1129075-4 (DE-576)033027250 1059-9495 nnns volume:22 year:2012 number:4 day:07 month:09 pages:1085-1090 https://doi.org/10.1007/s11665-012-0359-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 AR 22 2012 4 07 09 1085-1090 |
| language |
English |
| source |
Enthalten in Journal of materials engineering and performance 22(2012), 4 vom: 07. Sept., Seite 1085-1090 volume:22 year:2012 number:4 day:07 month:09 pages:1085-1090 |
| sourceStr |
Enthalten in Journal of materials engineering and performance 22(2012), 4 vom: 07. Sept., Seite 1085-1090 volume:22 year:2012 number:4 day:07 month:09 pages:1085-1090 |
| format_phy_str_mv |
Article |
| institution |
findex.gbv.de |
| topic_facet |
advanced characterization coatings mechanical testing |
| dewey-raw |
620 |
| isfreeaccess_bool |
false |
| container_title |
Journal of materials engineering and performance |
| authorswithroles_txt_mv |
Chawla, N. @@aut@@ Venkatesh, S. H. @@aut@@ Singh, D. R. P. @@aut@@ Alford, T. L. @@aut@@ |
| publishDateDaySort_date |
2012-09-07T00:00:00Z |
| hierarchy_top_id |
131147366 |
| dewey-sort |
3620 |
| id |
OLC2053039914 |
| language_de |
englisch |
| fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">OLC2053039914</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230401131435.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">200820s2012 xx ||||| 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/s11665-012-0359-0</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC2053039914</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-He213)s11665-012-0359-0-p</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">620</subfield><subfield code="a">660</subfield><subfield code="a">670</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Chawla, N.</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Characterization and Adhesion in Cu/Ru/$ SiO_{2} $/Si Multilayer Nano-scale Structure for Cu Metallization</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2012</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© ASM International 2012</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract In this study, we have characterized the microstructure, resistivity, and dynamic deformation behavior of Cu/Ru/$ SiO_{2} $ and Cu/$ SiO_{2} $ samples under scratch loading conditions. Cu/Ru/$ SiO_{2} $ samples showed higher elastic recovery and hardness when compared to the Cu/$ SiO_{2} $ samples. In the case of Cu/Ru/$ SiO_{2} $ samples, Ru acts as a glue layer between the Cu and the $ SiO_{2} $ substrate providing both strength and toughness against dynamic loading. Hence, the critical load for delamination is higher for Cu/Ru/$ SiO_{2} $ samples compared to Cu/$ SiO_{2} $ samples. Our results show that Cu/Ru/$ SiO_{2} $ thin films present significant potential to be used in Cu metallization.</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">advanced characterization</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">coatings</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">mechanical testing</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Venkatesh, S. H.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Singh, D. R. P.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Alford, T. L.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Journal of materials engineering and performance</subfield><subfield code="d">Springer US, 1992</subfield><subfield code="g">22(2012), 4 vom: 07. Sept., Seite 1085-1090</subfield><subfield code="w">(DE-627)131147366</subfield><subfield code="w">(DE-600)1129075-4</subfield><subfield code="w">(DE-576)033027250</subfield><subfield code="x">1059-9495</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:22</subfield><subfield code="g">year:2012</subfield><subfield code="g">number:4</subfield><subfield code="g">day:07</subfield><subfield code="g">month:09</subfield><subfield code="g">pages:1085-1090</subfield></datafield><datafield tag="856" ind1="4" ind2="1"><subfield code="u">https://doi.org/10.1007/s11665-012-0359-0</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-TEC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">22</subfield><subfield code="j">2012</subfield><subfield code="e">4</subfield><subfield code="b">07</subfield><subfield code="c">09</subfield><subfield code="h">1085-1090</subfield></datafield></record></collection>
|
| author |
Chawla, N. |
| spellingShingle |
