Development and characterization of eutectic Sn-Zn, Sn-Ag, Sn-Bi and Sn-Cu solder alloys
Abstract This paper reports the comparative study of the microstructure, melting point, hardness and electrical resistivity of as-cast eutectic Sn-8.8 wt.% Zn, Sn-3.5 wt.% Ag, Sn-43 wt.% Bi and Sn-0.7 wt.% Cu lead-free solder alloys. Sn-3.5 wt.% Ag eutectic solder alloy was found to have the lowest...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Raj, R. [verfasserIn] |
|---|
| Format: |
Artikel |
|---|---|
| Sprache: |
Englisch |
| Erschienen: |
2019 |
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| Anmerkung: |
© 2019, Carl Hanser Verlag, München |
|---|
| Übergeordnetes Werk: |
Enthalten in: Zeitschrift für Metallkunde - De Gruyter, 1919, 110(2019), 12 vom: 04. Dez., Seite 1150-1159 |
|---|---|
| Übergeordnetes Werk: |
volume:110 ; year:2019 ; number:12 ; day:04 ; month:12 ; pages:1150-1159 |
| Links: |
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| DOI / URN: |
10.3139/146.111851 |
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OLC214185606X |
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| 520 | |a Abstract This paper reports the comparative study of the microstructure, melting point, hardness and electrical resistivity of as-cast eutectic Sn-8.8 wt.% Zn, Sn-3.5 wt.% Ag, Sn-43 wt.% Bi and Sn-0.7 wt.% Cu lead-free solder alloys. Sn-3.5 wt.% Ag eutectic solder alloy was found to have the lowest electrical resistivity of 1.91 μΩ · cm whereas the highest electrical resistivity of 14.17 μΩ · cm was observed in the case of Sn-43 wt.% Bi eutectic solder alloy. The lowest melting point of 141.60°C was observed in the case of Sn-43 wt.% Bi eutectic alloy whereas the highest melting point of 243.28°C was observed in the case of Sn-3.5 wt.% Ag solder alloy. The results of the various solder alloys were compared with the properties of commercially available Sn-38.1 wt.% Pb eutectic solder alloy. | ||
| 700 | 1 | |a Shrivastava, P. |4 aut | |
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| 700 | 1 | |a Padhy, M. |4 aut | |
| 700 | 1 | |a Phani, A. S. D. |4 aut | |
| 700 | 1 | |a Ramana, T. V. V. |4 aut | |
| 700 | 1 | |a Abbas, M. M. |4 aut | |
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10.3139/146.111851 doi (DE-627)OLC214185606X (DE-B1597)146.111851-p DE-627 ger DE-627 rakwb eng 660 620 670 VZ 670 VZ Raj, R. verfasserin aut Development and characterization of eutectic Sn-Zn, Sn-Ag, Sn-Bi and Sn-Cu solder alloys 2019 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © 2019, Carl Hanser Verlag, München Abstract This paper reports the comparative study of the microstructure, melting point, hardness and electrical resistivity of as-cast eutectic Sn-8.8 wt.% Zn, Sn-3.5 wt.% Ag, Sn-43 wt.% Bi and Sn-0.7 wt.% Cu lead-free solder alloys. Sn-3.5 wt.% Ag eutectic solder alloy was found to have the lowest electrical resistivity of 1.91 μΩ · cm whereas the highest electrical resistivity of 14.17 μΩ · cm was observed in the case of Sn-43 wt.% Bi eutectic solder alloy. The lowest melting point of 141.60°C was observed in the case of Sn-43 wt.% Bi eutectic alloy whereas the highest melting point of 243.28°C was observed in the case of Sn-3.5 wt.% Ag solder alloy. The results of the various solder alloys were compared with the properties of commercially available Sn-38.1 wt.% Pb eutectic solder alloy. Shrivastava, P. aut Jindal, N. aut Alam, S. N. aut Naithani, N. aut Padhy, M. aut Phani, A. S. D. aut Ramana, T. V. V. aut Abbas, M. M. aut Enthalten in Zeitschrift für Metallkunde De Gruyter, 1919 110(2019), 12 vom: 04. Dez., Seite 1150-1159 (DE-627)12947424X (DE-600)203021-4 (DE-576)014852101 0044-3093 nnns volume:110 year:2019 number:12 day:04 month:12 pages:1150-1159 https://doi.org/10.3139/146.111851 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_32 GBV_ILN_40 GBV_ILN_2048 AR 110 2019 12 04 12 1150-1159 |
