Simulation of mixed-model PCB assembly lines with group setup and bypass conveyors
Abstract Recent technological innovations, namely the development of new solder pastes with increased tack life and the introduction of bypass conveyors, facilitate the use of mixed-model lines in printed circuit board (PCB) assembly. This paper presents a simulation study comparing PCB assembly lin...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Yilmaz, I. O. [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2008 |
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| Schlagwörter: |
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| Anmerkung: |
© Springer-Verlag London Limited 2008 |
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| Übergeordnetes Werk: |
Enthalten in: The international journal of advanced manufacturing technology - London : Springer, 1985, 42(2008), 3-4 vom: 27. Juni, Seite 335-347 |
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| Übergeordnetes Werk: |
volume:42 ; year:2008 ; number:3-4 ; day:27 ; month:06 ; pages:335-347 |
| Links: |
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| DOI / URN: |
10.1007/s00170-008-1599-x |
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| Katalog-ID: |
SPR001562622 |
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| 520 | |a Abstract Recent technological innovations, namely the development of new solder pastes with increased tack life and the introduction of bypass conveyors, facilitate the use of mixed-model lines in printed circuit board (PCB) assembly. This paper presents a simulation study comparing PCB assembly lines operating in conventional batch and in mixed-model assembly mode. For the latter case, a novel group setup strategy is developed. In the first stage, component types and placement operations for each type of PCB are assigned to the machines in the assembly line with the objective of balancing the workload. In the second stage, PCB types with similar component requirements are clustered into setup families. In addition, the feeder-slot assignment for each setup family and the sequence of placement operations for each PCB type are determined. In the final stage, a cyclical mixed-model production schedule is established. The performance of the proposed solution approach is evaluated by means of a simulation study. Two alternative material flow systems are investigated: a serial conveyor which directly links one machine to the other and a flexible one that allows to bypass downstream machines in the line. | ||
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| 650 | 4 | |a Group setup |7 (dpeaa)DE-He213 | |
| 700 | 1 | |a Günther, H.-O. |4 aut | |
| 700 | 1 | |a Jain, S. |4 aut | |
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10.1007/s00170-008-1599-x doi (DE-627)SPR001562622 (SPR)s00170-008-1599-x-e DE-627 ger DE-627 rakwb eng Yilmaz, I. O. verfasserin aut Simulation of mixed-model PCB assembly lines with group setup and bypass conveyors 2008 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Springer-Verlag London Limited 2008 Abstract Recent technological innovations, namely the development of new solder pastes with increased tack life and the introduction of bypass conveyors, facilitate the use of mixed-model lines in printed circuit board (PCB) assembly. This paper presents a simulation study comparing PCB assembly lines operating in conventional batch and in mixed-model assembly mode. For the latter case, a novel group setup strategy is developed. In the first stage, component types and placement operations for each type of PCB are assigned to the machines in the assembly line with the objective of balancing the workload. In the second stage, PCB types with similar component requirements are clustered into setup families. In addition, the feeder-slot assignment for each setup family and the sequence of placement operations for each PCB type are determined. In the final stage, a cyclical mixed-model production schedule is established. The performance of the proposed solution approach is evaluated by means of a simulation study. Two alternative material flow systems are investigated: a serial conveyor which directly links one machine to the other and a flexible one that allows to bypass downstream machines in the line. Printed circuit board assembly (dpeaa)DE-He213 Simulation (dpeaa)DE-He213 Mixed-model assembly lines (dpeaa)DE-He213 Group setup (dpeaa)DE-He213 Günther, H.-O. aut Jain, S. aut Enthalten in The international journal of advanced manufacturing technology London : Springer, 1985 42(2008), 3-4 vom: 27. Juni, Seite 335-347 (DE-627)270127712 (DE-600)1476510-X 1433-3015 nnns volume:42 year:2008 number:3-4 day:27 month:06 pages:335-347 https://dx.doi.org/10.1007/s00170-008-1599-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 42 2008 3-4 27 06 335-347 |
