Evaluation of the modified edge lift-off test for adhesion characterization in microelectronic multifilm applications
Abstract The modified edge lift-off test (MELT) has gained enough acceptance in the community for evaluating interfacial adhesion that there is now commercial equipment for automating the test. However, there are several experimental and mechanics assumptions of the test that may provide unexpected...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Hay, Jack C. [verfasserIn] |
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| Format: |
Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2001 |
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| Systematik: |
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| Anmerkung: |
© The Materials Research Society 2001 |
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| Übergeordnetes Werk: |
Enthalten in: Journal of materials research - Springer International Publishing, 1986, 16(2001), 2 vom: 01. Feb., Seite 385-393 |
|---|---|
| Übergeordnetes Werk: |
volume:16 ; year:2001 ; number:2 ; day:01 ; month:02 ; pages:385-393 |
| Links: |
|---|
| DOI / URN: |
10.1557/JMR.2001.0058 |
|---|
| Katalog-ID: |
OLC2121722505 |
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| 520 | |a Abstract The modified edge lift-off test (MELT) has gained enough acceptance in the community for evaluating interfacial adhesion that there is now commercial equipment for automating the test. However, there are several experimental and mechanics assumptions of the test that may provide unexpected outcomes. Experimental data suggested that for crack lengths greater than 5% of the film thickness the energy release rate was independent of crack length, contradicting the rule of thumb suggesting that the crack length should be greater than 10–20 times the film thickness to obtain a steady-state energy release rate in the edge crack problem. Finite element simulations not only corroborated the experimental observation but seemed to indicate that the crack length required for steady-state conditions was a function of the relative Young’s moduli for the film and substrate. It was also shown via an analytical model that plate bending (commonly neglected) can significantly affect the energy release rate in the MELT and lead to incorrect conclusions regarding the reliability of an interface. | ||
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| 700 | 1 | |a Liu, Xiao Hu |4 aut | |
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10.1557/JMR.2001.0058 doi (DE-627)OLC2121722505 (DE-He213)JMR.2001.0058-p DE-627 ger DE-627 rakwb eng 670 VZ VA 5350 VZ rvk Hay, Jack C. verfasserin aut Evaluation of the modified edge lift-off test for adhesion characterization in microelectronic multifilm applications 2001 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Materials Research Society 2001 Abstract The modified edge lift-off test (MELT) has gained enough acceptance in the community for evaluating interfacial adhesion that there is now commercial equipment for automating the test. However, there are several experimental and mechanics assumptions of the test that may provide unexpected outcomes. Experimental data suggested that for crack lengths greater than 5% of the film thickness the energy release rate was independent of crack length, contradicting the rule of thumb suggesting that the crack length should be greater than 10–20 times the film thickness to obtain a steady-state energy release rate in the edge crack problem. Finite element simulations not only corroborated the experimental observation but seemed to indicate that the crack length required for steady-state conditions was a function of the relative Young’s moduli for the film and substrate. It was also shown via an analytical model that plate bending (commonly neglected) can significantly affect the energy release rate in the MELT and lead to incorrect conclusions regarding the reliability of an interface. Liniger, Eric G. aut Liu, Xiao Hu aut Enthalten in Journal of materials research Springer International Publishing, 1986 16(2001), 2 vom: 01. Feb., Seite 385-393 (DE-627)129206288 (DE-600)54876-5 (DE-576)01445744X 0884-2914 nnns volume:16 year:2001 number:2 day:01 month:02 pages:385-393 https://doi.org/10.1557/JMR.2001.0058 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_21 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_30 GBV_ILN_31 GBV_ILN_70 GBV_ILN_602 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2010 GBV_ILN_2020 GBV_ILN_4126 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4319 GBV_ILN_4323 VA 5350 AR 16 2001 2 01 02 385-393 |
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10.1557/JMR.2001.0058 doi (DE-627)OLC2121722505 (DE-He213)JMR.2001.0058-p DE-627 ger DE-627 rakwb eng 670 VZ VA 5350 VZ rvk Hay, Jack C. verfasserin aut Evaluation of the modified edge lift-off test for adhesion characterization in microelectronic multifilm applications 2001 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Materials Research Society 2001 Abstract The modified edge lift-off test (MELT) has gained enough acceptance in the community for evaluating interfacial adhesion that there is now commercial equipment for automating the test. However, there are several experimental and mechanics assumptions of the test that may provide unexpected outcomes. Experimental data suggested that for crack lengths greater than 5% of the film thickness the energy release rate was independent of crack length, contradicting the rule of thumb suggesting that the crack length should be greater than 10–20 times the film thickness to obtain a steady-state energy release rate in the edge crack problem. Finite element simulations not only corroborated the experimental observation but seemed to indicate that the crack length required for steady-state conditions was a function of the relative Young’s moduli for the film and substrate. It was also shown via an analytical model that plate bending (commonly neglected) can significantly affect the energy release rate in the MELT and lead to incorrect conclusions regarding the reliability of an interface. Liniger, Eric G. aut Liu, Xiao Hu aut Enthalten in Journal of materials research Springer International Publishing, 1986 16(2001), 2 vom: 01. Feb., Seite 385-393 (DE-627)129206288 (DE-600)54876-5 (DE-576)01445744X 0884-2914 nnns volume:16 year:2001 number:2 day:01 month:02 pages:385-393 https://doi.org/10.1557/JMR.2001.0058 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_21 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_30 GBV_ILN_31 GBV_ILN_70 GBV_ILN_602 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2010 GBV_ILN_2020 GBV_ILN_4126 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4319 GBV_ILN_4323 VA 5350 AR 16 2001 2 01 02 385-393 |
