VI-Based Measurement System Focusing on Space Applications
Abstract This article describes in detail a custom, high-performance, compact, flexible and reconfigurable test equipment. This measurement system is able to perform, locally or remotely, the electrical characterization of semiconductor devices and integrated circuits (ICs) under ionizing irradiatio...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Seixas, L. E. [verfasserIn] |
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| Format: |
Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2017 |
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| Schlagwörter: |
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| Anmerkung: |
© Springer Science+Business Media New York 2017 |
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| Übergeordnetes Werk: |
Enthalten in: Journal of electronic testing - Springer US, 1990, 33(2017), 2 vom: 07. März, Seite 267-274 |
|---|---|
| Übergeordnetes Werk: |
volume:33 ; year:2017 ; number:2 ; day:07 ; month:03 ; pages:267-274 |
| Links: |
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| DOI / URN: |
10.1007/s10836-017-5651-3 |
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OLC2075593809 |
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Abstract This article describes in detail a custom, high-performance, compact, flexible and reconfigurable test equipment. This measurement system is able to perform, locally or remotely, the electrical characterization of semiconductor devices and integrated circuits (ICs) under ionizing irradiation tests. This measurement platform can be managed remotely through serial, Local Network Area (LAN) link, allowing the electrical characterization of these devices in harsh test environments. Using this customized test measurement system, we were capable to reduce total test time by 1/3 in our TID test application. © Springer Science+Business Media New York 2017 |
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Abstract This article describes in detail a custom, high-performance, compact, flexible and reconfigurable test equipment. This measurement system is able to perform, locally or remotely, the electrical characterization of semiconductor devices and integrated circuits (ICs) under ionizing irradiation tests. This measurement platform can be managed remotely through serial, Local Network Area (LAN) link, allowing the electrical characterization of these devices in harsh test environments. Using this customized test measurement system, we were capable to reduce total test time by 1/3 in our TID test application. © Springer Science+Business Media New York 2017 |
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Abstract This article describes in detail a custom, high-performance, compact, flexible and reconfigurable test equipment. This measurement system is able to perform, locally or remotely, the electrical characterization of semiconductor devices and integrated circuits (ICs) under ionizing irradiation tests. This measurement platform can be managed remotely through serial, Local Network Area (LAN) link, allowing the electrical characterization of these devices in harsh test environments. Using this customized test measurement system, we were capable to reduce total test time by 1/3 in our TID test application. © Springer Science+Business Media New York 2017 |
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<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">OLC2075593809</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230503114736.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">200820s2017 xx ||||| 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/s10836-017-5651-3</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC2075593809</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-He213)s10836-017-5651-3-p</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">004</subfield><subfield code="a">670</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Seixas, L. E.</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">VI-Based Measurement System Focusing on Space Applications</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2017</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© Springer Science+Business Media New York 2017</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract This article describes in detail a custom, high-performance, compact, flexible and reconfigurable test equipment. This measurement system is able to perform, locally or remotely, the electrical characterization of semiconductor devices and integrated circuits (ICs) under ionizing irradiation tests. This measurement platform can be managed remotely through serial, Local Network Area (LAN) link, allowing the electrical characterization of these devices in harsh test environments. 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März, Seite 267-274</subfield><subfield code="w">(DE-627)130869090</subfield><subfield code="w">(DE-600)1033317-4</subfield><subfield code="w">(DE-576)024991600</subfield><subfield code="x">0923-8174</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:33</subfield><subfield code="g">year:2017</subfield><subfield code="g">number:2</subfield><subfield code="g">day:07</subfield><subfield code="g">month:03</subfield><subfield code="g">pages:267-274</subfield></datafield><datafield tag="856" ind1="4" ind2="1"><subfield code="u">https://doi.org/10.1007/s10836-017-5651-3</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-TEC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-MAT</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4318</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">33</subfield><subfield code="j">2017</subfield><subfield code="e">2</subfield><subfield code="b">07</subfield><subfield code="c">03</subfield><subfield code="h">267-274</subfield></datafield></record></collection>
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