Nanocrystalline silicon films obtained by plasma enhanced chemical vapor deposition under time-modulated-microwave-power discharge conditions
Abstract It is suggested to use a time-modulated-microwave-power (TMWP) discharge regime for obtaining nanocrystalline silicon films by plasma-enhanced chemical-vapor deposition (PECVD) from a silane-hydrogen mixture. Using the TMWP-PECVD technique allows the nanocrystalline silicon films to be grow...
Ausführliche Beschreibung
Autor*in: |
Pevtsov, A. B. [verfasserIn] |
---|
Format: |
Artikel |
---|---|
Sprache: |
Englisch |
Erschienen: |
2002 |
---|
Schlagwörter: |
---|
Anmerkung: |
© MAIK "Nauka/Interperiodica" 2002 |
---|
Übergeordnetes Werk: |
Enthalten in: Technical physics letters - Nauka/Interperiodica, 1993, 28(2002), 4 vom: Apr., Seite 305-307 |
---|---|
Übergeordnetes Werk: |
volume:28 ; year:2002 ; number:4 ; month:04 ; pages:305-307 |
Links: |
---|
DOI / URN: |
10.1134/1.1476999 |
---|
Katalog-ID: |
OLC2072859263 |
---|
LEADER | 01000caa a22002652 4500 | ||
---|---|---|---|
001 | OLC2072859263 | ||
003 | DE-627 | ||
005 | 20230516201732.0 | ||
007 | tu | ||
008 | 200820s2002 xx ||||| 00| ||eng c | ||
024 | 7 | |a 10.1134/1.1476999 |2 doi | |
035 | |a (DE-627)OLC2072859263 | ||
035 | |a (DE-He213)1.1476999-p | ||
040 | |a DE-627 |b ger |c DE-627 |e rakwb | ||
041 | |a eng | ||
082 | 0 | 4 | |a 530 |q VZ |
100 | 1 | |a Pevtsov, A. B. |e verfasserin |4 aut | |
245 | 1 | 0 | |a Nanocrystalline silicon films obtained by plasma enhanced chemical vapor deposition under time-modulated-microwave-power discharge conditions |
264 | 1 | |c 2002 | |
336 | |a Text |b txt |2 rdacontent | ||
337 | |a ohne Hilfsmittel zu benutzen |b n |2 rdamedia | ||
338 | |a Band |b nc |2 rdacarrier | ||
500 | |a © MAIK "Nauka/Interperiodica" 2002 | ||
520 | |a Abstract It is suggested to use a time-modulated-microwave-power (TMWP) discharge regime for obtaining nanocrystalline silicon films by plasma-enhanced chemical-vapor deposition (PECVD) from a silane-hydrogen mixture. Using the TMWP-PECVD technique allows the nanocrystalline silicon films to be grown at a rate of up to 3 Å/s, which is 4–6 times as large as the process rate achieved with the conventional PECVD method. | ||
650 | 4 | |a Silicon | |
650 | 4 | |a Chemical Vapor Deposition | |
650 | 4 | |a Vapor Deposition | |
650 | 4 | |a Process Rate | |
650 | 4 | |a Chemical Vapor | |
700 | 1 | |a Feoktistov, N. A. |4 aut | |
773 | 0 | 8 | |i Enthalten in |t Technical physics letters |d Nauka/Interperiodica, 1993 |g 28(2002), 4 vom: Apr., Seite 305-307 |w (DE-627)171149521 |w (DE-600)1158056-2 |w (DE-576)038488426 |x 1063-7850 |7 nnns |
773 | 1 | 8 | |g volume:28 |g year:2002 |g number:4 |g month:04 |g pages:305-307 |
856 | 4 | 1 | |u https://doi.org/10.1134/1.1476999 |z lizenzpflichtig |3 Volltext |
912 | |a GBV_USEFLAG_A | ||
912 | |a SYSFLAG_A | ||
912 | |a GBV_OLC | ||
912 | |a SSG-OLC-PHY | ||
912 | |a SSG-OLC-PHA | ||
912 | |a SSG-OLC-DE-84 | ||
912 | |a GBV_ILN_40 | ||
912 | |a GBV_ILN_70 | ||
912 | |a GBV_ILN_2014 | ||
912 | |a GBV_ILN_4700 | ||
951 | |a AR | ||
952 | |d 28 |j 2002 |e 4 |c 04 |h 305-307 |
author_variant |
a b p ab abp n a f na naf |
---|---|
matchkey_str |
article:10637850:2002----::aorsalnslcnimotiebpamehneceiavpreoiinnetmmdltd |
hierarchy_sort_str |
2002 |
publishDate |
2002 |
allfields |
10.1134/1.1476999 doi (DE-627)OLC2072859263 (DE-He213)1.1476999-p DE-627 ger DE-627 rakwb eng 530 VZ Pevtsov, A. B. verfasserin aut Nanocrystalline silicon films obtained by plasma enhanced chemical vapor deposition under time-modulated-microwave-power discharge conditions 2002 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © MAIK "Nauka/Interperiodica" 2002 Abstract It is suggested to use a time-modulated-microwave-power (TMWP) discharge regime for obtaining nanocrystalline silicon films by plasma-enhanced chemical-vapor deposition (PECVD) from a silane-hydrogen mixture. Using the TMWP-PECVD technique allows the nanocrystalline silicon films to be grown at a rate of up to 3 Å/s, which is 4–6 times as large as the process rate achieved with the conventional PECVD method. Silicon Chemical Vapor Deposition Vapor Deposition Process Rate Chemical Vapor Feoktistov, N. A. aut Enthalten in Technical physics letters Nauka/Interperiodica, 1993 28(2002), 4 vom: Apr., Seite 305-307 (DE-627)171149521 (DE-600)1158056-2 (DE-576)038488426 1063-7850 nnns volume:28 year:2002 number:4 month:04 pages:305-307 https://doi.org/10.1134/1.1476999 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-PHY SSG-OLC-PHA SSG-OLC-DE-84 GBV_ILN_40 GBV_ILN_70 GBV_ILN_2014 GBV_ILN_4700 AR 28 2002 4 04 305-307 |
