Investigated new embedded shapes of electromagnetic bandgap structures and via effect for improved microstrip patch antenna performance
Abstract Three novel shapes of mushroom-like electromagnetic bandgap (EBG) structures are presented in this paper. The three shapes are based on a rectangular metal strip with different combinations. The performances of the three-shape structures are studied by using both an incident plane wave meth...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Elsheakh, D. N. [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2011 |
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| Schlagwörter: |
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| Anmerkung: |
© Springer-Verlag 2011 |
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| Übergeordnetes Werk: |
Enthalten in: Applied physics - Berlin : Springer, 1973, 103(2011), 3 vom: 21. Apr., Seite 541-545 |
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| Übergeordnetes Werk: |
volume:103 ; year:2011 ; number:3 ; day:21 ; month:04 ; pages:541-545 |
| Links: |
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| DOI / URN: |
10.1007/s00339-011-6395-z |
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| Katalog-ID: |
SPR004119363 |
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| 041 | |a eng | ||
| 100 | 1 | |a Elsheakh, D. N. |e verfasserin |4 aut | |
| 245 | 1 | 0 | |a Investigated new embedded shapes of electromagnetic bandgap structures and via effect for improved microstrip patch antenna performance |
| 264 | 1 | |c 2011 | |
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| 520 | |a Abstract Three novel shapes of mushroom-like electromagnetic bandgap (EBG) structures are presented in this paper. The three shapes are based on a rectangular metal strip with different combinations. The performances of the three-shape structures are studied by using both an incident plane wave method and transmission coefficient approach. The effect of height and via location is also studied to achieve multi or wide bandgap. These shapes are embedded in microstrip patch antenna substrates. The performance of the MPA is improved as increasing the antenna gain by 5 dBi, decreasing the surface current so improving the antenna radiation pattern as well as reducing the antenna size by more than 70% compared to the original size. The new shapes of EBG structures are integrated with MPA as a ground plane, where the conducting ground plane is replaced by a high impedance surface EBG layer. Parametric studies are conducted to maximize their impedance bandwidth and gain. It is found that the antenna bandwidth increased by approximately four times than the original band and its gain is similarly increased. Sample of these antennas are fabricated and tested to verify the designs. | ||
| 650 | 4 | |a Ground Plane |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a Patch Antenna |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a Antenna Gain |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a Microstrip Line |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a Microstrip Antenna |7 (dpeaa)DE-He213 | |
| 700 | 1 | |a Elsadek, H. A. |4 aut | |
| 700 | 1 | |a Abdallah, E. A. |4 aut | |
| 700 | 1 | |a Iskander, M. F. |4 aut | |
| 700 | 1 | |a Elhenawy, H. |4 aut | |
| 773 | 0 | 8 | |i Enthalten in |t Applied physics |d Berlin : Springer, 1973 |g 103(2011), 3 vom: 21. Apr., Seite 541-545 |w (DE-627)235503231 |w (DE-600)1398311-8 |x 1432-0630 |7 nnns |
| 773 | 1 | 8 | |g volume:103 |g year:2011 |g number:3 |g day:21 |g month:04 |g pages:541-545 |
| 856 | 4 | 0 | |u https://dx.doi.org/10.1007/s00339-011-6395-z |z lizenzpflichtig |3 Volltext |
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10.1007/s00339-011-6395-z doi (DE-627)SPR004119363 (SPR)s00339-011-6395-z-e DE-627 ger DE-627 rakwb eng Elsheakh, D. N. verfasserin aut Investigated new embedded shapes of electromagnetic bandgap structures and via effect for improved microstrip patch antenna performance 2011 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Springer-Verlag 2011 Abstract Three novel shapes of mushroom-like electromagnetic bandgap (EBG) structures are presented in this paper. The three shapes are based on a rectangular metal strip with different combinations. The performances of the three-shape structures are studied by using both an incident plane wave method and transmission coefficient approach. The effect of height and via location is also studied to achieve multi or wide bandgap. These shapes are embedded in microstrip patch antenna substrates. The performance of the MPA is improved as increasing the antenna gain by 5 dBi, decreasing the surface current so improving the antenna radiation pattern as well as reducing the antenna size by more than 70% compared to the original size. The new shapes of EBG structures are integrated with MPA as a ground plane, where the conducting ground plane is replaced by a high impedance surface EBG layer. Parametric studies are conducted to maximize their impedance bandwidth and gain. It is found that the antenna bandwidth increased by approximately four times than the original band and its gain is similarly increased. Sample of these antennas are fabricated and tested to verify the designs. Ground Plane (dpeaa)DE-He213 Patch Antenna (dpeaa)DE-He213 Antenna Gain (dpeaa)DE-He213 Microstrip Line (dpeaa)DE-He213 Microstrip Antenna (dpeaa)DE-He213 Elsadek, H. A. aut Abdallah, E. A. aut Iskander, M. F. aut Elhenawy, H. aut Enthalten in Applied physics Berlin : Springer, 1973 103(2011), 3 vom: 21. Apr., Seite 541-545 (DE-627)235503231 (DE-600)1398311-8 1432-0630 nnns volume:103 year:2011 number:3 day:21 month:04 pages:541-545 https://dx.doi.org/10.1007/s00339-011-6395-z lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_267 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 103 2011 3 21 04 541-545 |
