Experimental investigations on weak magnetization-enhanced force-rheological polishing of SiC mold
Abstract To investigate the influence of weak magnetization-enhanced force-rheological polishing (WMEFRP) parameters on the surface quality of a small aspheric SiC mold, a magnetic shear thickening fluid (MSTF) containing shear thickening fluid (STF), $ Al_{2} $$ O_{3} $ particles, and carbonyl iron...
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| Autor*in: |
Zhou, Dongdong [verfasserIn] |
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Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2023 |
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© The Author(s), under exclusive licence to Springer-Verlag London Ltd., part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. |
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Enthalten in: The international journal of advanced manufacturing technology - Springer London, 1985, 127(2023), 7-8 vom: 14. Juni, Seite 3497-3512 |
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volume:127 ; year:2023 ; number:7-8 ; day:14 ; month:06 ; pages:3497-3512 |
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| DOI / URN: |
10.1007/s00170-023-11606-8 |
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OLC2144377065 |
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| 520 | |a Abstract To investigate the influence of weak magnetization-enhanced force-rheological polishing (WMEFRP) parameters on the surface quality of a small aspheric SiC mold, a magnetic shear thickening fluid (MSTF) containing shear thickening fluid (STF), $ Al_{2} $$ O_{3} $ particles, and carbonyl iron powder particles was developed. Furthermore, the polishing characteristics and stability of the method were analyzed through rheological tests and magnetic field simulation. Orthogonal experiments were carried out on a small aspheric SiC mold using a five-axis machining center. The influence of spindle speed, polishing clearance, abrasive particle size, and other factors on material removal rate (MRR), surface morphology, surface roughness (SR), and subsurface damage (SSD) depth was explored. The results showed that MRR and SSD depth increased with spindle speed, whereas SR first decreased and then increased. Polishing clearance had a significant negative correlation effect on MRR, SR, and SSD depth, whereas abrasive particle size had a weak positive correlation effect on them. The parameter optimization method based on the multi-objective matrix was used to evaluate the influence weight of MRR, SR, and SSD depth on the orthogonal test results. The optimal scheme was determined as follows: the spindle speed was 720 rpm, the polishing gap was 0.5 mm, and the particle size was 3 μm. The verification test was carried out by using the optimal scheme. The results showed that the SR and SSD depths were considerably reduced, and the surface/subsurface quality was considerably improved. This evaluation method could meet the technical requirements of high efficiency and high surface/subsurface quality for the polishing of a small-aperture aspheric SiC mold. | ||
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| 700 | 1 | |a Li, Xiyang |4 aut | |
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10.1007/s00170-023-11606-8 doi (DE-627)OLC2144377065 (DE-He213)s00170-023-11606-8-p DE-627 ger DE-627 rakwb eng 670 VZ Zhou, Dongdong verfasserin aut Experimental investigations on weak magnetization-enhanced force-rheological polishing of SiC mold 2023 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Author(s), under exclusive licence to Springer-Verlag London Ltd., part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. Abstract To investigate the influence of weak magnetization-enhanced force-rheological polishing (WMEFRP) parameters on the surface quality of a small aspheric SiC mold, a magnetic shear thickening fluid (MSTF) containing shear thickening fluid (STF), $ Al_{2} $$ O_{3} $ particles, and carbonyl iron powder particles was developed. Furthermore, the polishing characteristics and stability of the method were analyzed through rheological tests and magnetic field simulation. Orthogonal experiments were carried out on a small aspheric SiC mold using a five-axis machining center. The influence of spindle speed, polishing clearance, abrasive particle size, and other factors on material removal rate (MRR), surface morphology, surface roughness (SR), and subsurface damage (SSD) depth was explored. The results showed that MRR and SSD depth increased with spindle speed, whereas SR first decreased and then increased. Polishing clearance had a significant negative correlation effect on MRR, SR, and SSD depth, whereas abrasive particle size had a weak positive correlation effect on them. The parameter optimization method based on the multi-objective matrix was used to evaluate the influence weight of MRR, SR, and