High-Temperature Electrical Insulation Behavior of Alumina Films Prepared at Room Temperature by Aerosol Deposition and Influence of Annealing Process and Powder Impurities
Abstract Alumina ($ Al_{2} $$ O_{3} $) is a widely used material for highly insulating films due to its very low electrical conductivity, even at high temperatures. Typically, alumina films have to be sintered far above 1200 °C, which precludes the coating of lower melting substrates. The aerosol de...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Schubert, Michael [verfasserIn] |
|---|
| Format: |
Artikel |
|---|---|
| Sprache: |
Englisch |
| Erschienen: |
2018 |
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| Schlagwörter: |
aerosol deposition method (ADM) |
|---|
| Anmerkung: |
© ASM International 2018 |
|---|
| Übergeordnetes Werk: |
Enthalten in: Journal of thermal spray technology - Springer US, 1992, 27(2018), 5 vom: 24. Apr., Seite 870-879 |
|---|---|
| Übergeordnetes Werk: |
volume:27 ; year:2018 ; number:5 ; day:24 ; month:04 ; pages:870-879 |
| Links: |
|---|
| DOI / URN: |
10.1007/s11666-018-0719-x |
|---|
| Katalog-ID: |
OLC2060570573 |
|---|
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| 520 | |a Abstract Alumina ($ Al_{2} $$ O_{3} $) is a widely used material for highly insulating films due to its very low electrical conductivity, even at high temperatures. Typically, alumina films have to be sintered far above 1200 °C, which precludes the coating of lower melting substrates. The aerosol deposition method (ADM), however, is a promising method to manufacture ceramic films at room temperature directly from the ceramic raw powder. In this work, alumina films were deposited by ADM on a three-electrode setup with guard ring and the electrical conductivity was measured between 400 and 900 °C by direct current measurements according to ASTM D257 or IEC 60093. The effects of film annealing and of zirconia impurities in the powder on the electrical conductivity were investigated. The conductivity values of the ADM films correlate well with literature data and can even be improved by annealing at 900 °C from 4.5 × $ 10^{−12} $ S/cm before annealing up to 5.6 × $ 10^{−13} $ S/cm after annealing (measured at 400 °C). The influence of zirconia impurities is very low as the conductivity is only slightly elevated. The ADM-processed films show a very good insulation behavior represented by an even lower electrical conductivity than conventional alumina substrates as they are commercially available for thick-film technology. | ||
| 650 | 4 | |a aerosol deposition method (ADM) | |
| 650 | 4 | |a annealing | |
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| 650 | 4 | |a insulation behavior | |
| 650 | 4 | |a room-temperature impact consolidation (RTIC) | |
| 650 | 4 | |a vacuum kinetic spraying | |
| 700 | 1 | |a Leupold, Nico |4 aut | |
| 700 | 1 | |a Exner, Jörg |4 aut | |
| 700 | 1 | |a Kita, Jaroslaw |4 aut | |
| 700 | 1 | |a Moos, Ralf |4 aut | |
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10.1007/s11666-018-0719-x doi (DE-627)OLC2060570573 (DE-He213)s11666-018-0719-x-p DE-627 ger DE-627 rakwb eng 670 VZ Schubert, Michael verfasserin (orcid)0000-0002-7388-7680 aut High-Temperature Electrical Insulation Behavior of Alumina Films Prepared at Room Temperature by Aerosol Deposition and Influence of Annealing Process and Powder Impurities 2018 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © ASM International 2018 Abstract Alumina ($ Al_{2} $$ O_{3} $) is a widely used material for highly insulating films due to its very low electrical conductivity, even at high temperatures. Typically, alumina films have to be sintered far above 1200 °C, which precludes the coating of lower melting substrates. The aerosol deposition method (ADM), however, is a promising method to manufacture ceramic films at room temperature directly from the ceramic raw powder. In this work, alumina films were deposited by ADM on a three-electrode setup with guard ring and the electrical conductivity was measured between 400 and 900 °C by direct current measurements according to ASTM D257 or IEC 60093. The effects of film annealing and of zirconia impurities in the powder on the electrical conductivity were investigated. The conductivity values of the ADM films correlate well with literature data and can even be improved by annealing at 900 °C from 4.5 × $ 10^{−12} $ S/cm before annealing up to 5.6 × $ 10^{−13} $ S/cm after annealing (measured at 400 °C). The influence of zirconia impurities is very low as the conductivity is only slightly elevated. The ADM-processed films show a very good insulation behavior represented by an even lower electrical conductivity than conventional alumina substrates as they are commercially available for thick-film technology. aerosol deposition method (ADM) annealing guard ring impurities insulation behavior room-temperature impact consolidation (RTIC) vacuum kinetic spraying Leupold, Nico aut Exner, Jörg aut Kita, Jaroslaw aut Moos, Ralf aut Enthalten in Journal of thermal spray technology Springer US, 1992 27(2018), 5 vom: 24. Apr., Seite 870-879 (DE-627)131101544 (DE-600)1118266-0 (DE-576)038867699 1059-9630 nnns volume:27 year:2018 number:5 day:24 month:04 pages:870-879 https://doi.org/10.1007/s11666-018-0719-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 AR 27 2018 5 24 04 870-879 |