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10.1007/s00170-008-1599-x doi (DE-627)SPR001562622 (SPR)s00170-008-1599-x-e DE-627 ger DE-627 rakwb eng Yilmaz, I. O. verfasserin aut Simulation of mixed-model PCB assembly lines with group setup and bypass conveyors 2008 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Springer-Verlag London Limited 2008 Abstract Recent technological innovations, namely the development of new solder pastes with increased tack life and the introduction of bypass conveyors, facilitate the use of mixed-model lines in printed circuit board (PCB) assembly. This paper presents a simulation study comparing PCB assembly lines operating in conventional batch and in mixed-model assembly mode. For the latter case, a novel group setup strategy is developed. In the first stage, component types and placement operations for each type of PCB are assigned to the machines in the assembly line with the objective of balancing the workload. In the second stage, PCB types with similar component requirements are clustered into setup families. In addition, the feeder-slot assignment for each setup family and the sequence of placement operations for each PCB type are determined. In the final stage, a cyclical mixed-model production schedule is established. The performance of the proposed solution approach is evaluated by means of a simulation study. Two alternative material flow systems are investigated: a serial conveyor which directly links one machine to the other and a flexible one that allows to bypass downstream machines in the line. Printed circuit board assembly (dpeaa)DE-He213 Simulation (dpeaa)DE-He213 Mixed-model assembly lines (dpeaa)DE-He213 Group setup (dpeaa)DE-He213 Günther, H.-O. aut Jain, S. aut Enthalten in The international journal of advanced manufacturing technology London : Springer, 1985 42(2008), 3-4 vom: 27. Juni, Seite 335-347 (DE-627)270127712 (DE-600)1476510-X 1433-3015 nnns volume:42 year:2008 number:3-4 day:27 month:06 pages:335-347 https://dx.doi.org/10.1007/s00170-008-1599-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 42 2008 3-4 27 06 335-347 |
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10.1007/s00170-008-1599-x doi (DE-627)SPR001562622 (SPR)s00170-008-1599-x-e DE-627 ger DE-627 rakwb eng Yilmaz, I. O. verfasserin aut Simulation of mixed-model PCB assembly lines with group setup and bypass conveyors 2008 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Springer-Verlag London Limited 2008 Abstract Recent technological innovations, namely the development of new solder pastes with increased tack life and the introduction of bypass conveyors, facilitate the use of mixed-model lines in printed circuit board (PCB) assembly. This paper presents a simulation study comparing PCB assembly lines operating in conventional batch and in mixed-model assembly mode. For the latter case, a novel group setup strategy is developed. In the first stage, component types and placement operations for each type of PCB are assigned to the machines in the assembly line with the objective of balancing the workload. In the second stage, PCB types with similar component requirements are clustered into setup families. In addition, the feeder-slot assignment for each setup family and the sequence of placement operations for each PCB type are determined. In the final stage, a cyclical mixed-model production schedule is established. The performance of the proposed solution approach is evaluated by means of a simulation study. Two alternative material flow systems are investigated: a serial conveyor which directly links one machine to the other and a flexible one that allows to bypass downstream machines in the line. Printed circuit board assembly (dpeaa)DE-He213 Simulation (dpeaa)DE-He213 Mixed-model assembly lines (dpeaa)DE-He213 Group setup (dpeaa)DE-He213 Günther, H.-O. aut Jain, S. aut Enthalten in The international journal of advanced manufacturing technology London : Springer, 1985 42(2008), 3-4 vom: 27. Juni, Seite 335-347 (DE-627)270127712 (DE-600)1476510-X 1433-3015 nnns volume:42 year:2008 number:3-4 day:27 month:06 pages:335-347 https://dx.doi.org/10.1007/s00170-008-1599-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 42 2008 3-4 27 06 335-347 |