SSD depth on the orthogonal test results. The optimal scheme was determined as follows: the spindle speed was 720 rpm, the polishing gap was 0.5 mm, and the particle size was 3 μm. The verification test was carried out by using the optimal scheme. The results showed that the SR and SSD depths were considerably reduced, and the surface/subsurface quality was considerably improved. This evaluation method could meet the technical requirements of high efficiency and high surface/subsurface quality for the polishing of a small-aperture aspheric SiC mold. Aspheric SiC mold Weak magnetization-enhanced force-rheological polishing Surface quality Orthogonal test Multi-objective matrix method Huang, Xiangming aut Ming, Yang aut Li, Xiyang aut Enthalten in The international journal of advanced manufacturing technology Springer London, 1985 127(2023), 7-8 vom: 14. Juni, Seite 3497-3512 (DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 0268-3768 nnns volume:127 year:2023 number:7-8 day:14 month:06 pages:3497-3512 https://doi.org/10.1007/s00170-023-11606-8 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_2018 GBV_ILN_2333 AR 127 2023 7-8 14 06 3497-3512 |
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10.1007/s00170-023-11606-8 doi (DE-627)OLC2144377065 (DE-He213)s00170-023-11606-8-p DE-627 ger DE-627 rakwb eng 670 VZ Zhou, Dongdong verfasserin aut Experimental investigations on weak magnetization-enhanced force-rheological polishing of SiC mold 2023 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Author(s), under exclusive licence to Springer-Verlag London Ltd., part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. Abstract To investigate the influence of weak magnetization-enhanced force-rheological polishing (WMEFRP) parameters on the surface quality of a small aspheric SiC mold, a magnetic shear thickening fluid (MSTF) containing shear thickening fluid (STF), $ Al_{2} $$ O_{3} $ particles, and carbonyl iron powder particles was developed. Furthermore, the polishing characteristics and stability of the method were analyzed through rheological tests and magnetic field simulation. Orthogonal experiments were carried out on a small aspheric SiC mold using a five-axis machining center. The influence of spindle speed, polishing clearance, abrasive particle size, and other factors on material removal rate (MRR), surface morphology, surface roughness (SR), and subsurface damage (SSD) depth was explored. The results showed that MRR and SSD depth increased with spindle speed, whereas SR first decreased and then increased. Polishing clearance had a significant negative correlation effect on MRR, SR, and SSD depth, whereas abrasive particle size had a weak positive correlation effect on them. The parameter optimization method based on the multi-objective matrix was used to evaluate the influence weight of MRR, SR, and SSD depth on the orthogonal test results. The optimal scheme was determined as follows: the spindle speed was 720 rpm, the polishing gap was 0.5 mm, and the particle size was 3 μm. The verification test was carried out by using the optimal scheme. The results showed that the SR and SSD depths were considerably reduced, and the surface/subsurface quality was considerably improved. This evaluation method could meet the technical requirements of high efficiency and high surface/subsurface quality for the polishing of a small-aperture aspheric SiC mold. Aspheric SiC mold Weak magnetization-enhanced force-rheological polishing Surface quality Orthogonal test Multi-objective matrix method Huang, Xiangming aut Ming, Yang aut Li, Xiyang aut Enthalten in The international journal of advanced manufacturing technology Springer London, 1985 127(2023), 7-8 vom: 14. Juni, Seite 3497-3512 (DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 0268-3768 nnns volume:127 year:2023 number:7-8 day:14 month:06 pages:3497-3512 https://doi.org/10.1007/s00170-023-11606-8 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_2018 GBV_ILN_2333 AR 127 2023 7-8 14 06 3497-3512 |
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10.1007/s00170-023-11606-8 doi (DE-627)OLC2144377065 (DE-He213)s00170-023-11606-8-p DE-627 ger DE-627 rakwb eng 670 VZ Zhou, Dongdong verfasserin aut Experimental investigations on weak magnetization-enhanced force-rheological polishing of SiC mold 2023 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Author(s), under exclusive licence to Springer-Verlag London Ltd., part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. Abstract To investigate the influence of weak magnetization-enhanced force-rheological polishing (WMEFRP) parameters on the surface quality of a small aspheric SiC mold, a magnetic shear thickening fluid (MSTF) containing shear thickening fluid (STF), $ Al_{2} $$ O_{3} $ particles, and carbonyl iron powder particles was developed. Furthermore, the polishing characteristics and stability of