Thermal characterization and wick optimization of mini-grooved flat heat pipe for electronics cooling
Abstract Effective cooling technology is intensely demanded to cool the electronic devices within small space under high heat flux. Mini-grooved flat heat pipe (FHP) with simple structure, close contact with heat source, uniform temperature and high thermal conductivity can satisfy the demand of tra...
Ausführliche Beschreibung
Autor*in: |
Xin, Fei [verfasserIn] |
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Englisch |
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2022 |
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Anmerkung: |
© Akadémiai Kiadó, Budapest, Hungary 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. |
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Übergeordnetes Werk: |
Enthalten in: Journal of thermal analysis and calorimetry - Springer International Publishing, 1998, 147(2022), 24 vom: 15. Nov., Seite 14859-14872 |
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Übergeordnetes Werk: |
volume:147 ; year:2022 ; number:24 ; day:15 ; month:11 ; pages:14859-14872 |
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DOI / URN: |
10.1007/s10973-022-11739-0 |
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Katalog-ID: |
OLC2080127969 |
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520 | |a Abstract Effective cooling technology is intensely demanded to cool the electronic devices within small space under high heat flux. Mini-grooved flat heat pipe (FHP) with simple structure, close contact with heat source, uniform temperature and high thermal conductivity can satisfy the demand of transferring the great heat rapidly and weakening the hot spot of electronic devices. As fine wick feature and distribution played a critical part in improving the performance of mini-grooved FHP, a thermal experiment was established to explore the heat transfer characterization of mini-grooved FHP with different wick structures and distributions. And a mathematical model in one dimension was set up to investigate the fluid flow and heat transmission performance of FHP with V-type or rectangle-type grooves, expecting to assist the experiment in understanding the operating mechanisms of mini-grooved FHP further. Effects of input heat, inclined angle, working temperature and wick structure were examined. It is found that among the V-type, rectangle-type and block-type mini-grooved FHPs, V-type FHP presents better heat transfer rate, while block-type FHP displays larger maximum heat transfer amount. V2 sloped convex gradient mini-grooved FHP owns the optimum overall performance. It possesses the merits of narrower grooves at the evaporation section, wider grooves at the condensation section and larger vapor chamber space, which can optimize the liquid and vapor circulation processes inside the FHP. Its thermal resistance and maximum temperature reduce by almost 9.7% and 3.4% separately in comparison with those of V1 straight mini-grooved FHP, which is beneficial to guarantee the reliability and stability of electronic devices. | ||
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10.1007/s10973-022-11739-0 doi (DE-627)OLC2080127969 (DE-He213)s10973-022-11739-0-p DE-627 ger DE-627 rakwb eng 660 VZ Xin, Fei verfasserin (orcid)0000-0002-4276-8494 aut Thermal characterization and wick optimization of mini-grooved flat heat pipe for electronics cooling 2022 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Akadémiai Kiadó, Budapest, Hungary 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. Abstract Effective cooling technology is intensely demanded to cool the electronic devices within small space under high heat flux. Mini-grooved flat heat pipe (FHP) with simple structure, close contact with heat source, uniform temperature and high thermal conductivity can satisfy the demand of transferring the great heat rapidly and weakening the hot spot of electronic devices. As fine wick feature and distribution played a critical part in improving the performance of mini-grooved FHP, a thermal experiment was established to explore the heat transfer characterization of mini-grooved FHP with different wick structures and distributions. And a mathematical model in one dimension was set up to investigate the fluid flow and heat transmission performance of FHP with V-type or rectangle-type grooves, expecting to assist the experiment in understanding the operating mechanisms of mini-grooved FHP further. Effects of input heat, inclined angle, working temperature and wick structure were examined. It is found that