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10.3139/146.111851 doi (DE-627)OLC214185606X (DE-B1597)146.111851-p DE-627 ger DE-627 rakwb eng 660 620 670 VZ 670 VZ Raj, R. verfasserin aut Development and characterization of eutectic Sn-Zn, Sn-Ag, Sn-Bi and Sn-Cu solder alloys 2019 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © 2019, Carl Hanser Verlag, München Abstract This paper reports the comparative study of the microstructure, melting point, hardness and electrical resistivity of as-cast eutectic Sn-8.8 wt.% Zn, Sn-3.5 wt.% Ag, Sn-43 wt.% Bi and Sn-0.7 wt.% Cu lead-free solder alloys. Sn-3.5 wt.% Ag eutectic solder alloy was found to have the lowest electrical resistivity of 1.91 μΩ · cm whereas the highest electrical resistivity of 14.17 μΩ · cm was observed in the case of Sn-43 wt.% Bi eutectic solder alloy. The lowest melting point of 141.60°C was observed in the case of Sn-43 wt.% Bi eutectic alloy whereas the highest melting point of 243.28°C was observed in the case of Sn-3.5 wt.% Ag solder alloy. The results of the various solder alloys were compared with the properties of commercially available Sn-38.1 wt.% Pb eutectic solder alloy. Shrivastava, P. aut Jindal, N. aut Alam, S. N. aut Naithani, N. aut Padhy, M. aut Phani, A. S. D. aut Ramana, T. V. V. aut Abbas, M. M. aut Enthalten in Zeitschrift für Metallkunde De Gruyter, 1919 110(2019), 12 vom: 04. Dez., Seite 1150-1159 (DE-627)12947424X (DE-600)203021-4 (DE-576)014852101 0044-3093 nnns volume:110 year:2019 number:12 day:04 month:12 pages:1150-1159 https://doi.org/10.3139/146.111851 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_32 GBV_ILN_40 GBV_ILN_2048 AR 110 2019 12 04 12 1150-1159 |
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10.3139/146.111851 doi (DE-627)OLC214185606X (DE-B1597)146.111851-p DE-627 ger DE-627 rakwb eng 660 620 670 VZ 670 VZ Raj, R. verfasserin aut Development and characterization of eutectic Sn-Zn, Sn-Ag, Sn-Bi and Sn-Cu solder alloys 2019 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © 2019, Carl Hanser Verlag, München Abstract This paper reports the comparative study of the microstructure, melting point, hardness and electrical resistivity of as-cast eutectic Sn-8.8 wt.% Zn, Sn-3.5 wt.% Ag, Sn-43 wt.% Bi and Sn-0.7 wt.% Cu lead-free solder alloys. Sn-3.5 wt.% Ag eutectic solder alloy was found to have the lowest electrical resistivity of 1.91 μΩ · cm whereas the highest electrical resistivity of 14.17 μΩ · cm was observed in the case of Sn-43 wt.% Bi eutectic solder alloy. The lowest melting point of 141.60°C was observed in the case of Sn-43 wt.% Bi eutectic alloy whereas the highest melting point of 243.28°C was observed in the case of Sn-3.5 wt.% Ag solder alloy. The results of the various solder alloys were compared with the properties of commercially available Sn-38.1 wt.% Pb eutectic solder alloy. Shrivastava, P. aut Jindal, N. aut Alam, S. N. aut Naithani, N. aut Padhy, M. aut Phani, A. S. D. aut Ramana, T. V. V. aut Abbas, M. M. aut Enthalten in Zeitschrift für Metallkunde De Gruyter, 1919 110(2019), 12 vom: 04. Dez., Seite 1150-1159 (DE-627)12947424X (DE-600)203021-4 (DE-576)014852101 0044-3093 nnns volume:110 year:2019 number:12 day:04 month:12 pages:1150-1159 https://doi.org/10.3139/146.111851 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_32 GBV_ILN_40 GBV_ILN_2048 AR 110 2019 12 04 12 1150-1159 |