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10.1007/s00170-008-1599-x doi (DE-627)SPR001562622 (SPR)s00170-008-1599-x-e DE-627 ger DE-627 rakwb eng Yilmaz, I. O. verfasserin aut Simulation of mixed-model PCB assembly lines with group setup and bypass conveyors 2008 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Springer-Verlag London Limited 2008 Abstract Recent technological innovations, namely the development of new solder pastes with increased tack life and the introduction of bypass conveyors, facilitate the use of mixed-model lines in printed circuit board (PCB) assembly. This paper presents a simulation study comparing PCB assembly lines operating in conventional batch and in mixed-model assembly mode. For the latter case, a novel group setup strategy is developed. In the first stage, component types and placement operations for each type of PCB are assigned to the machines in the assembly line with the objective of balancing the workload. In the second stage, PCB types with similar component requirements are clustered into setup families. In addition, the feeder-slot assignment for each setup family and the sequence of placement operations for each PCB type are determined. In the final stage, a cyclical mixed-model production schedule is established. The performance of the proposed solution approach is evaluated by means of a simulation study. Two alternative material flow systems are investigated: a serial conveyor which directly links one machine to the other and a flexible one that allows to bypass downstream machines in the line. Printed circuit board assembly (dpeaa)DE-He213 Simulation (dpeaa)DE-He213 Mixed-model assembly lines (dpeaa)DE-He213 Group setup (dpeaa)DE-He213 Günther, H.-O. aut Jain, S. aut Enthalten in The international journal of advanced manufacturing technology London : Springer, 1985 42(2008), 3-4 vom: 27. Juni, Seite 335-347 (DE-627)270127712 (DE-600)1476510-X 1433-3015 nnns volume:42 year:2008 number:3-4 day:27 month:06 pages:335-347 https://dx.doi.org/10.1007/s00170-008-1599-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 42 2008 3-4 27 06 335-347 |
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10.1007/s00170-008-1599-x doi (DE-627)SPR001562622 (SPR)s00170-008-1599-x-e DE-627 ger DE-627 rakwb eng Yilmaz, I. O. verfasserin aut Simulation of mixed-model PCB assembly lines with group setup and bypass conveyors 2008 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Springer-Verlag London Limited 2008 Abstract Recent technological innovations, namely the development of new solder pastes with increased tack life and the introduction of bypass conveyors, facilitate the use of mixed-model lines in printed circuit board (PCB) assembly. This paper presents a simulation study comparing PCB assembly lines operating in conventional batch and in mixed-model assembly mode. For the latter case, a novel group setup strategy is developed. In the first stage, component types and placement operations for each type of PCB are assigned to the machines in the assembly line with the objective of balancing the workload. In the second stage, PCB types with similar component requirements are clustered into setup families. In addition, the feeder-slot assignment for each setup family and the sequence of placement operations for each PCB type are determined. In the final stage, a cyclical mixed-model production schedule is established. The performance of the proposed solution approach is evaluated by means of a simulation study. Two alternative material flow systems are investigated: a serial conveyor which directly links one machine to the other and a flexible one that allows to bypass downstream machines in the line. Printed circuit board assembly (dpeaa)DE-He213 Simulation (dpeaa)DE-He213 Mixed-model assembly lines (dpeaa)DE-He213 Group setup (dpeaa)DE-He213 Günther, H.-O. aut Jain, S. aut Enthalten in The international journal of advanced manufacturing technology London : Springer, 1985 42(2008), 3-4 vom: 27. Juni, Seite 335-347 (DE-627)270127712 (DE-600)1476510-X 1433-3015 nnns volume:42 year:2008 number:3-4 day:27 month:06 pages:335-347 https://dx.doi.org/10.1007/s00170-008-1599-x lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 42 2008 3-4 27 06 335-347 |
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Yilmaz, I. O. |
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Yilmaz, I. O. misc Printed circuit board assembly misc Simulation misc Mixed-model assembly lines misc Group setup Simulation of mixed-model PCB assembly lines with group setup and bypass conveyors |
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Simulation of mixed-model PCB assembly lines with group setup and bypass conveyors Printed circuit board assembly (dpeaa)DE-He213 Simulation (dpeaa)DE-He213 Mixed-model assembly lines (dpeaa)DE-He213 Group setup (dpeaa)DE-He213 |
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Yilmaz, I. O. Günther, H.-O. Jain, S. |
