Thermal characterization and wick optimization of mini-grooved flat heat pipe for electronics cooling

Abstract Effective cooling technology is intensely demanded to cool the electronic devices within small space under high heat flux. Mini-grooved flat heat pipe (FHP) with simple structure, close contact with heat source, uniform temperature and high thermal conductivity can satisfy the demand of tra...
Ausführliche Beschreibung

Gespeichert in:
Autor*in:

Xin, Fei [verfasserIn]

Ma, Ting

Wang, Qiuwang

Yan, Yuying

Tian, Wenchao

Format:

Artikel

Sprache:

Englisch

Erschienen:

2022

Schlagwörter:

Mini-grooved flat heat pipe

Thermal characterization

Groove structure

Groove distribution optimization

Inclined angle

Anmerkung:

© Akadémiai Kiadó, Budapest, Hungary 2022. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.

Übergeordnetes Werk:

Enthalten in: Journal of thermal analysis and calorimetry - Springer International Publishing, 1998, 147(2022), 24 vom: 15. Nov., Seite 14859-14872

Übergeordnetes Werk:

volume:147 ; year:2022 ; number:24 ; day:15 ; month:11 ; pages:14859-14872

Links:

Volltext

DOI / URN:

10.1007/s10973-022-11739-0

Katalog-ID:

OLC2080127969

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