among the V-type, rectangle-type and block-type mini-grooved FHPs, V-type FHP presents better heat transfer rate, while block-type FHP displays larger maximum heat transfer amount. V2 sloped convex gradient mini-grooved FHP owns the optimum overall performance. It possesses the merits of narrower grooves at the evaporation section, wider grooves at the condensation section and larger vapor chamber space, which can optimize the liquid and vapor circulation processes inside the FHP. Its thermal resistance and maximum temperature reduce by almost 9.7% and 3.4% separately in comparison with those of V1 straight mini-grooved FHP, which is beneficial to guarantee the reliability and stability of electronic devices. Mini-grooved flat heat pipe Thermal characterization Groove structure Groove distribution optimization Inclined angle Ma, Ting aut Wang, Qiuwang aut Yan, Yuying aut Tian, Wenchao aut Enthalten in Journal of thermal analysis and calorimetry Springer International Publishing, 1998 147(2022), 24 vom: 15. Nov., Seite 14859-14872 (DE-627)244148767 (DE-600)1429493-X (DE-576)066397693 1388-6150 nnns volume:147 year:2022 number:24 day:15 month:11 pages:14859-14872 https://doi.org/10.1007/s10973-022-11739-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-CHE SSG-OLC-PHA SSG-OLC-DE-84 AR 147 2022 24 15 11 14859-14872 |
spelling |
10.1007/s10973-022-11739-0 doi (DE-627)OLC2080127969 (DE-He213)s10973-022-11739-0-p DE-627 ger DE-627 rakwb eng 660 VZ Xin, Fei verfasserin (orcid)0000-0002-4276-8494 aut Thermal characterization and wick optimization of mini-grooved flat heat pipe for electronics cooling 2022 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Akadémiai Kiadó, Budapest, Hungary 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. Abstract Effective cooling technology is intensely demanded to cool the electronic devices within small space under high heat flux. Mini-grooved flat heat pipe (FHP) with simple structure, close contact with heat source, uniform temperature and high thermal conductivity can satisfy the demand of transferring the great heat rapidly and weakening the hot spot of electronic devices. As fine wick feature and distribution played a critical part in improving the performance of mini-grooved FHP, a thermal experiment was established to explore the heat transfer characterization of mini-grooved FHP with different wick structures and distributions. And a mathematical model in one dimension was set up to investigate the fluid flow and heat transmission performance of FHP with V-type or rectangle-type grooves, expecting to assist the experiment in understanding the operating mechanisms of mini-grooved FHP further. Effects of input heat, inclined angle, working temperature and wick structure were examined. It is found that among the V-type, rectangle-type and block-type mini-grooved FHPs, V-type FHP presents better heat transfer rate, while block-type FHP displays larger maximum heat transfer amount. V2 sloped convex gradient mini-grooved FHP owns the optimum overall performance. It possesses the merits of narrower grooves at the evaporation section, wider grooves at the condensation section and larger vapor chamber space, which can optimize the liquid and vapor circulation processes inside the FHP. Its thermal resistance and maximum temperature reduce by almost 9.7% and 3.4% separately in comparison with those of V1 straight mini-grooved FHP, which is beneficial to guarantee the reliability and stability of electronic devices. Mini-grooved flat heat pipe Thermal characterization Groove structure Groove distribution optimization Inclined angle Ma, Ting aut Wang, Qiuwang aut Yan, Yuying aut Tian, Wenchao aut Enthalten in Journal of thermal analysis and calorimetry Springer International Publishing, 1998 147(2022), 24 vom: 15. Nov., Seite 14859-14872 (DE-627)244148767 (DE-600)1429493-X (DE-576)066397693 1388-6150 nnns volume:147 year:2022 number:24 day:15 month:11 pages:14859-14872 https://doi.org/10.1007/s10973-022-11739-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-CHE SSG-OLC-PHA SSG-OLC-DE-84 AR 147 2022 24 15 11 14859-14872 |
allfields_unstemmed |