the method were analyzed through rheological tests and magnetic field simulation. Orthogonal experiments were carried out on a small aspheric SiC mold using a five-axis machining center. The influence of spindle speed, polishing clearance, abrasive particle size, and other factors on material removal rate (MRR), surface morphology, surface roughness (SR), and subsurface damage (SSD) depth was explored. The results showed that MRR and SSD depth increased with spindle speed, whereas SR first decreased and then increased. Polishing clearance had a significant negative correlation effect on MRR, SR, and SSD depth, whereas abrasive particle size had a weak positive correlation effect on them. The parameter optimization method based on the multi-objective matrix was used to evaluate the influence weight of MRR, SR, and SSD depth on the orthogonal test results. The optimal scheme was determined as follows: the spindle speed was 720 rpm, the polishing gap was 0.5 mm, and the particle size was 3 μm. The verification test was carried out by using the optimal scheme. The results showed that the SR and SSD depths were considerably reduced, and the surface/subsurface quality was considerably improved. This evaluation method could meet the technical requirements of high efficiency and high surface/subsurface quality for the polishing of a small-aperture aspheric SiC mold. Aspheric SiC mold Weak magnetization-enhanced force-rheological polishing Surface quality Orthogonal test Multi-objective matrix method Huang, Xiangming aut Ming, Yang aut Li, Xiyang aut Enthalten in The international journal of advanced manufacturing technology Springer London, 1985 127(2023), 7-8 vom: 14. Juni, Seite 3497-3512 (DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 0268-3768 nnns volume:127 year:2023 number:7-8 day:14 month:06 pages:3497-3512 https://doi.org/10.1007/s00170-023-11606-8 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_2018 GBV_ILN_2333 AR 127 2023 7-8 14 06 3497-3512 |
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10.1007/s00170-023-11606-8 doi (DE-627)OLC2144377065 (DE-He213)s00170-023-11606-8-p DE-627 ger DE-627 rakwb eng 670 VZ Zhou, Dongdong verfasserin aut Experimental investigations on weak magnetization-enhanced force-rheological polishing of SiC mold 2023 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Author(s), under exclusive licence to Springer-Verlag London Ltd., part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. Abstract To investigate the influence of weak magnetization-enhanced force-rheological polishing (WMEFRP) parameters on the surface quality of a small aspheric SiC mold, a magnetic shear thickening fluid (MSTF) containing shear thickening fluid (STF), $ Al_{2} $$ O_{3} $ particles, and carbonyl iron powder particles was developed. Furthermore, the polishing characteristics and stability of the method were analyzed through rheological tests and magnetic field simulation. Orthogonal experiments were carried out on a small aspheric SiC mold using a five-axis machining center. The influence of spindle speed, polishing clearance, abrasive particle size, and other factors on material removal rate (MRR), surface morphology, surface roughness (SR), and subsurface damage (SSD) depth was explored. The results showed that MRR and SSD depth increased with spindle speed, whereas SR first decreased and then increased. Polishing clearance had a significant negative correlation effect on MRR, SR, and SSD depth, whereas abrasive particle size had a weak positive correlation effect on them. The parameter optimization method based on the multi-objective matrix was used to evaluate the influence weight of MRR, SR, and SSD depth on the orthogonal test results. The optimal scheme was determined as follows: the spindle speed was 720 rpm, the polishing gap was 0.5 mm, and the particle size was 3 μm. The verification test was carried out by using the optimal scheme. The results showed that the SR and SSD depths were considerably reduced, and the surface/subsurface quality was considerably improved. This evaluation method could meet the technical requirements of high efficiency and high surface/subsurface quality for the polishing of a small-aperture aspheric SiC mold. Aspheric SiC mold Weak magnetization-enhanced force-rheological polishing Surface quality Orthogonal test Multi-objective matrix method Huang, Xiangming aut Ming, Yang aut Li, Xiyang aut Enthalten in The international journal of advanced manufacturing technology Springer London, 1985 127(2023), 7-8 vom: 14. Juni, Seite 3497-3512 (DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 0268-3768 nnns volume:127 year:2023 number:7-8 day:14 month:06 pages:3497-3512 https://doi.org/10.1007/s00170-023-11606-8 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_2018 GBV_ILN_2333 AR 127 2023 7-8 14 06 3497-3512 |