Chawla, N. ddc 620 misc advanced characterization misc coatings misc mechanical testing Characterization and Adhesion in Cu/Ru/$ SiO_{2} $/Si Multilayer Nano-scale Structure for Cu Metallization |
| authorStr |
Chawla, N. |
| ppnlink_with_tag_str_mv |
@@773@@(DE-627)131147366 |
| format |
Article |
| dewey-ones |
620 - Engineering & allied operations 660 - Chemical engineering 670 - Manufacturing |
| delete_txt_mv |
keep |
| author_role |
aut aut aut aut |
| collection |
OLC |
| remote_str |
false |
| illustrated |
Not Illustrated |
| issn |
1059-9495 |
| topic_title |
620 660 670 VZ Characterization and Adhesion in Cu/Ru/$ SiO_{2} $/Si Multilayer Nano-scale Structure for Cu Metallization advanced characterization coatings mechanical testing |
| topic |
ddc 620 misc advanced characterization misc coatings misc mechanical testing |
| topic_unstemmed |
ddc 620 misc advanced characterization misc coatings misc mechanical testing |
| topic_browse |
ddc 620 misc advanced characterization misc coatings misc mechanical testing |
| format_facet |
Aufsätze Gedruckte Aufsätze |
| format_main_str_mv |
Text Zeitschrift/Artikel |
| carriertype_str_mv |
nc |
| hierarchy_parent_title |
Journal of materials engineering and performance |
| hierarchy_parent_id |
131147366 |
| dewey-tens |
620 - Engineering 660 - Chemical engineering 670 - Manufacturing |
| hierarchy_top_title |
Journal of materials engineering and performance |
| isfreeaccess_txt |
false |
| familylinks_str_mv |
(DE-627)131147366 (DE-600)1129075-4 (DE-576)033027250 |
| title |
Characterization and Adhesion in Cu/Ru/$ SiO_{2} $/Si Multilayer Nano-scale Structure for Cu Metallization |
| ctrlnum |
(DE-627)OLC2053039914 (DE-He213)s11665-012-0359-0-p |
| title_full |
Characterization and Adhesion in Cu/Ru/$ SiO_{2} $/Si Multilayer Nano-scale Structure for Cu Metallization |
| author_sort |
Chawla, N. |
| journal |
Journal of materials engineering and performance |
| journalStr |
Journal of materials engineering and performance |
| lang_code |
eng |
| isOA_bool |
false |
| dewey-hundreds |
600 - Technology |
| recordtype |
marc |
| publishDateSort |
2012 |
| contenttype_str_mv |
txt |
| container_start_page |
1085 |
| author_browse |
Chawla, N. Venkatesh, S. H. Singh, D. R. P. Alford, T. L. |
| container_volume |
22 |
| class |
620 660 670 VZ |
| format_se |
Aufsätze |
| author-letter |
Chawla, N. |
| doi_str_mv |
10.1007/s11665-012-0359-0 |
| dewey-full |
620 660 670 |
| title_sort |
characterization and adhesion in cu/ru/$ sio_{2} $/si multilayer nano-scale structure for cu metallization |
| title_auth |
Characterization and Adhesion in Cu/Ru/$ SiO_{2} $/Si Multilayer Nano-scale Structure for Cu Metallization |
| abstract |
Abstract In this study, we have characterized the microstructure, resistivity, and dynamic deformation behavior of Cu/Ru/$ SiO_{2} $ and Cu/$ SiO_{2} $ samples under scratch loading conditions. Cu/Ru/$ SiO_{2} $ samples showed higher elastic recovery and hardness when compared to the Cu/$ SiO_{2} $ samples. In the case of Cu/Ru/$ SiO_{2} $ samples, Ru acts as a glue layer between the Cu and the $ SiO_{2} $ substrate providing both strength and toughness against dynamic loading. Hence, the critical load for delamination is higher for Cu/Ru/$ SiO_{2} $ samples compared to Cu/$ SiO_{2} $ samples. Our results show that Cu/Ru/$ SiO_{2} $ thin films present significant potential to be used in Cu metallization. © ASM International 2012 |
| abstractGer |
Abstract In this study, we have characterized the microstructure, resistivity, and dynamic deformation behavior of Cu/Ru/$ SiO_{2} $ and Cu/$ SiO_{2} $ samples under scratch loading conditions. Cu/Ru/$ SiO_{2} $ samples showed higher elastic recovery and hardness when compared to the Cu/$ SiO_{2} $ samples. In the case of Cu/Ru/$ SiO_{2} $ samples, Ru acts as a glue layer between the Cu and the $ SiO_{2} $ substrate providing both strength and toughness against dynamic loading. Hence, the critical load for delamination is higher for Cu/Ru/$ SiO_{2} $ samples compared to Cu/$ SiO_{2} $ samples. Our results show that Cu/Ru/$ SiO_{2} $ thin films present significant potential to be used in Cu metallization. © ASM International 2012 |
| abstract_unstemmed |