| spelling |
10.1007/s00339-011-6395-z doi (DE-627)SPR004119363 (SPR)s00339-011-6395-z-e DE-627 ger DE-627 rakwb eng Elsheakh, D. N. verfasserin aut Investigated new embedded shapes of electromagnetic bandgap structures and via effect for improved microstrip patch antenna performance 2011 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Springer-Verlag 2011 Abstract Three novel shapes of mushroom-like electromagnetic bandgap (EBG) structures are presented in this paper. The three shapes are based on a rectangular metal strip with different combinations. The performances of the three-shape structures are studied by using both an incident plane wave method and transmission coefficient approach. The effect of height and via location is also studied to achieve multi or wide bandgap. These shapes are embedded in microstrip patch antenna substrates. The performance of the MPA is improved as increasing the antenna gain by 5 dBi, decreasing the surface current so improving the antenna radiation pattern as well as reducing the antenna size by more than 70% compared to the original size. The new shapes of EBG structures are integrated with MPA as a ground plane, where the conducting ground plane is replaced by a high impedance surface EBG layer. Parametric studies are conducted to maximize their impedance bandwidth and gain. It is found that the antenna bandwidth increased by approximately four times than the original band and its gain is similarly increased. Sample of these antennas are fabricated and tested to verify the designs. Ground Plane (dpeaa)DE-He213 Patch Antenna (dpeaa)DE-He213 Antenna Gain (dpeaa)DE-He213 Microstrip Line (dpeaa)DE-He213 Microstrip Antenna (dpeaa)DE-He213 Elsadek, H. A. aut Abdallah, E. A. aut Iskander, M. F. aut Elhenawy, H. aut Enthalten in Applied physics Berlin : Springer, 1973 103(2011), 3 vom: 21. Apr., Seite 541-545 (DE-627)235503231 (DE-600)1398311-8 1432-0630 nnns volume:103 year:2011 number:3 day:21 month:04 pages:541-545 https://dx.doi.org/10.1007/s00339-011-6395-z lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_267 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 103 2011 3 21 04 541-545 |
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10.1007/s00339-011-6395-z doi (DE-627)SPR004119363 (SPR)s00339-011-6395-z-e DE-627 ger DE-627 rakwb eng Elsheakh, D. N. verfasserin aut Investigated new embedded shapes of electromagnetic bandgap structures and via effect for improved microstrip patch antenna performance 2011 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Springer-Verlag 2011 Abstract Three novel shapes of mushroom-like electromagnetic bandgap (EBG) structures are presented in this paper. The three shapes are based on a rectangular metal strip with different combinations. The performances of the three-shape structures are studied by using both an incident plane wave method and transmission coefficient approach. The effect of height and via location is also studied to achieve multi or wide bandgap. These shapes are embedded in microstrip patch antenna substrates. The performance of the MPA is improved as increasing the antenna gain by 5 dBi, decreasing the surface current so improving the antenna radiation pattern as well as reducing the antenna size by more than 70% compared to the original size. The new shapes of EBG structures are integrated with MPA as a ground plane, where the conducting ground plane is replaced by a high impedance surface EBG layer. Parametric studies are conducted to maximize their impedance bandwidth and gain. It is found that the antenna bandwidth increased by approximately four times than the original band and its gain is similarly increased. Sample of these antennas are fabricated and tested to verify the designs. Ground Plane (dpeaa)DE-He213 Patch Antenna (dpeaa)DE-He213 Antenna Gain (dpeaa)DE-He213 Microstrip Line (dpeaa)DE-He213 Microstrip Antenna (dpeaa)DE-He213 Elsadek, H. A. aut Abdallah, E. A. aut Iskander, M. F. aut Elhenawy, H. aut Enthalten in Applied physics Berlin : Springer, 1973 103(2011), 3 vom: 21. Apr., Seite 541-545 (DE-627)235503231 (DE-600)1398311-8 1432-0630 nnns volume:103 year:2011 number:3 day:21 month:04 pages:541-545 https://dx.doi.org/10.1007/s00339-011-6395-z lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_267 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 103 2011 3 21 04 541-545 |