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10.1007/s11666-018-0719-x doi (DE-627)OLC2060570573 (DE-He213)s11666-018-0719-x-p DE-627 ger DE-627 rakwb eng 670 VZ Schubert, Michael verfasserin (orcid)0000-0002-7388-7680 aut High-Temperature Electrical Insulation Behavior of Alumina Films Prepared at Room Temperature by Aerosol Deposition and Influence of Annealing Process and Powder Impurities 2018 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © ASM International 2018 Abstract Alumina ($ Al_{2} $$ O_{3} $) is a widely used material for highly insulating films due to its very low electrical conductivity, even at high temperatures. Typically, alumina films have to be sintered far above 1200 °C, which precludes the coating of lower melting substrates. The aerosol deposition method (ADM), however, is a promising method to manufacture ceramic films at room temperature directly from the ceramic raw powder. In this work, alumina films were deposited by ADM on a three-electrode setup with guard ring and the electrical conductivity was measured between 400 and 900 °C by direct current measurements according to ASTM D257 or IEC 60093. The effects of film annealing and of zirconia impurities in the powder on the electrical conductivity were investigated. The conductivity values of the ADM films correlate well with literature data and can even be improved by annealing at 900 °C from 4.5 × $ 10^{−12} $ S/cm before annealing up to 5.6 × $ 10^{−13} $ S/cm after annealing (measured at 400 °C). The influence of zirconia impurities is very low as the conductivity is only slightly elevated. The ADM-processed films show a very good insulation behavior represented by an even lower electrical conductivity than conventional alumina substrates as they are commercially available for thick-film technology. aerosol deposition method (ADM) annealing guard ring impurities insulation behavior room-temperature impact consolidation (RTIC) vacuum kinetic spraying Leupold, Nico aut Exner, Jörg aut Kita, Jaroslaw aut Moos, Ralf aut Enthalten in Journal of thermal spray technology Springer US, 1992 27(2018), 5 vom: 24. Apr., Seite 870-879 (DE-627)131101544 (DE-600)1118266-0 (DE-576)038867699 1059-9630 nnns volume:27 year:2018 number:5 day:24 month:04 pages:870-879 https://doi.org/10.1007/s11666-018-0719-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 AR 27 2018 5 24 04 870-879 |
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10.1007/s11666-018-0719-x doi (DE-627)OLC2060570573 (DE-He213)s11666-018-0719-x-p DE-627 ger DE-627 rakwb eng 670 VZ Schubert, Michael verfasserin (orcid)0000-0002-7388-7680 aut High-Temperature Electrical Insulation Behavior of Alumina Films Prepared at Room Temperature by Aerosol Deposition and Influence of Annealing Process and Powder Impurities 2018 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © ASM International 2018 Abstract Alumina ($ Al_{2} $$ O_{3} $) is a widely used material for highly insulating films due to its very low electrical conductivity, even at high temperatures. Typically, alumina films have to be sintered far above 1200 °C, which precludes the coating of lower melting substrates. The aerosol deposition method (ADM), however, is a promising method to manufacture ceramic films at room temperature directly from the ceramic raw powder. In this work, alumina films were deposited by ADM on a three-electrode setup with guard ring and the electrical conductivity was measured between 400 and 900 °C by direct current measurements according to ASTM D257 or IEC 60093. The effects of film annealing and of zirconia impurities in the powder on the electrical conductivity were investigated. The conductivity values of the ADM films correlate well with literature data and can even be improved by annealing at 900 °C from 4.5 × $ 10^{−12} $ S/cm before annealing up to 5.6 × $ 10^{−13} $ S/cm after annealing (measured at 400 °C). The influence of zirconia impurities is very low as the conductivity is only slightly elevated. The ADM-processed films show a very good insulation behavior represented by an even lower electrical conductivity than conventional alumina substrates as they are commercially available for thick-film technology. aerosol deposition method (ADM) annealing guard ring impurities insulation behavior room-temperature impact consolidation (RTIC) vacuum kinetic spraying Leupold, Nico aut Exner, Jörg aut Kita, Jaroslaw aut Moos, Ralf aut Enthalten in Journal of thermal spray technology Springer US, 1992 27(2018), 5 vom: 24. Apr., Seite 870-879 (DE-627)131101544 (DE-600)1118266-0 (DE-576)038867699 1059-9630 nnns volume:27 year:2018 number:5 day:24 month:04 pages:870-879 https://doi.org/10.1007/s11666-018-0719-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 AR 27 2018 5 24 04 870-879 |