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simulation of mixed-model pcb assembly lines with group setup and bypass conveyors |
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Simulation of mixed-model PCB assembly lines with group setup and bypass conveyors |
| abstract |
Abstract Recent technological innovations, namely the development of new solder pastes with increased tack life and the introduction of bypass conveyors, facilitate the use of mixed-model lines in printed circuit board (PCB) assembly. This paper presents a simulation study comparing PCB assembly lines operating in conventional batch and in mixed-model assembly mode. For the latter case, a novel group setup strategy is developed. In the first stage, component types and placement operations for each type of PCB are assigned to the machines in the assembly line with the objective of balancing the workload. In the second stage, PCB types with similar component requirements are clustered into setup families. In addition, the feeder-slot assignment for each setup family and the sequence of placement operations for each PCB type are determined. In the final stage, a cyclical mixed-model production schedule is established. The performance of the proposed solution approach is evaluated by means of a simulation study. Two alternative material flow systems are investigated: a serial conveyor which directly links one machine to the other and a flexible one that allows to bypass downstream machines in the line. © Springer-Verlag London Limited 2008 |
| abstractGer |
Abstract Recent technological innovations, namely the development of new solder pastes with increased tack life and the introduction of bypass conveyors, facilitate the use of mixed-model lines in printed circuit board (PCB) assembly. This paper presents a simulation study comparing PCB assembly lines operating in conventional batch and in mixed-model assembly mode. For the latter case, a novel group setup strategy is developed. In the first stage, component types and placement operations for each type of PCB are assigned to the machines in the assembly line with the objective of balancing the workload. In the second stage, PCB types with similar component requirements are clustered into setup families. In addition, the feeder-slot assignment for each setup family and the sequence of placement operations for each PCB type are determined. In the final stage, a cyclical mixed-model production schedule is established. The performance of the proposed solution approach is evaluated by means of a simulation study. Two alternative material flow systems are investigated: a serial conveyor which directly links one machine to the other and a flexible one that allows to bypass downstream machines in the line. © Springer-Verlag London Limited 2008 |
| abstract_unstemmed |
Abstract Recent technological innovations, namely the development of new solder pastes with increased tack life and the introduction of bypass conveyors, facilitate the use of mixed-model lines in printed circuit board (PCB) assembly. This paper presents a simulation study comparing PCB assembly lines operating in conventional batch and in mixed-model assembly mode. For the latter case, a novel group setup strategy is developed. In the first stage, component types and placement operations for each type of PCB are assigned to the machines in the assembly line with the objective of balancing the workload. In the second stage, PCB types with similar component requirements are clustered into setup families. In addition, the feeder-slot assignment for each setup family and the sequence of placement operations for each PCB type are determined. In the final stage, a cyclical mixed-model production schedule is established. The performance of the proposed solution approach is evaluated by means of a simulation study. Two alternative material flow systems are investigated: a serial conveyor which directly links one machine to the other and a flexible one that allows to bypass downstream machines in the line. © Springer-Verlag London Limited 2008 |
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Simulation of mixed-model PCB assembly lines with group setup and bypass conveyors |
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https://dx.doi.org/10.1007/s00170-008-1599-x |
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Günther, H.-O. Jain, S. |
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| doi_str |
10.1007/s00170-008-1599-x |
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2024-07-03T23:18:09.753Z |
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| score |
7.4007235 |