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10.1007/s00339-011-6395-z doi (DE-627)SPR004119363 (SPR)s00339-011-6395-z-e DE-627 ger DE-627 rakwb eng Elsheakh, D. N. verfasserin aut Investigated new embedded shapes of electromagnetic bandgap structures and via effect for improved microstrip patch antenna performance 2011 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Springer-Verlag 2011 Abstract Three novel shapes of mushroom-like electromagnetic bandgap (EBG) structures are presented in this paper. The three shapes are based on a rectangular metal strip with different combinations. The performances of the three-shape structures are studied by using both an incident plane wave method and transmission coefficient approach. The effect of height and via location is also studied to achieve multi or wide bandgap. These shapes are embedded in microstrip patch antenna substrates. The performance of the MPA is improved as increasing the antenna gain by 5 dBi, decreasing the surface current so improving the antenna radiation pattern as well as reducing the antenna size by more than 70% compared to the original size. The new shapes of EBG structures are integrated with MPA as a ground plane, where the conducting ground plane is replaced by a high impedance surface EBG layer. Parametric studies are conducted to maximize their impedance bandwidth and gain. It is found that the antenna bandwidth increased by approximately four times than the original band and its gain is similarly increased. Sample of these antennas are fabricated and tested to verify the designs. Ground Plane (dpeaa)DE-He213 Patch Antenna (dpeaa)DE-He213 Antenna Gain (dpeaa)DE-He213 Microstrip Line (dpeaa)DE-He213 Microstrip Antenna (dpeaa)DE-He213 Elsadek, H. A. aut Abdallah, E. A. aut Iskander, M. F. aut Elhenawy, H. aut Enthalten in Applied physics Berlin : Springer, 1973 103(2011), 3 vom: 21. Apr., Seite 541-545 (DE-627)235503231 (DE-600)1398311-8 1432-0630 nnns volume:103 year:2011 number:3 day:21 month:04 pages:541-545 https://dx.doi.org/10.1007/s00339-011-6395-z lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_267 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 103 2011 3 21 04 541-545 |
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10.1007/s00339-011-6395-z doi (DE-627)SPR004119363 (SPR)s00339-011-6395-z-e DE-627 ger DE-627 rakwb eng Elsheakh, D. N. verfasserin aut Investigated new embedded shapes of electromagnetic bandgap structures and via effect for improved microstrip patch antenna performance 2011 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Springer-Verlag 2011 Abstract Three novel shapes of mushroom-like electromagnetic bandgap (EBG) structures are presented in this paper. The three shapes are based on a rectangular metal strip with different combinations. The performances of the three-shape structures are studied by using both an incident plane wave method and transmission coefficient approach. The effect of height and via location is also studied to achieve multi or wide bandgap. These shapes are embedded in microstrip patch antenna substrates. The performance of the MPA is improved as increasing the antenna gain by 5 dBi, decreasing the surface current so improving the antenna radiation pattern as well as reducing the antenna size by more than 70% compared to the original size. The new shapes of EBG structures are integrated with MPA as a ground plane, where the conducting ground plane is replaced by a high impedance surface EBG layer. Parametric studies are conducted to maximize their impedance bandwidth and gain. It is found that the antenna bandwidth increased by approximately four times than the original band and its gain is similarly increased. Sample of these antennas are fabricated and tested to verify the designs. Ground Plane (dpeaa)DE-He213 Patch Antenna (dpeaa)DE-He213 Antenna Gain (dpeaa)DE-He213 Microstrip Line (dpeaa)DE-He213 Microstrip Antenna (dpeaa)DE-He213 Elsadek, H. A. aut Abdallah, E. A. aut Iskander, M. F. aut Elhenawy, H. aut Enthalten in Applied physics Berlin : Springer, 1973 103(2011), 3 vom: 21. Apr., Seite 541-545 (DE-627)235503231 (DE-600)1398311-8 1432-0630 nnns volume:103 year:2011 number:3 day:21 month:04 pages:541-545 https://dx.doi.org/10.1007/s00339-011-6395-z lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_267 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 103 2011 3 21 04 541-545 |
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Enthalten in Applied physics 103(2011), 3 vom: 21. Apr., Seite 541-545 volume:103 year:2011 number:3 day:21 month:04 pages:541-545 |
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Ground Plane Patch Antenna Antenna Gain Microstrip Line Microstrip Antenna |
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Applied physics |
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Elsheakh, D. N. @@aut@@ Elsadek, H. A. @@aut@@ Abdallah, E. A. @@aut@@ Iskander, M. F. @@aut@@ Elhenawy, H. @@aut@@ |
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| author |
Elsheakh, D. N. |
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Elsheakh, D. N. misc Ground Plane misc Patch Antenna misc Antenna Gain misc Microstrip Line misc Microstrip Antenna Investigated new embedded shapes of electromagnetic bandgap structures and via effect for improved microstrip patch antenna performance |
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Investigated new embedded shapes of electromagnetic bandgap structures and via effect for improved microstrip patch antenna performance Ground Plane (dpeaa)DE-He213 Patch Antenna (dpeaa)DE-He213 Antenna Gain (dpeaa)DE-He213 Microstrip Line (dpeaa)DE-He213 Microstrip Antenna (dpeaa)DE-He213 |
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misc Ground Plane misc Patch Antenna misc Antenna Gain misc Microstrip Line misc Microstrip Antenna |