spelling |
10.1134/1.1476999 doi (DE-627)OLC2072859263 (DE-He213)1.1476999-p DE-627 ger DE-627 rakwb eng 530 VZ Pevtsov, A. B. verfasserin aut Nanocrystalline silicon films obtained by plasma enhanced chemical vapor deposition under time-modulated-microwave-power discharge conditions 2002 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © MAIK "Nauka/Interperiodica" 2002 Abstract It is suggested to use a time-modulated-microwave-power (TMWP) discharge regime for obtaining nanocrystalline silicon films by plasma-enhanced chemical-vapor deposition (PECVD) from a silane-hydrogen mixture. Using the TMWP-PECVD technique allows the nanocrystalline silicon films to be grown at a rate of up to 3 Å/s, which is 4–6 times as large as the process rate achieved with the conventional PECVD method. Silicon Chemical Vapor Deposition Vapor Deposition Process Rate Chemical Vapor Feoktistov, N. A. aut Enthalten in Technical physics letters Nauka/Interperiodica, 1993 28(2002), 4 vom: Apr., Seite 305-307 (DE-627)171149521 (DE-600)1158056-2 (DE-576)038488426 1063-7850 nnns volume:28 year:2002 number:4 month:04 pages:305-307 https://doi.org/10.1134/1.1476999 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-PHY SSG-OLC-PHA SSG-OLC-DE-84 GBV_ILN_40 GBV_ILN_70 GBV_ILN_2014 GBV_ILN_4700 AR 28 2002 4 04 305-307 |
allfields_unstemmed |
10.1134/1.1476999 doi (DE-627)OLC2072859263 (DE-He213)1.1476999-p DE-627 ger DE-627 rakwb eng 530 VZ Pevtsov, A. B. verfasserin aut Nanocrystalline silicon films obtained by plasma enhanced chemical vapor deposition under time-modulated-microwave-power discharge conditions 2002 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © MAIK "Nauka/Interperiodica" 2002 Abstract It is suggested to use a time-modulated-microwave-power (TMWP) discharge regime for obtaining nanocrystalline silicon films by plasma-enhanced chemical-vapor deposition (PECVD) from a silane-hydrogen mixture. Using the TMWP-PECVD technique allows the nanocrystalline silicon films to be grown at a rate of up to 3 Å/s, which is 4–6 times as large as the process rate achieved with the conventional PECVD method. Silicon Chemical Vapor Deposition Vapor Deposition Process Rate Chemical Vapor Feoktistov, N. A. aut Enthalten in Technical physics letters Nauka/Interperiodica, 1993 28(2002), 4 vom: Apr., Seite 305-307 (DE-627)171149521 (DE-600)1158056-2 (DE-576)038488426 1063-7850 nnns volume:28 year:2002 number:4 month:04 pages:305-307 https://doi.org/10.1134/1.1476999 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-PHY SSG-OLC-PHA SSG-OLC-DE-84 GBV_ILN_40 GBV_ILN_70 GBV_ILN_2014 GBV_ILN_4700 AR 28 2002 4 04 305-307 |
allfieldsGer |
10.1134/1.1476999 doi (DE-627)OLC2072859263 (DE-He213)1.1476999-p DE-627 ger DE-627 rakwb eng 530 VZ Pevtsov, A. B. verfasserin aut Nanocrystalline silicon films obtained by plasma enhanced chemical vapor deposition under time-modulated-microwave-power discharge conditions 2002 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © MAIK "Nauka/Interperiodica" 2002 Abstract It is suggested to use a time-modulated-microwave-power (TMWP) discharge regime for obtaining nanocrystalline silicon films by plasma-enhanced chemical-vapor deposition (PECVD) from a silane-hydrogen mixture. Using the TMWP-PECVD technique allows the nanocrystalline silicon films to be grown at a rate of up to 3 Å/s, which is 4–6 times as large as the process rate achieved with the conventional PECVD method. Silicon Chemical Vapor Deposition Vapor Deposition Process Rate Chemical Vapor Feoktistov, N. A. aut Enthalten in Technical physics letters Nauka/Interperiodica, 1993 28(2002), 4 vom: Apr., Seite 305-307 (DE-627)171149521 (DE-600)1158056-2 (DE-576)038488426 1063-7850 nnns volume:28 year:2002 number:4 month:04 pages:305-307 https://doi.org/10.1134/1.1476999 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-PHY SSG-OLC-PHA SSG-OLC-DE-84 GBV_ILN_40 GBV_ILN_70 GBV_ILN_2014 GBV_ILN_4700 AR 28 2002 4 04 305-307 |
allfieldsSound |
