Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration
Abstract Thermomigration (TM) and electromigration (EM) are two persistent reliability issues and they generally appear concurrently in solder joints. Many previous studies have attempted to understand the fundamental principles behind these phenomena with the majority of which focusing their intere...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Guo, Fu [verfasserIn] |
|---|
| Format: |
Artikel |
|---|---|
| Sprache: |
Englisch |
| Erschienen: |
2016 |
|---|
| Systematik: |
|
|---|
| Anmerkung: |
© The Materials Research Society 2016 |
|---|
| Übergeordnetes Werk: |
Enthalten in: Journal of materials research - Springer International Publishing, 1986, 31(2016), 12 vom: 01. Juni, Seite 1793-1800 |
|---|---|
| Übergeordnetes Werk: |
volume:31 ; year:2016 ; number:12 ; day:01 ; month:06 ; pages:1793-1800 |
| Links: |
|---|
| DOI / URN: |
10.1557/jmr.2016.145 |
|---|
| Katalog-ID: |
OLC2123855928 |
|---|
| LEADER | 01000naa a22002652 4500 | ||
|---|---|---|---|
| 001 | OLC2123855928 | ||
| 003 | DE-627 | ||
| 005 | 20230505080447.0 | ||
| 007 | tu | ||
| 008 | 230505s2016 xx ||||| 00| ||eng c | ||
| 024 | 7 | |a 10.1557/jmr.2016.145 |2 doi | |
| 035 | |a (DE-627)OLC2123855928 | ||
| 035 | |a (DE-He213)jmr.2016.145-p | ||
| 040 | |a DE-627 |b ger |c DE-627 |e rakwb | ||
| 041 | |a eng | ||
| 082 | 0 | 4 | |a 670 |q VZ |
| 084 | |a VA 5350 |q VZ |2 rvk | ||
| 100 | 1 | |a Guo, Fu |e verfasserin |4 aut | |
| 245 | 1 | 0 | |a Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration |
| 264 | 1 | |c 2016 | |
| 336 | |a Text |b txt |2 rdacontent | ||
| 337 | |a ohne Hilfsmittel zu benutzen |b n |2 rdamedia | ||
| 338 | |a Band |b nc |2 rdacarrier | ||
| 500 | |a © The Materials Research Society 2016 | ||
| 520 | |a Abstract Thermomigration (TM) and electromigration (EM) are two persistent reliability issues and they generally appear concurrently in solder joints. Many previous studies have attempted to understand the fundamental principles behind these phenomena with the majority of which focusing their interest into the faster migration elements in solders like Bi, Ni, or Cu. However, Sn as the slower migration element has not received that much attention. In the present study, a special linearly symmetrical structure was used. An unusual TM phenomenon of Sn atoms in the Sn58Bi solder joint was observed. The unusual TM of Sn atoms along the vertical edges was attributed to the coupled effect of the EM in the horizontal direction and the TM in vertical direction. The relationships between the microstructural characteristics and the temperature distribution were established. The results also indicated that elevated temperature and sufficient thermal gradient were the two major factors that caused TM. | ||
| 700 | 1 | |a Liu, Qian |4 aut | |
| 700 | 1 | |a Ma, Limin |4 aut | |
| 700 | 1 | |a Zuo, Yong |4 aut | |
| 773 | 0 | 8 | |i Enthalten in |t Journal of materials research |d Springer International Publishing, 1986 |g 31(2016), 12 vom: 01. Juni, Seite 1793-1800 |w (DE-627)129206288 |w (DE-600)54876-5 |w (DE-576)01445744X |x 0884-2914 |7 nnns |
| 773 | 1 | 8 | |g volume:31 |g year:2016 |g number:12 |g day:01 |g month:06 |g pages:1793-1800 |
| 856 | 4 | 1 | |u https://doi.org/10.1557/jmr.2016.145 |z lizenzpflichtig |3 Volltext |
| 912 | |a GBV_USEFLAG_A | ||
| 912 | |a SYSFLAG_A | ||
| 912 | |a GBV_OLC | ||
| 912 | |a SSG-OLC-TEC | ||
| 912 | |a GBV_ILN_21 | ||
| 912 | |a GBV_ILN_24 | ||
| 912 | |a GBV_ILN_70 | ||
| 912 | |a GBV_ILN_2005 | ||
| 912 | |a GBV_ILN_2020 | ||
| 912 | |a GBV_ILN_4126 | ||
| 912 | |a GBV_ILN_4319 | ||
| 912 | |a GBV_ILN_4323 | ||
| 936 | r | v | |a VA 5350 |
| 951 | |a AR | ||
| 952 | |d 31 |j 2016 |e 12 |b 01 |c 06 |h 1793-1800 | ||
| author_variant |
f g fg q l ql l m lm y z yz |
|---|---|
| matchkey_str |
article:08842914:2016----::ifsobhvoosaosnn8iodronsneteopigfetfhroi |
| hierarchy_sort_str |
2016 |
| publishDate |
2016 |
| allfields |
