Densification behavior of copper powder during the coupled multi-physics fields-activated microforming
Abstract External electric field-activated sintering techniques have been widely investigated and applied for the forming of large-sized components. These techniques are, however, rarely utilized for the manufacture of miniature and microsized components. In this paper, a novel, coupled forming, and...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Huang, Kunlan [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2013 |
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| Schlagwörter: |
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| Anmerkung: |
© Springer-Verlag London 2013 |
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| Übergeordnetes Werk: |
Enthalten in: The international journal of advanced manufacturing technology - London : Springer, 1985, 69(2013), 9-12 vom: 14. Aug., Seite 2651-2657 |
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| Übergeordnetes Werk: |
volume:69 ; year:2013 ; number:9-12 ; day:14 ; month:08 ; pages:2651-2657 |
| Links: |
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| DOI / URN: |
10.1007/s00170-013-5226-0 |
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| Katalog-ID: |
SPR001781758 |
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| 245 | 1 | 0 | |a Densification behavior of copper powder during the coupled multi-physics fields-activated microforming |
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| 520 | |a Abstract External electric field-activated sintering techniques have been widely investigated and applied for the forming of large-sized components. These techniques are, however, rarely utilized for the manufacture of miniature and microsized components. In this paper, a novel, coupled forming, and sintering method is reported, which has been used for the fabrication of microcomponents, wherein the loose powder is loaded directly into the die, followed by simultaneous electrical forming and electric sintering (named coupled multi-physics-fields activation). In the study, the gears with the module of 0.2 and the pitch diameter of 1.6 mm were formed from copper powder. The coupled multi-fields activations were enabled using a Gleeble-1500D thermal simulation machine. Sintered samples with a relative density of 97.20 % have been fabricated at a sintering temperature of 700 °C, heating rate of 50 °C/s, forming pressure of 100 MPa, while these parameters were applied cyclically. The study showed that the axial reduction of the samples increased rapidly with the increase of temperature during the sintering, while the external pressure was maintained. Based on the experimental observations, it can be concluded that the deformation of the particles resulted in an increase in, and then subsequent disappearance of, the interface areas among the particles, which feature plays a key role in the densification of the copper powder. | ||
| 650 | 4 | |a Microforming |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a Coupled multi-physics fields |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a Copper powder |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a Micro-gear |7 (dpeaa)DE-He213 | |
| 700 | 1 | |a Yang, Yi |4 aut | |
| 700 | 1 | |a Qin, Yi |4 aut | |
| 700 | 1 | |a Yang, Gang |4 aut | |
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10.1007/s00170-013-5226-0 doi (DE-627)SPR001781758 (SPR)s00170-013-5226-0-e DE-627 ger DE-627 rakwb eng Huang, Kunlan verfasserin aut Densification behavior of copper powder during the coupled multi-physics fields-activated microforming 2013 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Springer-Verlag London 2013 Abstract External electric field-activated sintering techniques have been widely investigated and applied for the forming of large-sized components. These techniques are, however, rarely utilized for the manufacture of miniature and microsized components. In this paper, a novel, coupled forming, and sintering method is reported, which has been used for the fabrication of microcomponents, wherein the loose powder is loaded directly into the die, followed by simultaneous electrical forming and electric sintering (named coupled multi-physics-fields activation). In the study, the gears with the module of 0.2 and the pitch diameter of 1.6 mm were formed from copper powder. The coupled multi-fields activations were enabled using a Gleeble-1500D thermal simulation machine. Sintered samples with a relative density of 97.20 % have been fabricated at a sintering temperature of 700 °C, heating rate of 50 °C/s, forming pressure of 100 MPa, while these parameters were applied cyclically. The study showed that the axial reduction of the samples increased rapidly with the increase of temperature during the sintering, while the external pressure was maintained. Based on the experimental observations, it can be concluded that the deformation of the particles resulted in an increase in, and then subsequent disappearance of, the interface areas among the particles, which feature plays a key role in the densification of the copper powder. Microforming (dpeaa)DE-He213 Coupled multi-physics fields (dpeaa)DE-He213 Copper powder (dpeaa)DE-He213 Micro-gear (dpeaa)DE-He213 Yang, Yi aut Qin, Yi aut Yang, Gang aut Enthalten in The international journal of advanced manufacturing technology London : Springer, 1985 69(2013), 9-12 vom: 14. Aug., Seite 2651-2657 (DE-627)270127712 (DE-600)1476510-X 1433-3015 nnns volume:69 year:2013 number:9-12 day:14 month:08 pages:2651-2657 https://dx.doi.org/10.1007/s00170-013-5226-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 69 2013 9-12 14 08 2651-2657 |
