In situ study of electrochemical migration of Sn3Ag0.5Cu solder reinforced by $ Cu_{6} $$ Sn_{5} $ nanoparticles
Abstract The increasing packaging density and power density have led to a drastic increase in the electric field strength between solder joints, and the accelerated movement of ions significantly rises the potential for failure of solder joints caused by electrochemical migration (ECM). To improve t...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Lv, Ziwen [verfasserIn] |
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| Format: |
Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2023 |
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| Anmerkung: |
© The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. |
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| Übergeordnetes Werk: |
Enthalten in: Journal of materials science / Materials in electronics - Springer US, 1990, 34(2023), 19 vom: Juli |
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| Übergeordnetes Werk: |
volume:34 ; year:2023 ; number:19 ; month:07 |
| Links: |
|---|
| DOI / URN: |
10.1007/s10854-023-10881-1 |
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| Katalog-ID: |
OLC2144294518 |
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| 520 | |a Abstract The increasing packaging density and power density have led to a drastic increase in the electric field strength between solder joints, and the accelerated movement of ions significantly rises the potential for failure of solder joints caused by electrochemical migration (ECM). To improve the anti-electrochemical migration ability of Sn3Ag0.5Cu solder (SAC305), we doped $ Cu_{6} $$ Sn_{5} $ nanoparticles (NPs) into SAC305 solder paste and studied its mechanism for inhibiting ECM. In this experiment, $ Cu_{6} $$ Sn_{5} $ NPs were prepared by ultrasound-assisted chemical reduction, and composite solder pastes were prepared by mechanically mixing $ Cu_{6} $$ Sn_{5} $ NPs with SAC305. In situ observation of the ECM between electrodes was carried out under different operating conditions. The addition of $ Cu_{6} $$ Sn_{5} $ NPs within 0.6 wt% could effectively inhibit the ECM by prolonging the incubation period. However, when the amount of $ Cu_{6} $$ Sn_{5} $ NPs exceeded 0.6 wt%, the catalytic effect of $ Cu_{6} $$ Sn_{5} $ NPs on the hydrogen evolution reaction would create vigorous convection within the droplet, which accelerated the failure by ECM. Apart from that, it was found that the addition of $ Cu_{6} $$ Sn_{5} $ NPs could increase the threshold for instantaneous failure of solder joints under high voltage. | ||
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| 700 | 1 | |a Wang, Jianqiang |4 aut | |
| 700 | 1 | |a Li, Fuquan |4 aut | |
| 700 | 1 | |a Chen, Hongtao |0 (orcid)0000-0003-0024-2539 |4 aut | |
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10.1007/s10854-023-10881-1 doi (DE-627)OLC2144294518 (DE-He213)s10854-023-10881-1-p DE-627 ger DE-627 rakwb eng 600 670 620 VZ Lv, Ziwen verfasserin aut In situ study of electrochemical migration of Sn3Ag0.5Cu solder reinforced by $ Cu_{6} $$ Sn_{5} $ nanoparticles 2023 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. Abstract The increasing packaging density and power density have led to a drastic increase in the electric field strength between solder joints, and the accelerated movement of ions significantly rises the potential for failure of solder joints caused by electrochemical migration (ECM). To improve the anti-electrochemical migration ability of Sn3Ag0.5Cu solder (SAC305), we doped $ Cu_{6} $$ Sn_{5} $ nanoparticles (NPs) into SAC305 solder paste and studied its mechanism for inhibiting ECM. In this experiment, $ Cu_{6} $$ Sn_{5} $ NPs were prepared by ultrasound-assisted chemical reduction, and composite solder pastes were prepared by mechanically mixing $ Cu_{6} $$ Sn_{5} $ NPs with SAC305. In situ observation of the ECM between electrodes was carried out under different operating conditions. The addition of $ Cu_{6} $$ Sn_{5} $ NPs within 0.6 wt% could effectively inhibit the ECM by prolonging the incubation period. However, when the amount of $ Cu_{6} $$ Sn_{5} $ NPs exceeded 0.6 wt%, the catalytic effect of $ Cu_{6} $$ Sn_{5} $ NPs on the hydrogen evolution reaction would create vigorous convection within the droplet, which accelerated the failure by ECM. Apart from that, it was found that the addition of $ Cu_{6} $$ Sn_{5} $ NPs could increase the threshold for instantaneous failure of solder joints under high voltage. Wang, Jintao aut Wang, Fengyi aut Zhang, Weiwei aut Wang, Jianqiang aut Li, Fuquan aut Chen, Hongtao (orcid)0000-0003-0024-2539 aut Enthalten in Journal of materials science / Materials in electronics Springer US, 1990 34(2023), 19 vom: Juli (DE-627)130863289 (DE-600)1030929-9 (DE-576)023106719 0957-4522 nnns volume:34 year:2023 number:19 month:07 https://doi.org/10.1007/s10854-023-10881-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_2004 GBV_ILN_2015 AR 34 2023 19 07 |
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10.1007/s10854-023-10881-1 doi (DE-627)OLC2144294518 (DE-He213)s10854-023-10881-1-p DE-627 ger DE-627 rakwb eng 600 670 620 VZ Lv, Ziwen verfasserin aut In situ study of electrochemical migration of Sn3Ag0.5Cu solder reinforced by $ Cu_{6} $$ Sn_{5} $ nanoparticles 2023 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. Abstract The increasing packaging density and power density have led to a drastic increase in the electric field strength between solder joints, and the accelerated movement of ions significantly rises the potential for failure of solder joints caused by electrochemical migration (ECM). To improve the anti-electrochemical migration ability of Sn3Ag0.5Cu solder (SAC305), we doped $ Cu_{6} $$ Sn_{5} $ nanoparticles (NPs) into SAC305 solder paste and studied its mechanism for inhibiting ECM. In this experiment, $ Cu_{6} $$ Sn_{5} $ NPs were prepared by ultrasound-assisted chemical reduction, and composite solder pastes were prepared by mechanically mixing $ Cu_{6} $$ Sn_{5} $ NPs with SAC305. In situ observation of the ECM between electrodes was carried out under different operating conditions. The addition of $ Cu_{6} $$ Sn_{5} $ NPs within 0.6 wt% could effectively inhibit the ECM by prolonging the incubation period. However, when the amount of $ Cu_{6} $$ Sn_{5} $ NPs exceeded 0.6 wt%, the catalytic effect of $ Cu_{6} $$ Sn_{5} $ NPs on the hydrogen evolution reaction would create vigorous convection within the droplet, which accelerated the failure by ECM. Apart from that, it was found that the addition of $ Cu_{6} $$ Sn_{5} $ NPs could increase the threshold for instantaneous failure of solder joints under high voltage. Wang, Jintao aut Wang, Fengyi aut Zhang, Weiwei aut Wang, Jianqiang aut Li, Fuquan aut Chen, Hongtao (orcid)0000-0003-0024-2539 aut Enthalten in Journal of materials science / Materials in electronics Springer US, 1990 34(2023), 19 vom: Juli (DE-627)130863289 (DE-600)1030929-9 (DE-576)023106719 0957-4522 nnns volume:34 year:2023 number:19 month:07 https://doi.org/10.1007/s10854-023-10881-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_2004 GBV_ILN_2015 AR 34 2023 19 07 |
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10.1007/s10854-023-10881-1 doi (DE-627)OLC2144294518 (DE-He213)s10854-023-10881-1-p DE-627 ger DE-627 rakwb eng 600 670 620 VZ Lv, Ziwen verfasserin aut In situ study of electrochemical migration of Sn3Ag0.5Cu solder reinforced by $ Cu_{6} $$ Sn_{5} $ nanoparticles 2023 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. Abstract The increasing packaging density and power density have led to a drastic increase in the electric field strength between solder joints, and the accelerated movement of ions significantly rises the potential for failure