10.1557/jmr.2016.145 doi (DE-627)OLC2123855928 (DE-He213)jmr.2016.145-p DE-627 ger DE-627 rakwb eng 670 VZ VA 5350 VZ rvk Guo, Fu verfasserin aut Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Materials Research Society 2016 Abstract Thermomigration (TM) and electromigration (EM) are two persistent reliability issues and they generally appear concurrently in solder joints. Many previous studies have attempted to understand the fundamental principles behind these phenomena with the majority of which focusing their interest into the faster migration elements in solders like Bi, Ni, or Cu. However, Sn as the slower migration element has not received that much attention. In the present study, a special linearly symmetrical structure was used. An unusual TM phenomenon of Sn atoms in the Sn58Bi solder joint was observed. The unusual TM of Sn atoms along the vertical edges was attributed to the coupled effect of the EM in the horizontal direction and the TM in vertical direction. The relationships between the microstructural characteristics and the temperature distribution were established. The results also indicated that elevated temperature and sufficient thermal gradient were the two major factors that caused TM. Liu, Qian aut Ma, Limin aut Zuo, Yong aut Enthalten in Journal of materials research Springer International Publishing, 1986 31(2016), 12 vom: 01. Juni, Seite 1793-1800 (DE-627)129206288 (DE-600)54876-5 (DE-576)01445744X 0884-2914 nnns volume:31 year:2016 number:12 day:01 month:06 pages:1793-1800 https://doi.org/10.1557/jmr.2016.145 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_21 GBV_ILN_24 GBV_ILN_70 GBV_ILN_2005 GBV_ILN_2020 GBV_ILN_4126 GBV_ILN_4319 GBV_ILN_4323 VA 5350 AR 31 2016 12 01 06 1793-1800 |
| spelling |
10.1557/jmr.2016.145 doi (DE-627)OLC2123855928 (DE-He213)jmr.2016.145-p DE-627 ger DE-627 rakwb eng 670 VZ VA 5350 VZ rvk Guo, Fu verfasserin aut Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Materials Research Society 2016 Abstract Thermomigration (TM) and electromigration (EM) are two persistent reliability issues and they generally appear concurrently in solder joints. Many previous studies have attempted to understand the fundamental principles behind these phenomena with the majority of which focusing their interest into the faster migration elements in solders like Bi, Ni, or Cu. However, Sn as the slower migration element has not received that much attention. In the present study, a special linearly symmetrical structure was used. An unusual TM phenomenon of Sn atoms in the Sn58Bi solder joint was observed. The unusual TM of Sn atoms along the vertical edges was attributed to the coupled effect of the EM in the horizontal direction and the TM in vertical direction. The relationships between the microstructural characteristics and the temperature distribution were established. The results also indicated that elevated temperature and sufficient thermal gradient were the two major factors that caused TM. Liu, Qian aut Ma, Limin aut Zuo, Yong aut Enthalten in Journal of materials research Springer International Publishing, 1986 31(2016), 12 vom: 01. Juni, Seite 1793-1800 (DE-627)129206288 (DE-600)54876-5 (DE-576)01445744X 0884-2914 nnns volume:31 year:2016 number:12 day:01 month:06 pages:1793-1800 https://doi.org/10.1557/jmr.2016.145 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_21 GBV_ILN_24 GBV_ILN_70 GBV_ILN_2005 GBV_ILN_2020 GBV_ILN_4126 GBV_ILN_4319 GBV_ILN_4323 VA 5350 AR 31 2016 12 01 06 1793-1800 |
| allfields_unstemmed |
10.1557/jmr.2016.145 doi (DE-627)OLC2123855928 (DE-He213)jmr.2016.145-p DE-627 ger DE-627 rakwb eng 670 VZ VA 5350 VZ rvk Guo, Fu verfasserin aut Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Materials Research Society 2016 Abstract Thermomigration (TM) and electromigration (EM) are two persistent reliability issues and they generally appear concurrently in solder joints. Many previous studies have attempted to understand the fundamental principles behind these phenomena with the majority of which focusing their interest into the faster migration elements in solders like Bi, Ni, or Cu. However, Sn as the slower migration element has not received that much attention. In the present study, a special linearly symmetrical structure was used. An unusual TM phenomenon of Sn atoms in the Sn58Bi solder joint was observed. The unusual TM of Sn atoms along the vertical edges was attributed to the coupled effect of the EM in the horizontal direction and the TM in vertical direction. The relationships between the microstructural characteristics and the temperature distribution were established. The results also indicated that elevated temperature and sufficient thermal gradient were the two major factors that caused TM. Liu, Qian aut Ma, Limin aut Zuo, Yong aut Enthalten in Journal of materials research Springer International Publishing, 1986 31(2016), 12 vom: 01. Juni, Seite 1793-1800 (DE-627)129206288 (DE-600)54876-5 (DE-576)01445744X 0884-2914 nnns volume:31 year:2016 number:12 day:01 month:06 pages:1793-1800 https://doi.org/10.1557/jmr.2016.145 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_21 GBV_ILN_24 GBV_ILN_70 GBV_ILN_2005 GBV_ILN_2020 GBV_ILN_4126 GBV_ILN_4319 GBV_ILN_4323 VA 5350 AR 31 2016 12 01 06 1793-1800 |
