Brittle fracture of nickel by dynamic indentation
Abstract Cracks of up to 40 μm which are either transgranular cleavage or very low energy “ductile” cracks have been introduced into large-grained fcc Ni. The mechanism for introducing this brittle fracture was dynamic indentation. Optical and scanning electron microscopy together with use of select...
Ausführliche Beschreibung
Autor*in: |
Hoehn, J. W. [verfasserIn] |
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Artikel |
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Sprache: |
Englisch |
Erschienen: |
1992 |
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Anmerkung: |
© The Materials Research Society 1992 |
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Übergeordnetes Werk: |
Enthalten in: Journal of materials research - Springer International Publishing, 1986, 7(1992), 8 vom: Aug., Seite 1973-1975 |
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Übergeordnetes Werk: |
volume:7 ; year:1992 ; number:8 ; month:08 ; pages:1973-1975 |
Links: |
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DOI / URN: |
10.1557/JMR.1992.1973 |
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OLC2119921822 |
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520 | |a Abstract Cracks of up to 40 μm which are either transgranular cleavage or very low energy “ductile” cracks have been introduced into large-grained fcc Ni. The mechanism for introducing this brittle fracture was dynamic indentation. Optical and scanning electron microscopy together with use of selected area channeling patterns were used to confirm that the fracture process is transgranular. The results qualitatively support the hypothesis that dynamic cracks originating in a brittle film can propagate relatively large distances into a ductile face-centered-cubic substrate by a rapid, low energy process. | ||
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10.1557/JMR.1992.1973 doi (DE-627)OLC2119921822 (DE-He213)JMR.1992.1973-p DE-627 ger DE-627 rakwb eng 670 VZ VA 5350 VZ rvk Hoehn, J. W. verfasserin aut Brittle fracture of nickel by dynamic indentation 1992 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Materials Research Society 1992 Abstract Cracks of up to 40 μm which are either transgranular cleavage or very low energy “ductile” cracks have been introduced into large-grained fcc Ni. The mechanism for introducing this brittle fracture was dynamic indentation. Optical and scanning electron microscopy together with use of selected area channeling patterns were used to confirm that the fracture process is transgranular. The results qualitatively support the hypothesis that dynamic cracks originating in a brittle film can propagate relatively large distances into a ductile face-centered-cubic substrate by a rapid, low energy process. Foecke, T. aut Gerberich, W. W. aut Enthalten in Journal of materials research Springer International Publishing, 1986 7(1992), 8 vom: Aug., Seite 1973-1975 (DE-627)129206288 (DE-600)54876-5 (DE-576)01445744X 0884-2914 nnns volume:7 year:1992 number:8 month:08 pages:1973-1975 https://doi.org/10.1557/JMR.1992.1973 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_21 GBV_ILN_22 GBV_ILN_23 GBV_ILN_30 GBV_ILN_31 GBV_ILN_40 GBV_ILN_70 GBV_ILN_100 GBV_ILN_130 GBV_ILN_602 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2010 GBV_ILN_2020 GBV_ILN_2027 GBV_ILN_4126 GBV_ILN_4155 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4315 GBV_ILN_4319 GBV_ILN_4323 VA 5350 AR 7 1992 8 08 1973-1975 |
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10.1557/JMR.1992.1973 doi (DE-627)OLC2119921822 (DE-He213)JMR.1992.1973-p DE-627 ger DE-627 rakwb eng 670 VZ VA 5350 VZ rvk Hoehn, J. W. verfasserin aut Brittle fracture of nickel by dynamic indentation 1992 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Materials Research Society 1992 Abstract Cracks of up to 40 μm which are either transgranular cleavage or very low energy “ductile” cracks have been introduced into large-grained fcc Ni. The mechanism for introducing this brittle fracture was dynamic indentation. Optical and scanning electron microscopy together with use