of solder joints caused by electrochemical migration (ECM). To improve the anti-electrochemical migration ability of Sn3Ag0.5Cu solder (SAC305), we doped $ Cu_{6} $$ Sn_{5} $ nanoparticles (NPs) into SAC305 solder paste and studied its mechanism for inhibiting ECM. In this experiment, $ Cu_{6} $$ Sn_{5} $ NPs were prepared by ultrasound-assisted chemical reduction, and composite solder pastes were prepared by mechanically mixing $ Cu_{6} $$ Sn_{5} $ NPs with SAC305. In situ observation of the ECM between electrodes was carried out under different operating conditions. The addition of $ Cu_{6} $$ Sn_{5} $ NPs within 0.6 wt% could effectively inhibit the ECM by prolonging the incubation period. However, when the amount of $ Cu_{6} $$ Sn_{5} $ NPs exceeded 0.6 wt%, the catalytic effect of $ Cu_{6} $$ Sn_{5} $ NPs on the hydrogen evolution reaction would create vigorous convection within the droplet, which accelerated the failure by ECM. Apart from that, it was found that the addition of $ Cu_{6} $$ Sn_{5} $ NPs could increase the threshold for instantaneous failure of solder joints under high voltage. Wang, Jintao aut Wang, Fengyi aut Zhang, Weiwei aut Wang, Jianqiang aut Li, Fuquan aut Chen, Hongtao (orcid)0000-0003-0024-2539 aut Enthalten in Journal of materials science / Materials in electronics Springer US, 1990 34(2023), 19 vom: Juli (DE-627)130863289 (DE-600)1030929-9 (DE-576)023106719 0957-4522 nnns volume:34 year:2023 number:19 month:07 https://doi.org/10.1007/s10854-023-10881-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_2004 GBV_ILN_2015 AR 34 2023 19 07 |
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10.1007/s10854-023-10881-1 doi (DE-627)OLC2144294518 (DE-He213)s10854-023-10881-1-p DE-627 ger DE-627 rakwb eng 600 670 620 VZ Lv, Ziwen verfasserin aut In situ study of electrochemical migration of Sn3Ag0.5Cu solder reinforced by $ Cu_{6} $$ Sn_{5} $ nanoparticles 2023 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. Abstract The increasing packaging density and power density have led to a drastic increase in the electric field strength between solder joints, and the accelerated movement of ions significantly rises the potential for failure of solder joints caused by electrochemical migration (ECM). To improve the anti-electrochemical migration ability of Sn3Ag0.5Cu solder (SAC305), we doped $ Cu_{6} $$ Sn_{5} $ nanoparticles (NPs) into SAC305 solder paste and studied its mechanism for inhibiting ECM. In this experiment, $ Cu_{6} $$ Sn_{5} $ NPs were prepared by ultrasound-assisted chemical reduction, and composite solder pastes were prepared by mechanically mixing $ Cu_{6} $$ Sn_{5} $ NPs with SAC305. In situ observation of the ECM between electrodes was carried out under different operating conditions. The addition of $ Cu_{6} $$ Sn_{5} $ NPs within 0.6 wt% could effectively inhibit the ECM by prolonging the incubation period. However, when the amount of $ Cu_{6} $$ Sn_{5} $ NPs exceeded 0.6 wt%, the catalytic effect of $ Cu_{6} $$ Sn_{5} $ NPs on the hydrogen evolution reaction would create vigorous convection within the droplet, which accelerated the failure by ECM. Apart from that, it was found that the addition of $ Cu_{6} $$ Sn_{5} $ NPs could increase the threshold for instantaneous failure of solder joints under high voltage. Wang, Jintao aut Wang, Fengyi aut Zhang, Weiwei aut Wang, Jianqiang aut Li, Fuquan aut Chen, Hongtao (orcid)0000-0003-0024-2539 aut Enthalten in Journal of materials science / Materials in electronics Springer US, 1990 34(2023), 19 vom: Juli (DE-627)130863289 (DE-600)1030929-9 (DE-576)023106719 0957-4522 nnns volume:34 year:2023 number:19 month:07 https://doi.org/10.1007/s10854-023-10881-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_2004 GBV_ILN_2015 AR 34 2023 19 07 |