10.1007/s10973-022-11739-0 doi (DE-627)OLC2080127969 (DE-He213)s10973-022-11739-0-p DE-627 ger DE-627 rakwb eng 660 VZ Xin, Fei verfasserin (orcid)0000-0002-4276-8494 aut Thermal characterization and wick optimization of mini-grooved flat heat pipe for electronics cooling 2022 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Akadémiai Kiadó, Budapest, Hungary 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. Abstract Effective cooling technology is intensely demanded to cool the electronic devices within small space under high heat flux. Mini-grooved flat heat pipe (FHP) with simple structure, close contact with heat source, uniform temperature and high thermal conductivity can satisfy the demand of transferring the great heat rapidly and weakening the hot spot of electronic devices. As fine wick feature and distribution played a critical part in improving the performance of mini-grooved FHP, a thermal experiment was established to explore the heat transfer characterization of mini-grooved FHP with different wick structures and distributions. And a mathematical model in one dimension was set up to investigate the fluid flow and heat transmission performance of FHP with V-type or rectangle-type grooves, expecting to assist the experiment in understanding the operating mechanisms of mini-grooved FHP further. Effects of input heat, inclined angle, working temperature and wick structure were examined. It is found that among the V-type, rectangle-type and block-type mini-grooved FHPs, V-type FHP presents better heat transfer rate, while block-type FHP displays larger maximum heat transfer amount. V2 sloped convex gradient mini-grooved FHP owns the optimum overall performance. It possesses the merits of narrower grooves at the evaporation section, wider grooves at the condensation section and larger vapor chamber space, which can optimize the liquid and vapor circulation processes inside the FHP. Its thermal resistance and maximum temperature reduce by almost 9.7% and 3.4% separately in comparison with those of V1 straight mini-grooved FHP, which is beneficial to guarantee the reliability and stability of electronic devices. Mini-grooved flat heat pipe Thermal characterization Groove structure Groove distribution optimization Inclined angle Ma, Ting aut Wang, Qiuwang aut Yan, Yuying aut Tian, Wenchao aut Enthalten in Journal of thermal analysis and calorimetry Springer International Publishing, 1998 147(2022), 24 vom: 15. Nov., Seite 14859-14872 (DE-627)244148767 (DE-600)1429493-X (DE-576)066397693 1388-6150 nnns volume:147 year:2022 number:24 day:15 month:11 pages:14859-14872 https://doi.org/10.1007/s10973-022-11739-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-CHE SSG-OLC-PHA SSG-OLC-DE-84 AR 147 2022 24 15 11 14859-14872 |
allfieldsGer |
10.1007/s10973-022-11739-0 doi (DE-627)OLC2080127969 (DE-He213)s10973-022-11739-0-p DE-627 ger DE-627 rakwb eng 660 VZ Xin, Fei verfasserin (orcid)0000-0002-4276-8494 aut Thermal characterization and wick optimization of mini-grooved flat heat pipe for electronics cooling 2022 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Akadémiai Kiadó, Budapest, Hungary 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. Abstract Effective cooling technology is intensely demanded to cool the electronic devices within small space under high heat flux. Mini-grooved flat heat pipe (FHP) with simple structure, close contact with heat source, uniform temperature and high thermal conductivity can satisfy the demand of transferring the great heat rapidly and weakening the hot spot of electronic devices. As fine wick feature and distribution played a critical part in improving the performance of mini-grooved FHP, a thermal experiment was established to explore the heat transfer characterization of mini-grooved FHP with different wick structures and distributions. And a mathematical model in one dimension was set up to investigate the fluid flow and heat transmission performance of FHP with V-type or rectangle-type grooves, expecting to assist the experiment in understanding the operating mechanisms of mini-grooved FHP further. Effects of input heat, inclined angle, working temperature and wick structure were examined. It is found that among the V-type, rectangle-type and block-type mini-grooved FHPs, V-type FHP presents better heat transfer rate, while block-type FHP displays larger maximum heat transfer amount. V2 sloped convex gradient mini-grooved FHP owns the optimum overall performance. It possesses the merits of narrower grooves at the evaporation section, wider grooves at the condensation section and larger vapor chamber space, which can optimize the liquid and vapor circulation processes inside the FHP. Its thermal resistance and maximum temperature reduce by almost 9.7% and 3.4% separately in comparison with those of V1 straight mini-grooved FHP, which is beneficial to guarantee the reliability and stability of electronic devices. Mini-grooved flat heat pipe Thermal characterization Groove structure Groove distribution optimization Inclined angle Ma, Ting aut Wang, Qiuwang aut Yan, Yuying aut Tian, Wenchao aut Enthalten in Journal of thermal analysis and calorimetry Springer International Publishing, 1998 147(2022), 24 vom: 15. Nov., Seite 14859-14872 (DE-627)244148767 (DE-600)1429493-X (DE-576)066397693 1388-6150 nnns volume:147 year:2022 number:24 day:15 month:11 pages:14859-14872 https://doi.org/10.1007/s10973-022-11739-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-CHE SSG-OLC-PHA SSG-OLC-DE-84 AR 147 2022 24 15 11 14859-14872 |