| allfieldsGer |
10.1557/jmr.2016.145 doi (DE-627)OLC2123855928 (DE-He213)jmr.2016.145-p DE-627 ger DE-627 rakwb eng 670 VZ VA 5350 VZ rvk Guo, Fu verfasserin aut Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Materials Research Society 2016 Abstract Thermomigration (TM) and electromigration (EM) are two persistent reliability issues and they generally appear concurrently in solder joints. Many previous studies have attempted to understand the fundamental principles behind these phenomena with the majority of which focusing their interest into the faster migration elements in solders like Bi, Ni, or Cu. However, Sn as the slower migration element has not received that much attention. In the present study, a special linearly symmetrical structure was used. An unusual TM phenomenon of Sn atoms in the Sn58Bi solder joint was observed. The unusual TM of Sn atoms along the vertical edges was attributed to the coupled effect of the EM in the horizontal direction and the TM in vertical direction. The relationships between the microstructural characteristics and the temperature distribution were established. The results also indicated that elevated temperature and sufficient thermal gradient were the two major factors that caused TM. Liu, Qian aut Ma, Limin aut Zuo, Yong aut Enthalten in Journal of materials research Springer International Publishing, 1986 31(2016), 12 vom: 01. Juni, Seite 1793-1800 (DE-627)129206288 (DE-600)54876-5 (DE-576)01445744X 0884-2914 nnns volume:31 year:2016 number:12 day:01 month:06 pages:1793-1800 https://doi.org/10.1557/jmr.2016.145 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_21 GBV_ILN_24 GBV_ILN_70 GBV_ILN_2005 GBV_ILN_2020 GBV_ILN_4126 GBV_ILN_4319 GBV_ILN_4323 VA 5350 AR 31 2016 12 01 06 1793-1800 |
| allfieldsSound |
10.1557/jmr.2016.145 doi (DE-627)OLC2123855928 (DE-He213)jmr.2016.145-p DE-627 ger DE-627 rakwb eng 670 VZ VA 5350 VZ rvk Guo, Fu verfasserin aut Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration 2016 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Materials Research Society 2016 Abstract Thermomigration (TM) and electromigration (EM) are two persistent reliability issues and they generally appear concurrently in solder joints. Many previous studies have attempted to understand the fundamental principles behind these phenomena with the majority of which focusing their interest into the faster migration elements in solders like Bi, Ni, or Cu. However, Sn as the slower migration element has not received that much attention. In the present study, a special linearly symmetrical structure was used. An unusual TM phenomenon of Sn atoms in the Sn58Bi solder joint was observed. The unusual TM of Sn atoms along the vertical edges was attributed to the coupled effect of the EM in the horizontal direction and the TM in vertical direction. The relationships between the microstructural characteristics and the temperature distribution were established. The results also indicated that elevated temperature and sufficient thermal gradient were the two major factors that caused TM. Liu, Qian aut Ma, Limin aut Zuo, Yong aut Enthalten in Journal of materials research Springer International Publishing, 1986 31(2016), 12 vom: 01. Juni, Seite 1793-1800 (DE-627)129206288 (DE-600)54876-5 (DE-576)01445744X 0884-2914 nnns volume:31 year:2016 number:12 day:01 month:06 pages:1793-1800 https://doi.org/10.1557/jmr.2016.145 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_21 GBV_ILN_24 GBV_ILN_70 GBV_ILN_2005 GBV_ILN_2020 GBV_ILN_4126 GBV_ILN_4319 GBV_ILN_4323 VA 5350 AR 31 2016 12 01 06 1793-1800 |
| language |
English |
| source |
Enthalten in Journal of materials research 31(2016), 12 vom: 01. Juni, Seite 1793-1800 volume:31 year:2016 number:12 day:01 month:06 pages:1793-1800 |
| sourceStr |
Enthalten in Journal of materials research 31(2016), 12 vom: 01. Juni, Seite 1793-1800 volume:31 year:2016 number:12 day:01 month:06 pages:1793-1800 |
| format_phy_str_mv |
Article |
| institution |
findex.gbv.de |
| dewey-raw |
670 |
| isfreeaccess_bool |
false |
| container_title |
Journal of materials research |
| authorswithroles_txt_mv |
Guo, Fu @@aut@@ Liu, Qian @@aut@@ Ma, Limin @@aut@@ Zuo, Yong @@aut@@ |
| publishDateDaySort_date |
2016-06-01T00:00:00Z |
| hierarchy_top_id |
129206288 |
| dewey-sort |
3670 |
| id |
OLC2123855928 |
| language_de |
englisch |
| fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000naa a22002652 4500</leader><controlfield tag="001">OLC2123855928</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230505080447.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">230505s2016 xx ||||| 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1557/jmr.2016.145</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC2123855928</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-He213)jmr.2016.145-p</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">670</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">VA 5350</subfield><subfield code="q">VZ</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Guo, Fu</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2016</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© The Materials Research Society 2016</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract Thermomigration (TM) and electromigration (EM) are two persistent reliability issues and they generally appear concurrently in solder joints. Many previous studies have attempted to understand the fundamental principles behind these phenomena with the majority of which focusing their interest into the faster migration elements in solders like Bi, Ni, or Cu. However, Sn as the slower migration element has not received that much attention. In the present study, a special linearly symmetrical structure was used. An unusual TM phenomenon of Sn atoms in the Sn58Bi solder joint was observed. The unusual TM of Sn atoms along the vertical edges was attributed to the coupled effect of the EM in the horizontal direction and the TM in vertical direction. The relationships between the microstructural characteristics and the temperature distribution were established. The results also indicated that elevated temperature and sufficient thermal gradient were the two major factors that caused TM.</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Liu, Qian</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Ma, Limin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Zuo, Yong</subfield><subfield code="4">aut</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Journal of materials research</subfield><subfield code="d">Springer International Publishing, 1986</subfield><subfield code="g">31(2016), 12 vom: 01. Juni, Seite 1793-1800</subfield><subfield code="w">(DE-627)129206288</subfield><subfield code="w">(DE-600)54876-5</subfield><subfield code="w">(DE-576)01445744X</subfield><subfield code="x">0884-2914</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:31</subfield><subfield code="g">year:2016</subfield><subfield code="g">number:12</subfield><subfield code="g">day:01</subfield><subfield code="g">month:06</subfield><subfield code="g">pages:1793-1800</subfield></datafield><datafield tag="856" ind1="4" ind2="1"><subfield code="u">https://doi.org/10.1557/jmr.2016.145</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-TEC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_21</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_24</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2005</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2020</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4126</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4319</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4323</subfield></datafield><datafield tag="936" ind1="r" ind2="v"><subfield code="a">VA 5350</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">31</subfield><subfield code="j">2016</subfield><subfield code="e">12</subfield><subfield code="b">01</subfield><subfield code="c">06</subfield><subfield code="h">1793-1800</subfield></datafield></record></collection>
|
| author |
Guo, Fu |
| spellingShingle |
Guo, Fu ddc 670 rvk VA 5350 Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration |
| authorStr |
Guo, Fu |
| ppnlink_with_tag_str_mv |
@@773@@(DE-627)129206288 |
| format |
Article |
| dewey-ones |
670 - Manufacturing |
| delete_txt_mv |
keep |
| author_role |
aut aut aut aut |
| collection |
OLC |
| remote_str |
false |
| illustrated |
Not Illustrated |
| issn |
0884-2914 |
| topic_title |
670 VZ VA 5350 VZ rvk Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration |
| topic |
ddc 670 rvk VA 5350 |
| topic_unstemmed |
ddc 670 rvk VA 5350 |
| topic_browse |
ddc 670 rvk VA 5350 |
| format_facet |
Aufsätze Gedruckte Aufsätze |
| format_main_str_mv |
Text Zeitschrift/Artikel |
| carriertype_str_mv |
nc |
| hierarchy_parent_title |
Journal of materials research |
| hierarchy_parent_id |
129206288 |
| dewey-tens |
670 - Manufacturing |
| hierarchy_top_title |
Journal of materials research |