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10.1007/s00170-013-5226-0 doi (DE-627)SPR001781758 (SPR)s00170-013-5226-0-e DE-627 ger DE-627 rakwb eng Huang, Kunlan verfasserin aut Densification behavior of copper powder during the coupled multi-physics fields-activated microforming 2013 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Springer-Verlag London 2013 Abstract External electric field-activated sintering techniques have been widely investigated and applied for the forming of large-sized components. These techniques are, however, rarely utilized for the manufacture of miniature and microsized components. In this paper, a novel, coupled forming, and sintering method is reported, which has been used for the fabrication of microcomponents, wherein the loose powder is loaded directly into the die, followed by simultaneous electrical forming and electric sintering (named coupled multi-physics-fields activation). In the study, the gears with the module of 0.2 and the pitch diameter of 1.6 mm were formed from copper powder. The coupled multi-fields activations were enabled using a Gleeble-1500D thermal simulation machine. Sintered samples with a relative density of 97.20 % have been fabricated at a sintering temperature of 700 °C, heating rate of 50 °C/s, forming pressure of 100 MPa, while these parameters were applied cyclically. The study showed that the axial reduction of the samples increased rapidly with the increase of temperature during the sintering, while the external pressure was maintained. Based on the experimental observations, it can be concluded that the deformation of the particles resulted in an increase in, and then subsequent disappearance of, the interface areas among the particles, which feature plays a key role in the densification of the copper powder. Microforming (dpeaa)DE-He213 Coupled multi-physics fields (dpeaa)DE-He213 Copper powder (dpeaa)DE-He213 Micro-gear (dpeaa)DE-He213 Yang, Yi aut Qin, Yi aut Yang, Gang aut Enthalten in The international journal of advanced manufacturing technology London : Springer, 1985 69(2013), 9-12 vom: 14. Aug., Seite 2651-2657 (DE-627)270127712 (DE-600)1476510-X 1433-3015 nnns volume:69 year:2013 number:9-12 day:14 month:08 pages:2651-2657 https://dx.doi.org/10.1007/s00170-013-5226-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 69 2013 9-12 14 08 2651-2657 |
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10.1007/s00170-013-5226-0 doi (DE-627)SPR001781758 (SPR)s00170-013-5226-0-e DE-627 ger DE-627 rakwb eng Huang, Kunlan verfasserin aut Densification behavior of copper powder during the coupled multi-physics fields-activated microforming 2013 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Springer-Verlag London 2013 Abstract External electric field-activated sintering techniques have been widely investigated and applied for the forming of large-sized components. These techniques are, however, rarely utilized for the manufacture of miniature and microsized components. In this paper, a novel, coupled forming, and sintering method is reported, which has been used for the fabrication of microcomponents, wherein the loose powder is loaded directly into the die, followed by simultaneous electrical forming and electric sintering (named coupled multi-physics-fields activation). In the study, the gears with the module of 0.2 and the pitch diameter of 1.6 mm were formed from copper powder. The coupled multi-fields activations were enabled using a Gleeble-1500D thermal simulation machine. Sintered samples with a relative density of 97.20 % have been fabricated at a sintering temperature of 700 °C, heating rate of 50 °C/s, forming pressure of 100 MPa, while these parameters were applied cyclically. The study showed that the axial reduction of the samples increased rapidly with the increase of temperature during the sintering, while the external pressure was maintained. Based on the experimental observations, it can be concluded that the deformation of the particles resulted in an increase in, and then subsequent disappearance of, the interface areas among the particles, which feature plays a key role in the densification of the copper powder. Microforming (dpeaa)DE-He213 Coupled multi-physics fields (dpeaa)DE-He213 Copper powder (dpeaa)DE-He213 Micro-gear (dpeaa)DE-He213 Yang, Yi aut Qin, Yi aut Yang, Gang aut Enthalten in The international journal of advanced manufacturing technology London : Springer, 1985 69(2013), 9-12 vom: 14. Aug., Seite 2651-2657 (DE-627)270127712 (DE-600)1476510-X 1433-3015 nnns volume:69 year:2013 number:9-12 day:14 month:08 pages:2651-2657 https://dx.doi.org/10.1007/s00170-013-5226-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 69 2013 9-12 14 08 2651-2657 |