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10.1007/s11666-018-0719-x doi (DE-627)OLC2060570573 (DE-He213)s11666-018-0719-x-p DE-627 ger DE-627 rakwb eng 670 VZ Schubert, Michael verfasserin (orcid)0000-0002-7388-7680 aut High-Temperature Electrical Insulation Behavior of Alumina Films Prepared at Room Temperature by Aerosol Deposition and Influence of Annealing Process and Powder Impurities 2018 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © ASM International 2018 Abstract Alumina ($ Al_{2} $$ O_{3} $) is a widely used material for highly insulating films due to its very low electrical conductivity, even at high temperatures. Typically, alumina films have to be sintered far above 1200 °C, which precludes the coating of lower melting substrates. The aerosol deposition method (ADM), however, is a promising method to manufacture ceramic films at room temperature directly from the ceramic raw powder. In this work, alumina films were deposited by ADM on a three-electrode setup with guard ring and the electrical conductivity was measured between 400 and 900 °C by direct current measurements according to ASTM D257 or IEC 60093. The effects of film annealing and of zirconia impurities in the powder on the electrical conductivity were investigated. The conductivity values of the ADM films correlate well with literature data and can even be improved by annealing at 900 °C from 4.5 × $ 10^{−12} $ S/cm before annealing up to 5.6 × $ 10^{−13} $ S/cm after annealing (measured at 400 °C). The influence of zirconia impurities is very low as the conductivity is only slightly elevated. The ADM-processed films show a very good insulation behavior represented by an even lower electrical conductivity than conventional alumina substrates as they are commercially available for thick-film technology. aerosol deposition method (ADM) annealing guard ring impurities insulation behavior room-temperature impact consolidation (RTIC) vacuum kinetic spraying Leupold, Nico aut Exner, Jörg aut Kita, Jaroslaw aut Moos, Ralf aut Enthalten in Journal of thermal spray technology Springer US, 1992 27(2018), 5 vom: 24. Apr., Seite 870-879 (DE-627)131101544 (DE-600)1118266-0 (DE-576)038867699 1059-9630 nnns volume:27 year:2018 number:5 day:24 month:04 pages:870-879 https://doi.org/10.1007/s11666-018-0719-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 AR 27 2018 5 24 04 870-879 |
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10.1007/s11666-018-0719-x doi (DE-627)OLC2060570573 (DE-He213)s11666-018-0719-x-p DE-627 ger DE-627 rakwb eng 670 VZ Schubert, Michael verfasserin (orcid)0000-0002-7388-7680 aut High-Temperature Electrical Insulation Behavior of Alumina Films Prepared at Room Temperature by Aerosol Deposition and Influence of Annealing Process and Powder Impurities 2018 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © ASM International 2018 Abstract Alumina ($ Al_{2} $$ O_{3} $) is a widely used material for highly insulating films due to its very low electrical conductivity, even at high temperatures. Typically, alumina films have to be sintered far above 1200 °C, which precludes the coating of lower melting substrates. The aerosol deposition method (ADM), however, is a promising method to manufacture ceramic films at room temperature directly from the ceramic raw powder. In this work, alumina films were deposited by ADM on a three-electrode setup with guard ring and the electrical conductivity was measured between 400 and 900 °C by direct current measurements according to ASTM D257 or IEC 60093. The effects of film annealing and of zirconia impurities in the powder on the electrical conductivity were investigated. The conductivity values of the ADM films correlate well with literature data and can even be improved by annealing at 900 °C from 4.5 × $ 10^{−12} $ S/cm before annealing up to 5.6 × $ 10^{−13} $ S/cm after annealing (measured at 400 °C). The influence of zirconia impurities is very low as the conductivity is only slightly elevated. The ADM-processed films show a very good insulation behavior represented by an even lower electrical conductivity than conventional alumina substrates as they are commercially available for thick-film technology. aerosol deposition method (ADM) annealing guard ring impurities insulation behavior room-temperature impact consolidation (RTIC) vacuum kinetic spraying Leupold, Nico aut Exner, Jörg aut Kita, Jaroslaw aut Moos, Ralf aut Enthalten in Journal of thermal spray technology Springer US, 1992 27(2018), 5 vom: 24. Apr., Seite 870-879 (DE-627)131101544 (DE-600)1118266-0 (DE-576)038867699 1059-9630 nnns volume:27 year:2018 number:5 day:24 month:04 pages:870-879 https://doi.org/10.1007/s11666-018-0719-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_70 AR 27 2018 5 24 04 870-879 |
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| title_full |
High-Temperature Electrical Insulation Behavior of Alumina Films Prepared at Room Temperature by Aerosol Deposition and Influence of Annealing Process and Powder Impurities |
| author_sort |
Schubert, Michael |
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Journal of thermal spray technology |
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Journal of thermal spray technology |
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eng |
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600 - Technology |
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marc |
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2018 |
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txt |
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870 |
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Schubert, Michael Leupold, Nico Exner, Jörg Kita, Jaroslaw Moos, Ralf |
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27 |
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670 VZ |
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Aufsätze |
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Schubert, Michael |