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10.1007/s00170-023-11606-8 doi (DE-627)OLC2144377065 (DE-He213)s00170-023-11606-8-p DE-627 ger DE-627 rakwb eng 670 VZ Zhou, Dongdong verfasserin aut Experimental investigations on weak magnetization-enhanced force-rheological polishing of SiC mold 2023 Text txt rdacontent ohne Hilfsmittel zu benutzen n rdamedia Band nc rdacarrier © The Author(s), under exclusive licence to Springer-Verlag London Ltd., part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. Abstract To investigate the influence of weak magnetization-enhanced force-rheological polishing (WMEFRP) parameters on the surface quality of a small aspheric SiC mold, a magnetic shear thickening fluid (MSTF) containing shear thickening fluid (STF), $ Al_{2} $$ O_{3} $ particles, and carbonyl iron powder particles was developed. Furthermore, the polishing characteristics and stability of the method were analyzed through rheological tests and magnetic field simulation. Orthogonal experiments were carried out on a small aspheric SiC mold using a five-axis machining center. The influence of spindle speed, polishing clearance, abrasive particle size, and other factors on material removal rate (MRR), surface morphology, surface roughness (SR), and subsurface damage (SSD) depth was explored. The results showed that MRR and SSD depth increased with spindle speed, whereas SR first decreased and then increased. Polishing clearance had a significant negative correlation effect on MRR, SR, and SSD depth, whereas abrasive particle size had a weak positive correlation effect on them. The parameter optimization method based on the multi-objective matrix was used to evaluate the influence weight of MRR, SR, and SSD depth on the orthogonal test results. The optimal scheme was determined as follows: the spindle speed was 720 rpm, the polishing gap was 0.5 mm, and the particle size was 3 μm. The verification test was carried out by using the optimal scheme. The results showed that the SR and SSD depths were considerably reduced, and the surface/subsurface quality was considerably improved. This evaluation method could meet the technical requirements of high efficiency and high surface/subsurface quality for the polishing of a small-aperture aspheric SiC mold. Aspheric SiC mold Weak magnetization-enhanced force-rheological polishing Surface quality Orthogonal test Multi-objective matrix method Huang, Xiangming aut Ming, Yang aut Li, Xiyang aut Enthalten in The international journal of advanced manufacturing technology Springer London, 1985 127(2023), 7-8 vom: 14. Juni, Seite 3497-3512 (DE-627)129185299 (DE-600)52651-4 (DE-576)014456192 0268-3768 nnns volume:127 year:2023 number:7-8 day:14 month:06 pages:3497-3512 https://doi.org/10.1007/s00170-023-11606-8 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_OLC SSG-OLC-TEC GBV_ILN_2018 GBV_ILN_2333 AR 127 2023 7-8 14 06 3497-3512 |
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The influence of spindle speed, polishing clearance, abrasive particle size, and other factors on material removal rate (MRR), surface morphology, surface roughness (SR), and subsurface damage (SSD) depth was explored. The results showed that MRR and SSD depth increased with spindle speed, whereas SR first decreased and then increased. Polishing clearance had a significant negative correlation effect on MRR, SR, and SSD depth, whereas abrasive particle size had a weak positive correlation effect on them. The parameter optimization method based on the multi-objective matrix was used to evaluate the influence weight of MRR, SR, and SSD depth on the orthogonal test results. The optimal scheme was determined as follows: the spindle speed was 720 rpm, the polishing gap was 0.5 mm, and the particle size was 3 μm. The verification test was carried out by using the optimal scheme. 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Experimental investigations on weak magnetization-enhanced force-rheological polishing of SiC mold |
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Abstract To investigate the influence of weak magnetization-enhanced force-rheological polishing (WMEFRP) parameters on the surface quality of a small aspheric SiC mold, a magnetic shear thickening fluid (MSTF) containing shear thickening fluid (STF), $ Al_{2} $$ O_{3} $ particles, and carbonyl iron powder particles was developed. Furthermore, the polishing characteristics and stability of the method were analyzed through rheological tests and magnetic field simulation. Orthogonal experiments were carried out on a small aspheric SiC mold using a five-axis machining center. The influence of spindle speed, polishing clearance, abrasive particle size, and other factors on material removal rate (MRR), surface morphology, surface roughness (SR), and subsurface damage (SSD) depth was explored. The results showed that MRR and SSD depth increased with spindle speed, whereas SR first decreased and then