of selected area channeling patterns were used to confirm that the fracture process is transgranular. The results qualitatively support the hypothesis that dynamic cracks originating in a brittle film can propagate relatively large distances into a ductile face-centered-cubic substrate by a rapid, low energy process. Foecke, T. aut Gerberich, W. W. aut Enthalten in Journal of materials research Springer International Publishing, 1986 7(1992), 8 vom: Aug., Seite 1973-1975 (DE-627)129206288 (DE-600)54876-5 (DE-576)01445744X 0884-2914 nnns volume:7 year:1992 number:8 month:08 pages:1973-1975 https://doi.org/10.1557/JMR.1992.1973 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_21 GBV_ILN_22 GBV_ILN_23 GBV_ILN_30 GBV_ILN_31 GBV_ILN_40 GBV_ILN_70 GBV_ILN_100 GBV_ILN_130 GBV_ILN_602 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2010 GBV_ILN_2020 GBV_ILN_2027 GBV_ILN_4126 GBV_ILN_4155 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4315 GBV_ILN_4319 GBV_ILN_4323 VA 5350 AR 7 1992 8 08 1973-1975 |
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10.1557/JMR.1992.1973 doi (DE-627)OLC2119921822 (DE-He213)JMR.1992.1973-p DE-627 ger DE-627 rakwb eng 670 VZ VA 5350 VZ rvk Hoehn, J. W. verfasserin aut Brittle fracture of nickel by dynamic indentation 1992 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Materials Research Society 1992 Abstract Cracks of up to 40 μm which are either transgranular cleavage or very low energy “ductile” cracks have been introduced into large-grained fcc Ni. The mechanism for introducing this brittle fracture was dynamic indentation. Optical and scanning electron microscopy together with use of selected area channeling patterns were used to confirm that the fracture process is transgranular. The results qualitatively support the hypothesis that dynamic cracks originating in a brittle film can propagate relatively large distances into a ductile face-centered-cubic substrate by a rapid, low energy process. Foecke, T. aut Gerberich, W. W. aut Enthalten in Journal of materials research Springer International Publishing, 1986 7(1992), 8 vom: Aug., Seite 1973-1975 (DE-627)129206288 (DE-600)54876-5 (DE-576)01445744X 0884-2914 nnns volume:7 year:1992 number:8 month:08 pages:1973-1975 https://doi.org/10.1557/JMR.1992.1973 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_21 GBV_ILN_22 GBV_ILN_23 GBV_ILN_30 GBV_ILN_31 GBV_ILN_40 GBV_ILN_70 GBV_ILN_100 GBV_ILN_130 GBV_ILN_602 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2010 GBV_ILN_2020 GBV_ILN_2027 GBV_ILN_4126 GBV_ILN_4155 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4315 GBV_ILN_4319 GBV_ILN_4323 VA 5350 AR 7 1992 8 08 1973-1975 |
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10.1557/JMR.1992.1973 doi (DE-627)OLC2119921822 (DE-He213)JMR.1992.1973-p DE-627 ger DE-627 rakwb eng 670 VZ VA 5350 VZ rvk Hoehn, J. W. verfasserin aut Brittle fracture of nickel by dynamic indentation 1992 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Materials Research Society 1992 Abstract Cracks of up to 40 μm which are either transgranular cleavage or very low energy “ductile” cracks have been introduced into large-grained fcc Ni. The mechanism for introducing this brittle fracture was dynamic indentation. Optical and scanning electron microscopy together with use of selected area channeling patterns were used to confirm that the fracture process is transgranular. The results qualitatively support the hypothesis that dynamic cracks originating in a brittle film can propagate relatively large distances into a ductile face-centered-cubic substrate by a rapid, low energy process. Foecke, T. aut Gerberich, W. W. aut Enthalten in Journal of materials research Springer International Publishing, 1986 7(1992), 8 vom: Aug., Seite 1973-1975 (DE-627)129206288 (DE-600)54876-5 (DE-576)01445744X 0884-2914 nnns volume:7 year:1992 number:8 month:08 pages:1973-1975 https://doi.org/10.1557/JMR.1992.1973 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_21 GBV_ILN_22 GBV_ILN_23 GBV_ILN_30 GBV_ILN_31 GBV_ILN_40 GBV_ILN_70 GBV_ILN_100 GBV_ILN_130 GBV_ILN_602 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2010 GBV_ILN_2020 GBV_ILN_2027 GBV_ILN_4126 GBV_ILN_4155 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4315 GBV_ILN_4319 GBV_ILN_4323 VA 5350 AR 7 1992 8 08 1973-1975 |