10.1134/1.1476999 doi (DE-627)OLC2072859263 (DE-He213)1.1476999-p DE-627 ger DE-627 rakwb eng 530 VZ Pevtsov, A. B. verfasserin aut Nanocrystalline silicon films obtained by plasma enhanced chemical vapor deposition under time-modulated-microwave-power discharge conditions 2002 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © MAIK "Nauka/Interperiodica" 2002 Abstract It is suggested to use a time-modulated-microwave-power (TMWP) discharge regime for obtaining nanocrystalline silicon films by plasma-enhanced chemical-vapor deposition (PECVD) from a silane-hydrogen mixture. Using the TMWP-PECVD technique allows the nanocrystalline silicon films to be grown at a rate of up to 3 Å/s, which is 4–6 times as large as the process rate achieved with the conventional PECVD method. Silicon Chemical Vapor Deposition Vapor Deposition Process Rate Chemical Vapor Feoktistov, N. A. aut Enthalten in Technical physics letters Nauka/Interperiodica, 1993 28(2002), 4 vom: Apr., Seite 305-307 (DE-627)171149521 (DE-600)1158056-2 (DE-576)038488426 1063-7850 nnns volume:28 year:2002 number:4 month:04 pages:305-307 https://doi.org/10.1134/1.1476999 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-PHY SSG-OLC-PHA SSG-OLC-DE-84 GBV_ILN_40 GBV_ILN_70 GBV_ILN_2014 GBV_ILN_4700 AR 28 2002 4 04 305-307 |
language |
English |
source |
Enthalten in Technical physics letters 28(2002), 4 vom: Apr., Seite 305-307 volume:28 year:2002 number:4 month:04 pages:305-307 |
sourceStr |
Enthalten in Technical physics letters 28(2002), 4 vom: Apr., Seite 305-307 volume:28 year:2002 number:4 month:04 pages:305-307 |
format_phy_str_mv |
Article |
institution |
findex.gbv.de |
topic_facet |
Silicon Chemical Vapor Deposition Vapor Deposition Process Rate Chemical Vapor |
dewey-raw |
530 |
isfreeaccess_bool |
false |
container_title |
Technical physics letters |
authorswithroles_txt_mv |
Pevtsov, A. B. @@aut@@ Feoktistov, N. A. @@aut@@ |
publishDateDaySort_date |
2002-04-01T00:00:00Z |
hierarchy_top_id |
171149521 |
dewey-sort |
3530 |
id |
OLC2072859263 |
language_de |
englisch |
fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">OLC2072859263</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230516201732.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">200820s2002 xx ||||| 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1134/1.1476999</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC2072859263</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-He213)1.1476999-p</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">530</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Pevtsov, A. B.</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Nanocrystalline silicon films obtained by plasma enhanced chemical vapor deposition under time-modulated-microwave-power discharge conditions</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2002</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© MAIK "Nauka/Interperiodica" 2002</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract It is suggested to use a time-modulated-microwave-power (TMWP) discharge regime for obtaining nanocrystalline silicon films by plasma-enhanced chemical-vapor deposition (PECVD) from a silane-hydrogen mixture. Using the TMWP-PECVD technique allows the nanocrystalline silicon films to be grown at a rate of up to 3 Å/s, which is 4–6 times as large as the process rate achieved with the conventional PECVD method.</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Silicon</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Chemical Vapor Deposition</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Vapor Deposition</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Process Rate</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Chemical Vapor</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Feoktistov, N. A.