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10.3139/146.111851 doi (DE-627)OLC214185606X (DE-B1597)146.111851-p DE-627 ger DE-627 rakwb eng 660 620 670 VZ 670 VZ Raj, R. verfasserin aut Development and characterization of eutectic Sn-Zn, Sn-Ag, Sn-Bi and Sn-Cu solder alloys 2019 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © 2019, Carl Hanser Verlag, München Abstract This paper reports the comparative study of the microstructure, melting point, hardness and electrical resistivity of as-cast eutectic Sn-8.8 wt.% Zn, Sn-3.5 wt.% Ag, Sn-43 wt.% Bi and Sn-0.7 wt.% Cu lead-free solder alloys. Sn-3.5 wt.% Ag eutectic solder alloy was found to have the lowest electrical resistivity of 1.91 μΩ · cm whereas the highest electrical resistivity of 14.17 μΩ · cm was observed in the case of Sn-43 wt.% Bi eutectic solder alloy. The lowest melting point of 141.60°C was observed in the case of Sn-43 wt.% Bi eutectic alloy whereas the highest melting point of 243.28°C was observed in the case of Sn-3.5 wt.% Ag solder alloy. The results of the various solder alloys were compared with the properties of commercially available Sn-38.1 wt.% Pb eutectic solder alloy. Shrivastava, P. aut Jindal, N. aut Alam, S. N. aut Naithani, N. aut Padhy, M. aut Phani, A. S. D. aut Ramana, T. V. V. aut Abbas, M. M. aut Enthalten in Zeitschrift für Metallkunde De Gruyter, 1919 110(2019), 12 vom: 04. Dez., Seite 1150-1159 (DE-627)12947424X (DE-600)203021-4 (DE-576)014852101 0044-3093 nnns volume:110 year:2019 number:12 day:04 month:12 pages:1150-1159 https://doi.org/10.3139/146.111851 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_32 GBV_ILN_40 GBV_ILN_2048 AR 110 2019 12 04 12 1150-1159 |
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10.3139/146.111851 doi (DE-627)OLC214185606X (DE-B1597)146.111851-p DE-627 ger DE-627 rakwb eng 660 620 670 VZ 670 VZ Raj, R. verfasserin aut Development and characterization of eutectic Sn-Zn, Sn-Ag, Sn-Bi and Sn-Cu solder alloys 2019 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © 2019, Carl Hanser Verlag, München Abstract This paper reports the comparative study of the microstructure, melting point, hardness and electrical resistivity of as-cast eutectic Sn-8.8 wt.% Zn, Sn-3.5 wt.% Ag, Sn-43 wt.% Bi and Sn-0.7 wt.% Cu lead-free solder alloys. Sn-3.5 wt.% Ag eutectic solder alloy was found to have the lowest electrical resistivity of 1.91 μΩ · cm whereas the highest electrical resistivity of 14.17 μΩ · cm was observed in the case of Sn-43 wt.% Bi eutectic solder alloy. The lowest melting point of 141.60°C was observed in the case of Sn-43 wt.% Bi eutectic alloy whereas the highest melting point of 243.28°C was observed in the case of Sn-3.5 wt.% Ag solder alloy. The results of the various solder alloys were compared with the properties of commercially available Sn-38.1 wt.% Pb eutectic solder alloy. Shrivastava, P. aut Jindal, N. aut Alam, S. N. aut Naithani, N. aut Padhy, M. aut Phani, A. S. D. aut Ramana, T. V. V. aut Abbas, M. M. aut Enthalten in Zeitschrift für Metallkunde De Gruyter, 1919 110(2019), 12 vom: 04. Dez., Seite 1150-1159 (DE-627)12947424X (DE-600)203021-4 (DE-576)014852101 0044-3093 nnns volume:110 year:2019 number:12 day:04 month:12 pages:1150-1159 https://doi.org/10.3139/146.111851 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_32 GBV_ILN_40 GBV_ILN_2048 AR 110 2019 12 04 12 1150-1159 |