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10.1557/JMR.2001.0058 doi (DE-627)OLC2121722505 (DE-He213)JMR.2001.0058-p DE-627 ger DE-627 rakwb eng 670 VZ VA 5350 VZ rvk Hay, Jack C. verfasserin aut Evaluation of the modified edge lift-off test for adhesion characterization in microelectronic multifilm applications 2001 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Materials Research Society 2001 Abstract The modified edge lift-off test (MELT) has gained enough acceptance in the community for evaluating interfacial adhesion that there is now commercial equipment for automating the test. However, there are several experimental and mechanics assumptions of the test that may provide unexpected outcomes. Experimental data suggested that for crack lengths greater than 5% of the film thickness the energy release rate was independent of crack length, contradicting the rule of thumb suggesting that the crack length should be greater than 10–20 times the film thickness to obtain a steady-state energy release rate in the edge crack problem. Finite element simulations not only corroborated the experimental observation but seemed to indicate that the crack length required for steady-state conditions was a function of the relative Young’s moduli for the film and substrate. It was also shown via an analytical model that plate bending (commonly neglected) can significantly affect the energy release rate in the MELT and lead to incorrect conclusions regarding the reliability of an interface. Liniger, Eric G. aut Liu, Xiao Hu aut Enthalten in Journal of materials research Springer International Publishing, 1986 16(2001), 2 vom: 01. Feb., Seite 385-393 (DE-627)129206288 (DE-600)54876-5 (DE-576)01445744X 0884-2914 nnns volume:16 year:2001 number:2 day:01 month:02 pages:385-393 https://doi.org/10.1557/JMR.2001.0058 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_21 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_30 GBV_ILN_31 GBV_ILN_70 GBV_ILN_602 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2010 GBV_ILN_2020 GBV_ILN_4126 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4319 GBV_ILN_4323 VA 5350 AR 16 2001 2 01 02 385-393 |
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10.1557/JMR.2001.0058 doi (DE-627)OLC2121722505 (DE-He213)JMR.2001.0058-p DE-627 ger DE-627 rakwb eng 670 VZ VA 5350 VZ rvk Hay, Jack C. verfasserin aut Evaluation of the modified edge lift-off test for adhesion characterization in microelectronic multifilm applications 2001 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Materials Research Society 2001 Abstract The modified edge lift-off test (MELT) has gained enough acceptance in the community for evaluating interfacial adhesion that there is now commercial equipment for automating the test. However, there are several experimental and mechanics assumptions of the test that may provide unexpected outcomes. Experimental data suggested that for crack lengths greater than 5% of the film thickness the energy release rate was independent of crack length, contradicting the rule of thumb suggesting that the crack length should be greater than 10–20 times the film thickness to obtain a steady-state energy release rate in the edge crack problem. Finite element simulations not only corroborated the experimental observation but seemed to indicate that the crack length required for steady-state conditions was a function of the relative Young’s moduli for the film and substrate. It was also shown via an analytical model that plate bending (commonly neglected) can significantly affect the energy release rate in the MELT and lead to incorrect conclusions regarding the reliability of an interface. Liniger, Eric G. aut Liu, Xiao Hu aut Enthalten in Journal of materials research Springer International Publishing, 1986 16(2001), 2 vom: 01. Feb., Seite 385-393 (DE-627)129206288 (DE-600)54876-5 (DE-576)01445744X 0884-2914 nnns volume:16 year:2001 number:2 day:01 month:02 pages:385-393 https://doi.org/10.1557/JMR.2001.0058 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_21 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_30 GBV_ILN_31 GBV_ILN_70 GBV_ILN_602 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2010 GBV_ILN_2020 GBV_ILN_4126 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4319 GBV_ILN_4323 VA 5350 AR 16 2001 2 01 02 385-393 |