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10.1007/s10854-023-10881-1 doi (DE-627)OLC2144294518 (DE-He213)s10854-023-10881-1-p DE-627 ger DE-627 rakwb eng 600 670 620 VZ Lv, Ziwen verfasserin aut In situ study of electrochemical migration of Sn3Ag0.5Cu solder reinforced by $ Cu_{6} $$ Sn_{5} $ nanoparticles 2023 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. Abstract The increasing packaging density and power density have led to a drastic increase in the electric field strength between solder joints, and the accelerated movement of ions significantly rises the potential for failure of solder joints caused by electrochemical migration (ECM). To improve the anti-electrochemical migration ability of Sn3Ag0.5Cu solder (SAC305), we doped $ Cu_{6} $$ Sn_{5} $ nanoparticles (NPs) into SAC305 solder paste and studied its mechanism for inhibiting ECM. In this experiment, $ Cu_{6} $$ Sn_{5} $ NPs were prepared by ultrasound-assisted chemical reduction, and composite solder pastes were prepared by mechanically mixing $ Cu_{6} $$ Sn_{5} $ NPs with SAC305. In situ observation of the ECM between electrodes was carried out under different operating conditions. The addition of $ Cu_{6} $$ Sn_{5} $ NPs within 0.6 wt% could effectively inhibit the ECM by prolonging the incubation period. However, when the amount of $ Cu_{6} $$ Sn_{5} $ NPs exceeded 0.6 wt%, the catalytic effect of $ Cu_{6} $$ Sn_{5} $ NPs on the hydrogen evolution reaction would create vigorous convection within the droplet, which accelerated the failure by ECM. Apart from that, it was found that the addition of $ Cu_{6} $$ Sn_{5} $ NPs could increase the threshold for instantaneous failure of solder joints under high voltage. Wang, Jintao aut Wang, Fengyi aut Zhang, Weiwei aut Wang, Jianqiang aut Li, Fuquan aut Chen, Hongtao (orcid)0000-0003-0024-2539 aut Enthalten in Journal of materials science / Materials in electronics Springer US, 1990 34(2023), 19 vom: Juli (DE-627)130863289 (DE-600)1030929-9 (DE-576)023106719 0957-4522 nnns volume:34 year:2023 number:19 month:07 https://doi.org/10.1007/s10854-023-10881-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC SSG-OLC-PHY GBV_ILN_2004 GBV_ILN_2015 AR 34 2023 19 07 |
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600 670 620 VZ In situ study of electrochemical migration of Sn3Ag0.5Cu solder reinforced by $ Cu_{6} $$ Sn_{5} $ nanoparticles |
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In situ study of electrochemical migration of Sn3Ag0.5Cu solder reinforced by $ Cu_{6} $$ Sn_{5} $ nanoparticles |
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In situ study of electrochemical migration of Sn3Ag0.5Cu solder reinforced by $ Cu_{6} $$ Sn_{5} $ nanoparticles |
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Lv, Ziwen |
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Journal of materials science / Materials in electronics |
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Lv, Ziwen Wang, Jintao Wang, Fengyi Zhang, Weiwei Wang, Jianqiang Li, Fuquan Chen, Hongtao |
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Lv, Ziwen |
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in situ study of electrochemical migration of sn3ag0.5cu solder reinforced by $ cu_{6} $$ sn_{5} $ nanoparticles |
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In situ study of electrochemical migration of Sn3Ag0.5Cu solder reinforced by $ Cu_{6} $$ Sn_{5} $ nanoparticles |
| abstract |