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10.1007/s00170-013-5226-0 doi (DE-627)SPR001781758 (SPR)s00170-013-5226-0-e DE-627 ger DE-627 rakwb eng Huang, Kunlan verfasserin aut Densification behavior of copper powder during the coupled multi-physics fields-activated microforming 2013 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Springer-Verlag London 2013 Abstract External electric field-activated sintering techniques have been widely investigated and applied for the forming of large-sized components. These techniques are, however, rarely utilized for the manufacture of miniature and microsized components. In this paper, a novel, coupled forming, and sintering method is reported, which has been used for the fabrication of microcomponents, wherein the loose powder is loaded directly into the die, followed by simultaneous electrical forming and electric sintering (named coupled multi-physics-fields activation). In the study, the gears with the module of 0.2 and the pitch diameter of 1.6 mm were formed from copper powder. The coupled multi-fields activations were enabled using a Gleeble-1500D thermal simulation machine. Sintered samples with a relative density of 97.20 % have been fabricated at a sintering temperature of 700 °C, heating rate of 50 °C/s, forming pressure of 100 MPa, while these parameters were applied cyclically. The study showed that the axial reduction of the samples increased rapidly with the increase of temperature during the sintering, while the external pressure was maintained. Based on the experimental observations, it can be concluded that the deformation of the particles resulted in an increase in, and then subsequent disappearance of, the interface areas among the particles, which feature plays a key role in the densification of the copper powder. Microforming (dpeaa)DE-He213 Coupled multi-physics fields (dpeaa)DE-He213 Copper powder (dpeaa)DE-He213 Micro-gear (dpeaa)DE-He213 Yang, Yi aut Qin, Yi aut Yang, Gang aut Enthalten in The international journal of advanced manufacturing technology London : Springer, 1985 69(2013), 9-12 vom: 14. Aug., Seite 2651-2657 (DE-627)270127712 (DE-600)1476510-X 1433-3015 nnns volume:69 year:2013 number:9-12 day:14 month:08 pages:2651-2657 https://dx.doi.org/10.1007/s00170-013-5226-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 69 2013 9-12 14 08 2651-2657 |
| allfieldsSound |
10.1007/s00170-013-5226-0 doi (DE-627)SPR001781758 (SPR)s00170-013-5226-0-e DE-627 ger DE-627 rakwb eng Huang, Kunlan verfasserin aut Densification behavior of copper powder during the coupled multi-physics fields-activated microforming 2013 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Springer-Verlag London 2013 Abstract External electric field-activated sintering techniques have been widely investigated and applied for the forming of large-sized components. These techniques are, however, rarely utilized for the manufacture of miniature and microsized components. In this paper, a novel, coupled forming, and sintering method is reported, which has been used for the fabrication of microcomponents, wherein the loose powder is loaded directly into the die, followed by simultaneous electrical forming and electric sintering (named coupled multi-physics-fields activation). In the study, the gears with the module of 0.2 and the pitch diameter of 1.6 mm were formed from copper powder. The coupled multi-fields activations were enabled using a Gleeble-1500D thermal simulation machine. Sintered samples with a relative density of 97.20 % have been fabricated at a sintering temperature of 700 °C, heating rate of 50 °C/s, forming pressure of 100 MPa, while these parameters were applied cyclically. The study showed that the axial reduction of the samples increased rapidly with the increase of temperature during the sintering, while the external pressure was maintained. Based on the experimental observations, it can be concluded that the deformation of the particles resulted in an increase in, and then subsequent disappearance of, the interface areas among the particles, which feature plays a key role in the densification of the copper powder. Microforming (dpeaa)DE-He213 Coupled multi-physics fields (dpeaa)DE-He213 Copper powder (dpeaa)DE-He213 Micro-gear (dpeaa)DE-He213 Yang, Yi aut Qin, Yi aut Yang, Gang aut Enthalten in The international journal of advanced manufacturing technology London : Springer, 1985 69(2013), 9-12 vom: 14. Aug., Seite 2651-2657 (DE-627)270127712 (DE-600)1476510-X 1433-3015 nnns volume:69 year:2013 number:9-12 day:14 month:08 pages:2651-2657 https://dx.doi.org/10.1007/s00170-013-5226-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 69 2013 9-12 14 08 2651-2657 |
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Huang, Kunlan @@aut@@ Yang, Yi @@aut@@ Qin, Yi @@aut@@ Yang, Gang @@aut@@ |
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These techniques are, however, rarely utilized for the manufacture of miniature and microsized components. In this paper, a novel, coupled forming, and sintering method is reported, which has been used for the fabrication of microcomponents, wherein the loose powder is loaded directly into the die, followed by simultaneous electrical forming and electric sintering (named coupled multi-physics-fields activation). In the study, the gears with the module of 0.2 and the pitch diameter of 1.6 mm were formed from copper powder. The coupled multi-fields activations were enabled using a Gleeble-1500D thermal simulation machine. Sintered samples with a relative density of 97.20 % have been fabricated at a sintering temperature of 700 °C, heating rate of 50 °C/s, forming pressure of 100 MPa, while these parameters were applied cyclically. The study showed that the axial reduction of the samples increased rapidly with the increase of temperature during the sintering, while the external pressure was maintained. 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Huang, Kunlan |
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Huang, Kunlan misc Microforming misc Coupled multi-physics fields misc Copper powder misc Micro-gear Densification behavior of copper powder during the coupled multi-physics fields-activated microforming |