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10.1557/JMR.2001.0058 doi (DE-627)OLC2121722505 (DE-He213)JMR.2001.0058-p DE-627 ger DE-627 rakwb eng 670 VZ VA 5350 VZ rvk Hay, Jack C. verfasserin aut Evaluation of the modified edge lift-off test for adhesion characterization in microelectronic multifilm applications 2001 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Materials Research Society 2001 Abstract The modified edge lift-off test (MELT) has gained enough acceptance in the community for evaluating interfacial adhesion that there is now commercial equipment for automating the test. However, there are several experimental and mechanics assumptions of the test that may provide unexpected outcomes. Experimental data suggested that for crack lengths greater than 5% of the film thickness the energy release rate was independent of crack length, contradicting the rule of thumb suggesting that the crack length should be greater than 10–20 times the film thickness to obtain a steady-state energy release rate in the edge crack problem. Finite element simulations not only corroborated the experimental observation but seemed to indicate that the crack length required for steady-state conditions was a function of the relative Young’s moduli for the film and substrate. It was also shown via an analytical model that plate bending (commonly neglected) can significantly affect the energy release rate in the MELT and lead to incorrect conclusions regarding the reliability of an interface. Liniger, Eric G. aut Liu, Xiao Hu aut Enthalten in Journal of materials research Springer International Publishing, 1986 16(2001), 2 vom: 01. Feb., Seite 385-393 (DE-627)129206288 (DE-600)54876-5 (DE-576)01445744X 0884-2914 nnns volume:16 year:2001 number:2 day:01 month:02 pages:385-393 https://doi.org/10.1557/JMR.2001.0058 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_21 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_30 GBV_ILN_31 GBV_ILN_70 GBV_ILN_602 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2010 GBV_ILN_2020 GBV_ILN_4126 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4319 GBV_ILN_4323 VA 5350 AR 16 2001 2 01 02 385-393 |
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Hay, Jack C. |
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2001 |
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Hay, Jack C. Liniger, Eric G. Liu, Xiao Hu |
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Hay, Jack C. |
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10.1557/JMR.2001.0058 |
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670 |
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evaluation of the modified edge lift-off test for adhesion characterization in microelectronic multifilm applications |
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Evaluation of the modified edge lift-off test for adhesion characterization in microelectronic multifilm applications |
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Abstract The modified edge lift-off test (MELT) has gained enough acceptance in the community for evaluating interfacial adhesion that there is now commercial equipment for automating the test. However, there are several experimental and mechanics assumptions of the test that may provide unexpected outcomes. Experimental data suggested that for crack lengths greater than 5% of the film thickness the energy release rate was independent of crack length, contradicting the rule of thumb suggesting that the crack length should be greater than 10–20 times the film thickness to obtain a steady-state energy release rate in the edge crack problem. Finite element simulations not only corroborated the experimental observation but seemed to indicate that the crack length required for steady-state conditions was a function of the relative Young’s moduli for the film and substrate. It was also shown via an analytical model that plate bending (commonly neglected) can significantly affect the energy release rate in the MELT and lead to incorrect conclusions regarding the reliability of an interface. © The Materials Research Society 2001 |
| abstractGer |
Abstract The modified edge lift-off test (MELT) has gained enough acceptance in the community for evaluating interfacial adhesion that there is now commercial equipment for automating the test. However, there are several experimental and mechanics assumptions of the test that may provide unexpected outcomes. Experimental data suggested that for crack lengths greater than 5% of the film thickness the energy release rate was independent of crack length, contradicting the rule of thumb suggesting that the crack length should be greater than 10–20 times the film thickness to obtain a steady-state energy release rate in the edge crack problem. Finite element simulations not only corroborated the experimental observation but seemed to indicate that the crack length required for steady-state conditions was a function of the relative Young’s moduli for the film and substrate. It was also shown via an analytical model that plate bending (commonly neglected) can significantly affect the energy release rate in the MELT and lead to incorrect conclusions regarding the reliability of an interface. © The Materials Research Society 2001 |
| abstract_unstemmed |
Abstract The modified edge lift-off test (MELT) has gained enough acceptance in the community for evaluating interfacial adhesion that there is now commercial equipment for automating the test. However, there are several experimental and mechanics assumptions of the test that may provide unexpected outcomes. Experimental data suggested that for crack lengths greater than 5% of the film thickness the energy release rate was independent of crack length, contradicting the rule of thumb suggesting that the crack length should be greater than 10–20 times the film thickness to obtain a steady-state energy release rate in the edge crack problem. Finite element simulations not only corroborated the experimental observation but seemed to indicate that the crack length required for steady-state conditions was a function of the relative Young’s moduli for the film and substrate. It was also shown via an analytical model that plate bending (commonly neglected) can significantly affect the energy release rate in the MELT and lead to incorrect conclusions regarding the reliability of an interface. © The Materials Research Society 2001 |
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Evaluation of the modified edge lift-off test for adhesion characterization in microelectronic multifilm applications |
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