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Technical physics letters</subfield><subfield code="d">Nauka/Interperiodica, 1993</subfield><subfield code="g">28(2002), 4 vom: Apr., Seite 305-307</subfield><subfield code="w">(DE-627)171149521</subfield><subfield code="w">(DE-600)1158056-2</subfield><subfield code="w">(DE-576)038488426</subfield><subfield code="x">1063-7850</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:28</subfield><subfield code="g">year:2002</subfield><subfield code="g">number:4</subfield><subfield code="g">month:04</subfield><subfield code="g">pages:305-307</subfield></datafield><datafield tag="856" ind1="4" ind2="1"><subfield code="u">https://doi.org/10.1134/1.1476999</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-PHY</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-PHA</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-DE-84</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_40</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2014</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4700</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">28</subfield><subfield code="j">2002</subfield><subfield code="e">4</subfield><subfield code="c">04</subfield><subfield code="h">305-307</subfield></datafield></record></collection>
|
author |
Pevtsov, A. B. |
spellingShingle |
Pevtsov, A. B. ddc 530 misc Silicon misc Chemical Vapor Deposition misc Vapor Deposition misc Process Rate misc Chemical Vapor Nanocrystalline silicon films obtained by plasma enhanced chemical vapor deposition under time-modulated-microwave-power discharge conditions |
authorStr |
Pevtsov, A. B. |
ppnlink_with_tag_str_mv |
@@773@@(DE-627)171149521 |
format |
Article |
dewey-ones |
530 - Physics |
delete_txt_mv |
keep |
author_role |
aut aut |
collection |
OLC |
remote_str |
false |
illustrated |
Not Illustrated |
issn |
1063-7850 |
topic_title |
530 VZ Nanocrystalline silicon films obtained by plasma enhanced chemical vapor deposition under time-modulated-microwave-power discharge conditions Silicon Chemical Vapor Deposition Vapor Deposition Process Rate Chemical Vapor |
topic |
ddc 530 misc Silicon misc Chemical Vapor Deposition misc Vapor Deposition misc Process Rate misc Chemical Vapor |
topic_unstemmed |
ddc 530 misc Silicon misc Chemical Vapor Deposition misc Vapor Deposition misc Process Rate misc Chemical Vapor |
topic_browse |
ddc 530 misc Silicon misc Chemical Vapor Deposition misc Vapor Deposition misc Process Rate misc Chemical Vapor |
format_facet |
Aufsätze Gedruckte Aufsätze |
format_main_str_mv |
Text Zeitschrift/Artikel |
carriertype_str_mv |
nc |
hierarchy_parent_title |
Technical physics letters |
hierarchy_parent_id |
171149521 |
dewey-tens |
530 - Physics |
hierarchy_top_title |
Technical physics letters |
isfreeaccess_txt |
false |
familylinks_str_mv |
(DE-627)171149521 (DE-600)1158056-2 (DE-576)038488426 |
title |
Nanocrystalline silicon films obtained by plasma enhanced chemical vapor deposition under time-modulated-microwave-power discharge conditions |
ctrlnum |
(DE-627)OLC2072859263 (DE-He213)1.1476999-p |
title_full |
Nanocrystalline silicon films obtained by plasma enhanced chemical vapor deposition under time-modulated-microwave-power discharge conditions |
author_sort |
Pevtsov, A. B. |
journal |
Technical physics letters |
journalStr |
Technical physics letters |
lang_code |
eng |
isOA_bool |
false |
dewey-hundreds |
500 - Science |
recordtype |
marc |
publishDateSort |
2002 |
contenttype_str_mv |
txt |
container_start_page |
305 |
author_browse |
Pevtsov, A. B. Feoktistov, N. A. |
container_volume |
28 |
class |
530 VZ |
format_se |
Aufsätze |
author-letter |
Pevtsov, A. B. |
doi_str_mv |
10.1134/1.1476999 |
dewey-full |
530 |
title_sort |
nanocrystalline silicon films obtained by plasma enhanced chemical vapor deposition under time-modulated-microwave-power discharge conditions |
title_auth |
Nanocrystalline silicon films obtained by plasma enhanced chemical vapor deposition under time-modulated-microwave-power discharge conditions |
abstract |
Abstract It is suggested to use a time-modulated-microwave-power (TMWP) discharge regime for obtaining nanocrystalline silicon films by plasma-enhanced chemical-vapor deposition (PECVD) from a silane-hydrogen mixture. Using the TMWP-PECVD technique allows the nanocrystalline silicon films to be grown at a rate of up to 3 Å/s, which is 4–6 times as large as the process rate achieved with the conventional PECVD method. © MAIK "Nauka/Interperiodica" 2002 |
abstractGer |
Abstract It is suggested to use a time-modulated-microwave-power (TMWP) discharge regime for obtaining nanocrystalline silicon films by plasma-enhanced chemical-vapor deposition (PECVD) from a silane-hydrogen mixture. Using the TMWP-PECVD technique allows the nanocrystalline silicon films to be grown at a rate of up to 3 Å/s, which is 4–6 times as large as the process rate achieved with the conventional PECVD method. © MAIK "Nauka/Interperiodica" 2002 |
