Lattice thermal expansion of $ CuSi_{4} $$ P_{3} $
Autor*in: |
Bhikshamaiah, G. [verfasserIn] |
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Format: |
Artikel |
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Sprache: |
Englisch |
Erschienen: |
1988 |
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Schlagwörter: |
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Anmerkung: |
© Chapman and Hall Ltd. 1988 |
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Übergeordnetes Werk: |
Enthalten in: Journal of materials science / Letters - Kluwer Academic Publishers, 1982, 7(1988), 10 vom: Okt., Seite 1074-1075 |
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Übergeordnetes Werk: |
volume:7 ; year:1988 ; number:10 ; month:10 ; pages:1074-1075 |
Links: |
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DOI / URN: |
10.1007/BF00720832 |
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Katalog-ID: |
OLC2072952204 |
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10.1007/BF00720832 doi (DE-627)OLC2072952204 (DE-He213)BF00720832-p DE-627 ger DE-627 rakwb eng 670 VZ Bhikshamaiah, G. verfasserin aut Lattice thermal expansion of $ CuSi_{4} $$ P_{3} $ 1988 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Chapman and Hall Ltd. 1988 Polymer Thermal Expansion Lattice Thermal Expansion Suryanarayana, S. V. aut Omar, M. S. aut Enthalten in Journal of materials science / Letters Kluwer Academic Publishers, 1982 7(1988), 10 vom: Okt., Seite 1074-1075 (DE-627)130626473 (DE-600)797184-9 (DE-576)016132890 0261-8028 nnns volume:7 year:1988 number:10 month:10 pages:1074-1075 https://doi.org/10.1007/BF00720832 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_11 GBV_ILN_20 GBV_ILN_21 GBV_ILN_23 GBV_ILN_30 GBV_ILN_31 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2057 GBV_ILN_2333 GBV_ILN_4046 GBV_ILN_4082 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4314 GBV_ILN_4316 GBV_ILN_4319 GBV_ILN_4323 GBV_ILN_4700 AR 7 1988 10 10 1074-1075 |
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10.1007/BF00720832 doi (DE-627)OLC2072952204 (DE-He213)BF00720832-p DE-627 ger DE-627 rakwb eng 670 VZ Bhikshamaiah, G. verfasserin aut Lattice thermal expansion of $ CuSi_{4} $$ P_{3} $ 1988 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Chapman and Hall Ltd. 1988 Polymer Thermal Expansion Lattice Thermal Expansion Suryanarayana, S. V. aut Omar, M. S. aut Enthalten in Journal of materials science / Letters Kluwer Academic Publishers, 1982 7(1988), 10 vom: Okt., Seite 1074-1075 (DE-627)130626473 (DE-600)797184-9 (DE-576)016132890 0261-8028 nnns volume:7 year:1988 number:10 month:10 pages:1074-1075 https://doi.org/10.1007/BF00720832 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_11 GBV_ILN_20 GBV_ILN_21 GBV_ILN_23 GBV_ILN_30 GBV_ILN_31 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_65 GBV_ILN_70 GBV_ILN_2004 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2057 GBV_ILN_2333 GBV_ILN_4046 GBV_ILN_4082 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4314 GBV_ILN_4316 GBV_ILN_4319 GBV_ILN_4323 GBV_ILN_4700 AR 7 1988 10 10 1074-1075 |
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670 VZ Lattice thermal expansion of $ CuSi_{4} $$ P_{3} $ Polymer Thermal Expansion Lattice Thermal Expansion |
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lattice thermal expansion of $ cusi_{4} $$ p_{3} $ |
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Lattice thermal expansion of $ CuSi_{4} $$ P_{3} $ |
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© Chapman and Hall Ltd. 1988 |
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