Abstract The increasing packaging density and power density have led to a drastic increase in the electric field strength between solder joints, and the accelerated movement of ions significantly rises the potential for failure of solder joints caused by electrochemical migration (ECM). To improve the anti-electrochemical migration ability of Sn3Ag0.5Cu solder (SAC305), we doped $ Cu_{6} $$ Sn_{5} $ nanoparticles (NPs) into SAC305 solder paste and studied its mechanism for inhibiting ECM. In this experiment, $ Cu_{6} $$ Sn_{5} $ NPs were prepared by ultrasound-assisted chemical reduction, and composite solder pastes were prepared by mechanically mixing $ Cu_{6} $$ Sn_{5} $ NPs with SAC305. In situ observation of the ECM between electrodes was carried out under different operating conditions. The addition of $ Cu_{6} $$ Sn_{5} $ NPs within 0.6 wt% could effectively inhibit the ECM by prolonging the incubation period. However, when the amount of $ Cu_{6} $$ Sn_{5} $ NPs exceeded 0.6 wt%, the catalytic effect of $ Cu_{6} $$ Sn_{5} $ NPs on the hydrogen evolution reaction would create vigorous convection within the droplet, which accelerated the failure by ECM. Apart from that, it was found that the addition of $ Cu_{6} $$ Sn_{5} $ NPs could increase the threshold for instantaneous failure of solder joints under high voltage. © The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. |
| abstractGer |
Abstract The increasing packaging density and power density have led to a drastic increase in the electric field strength between solder joints, and the accelerated movement of ions significantly rises the potential for failure of solder joints caused by electrochemical migration (ECM). To improve the anti-electrochemical migration ability of Sn3Ag0.5Cu solder (SAC305), we doped $ Cu_{6} $$ Sn_{5} $ nanoparticles (NPs) into SAC305 solder paste and studied its mechanism for inhibiting ECM. In this experiment, $ Cu_{6} $$ Sn_{5} $ NPs were prepared by ultrasound-assisted chemical reduction, and composite solder pastes were prepared by mechanically mixing $ Cu_{6} $$ Sn_{5} $ NPs with SAC305. In situ observation of the ECM between electrodes was carried out under different operating conditions. The addition of $ Cu_{6} $$ Sn_{5} $ NPs within 0.6 wt% could effectively inhibit the ECM by prolonging the incubation period. However, when the amount of $ Cu_{6} $$ Sn_{5} $ NPs exceeded 0.6 wt%, the catalytic effect of $ Cu_{6} $$ Sn_{5} $ NPs on the hydrogen evolution reaction would create vigorous convection within the droplet, which accelerated the failure by ECM. Apart from that, it was found that the addition of $ Cu_{6} $$ Sn_{5} $ NPs could increase the threshold for instantaneous failure of solder joints under high voltage. © The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. |
| abstract_unstemmed |
Abstract The increasing packaging density and power density have led to a drastic increase in the electric field strength between solder joints, and the accelerated movement of ions significantly rises the potential for failure of solder joints caused by electrochemical migration (ECM). To improve the anti-electrochemical migration ability of Sn3Ag0.5Cu solder (SAC305), we doped $ Cu_{6} $$ Sn_{5} $ nanoparticles (NPs) into SAC305 solder paste and studied its mechanism for inhibiting ECM. In this experiment, $ Cu_{6} $$ Sn_{5} $ NPs were prepared by ultrasound-assisted chemical reduction, and composite solder pastes were prepared by mechanically mixing $ Cu_{6} $$ Sn_{5} $ NPs with SAC305. In situ observation of the ECM between electrodes was carried out under different operating conditions. The addition of $ Cu_{6} $$ Sn_{5} $ NPs within 0.6 wt% could effectively inhibit the ECM by prolonging the incubation period. However, when the amount of $ Cu_{6} $$ Sn_{5} $ NPs exceeded 0.6 wt%, the catalytic effect of $ Cu_{6} $$ Sn_{5} $ NPs on the hydrogen evolution reaction would create vigorous convection within the droplet, which accelerated the failure by ECM. Apart from that, it was found that the addition of $ Cu_{6} $$ Sn_{5} $ NPs could increase the threshold for instantaneous failure of solder joints under high voltage. © The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. |
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In situ study of electrochemical migration of Sn3Ag0.5Cu solder reinforced by $ Cu_{6} $$ Sn_{5} $ nanoparticles |
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