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development and characterization of eutectic sn-zn, sn-ag, sn-bi and sn-cu solder alloys |
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Development and characterization of eutectic Sn-Zn, Sn-Ag, Sn-Bi and Sn-Cu solder alloys |
| abstract |
Abstract This paper reports the comparative study of the microstructure, melting point, hardness and electrical resistivity of as-cast eutectic Sn-8.8 wt.% Zn, Sn-3.5 wt.% Ag, Sn-43 wt.% Bi and Sn-0.7 wt.% Cu lead-free solder alloys. Sn-3.5 wt.% Ag eutectic solder alloy was found to have the lowest electrical resistivity of 1.91 μΩ · cm whereas the highest electrical resistivity of 14.17 μΩ · cm was observed in the case of Sn-43 wt.% Bi eutectic solder alloy. The lowest melting point of 141.60°C was observed in the case of Sn-43 wt.% Bi eutectic alloy whereas the highest melting point of 243.28°C was observed in the case of Sn-3.5 wt.% Ag solder alloy. The results of the various solder alloys were compared with the properties of commercially available Sn-38.1 wt.% Pb eutectic solder alloy. © 2019, Carl Hanser Verlag, München |
| abstractGer |
Abstract This paper reports the comparative study of the microstructure, melting point, hardness and electrical resistivity of as-cast eutectic Sn-8.8 wt.% Zn, Sn-3.5 wt.% Ag, Sn-43 wt.% Bi and Sn-0.7 wt.% Cu lead-free solder alloys. Sn-3.5 wt.% Ag eutectic solder alloy was found to have the lowest electrical resistivity of 1.91 μΩ · cm whereas the highest electrical resistivity of 14.17 μΩ · cm was observed in the case of Sn-43 wt.% Bi eutectic solder alloy. The lowest melting point of 141.60°C was observed in the case of Sn-43 wt.% Bi eutectic alloy whereas the highest melting point of 243.28°C was observed in the case of Sn-3.5 wt.% Ag solder alloy. The results of the various solder alloys were compared with the properties of commercially available Sn-38.1 wt.% Pb eutectic solder alloy. © 2019, Carl Hanser Verlag, München |
| abstract_unstemmed |
Abstract This paper reports the comparative study of the microstructure, melting point, hardness and electrical resistivity of as-cast eutectic Sn-8.8 wt.% Zn, Sn-3.5 wt.% Ag, Sn-43 wt.% Bi and Sn-0.7 wt.% Cu lead-free solder alloys. Sn-3.5 wt.% Ag eutectic solder alloy was found to have the lowest electrical resistivity of 1.91 μΩ · cm whereas the highest electrical resistivity of 14.17 μΩ · cm was observed in the case of Sn-43 wt.% Bi eutectic solder alloy. The lowest melting point of 141.60°C was observed in the case of Sn-43 wt.% Bi eutectic alloy whereas the highest melting point of 243.28°C was observed in the case of Sn-3.5 wt.% Ag solder alloy. The results of the various solder alloys were compared with the properties of commercially available Sn-38.1 wt.% Pb eutectic solder alloy. © 2019, Carl Hanser Verlag, München |
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12 |
| title_short |
Development and characterization of eutectic Sn-Zn, Sn-Ag, Sn-Bi and Sn-Cu solder alloys |
| url |
https://doi.org/10.3139/146.111851 |
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| author2 |
Shrivastava, P. Jindal, N. Alam, S. N. Naithani, N. Padhy, M. Phani, A. S. D. Ramana, T. V. V. Abbas, M. M. |
| author2Str |
Shrivastava, P. Jindal, N. Alam, S. N. Naithani, N. Padhy, M. Phani, A. S. D. Ramana, T. V. V. Abbas, M. M. |
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| doi_str |
10.3139/146.111851 |
| up_date |
2024-07-04T03:03:24.031Z |
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1803615945668689920 |
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