allfieldsSound |
10.1007/s10973-022-11739-0 doi (DE-627)OLC2080127969 (DE-He213)s10973-022-11739-0-p DE-627 ger DE-627 rakwb eng 660 VZ Xin, Fei verfasserin (orcid)0000-0002-4276-8494 aut Thermal characterization and wick optimization of mini-grooved flat heat pipe for electronics cooling 2022 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © Akadémiai Kiadó, Budapest, Hungary 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. Abstract Effective cooling technology is intensely demanded to cool the electronic devices within small space under high heat flux. Mini-grooved flat heat pipe (FHP) with simple structure, close contact with heat source, uniform temperature and high thermal conductivity can satisfy the demand of transferring the great heat rapidly and weakening the hot spot of electronic devices. As fine wick feature and distribution played a critical part in improving the performance of mini-grooved FHP, a thermal experiment was established to explore the heat transfer characterization of mini-grooved FHP with different wick structures and distributions. And a mathematical model in one dimension was set up to investigate the fluid flow and heat transmission performance of FHP with V-type or rectangle-type grooves, expecting to assist the experiment in understanding the operating mechanisms of mini-grooved FHP further. Effects of input heat, inclined angle, working temperature and wick structure were examined. It is found that among the V-type, rectangle-type and block-type mini-grooved FHPs, V-type FHP presents better heat transfer rate, while block-type FHP displays larger maximum heat transfer amount. V2 sloped convex gradient mini-grooved FHP owns the optimum overall performance. It possesses the merits of narrower grooves at the evaporation section, wider grooves at the condensation section and larger vapor chamber space, which can optimize the liquid and vapor circulation processes inside the FHP. Its thermal resistance and maximum temperature reduce by almost 9.7% and 3.4% separately in comparison with those of V1 straight mini-grooved FHP, which is beneficial to guarantee the reliability and stability of electronic devices. Mini-grooved flat heat pipe Thermal characterization Groove structure Groove distribution optimization Inclined angle Ma, Ting aut Wang, Qiuwang aut Yan, Yuying aut Tian, Wenchao aut Enthalten in Journal of thermal analysis and calorimetry Springer International Publishing, 1998 147(2022), 24 vom: 15. Nov., Seite 14859-14872 (DE-627)244148767 (DE-600)1429493-X (DE-576)066397693 1388-6150 nnns volume:147 year:2022 number:24 day:15 month:11 pages:14859-14872 https://doi.org/10.1007/s10973-022-11739-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-CHE SSG-OLC-PHA SSG-OLC-DE-84 AR 147 2022 24 15 11 14859-14872 |
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thermal characterization and wick optimization of mini-grooved flat heat pipe for electronics cooling |
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Thermal characterization and wick optimization of mini-grooved flat heat pipe for electronics cooling |
abstract |
Abstract Effective cooling technology is intensely demanded to cool the electronic devices within small space under high heat flux. Mini-grooved flat heat pipe (FHP) with simple structure, close contact with heat source, uniform temperature and high thermal conductivity can satisfy the demand of transferring the great heat rapidly and weakening the hot spot of electronic devices. As fine wick feature and distribution played a critical part in improving the performance of mini-grooved FHP, a thermal experiment was established to explore the heat transfer characterization of mini-grooved FHP with different wick structures and distributions. And a mathematical model in one dimension was set up to investigate the fluid flow and heat transmission performance of FHP with V-type or rectangle-type grooves, expecting to assist the experiment in understanding the operating mechanisms of mini-grooved FHP further. Effects of input heat, inclined angle, working temperature and wick