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Investigated new embedded shapes of electromagnetic bandgap structures and via effect for improved microstrip patch antenna performance |
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Investigated new embedded shapes of electromagnetic bandgap structures and via effect for improved microstrip patch antenna performance |
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Elsheakh, D. N. |
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Elsheakh, D. N. Elsadek, H. A. Abdallah, E. A. Iskander, M. F. Elhenawy, H. |
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Elektronische Aufsätze |
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Elsheakh, D. N. |
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10.1007/s00339-011-6395-z |
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investigated new embedded shapes of electromagnetic bandgap structures and via effect for improved microstrip patch antenna performance |
| title_auth |
Investigated new embedded shapes of electromagnetic bandgap structures and via effect for improved microstrip patch antenna performance |
| abstract |
Abstract Three novel shapes of mushroom-like electromagnetic bandgap (EBG) structures are presented in this paper. The three shapes are based on a rectangular metal strip with different combinations. The performances of the three-shape structures are studied by using both an incident plane wave method and transmission coefficient approach. The effect of height and via location is also studied to achieve multi or wide bandgap. These shapes are embedded in microstrip patch antenna substrates. The performance of the MPA is improved as increasing the antenna gain by 5 dBi, decreasing the surface current so improving the antenna radiation pattern as well as reducing the antenna size by more than 70% compared to the original size. The new shapes of EBG structures are integrated with MPA as a ground plane, where the conducting ground plane is replaced by a high impedance surface EBG layer. Parametric studies are conducted to maximize their impedance bandwidth and gain. It is found that the antenna bandwidth increased by approximately four times than the original band and its gain is similarly increased. Sample of these antennas are fabricated and tested to verify the designs. © Springer-Verlag 2011 |
| abstractGer |
Abstract Three novel shapes of mushroom-like electromagnetic bandgap (EBG) structures are presented in this paper. The three shapes are based on a rectangular metal strip with different combinations. The performances of the three-shape structures are studied by using both an incident plane wave method and transmission coefficient approach. The effect of height and via location is also studied to achieve multi or wide bandgap. These shapes are embedded in microstrip patch antenna substrates. The performance of the MPA is improved as increasing the antenna gain by 5 dBi, decreasing the surface current so improving the antenna radiation pattern as well as reducing the antenna size by more than 70% compared to the original size. The new shapes of EBG structures are integrated with MPA as a ground plane, where the conducting ground plane is replaced by a high impedance surface EBG layer. Parametric studies are conducted to maximize their impedance bandwidth and gain. It is found that the antenna bandwidth increased by approximately four times than the original band and its gain is similarly increased. Sample of these antennas are fabricated and tested to verify the designs. © Springer-Verlag 2011 |
| abstract_unstemmed |
Abstract Three novel shapes of mushroom-like electromagnetic bandgap (EBG) structures are presented in this paper. The three shapes are based on a rectangular metal strip with different combinations. The performances of the three-shape structures are studied by using both an incident plane wave method and transmission coefficient approach. The effect of height and via location is also studied to achieve multi or wide bandgap. These shapes are embedded in microstrip patch antenna substrates. The performance of the MPA is improved as increasing the antenna gain by 5 dBi, decreasing the surface current so improving the antenna radiation pattern as well as reducing the antenna size by more than 70% compared to the original size. The new shapes of EBG structures are integrated with MPA as a ground plane, where the conducting ground plane is replaced by a high impedance surface EBG layer. Parametric studies are conducted to maximize their impedance bandwidth and gain. It is found that the antenna bandwidth increased by approximately four times than the original band and its gain is similarly increased. Sample of these antennas are fabricated and tested to verify the designs. © Springer-Verlag 2011 |
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Investigated new embedded shapes of electromagnetic bandgap structures and via effect for improved microstrip patch antenna performance |
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Elsadek, H. A. Abdallah, E. A. Iskander, M. F. Elhenawy, H. |
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Elsadek, H. A. Abdallah, E. A. Iskander, M. F. Elhenawy, H. |
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| score |
7.4010105 |