Low-temperature pulsed CVD of ruthenium thin films for micro- and nanoelectronic applications, Part 1: Equipment and methodology

Abstract An overview is presented of the low-temperature pulsed CVD equipment and techniques used in these experiments for making ruthenium thin films with Ru(CO)3($ C_{6} $$ H_{8} $) as the first precursor and $ NH_{3} $, $ H_{2} $, or $ N_{2} $O as the second precursor.

Gespeichert in:
Autor*in:

Vasilyev, V. Yu. [verfasserIn]

Format:

Artikel

Sprache:

Englisch

Erschienen:

2010

Schlagwörter:

Ruthenium

Atomic Layer Deposition

RUSSIAN Microelectronics

Deposition Chamber

Chemical Vapor Deposition Process

Anmerkung:

© Pleiades Publishing, Ltd. 2010

Übergeordnetes Werk:

Enthalten in: Russian microelectronics - SP MAIK Nauka/Interperiodica, 1992, 39(2010), 1 vom: Jan., Seite 26-33

Übergeordnetes Werk:

volume:39 ; year:2010 ; number:1 ; month:01 ; pages:26-33

Links:

Volltext

DOI / URN:

10.1134/S106373971001004X

Katalog-ID:

OLC2067573128

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