| isfreeaccess_txt |
false |
| familylinks_str_mv |
(DE-627)129206288 (DE-600)54876-5 (DE-576)01445744X |
| title |
Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration |
| ctrlnum |
(DE-627)OLC2123855928 (DE-He213)jmr.2016.145-p |
| title_full |
Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration |
| author_sort |
Guo, Fu |
| journal |
Journal of materials research |
| journalStr |
Journal of materials research |
| lang_code |
eng |
| isOA_bool |
false |
| dewey-hundreds |
600 - Technology |
| recordtype |
marc |
| publishDateSort |
2016 |
| contenttype_str_mv |
txt |
| container_start_page |
1793 |
| author_browse |
Guo, Fu Liu, Qian Ma, Limin Zuo, Yong |
| container_volume |
31 |
| class |
670 VZ VA 5350 VZ rvk |
| format_se |
Aufsätze |
| author-letter |
Guo, Fu |
| doi_str_mv |
10.1557/jmr.2016.145 |
| dewey-full |
670 |
| title_sort |
diffusion behavior of sn atoms in sn58bi solder joints under the coupling effect of thermomigration and electromigration |
| title_auth |
Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration |
| abstract |
Abstract Thermomigration (TM) and electromigration (EM) are two persistent reliability issues and they generally appear concurrently in solder joints. Many previous studies have attempted to understand the fundamental principles behind these phenomena with the majority of which focusing their interest into the faster migration elements in solders like Bi, Ni, or Cu. However, Sn as the slower migration element has not received that much attention. In the present study, a special linearly symmetrical structure was used. An unusual TM phenomenon of Sn atoms in the Sn58Bi solder joint was observed. The unusual TM of Sn atoms along the vertical edges was attributed to the coupled effect of the EM in the horizontal direction and the TM in vertical direction. The relationships between the microstructural characteristics and the temperature distribution were established. The results also indicated that elevated temperature and sufficient thermal gradient were the two major factors that caused TM. © The Materials Research Society 2016 |
| abstractGer |
Abstract Thermomigration (TM) and electromigration (EM) are two persistent reliability issues and they generally appear concurrently in solder joints. Many previous studies have attempted to understand the fundamental principles behind these phenomena with the majority of which focusing their interest into the faster migration elements in solders like Bi, Ni, or Cu. However, Sn as the slower migration element has not received that much attention. In the present study, a special linearly symmetrical structure was used. An unusual TM phenomenon of Sn atoms in the Sn58Bi solder joint was observed. The unusual TM of Sn atoms along the vertical edges was attributed to the coupled effect of the EM in the horizontal direction and the TM in vertical direction. The relationships between the microstructural characteristics and the temperature distribution were established. The results also indicated that elevated temperature and sufficient thermal gradient were the two major factors that caused TM. © The Materials Research Society 2016 |
| abstract_unstemmed |
Abstract Thermomigration (TM) and electromigration (EM) are two persistent reliability issues and they generally appear concurrently in solder joints. Many previous studies have attempted to understand the fundamental principles behind these phenomena with the majority of which focusing their interest into the faster migration elements in solders like Bi, Ni, or Cu. However, Sn as the slower migration element has not received that much attention. In the present study, a special linearly symmetrical structure was used. An unusual TM phenomenon of Sn atoms in the Sn58Bi solder joint was observed. The unusual TM of Sn atoms along the vertical edges was attributed to the coupled effect of the EM in the horizontal direction and the TM in vertical direction. The relationships between the microstructural characteristics and the temperature distribution were established. The results also indicated that elevated temperature and sufficient thermal gradient were the two major factors that caused TM. © The Materials Research Society 2016 |
| collection_details |
GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_21 GBV_ILN_24 GBV_ILN_70 GBV_ILN_2005 GBV_ILN_2020 GBV_ILN_4126 GBV_ILN_4319 GBV_ILN_4323 |
| container_issue |
12 |
| title_short |
Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration |
| url |
https://doi.org/10.1557/jmr.2016.145 |
| remote_bool |