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10.1007/s11666-018-0719-x |
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(ORCID)0000-0002-7388-7680 |
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(orcid)0000-0002-7388-7680 |
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670 |
| title_sort |
high-temperature electrical insulation behavior of alumina films prepared at room temperature by aerosol deposition and influence of annealing process and powder impurities |
| title_auth |
High-Temperature Electrical Insulation Behavior of Alumina Films Prepared at Room Temperature by Aerosol Deposition and Influence of Annealing Process and Powder Impurities |
| abstract |
Abstract Alumina ($ Al_{2} $$ O_{3} $) is a widely used material for highly insulating films due to its very low electrical conductivity, even at high temperatures. Typically, alumina films have to be sintered far above 1200 °C, which precludes the coating of lower melting substrates. The aerosol deposition method (ADM), however, is a promising method to manufacture ceramic films at room temperature directly from the ceramic raw powder. In this work, alumina films were deposited by ADM on a three-electrode setup with guard ring and the electrical conductivity was measured between 400 and 900 °C by direct current measurements according to ASTM D257 or IEC 60093. The effects of film annealing and of zirconia impurities in the powder on the electrical conductivity were investigated. The conductivity values of the ADM films correlate well with literature data and can even be improved by annealing at 900 °C from 4.5 × $ 10^{−12} $ S/cm before annealing up to 5.6 × $ 10^{−13} $ S/cm after annealing (measured at 400 °C). The influence of zirconia impurities is very low as the conductivity is only slightly elevated. The ADM-processed films show a very good insulation behavior represented by an even lower electrical conductivity than conventional alumina substrates as they are commercially available for thick-film technology. © ASM International 2018 |
| abstractGer |
Abstract Alumina ($ Al_{2} $$ O_{3} $) is a widely used material for highly insulating films due to its very low electrical conductivity, even at high temperatures. Typically, alumina films have to be sintered far above 1200 °C, which precludes the coating of lower melting substrates. The aerosol deposition method (ADM), however, is a promising method to manufacture ceramic films at room temperature directly from the ceramic raw powder. In this work, alumina films were deposited by ADM on a three-electrode setup with guard ring and the electrical conductivity was measured between 400 and 900 °C by direct current measurements according to ASTM D257 or IEC 60093. The effects of film annealing and of zirconia impurities in the powder on the electrical conductivity were investigated. The conductivity values of the ADM films correlate well with literature data and can even be improved by annealing at 900 °C from 4.5 × $ 10^{−12} $ S/cm before annealing up to 5.6 × $ 10^{−13} $ S/cm after annealing (measured at 400 °C). The influence of zirconia impurities is very low as the conductivity is only slightly elevated. The ADM-processed films show a very good insulation behavior represented by an even lower electrical conductivity than conventional alumina substrates as they are commercially available for thick-film technology. © ASM International 2018 |
| abstract_unstemmed |
Abstract Alumina ($ Al_{2} $$ O_{3} $) is a widely used material for highly insulating films due to its very low electrical conductivity, even at high temperatures. Typically, alumina films have to be sintered far above 1200 °C, which precludes the coating of lower melting substrates. The aerosol deposition method (ADM), however, is a promising method to manufacture ceramic films at room temperature directly from the ceramic raw powder. In this work, alumina films were deposited by ADM on a three-electrode setup with guard ring and the electrical conductivity was measured between 400 and 900 °C by direct current measurements according to ASTM D257 or IEC 60093. The effects of film annealing and of zirconia impurities in the powder on the electrical conductivity were investigated. The conductivity values of the ADM films correlate well with literature data and can even be improved by annealing at 900 °C from 4.5 × $ 10^{−12} $ S/cm before annealing up to 5.6 × $ 10^{−13} $ S/cm after annealing (measured at 400 °C). The influence of zirconia impurities is very low as the conductivity is only slightly elevated. The ADM-processed films show a very good insulation behavior represented by an even lower electrical conductivity than conventional alumina substrates as they are commercially available for thick-film technology. © ASM International 2018 |
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| container_issue |
5 |
| title_short |
High-Temperature Electrical Insulation Behavior of Alumina Films Prepared at Room Temperature by Aerosol Deposition and Influence of Annealing Process and Powder Impurities |
| url |
https://doi.org/10.1007/s11666-018-0719-x |
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Leupold, Nico Exner, Jörg Kita, Jaroslaw Moos, Ralf |
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2024-07-04T01:40:36.345Z |
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