Abstract In this study, we have characterized the microstructure, resistivity, and dynamic deformation behavior of Cu/Ru/$ SiO_{2} $ and Cu/$ SiO_{2} $ samples under scratch loading conditions. Cu/Ru/$ SiO_{2} $ samples showed higher elastic recovery and hardness when compared to the Cu/$ SiO_{2} $ samples. In the case of Cu/Ru/$ SiO_{2} $ samples, Ru acts as a glue layer between the Cu and the $ SiO_{2} $ substrate providing both strength and toughness against dynamic loading. Hence, the critical load for delamination is higher for Cu/Ru/$ SiO_{2} $ samples compared to Cu/$ SiO_{2} $ samples. Our results show that Cu/Ru/$ SiO_{2} $ thin films present significant potential to be used in Cu metallization. © ASM International 2012 |
| collection_details |
GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 |
| container_issue |
4 |
| title_short |
Characterization and Adhesion in Cu/Ru/$ SiO_{2} $/Si Multilayer Nano-scale Structure for Cu Metallization |
| url |
https://doi.org/10.1007/s11665-012-0359-0 |
| remote_bool |
false |
| author2 |
Venkatesh, S. H. Singh, D. R. P. Alford, T. L. |
| author2Str |
Venkatesh, S. H. Singh, D. R. P. Alford, T. L. |
| ppnlink |
131147366 |
| mediatype_str_mv |
n |
| isOA_txt |
false |
| hochschulschrift_bool |
false |
| doi_str |
10.1007/s11665-012-0359-0 |
| up_date |
2024-07-03T17:45:53.876Z |
| _version_ |
1803580870625329152 |
| fullrecord_marcxml |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">OLC2053039914</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230401131435.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">200820s2012 xx ||||| 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/s11665-012-0359-0</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC2053039914</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-He213)s11665-012-0359-0-p</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">620</subfield><subfield code="a">660</subfield><subfield code="a">670</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Chawla, N.</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Characterization and Adhesion in Cu/Ru/$ SiO_{2} $/Si Multilayer Nano-scale Structure for Cu Metallization</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2012</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© ASM International 2012</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract In this study, we have characterized the microstructure, resistivity, and dynamic deformation behavior of Cu/Ru/$ SiO_{2} $ and Cu/$ SiO_{2} $ samples under scratch loading conditions. Cu/Ru/$ SiO_{2} $ samples showed higher elastic recovery and hardness when compared to the Cu/$ SiO_{2} $ samples. In the case of Cu/Ru/$ SiO_{2} $ samples, Ru acts as a glue layer between the Cu and the $ SiO_{2} $ substrate providing both strength and toughness against dynamic loading. Hence, the critical load for delamination is higher for Cu/Ru/$ SiO_{2} $ samples compared to Cu/$ SiO_{2} $ samples. Our results show that Cu/Ru/$ SiO_{2} $ thin films present significant potential to be used in Cu metallization.</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">advanced characterization</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">coatings</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">mechanical testing</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Venkatesh, S. H.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Singh, D. R. P.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Alford, T. L.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Journal of materials engineering and performance</subfield><subfield code="d">Springer US, 1992</subfield><subfield code="g">22(2012), 4 vom: 07. Sept., Seite 1085-1090</subfield><subfield code="w">(DE-627)131147366</subfield><subfield code="w">(DE-600)1129075-4</subfield><subfield code="w">(DE-576)033027250</subfield><subfield code="x">1059-9495</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:22</subfield><subfield code="g">year:2012</subfield><subfield code="g">number:4</subfield><subfield code="g">day:07</subfield><subfield code="g">month:09</subfield><subfield code="g">pages:1085-1090</subfield></datafield><datafield tag="856" ind1="4" ind2="1"><subfield code="u">https://doi.org/10.1007/s11665-012-0359-0</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-TEC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">22</subfield><subfield code="j">2012</subfield><subfield code="e">4</subfield><subfield code="b">07</subfield><subfield code="c">09</subfield><subfield code="h">1085-1090</subfield></datafield></record></collection>
|
| score |
7.4011383 |