false |
| author2 |
Liu, Qian Ma, Limin Zuo, Yong |
| author2Str |
Liu, Qian Ma, Limin Zuo, Yong |
| ppnlink |
129206288 |
| mediatype_str_mv |
n |
| isOA_txt |
false |
| hochschulschrift_bool |
false |
| doi_str |
10.1557/jmr.2016.145 |
| up_date |
2024-07-03T20:28:18.158Z |
| _version_ |
1803591088247668736 |
| fullrecord_marcxml |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000naa a22002652 4500</leader><controlfield tag="001">OLC2123855928</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230505080447.0</controlfield><controlfield tag="007">tu</controlfield><controlfield tag="008">230505s2016 xx ||||| 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1557/jmr.2016.145</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)OLC2123855928</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-He213)jmr.2016.145-p</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">670</subfield><subfield code="q">VZ</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">VA 5350</subfield><subfield code="q">VZ</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Guo, Fu</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Diffusion behavior of Sn atoms in Sn58Bi solder joints under the coupling effect of thermomigration and electromigration</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2016</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">ohne Hilfsmittel zu benutzen</subfield><subfield code="b">n</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Band</subfield><subfield code="b">nc</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© The Materials Research Society 2016</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract Thermomigration (TM) and electromigration (EM) are two persistent reliability issues and they generally appear concurrently in solder joints. Many previous studies have attempted to understand the fundamental principles behind these phenomena with the majority of which focusing their interest into the faster migration elements in solders like Bi, Ni, or Cu. However, Sn as the slower migration element has not received that much attention. In the present study, a special linearly symmetrical structure was used. An unusual TM phenomenon of Sn atoms in the Sn58Bi solder joint was observed. The unusual TM of Sn atoms along the vertical edges was attributed to the coupled effect of the EM in the horizontal direction and the TM in vertical direction. The relationships between the microstructural characteristics and the temperature distribution were established. The results also indicated that elevated temperature and sufficient thermal gradient were the two major factors that caused TM.</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Liu, Qian</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Ma, Limin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Zuo, Yong</subfield><subfield code="4">aut</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Journal of materials research</subfield><subfield code="d">Springer International Publishing, 1986</subfield><subfield code="g">31(2016), 12 vom: 01. Juni, Seite 1793-1800</subfield><subfield code="w">(DE-627)129206288</subfield><subfield code="w">(DE-600)54876-5</subfield><subfield code="w">(DE-576)01445744X</subfield><subfield code="x">0884-2914</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:31</subfield><subfield code="g">year:2016</subfield><subfield code="g">number:12</subfield><subfield code="g">day:01</subfield><subfield code="g">month:06</subfield><subfield code="g">pages:1793-1800</subfield></datafield><datafield tag="856" ind1="4" ind2="1"><subfield code="u">https://doi.org/10.1557/jmr.2016.145</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_OLC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SSG-OLC-TEC</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_21</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_24</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2005</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2020</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4126</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4319</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4323</subfield></datafield><datafield tag="936" ind1="r" ind2="v"><subfield code="a">VA 5350</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">31</subfield><subfield code="j">2016</subfield><subfield code="e">12</subfield><subfield code="b">01</subfield><subfield code="c">06</subfield><subfield code="h">1793-1800</subfield></datafield></record></collection>
|
| score |
7.39966 |