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Densification behavior of copper powder during the coupled multi-physics fields-activated microforming Microforming (dpeaa)DE-He213 Coupled multi-physics fields (dpeaa)DE-He213 Copper powder (dpeaa)DE-He213 Micro-gear (dpeaa)DE-He213 |
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densification behavior of copper powder during the coupled multi-physics fields-activated microforming |
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Densification behavior of copper powder during the coupled multi-physics fields-activated microforming |
| abstract |
Abstract External electric field-activated sintering techniques have been widely investigated and applied for the forming of large-sized components. These techniques are, however, rarely utilized for the manufacture of miniature and microsized components. In this paper, a novel, coupled forming, and sintering method is reported, which has been used for the fabrication of microcomponents, wherein the loose powder is loaded directly into the die, followed by simultaneous electrical forming and electric sintering (named coupled multi-physics-fields activation). In the study, the gears with the module of 0.2 and the pitch diameter of 1.6 mm were formed from copper powder. The coupled multi-fields activations were enabled using a Gleeble-1500D thermal simulation machine. Sintered samples with a relative density of 97.20 % have been fabricated at a sintering temperature of 700 °C, heating rate of 50 °C/s, forming pressure of 100 MPa, while these parameters were applied cyclically. The study showed that the axial reduction of the samples increased rapidly with the increase of temperature during the sintering, while the external pressure was maintained. Based on the experimental observations, it can be concluded that the deformation of the particles resulted in an increase in, and then subsequent disappearance of, the interface areas among the particles, which feature plays a key role in the densification of the copper powder. © Springer-Verlag London 2013 |
| abstractGer |
Abstract External electric field-activated sintering techniques have been widely investigated and applied for the forming of large-sized components. These techniques are, however, rarely utilized for the manufacture of miniature and microsized components. In this paper, a novel, coupled forming, and sintering method is reported, which has been used for the fabrication of microcomponents, wherein the loose powder is loaded directly into the die, followed by simultaneous electrical forming and electric sintering (named coupled multi-physics-fields activation). In the study, the gears with the module of 0.2 and the pitch diameter of 1.6 mm were formed from copper powder. The coupled multi-fields activations were enabled using a Gleeble-1500D thermal simulation machine. Sintered samples with a relative density of 97.20 % have been fabricated at a sintering temperature of 700 °C, heating rate of 50 °C/s, forming pressure of 100 MPa, while these parameters were applied cyclically. The study showed that the axial reduction of the samples increased rapidly with the increase of temperature during the sintering, while the external pressure was maintained. Based on the experimental observations, it can be concluded that the deformation of the particles resulted in an increase in, and then subsequent disappearance of, the interface areas among the particles, which feature plays a key role in the densification of the copper powder. © Springer-Verlag London 2013 |
| abstract_unstemmed |
Abstract External electric field-activated sintering techniques have been widely investigated and applied for the forming of large-sized components. These techniques are, however, rarely utilized for the manufacture of miniature and microsized components. In this paper, a novel, coupled forming, and sintering method is reported, which has been used for the fabrication of microcomponents, wherein the loose powder is loaded directly into the die, followed by simultaneous electrical forming and electric sintering (named coupled multi-physics-fields activation). In the study, the gears with the module of 0.2 and the pitch diameter of 1.6 mm were formed from copper powder. The coupled multi-fields activations were enabled using a Gleeble-1500D thermal simulation machine. Sintered samples with a relative density of 97.20 % have been fabricated at a sintering temperature of 700 °C, heating rate of 50 °C/s, forming pressure of 100 MPa, while these parameters were applied cyclically. The study showed that the axial reduction of the samples increased rapidly with the increase of temperature during the sintering, while the external pressure was maintained. Based on the experimental observations, it can be concluded that the deformation of the particles resulted in an increase in, and then subsequent disappearance of, the interface areas among the particles, which feature plays a key role in the densification of the copper powder. © Springer-Verlag London 2013 |
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Densification behavior of copper powder during the coupled multi-physics fields-activated microforming |
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https://dx.doi.org/10.1007/s00170-013-5226-0 |
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Yang, Yi Qin, Yi Yang, Gang |
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10.1007/s00170-013-5226-0 |
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| score |
7.401636 |