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10.1557/JMR.1992.1973 doi (DE-627)OLC2119921822 (DE-He213)JMR.1992.1973-p DE-627 ger DE-627 rakwb eng 670 VZ VA 5350 VZ rvk Hoehn, J. W. verfasserin aut Brittle fracture of nickel by dynamic indentation 1992 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Materials Research Society 1992 Abstract Cracks of up to 40 μm which are either transgranular cleavage or very low energy “ductile” cracks have been introduced into large-grained fcc Ni. The mechanism for introducing this brittle fracture was dynamic indentation. Optical and scanning electron microscopy together with use of selected area channeling patterns were used to confirm that the fracture process is transgranular. The results qualitatively support the hypothesis that dynamic cracks originating in a brittle film can propagate relatively large distances into a ductile face-centered-cubic substrate by a rapid, low energy process. Foecke, T. aut Gerberich, W. W. aut Enthalten in Journal of materials research Springer International Publishing, 1986 7(1992), 8 vom: Aug., Seite 1973-1975 (DE-627)129206288 (DE-600)54876-5 (DE-576)01445744X 0884-2914 nnns volume:7 year:1992 number:8 month:08 pages:1973-1975 https://doi.org/10.1557/JMR.1992.1973 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_21 GBV_ILN_22 GBV_ILN_23 GBV_ILN_30 GBV_ILN_31 GBV_ILN_40 GBV_ILN_70 GBV_ILN_100 GBV_ILN_130 GBV_ILN_602 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2010 GBV_ILN_2020 GBV_ILN_2027 GBV_ILN_4126 GBV_ILN_4155 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4315 GBV_ILN_4319 GBV_ILN_4323 VA 5350 AR 7 1992 8 08 1973-1975 |
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Abstract Cracks of up to 40 μm which are either transgranular cleavage or very low energy “ductile” cracks have been introduced into large-grained fcc Ni. The mechanism for introducing this brittle fracture was dynamic indentation. Optical and scanning electron microscopy together with use of selected area channeling patterns were used to confirm that the fracture process is transgranular. The results qualitatively support the hypothesis that dynamic cracks originating in a brittle film can propagate relatively large distances into a ductile face-centered-cubic substrate by a rapid, low energy process. © The Materials Research Society 1992 |
abstractGer |
Abstract Cracks of up to 40 μm which are either transgranular cleavage or very low energy “ductile” cracks have been introduced into large-grained fcc Ni. The mechanism for introducing this brittle fracture was dynamic indentation. Optical and scanning electron microscopy together with use of selected area channeling patterns were used to confirm that the fracture process is transgranular. The results qualitatively support the hypothesis that dynamic cracks originating in a brittle film can propagate relatively large distances into a ductile face-centered-cubic substrate by a rapid, low energy process. © The Materials Research Society 1992 |
abstract_unstemmed |
Abstract Cracks of up to 40 μm which are either transgranular cleavage or very low energy “ductile” cracks have been introduced into large-grained fcc Ni. The mechanism for introducing this brittle fracture was dynamic indentation. Optical and scanning electron microscopy together with use of selected area channeling patterns were used to confirm that the fracture process is transgranular. The results qualitatively support the hypothesis that dynamic cracks originating in a brittle film can propagate relatively large distances into a ductile face-centered-cubic substrate by a rapid, low energy process. © The Materials Research Society 1992 |
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title_short |
Brittle fracture of nickel by dynamic indentation |
url |
https://doi.org/10.1557/JMR.1992.1973 |
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Foecke, T. Gerberich, W. W. |
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