structure were examined. It is found that among the V-type, rectangle-type and block-type mini-grooved FHPs, V-type FHP presents better heat transfer rate, while block-type FHP displays larger maximum heat transfer amount. V2 sloped convex gradient mini-grooved FHP owns the optimum overall performance. It possesses the merits of narrower grooves at the evaporation section, wider grooves at the condensation section and larger vapor chamber space, which can optimize the liquid and vapor circulation processes inside the FHP. Its thermal resistance and maximum temperature reduce by almost 9.7% and 3.4% separately in comparison with those of V1 straight mini-grooved FHP, which is beneficial to guarantee the reliability and stability of electronic devices. © Akadémiai Kiadó, Budapest, Hungary 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. |
abstractGer |
Abstract Effective cooling technology is intensely demanded to cool the electronic devices within small space under high heat flux. Mini-grooved flat heat pipe (FHP) with simple structure, close contact with heat source, uniform temperature and high thermal conductivity can satisfy the demand of transferring the great heat rapidly and weakening the hot spot of electronic devices. As fine wick feature and distribution played a critical part in improving the performance of mini-grooved FHP, a thermal experiment was established to explore the heat transfer characterization of mini-grooved FHP with different wick structures and distributions. And a mathematical model in one dimension was set up to investigate the fluid flow and heat transmission performance of FHP with V-type or rectangle-type grooves, expecting to assist the experiment in understanding the operating mechanisms of mini-grooved FHP further. Effects of input heat, inclined angle, working temperature and wick structure were examined. It is found that among the V-type, rectangle-type and block-type mini-grooved FHPs, V-type FHP presents better heat transfer rate, while block-type FHP displays larger maximum heat transfer amount. V2 sloped convex gradient mini-grooved FHP owns the optimum overall performance. It possesses the merits of narrower grooves at the evaporation section, wider grooves at the condensation section and larger vapor chamber space, which can optimize the liquid and vapor circulation processes inside the FHP. Its thermal resistance and maximum temperature reduce by almost 9.7% and 3.4% separately in comparison with those of V1 straight mini-grooved FHP, which is beneficial to guarantee the reliability and stability of electronic devices. © Akadémiai Kiadó, Budapest, Hungary 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. |
abstract_unstemmed |
Abstract Effective cooling technology is intensely demanded to cool the electronic devices within small space under high heat flux. Mini-grooved flat heat pipe (FHP) with simple structure, close contact with heat source, uniform temperature and high thermal conductivity can satisfy the demand of transferring the great heat rapidly and weakening the hot spot of electronic devices. As fine wick feature and distribution played a critical part in improving the performance of mini-grooved FHP, a thermal experiment was established to explore the heat transfer characterization of mini-grooved FHP with different wick structures and distributions. And a mathematical model in one dimension was set up to investigate the fluid flow and heat transmission performance of FHP with V-type or rectangle-type grooves, expecting to assist the experiment in understanding the operating mechanisms of mini-grooved FHP further. Effects of input heat, inclined angle, working temperature and wick structure were examined. It is found that among the V-type, rectangle-type and block-type mini-grooved FHPs, V-type FHP presents better heat transfer rate, while block-type FHP displays larger maximum heat transfer amount. V2 sloped convex gradient mini-grooved FHP owns the optimum overall performance. It possesses the merits of narrower grooves at the evaporation section, wider grooves at the condensation section and larger vapor chamber space, which can optimize the liquid and vapor circulation processes inside the FHP. Its thermal resistance and maximum temperature reduce by almost 9.7% and 3.4% separately in comparison with those of V1 straight mini-grooved FHP, which is beneficial to guarantee the reliability and stability of electronic devices. © Akadémiai Kiadó, Budapest, Hungary 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. |
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