abstract_unstemmed |
Abstract It is suggested to use a time-modulated-microwave-power (TMWP) discharge regime for obtaining nanocrystalline silicon films by plasma-enhanced chemical-vapor deposition (PECVD) from a silane-hydrogen mixture. Using the TMWP-PECVD technique allows the nanocrystalline silicon films to be grown at a rate of up to 3 Å/s, which is 4–6 times as large as the process rate achieved with the conventional PECVD method. © MAIK "Nauka/Interperiodica" 2002 |
collection_details |
GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-PHY SSG-OLC-PHA SSG-OLC-DE-84 GBV_ILN_40 GBV_ILN_70 GBV_ILN_2014 GBV_ILN_4700 |
container_issue |
4 |
title_short |
Nanocrystalline silicon films obtained by plasma enhanced chemical vapor deposition under time-modulated-microwave-power discharge conditions |
url |
https://doi.org/10.1134/1.1476999 |
remote_bool |
false |
author2 |
Feoktistov, N. A. |
author2Str |
Feoktistov, N. A. |
ppnlink |
171149521 |
mediatype_str_mv |
n |
isOA_txt |
false |
hochschulschrift_bool |
false |
doi_str |
10.1134/1.1476999 |
up_date |
2024-07-03T16:27:48.402Z |
_version_ |
1803575957548695552 |
fullrecord_marcxml |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">OLC2072859263</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230516201732.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">200820s2002 xx ||||| 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1134/1.1476999</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC2072859263</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-He213)1.1476999-p</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">530</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Pevtsov, A. B.</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Nanocrystalline silicon films obtained by plasma enhanced chemical vapor deposition under time-modulated-microwave-power discharge conditions</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2002</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© MAIK "Nauka/Interperiodica" 2002</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract It is suggested to use a time-modulated-microwave-power (TMWP) discharge regime for obtaining nanocrystalline silicon films by plasma-enhanced chemical-vapor deposition (PECVD) from a silane-hydrogen mixture. Using the TMWP-PECVD technique allows the nanocrystalline silicon films to be grown at a rate of up to 3 Å/s, which is 4–6 times as large as the process rate achieved with the conventional PECVD method.</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Silicon</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Chemical Vapor Deposition</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Vapor Deposition</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Process Rate</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Chemical Vapor</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Feoktistov, N. A.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Technical physics letters</subfield><subfield code="d">Nauka/Interperiodica, 1993</subfield><subfield code="g">28(2002), 4 vom: Apr., Seite 305-307</subfield><subfield code="w">(DE-627)171149521</subfield><subfield code="w">(DE-600)1158056-2</subfield><subfield code="w">(DE-576)038488426</subfield><subfield code="x">1063-7850</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:28</subfield><subfield code="g">year:2002</subfield><subfield code="g">number:4</subfield><subfield code="g">month:04</subfield><subfield code="g">pages:305-307</subfield></datafield><datafield tag="856" ind1="4" ind2="1"><subfield code="u">https://doi.org/10.1134/1.1476999</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-PHY</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-PHA</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-DE-84</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_40</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2014</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4700</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">28</subfield><subfield code="j">2002</subfield><subfield code="e">4</subfield><subfield code="c">04</subfield><subfield code="h">305-307</subfield></datafield></record></collection>
|
score |
7.4016542 |