increased. Polishing clearance had a significant negative correlation effect on MRR, SR, and SSD depth, whereas abrasive particle size had a weak positive correlation effect on them. The parameter optimization method based on the multi-objective matrix was used to evaluate the influence weight of MRR, SR, and SSD depth on the orthogonal test results. The optimal scheme was determined as follows: the spindle speed was 720 rpm, the polishing gap was 0.5 mm, and the particle size was 3 μm. The verification test was carried out by using the optimal scheme. The results showed that the SR and SSD depths were considerably reduced, and the surface/subsurface quality was considerably improved. This evaluation method could meet the technical requirements of high efficiency and high surface/subsurface quality for the polishing of a small-aperture aspheric SiC mold. © The Author(s), under exclusive licence to Springer-Verlag London Ltd., part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. |
| abstractGer |
Abstract To investigate the influence of weak magnetization-enhanced force-rheological polishing (WMEFRP) parameters on the surface quality of a small aspheric SiC mold, a magnetic shear thickening fluid (MSTF) containing shear thickening fluid (STF), $ Al_{2} $$ O_{3} $ particles, and carbonyl iron powder particles was developed. Furthermore, the polishing characteristics and stability of the method were analyzed through rheological tests and magnetic field simulation. Orthogonal experiments were carried out on a small aspheric SiC mold using a five-axis machining center. The influence of spindle speed, polishing clearance, abrasive particle size, and other factors on material removal rate (MRR), surface morphology, surface roughness (SR), and subsurface damage (SSD) depth was explored. The results showed that MRR and SSD depth increased with spindle speed, whereas SR first decreased and then increased. Polishing clearance had a significant negative correlation effect on MRR, SR, and SSD depth, whereas abrasive particle size had a weak positive correlation effect on them. The parameter optimization method based on the multi-objective matrix was used to evaluate the influence weight of MRR, SR, and SSD depth on the orthogonal test results. The optimal scheme was determined as follows: the spindle speed was 720 rpm, the polishing gap was 0.5 mm, and the particle size was 3 μm. The verification test was carried out by using the optimal scheme. The results showed that the SR and SSD depths were considerably reduced, and the surface/subsurface quality was considerably improved. This evaluation method could meet the technical requirements of high efficiency and high surface/subsurface quality for the polishing of a small-aperture aspheric SiC mold. © The Author(s), under exclusive licence to Springer-Verlag London Ltd., part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. |
| abstract_unstemmed |
Abstract To investigate the influence of weak magnetization-enhanced force-rheological polishing (WMEFRP) parameters on the surface quality of a small aspheric SiC mold, a magnetic shear thickening fluid (MSTF) containing shear thickening fluid (STF), $ Al_{2} $$ O_{3} $ particles, and carbonyl iron powder particles was developed. Furthermore, the polishing characteristics and stability of the method were analyzed through rheological tests and magnetic field simulation. Orthogonal experiments were carried out on a small aspheric SiC mold using a five-axis machining center. The influence of spindle speed, polishing clearance, abrasive particle size, and other factors on material removal rate (MRR), surface morphology, surface roughness (SR), and subsurface damage (SSD) depth was explored. The results showed that MRR and SSD depth increased with spindle speed, whereas SR first decreased and then increased. Polishing clearance had a significant negative correlation effect on MRR, SR, and SSD depth, whereas abrasive particle size had a weak positive correlation effect on them. The parameter optimization method based on the multi-objective matrix was used to evaluate the influence weight of MRR, SR, and SSD depth on the orthogonal test results. The optimal scheme was determined as follows: the spindle speed was 720 rpm, the polishing gap was 0.5 mm, and the particle size was 3 μm. The verification test was carried out by using the optimal scheme. The results showed that the SR and SSD depths were considerably reduced, and the surface/subsurface quality was considerably improved. This evaluation method could meet the technical requirements of high efficiency and high surface/subsurface quality for the polishing of a small-aperture aspheric SiC mold. © The Author(s), under exclusive licence to Springer-Verlag London Ltd., part of Springer Nature 2023. Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law. |
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