Component-based workflows for parallel thermomechanical analysis of arrayed geometries

Abstract Component-based simulation workflows can increase the agility of the design process by streamlining adaptation of new simulation methods. We present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in the thermomechanical analysis of an array...
Ausführliche Beschreibung

Gespeichert in:

Autor*in:	Bloomfield, Max O. [verfasserIn] Li, Zhen Granzow, Brian Ibanez, Daniel A. Oberai, Assad A. Hansen, Glen A. Liu, Xiao Hu Shephard, Mark S.

Format:	E-Artikel
Sprache:	Englisch

Erschienen:	2016

Schlagwörter:	Component-based workflow Inelastic mechanics Automated problem setup

Anmerkung:	© Springer-Verlag London 2016

Übergeordnetes Werk:	Enthalten in: Engineering with computers - London : Springer, 1985, 33(2016), 3 vom: 21. Nov., Seite 509-517
Übergeordnetes Werk:	volume:33 ; year:2016 ; number:3 ; day:21 ; month:11 ; pages:509-517

Links:	Volltext

DOI / URN:	10.1007/s00366-016-0487-5

Katalog-ID:	SPR004523784

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520			\|a Abstract Component-based simulation workflows can increase the agility of the design process by streamlining adaptation of new simulation methods. We present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in the thermomechanical analysis of an array of solder joints used in microelectronics fabrication. We automate the simulation process from problem specification to the solution of the underlying PDEs, including problem setup, domain definition, and mesh generation. We establish the utility of the proposed approach by demonstrating that qualitatively different stress concentrations are seen in solder joints near the center of such an array and a solder joint seen at the edge of the same array.
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700	1		\|a Ibanez, Daniel A. \|4 aut
700	1		\|a Oberai, Assad A. \|4 aut
700	1		\|a Hansen, Glen A. \|4 aut
700	1		\|a Liu, Xiao Hu \|4 aut
700	1		\|a Shephard, Mark S. \|4 aut
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912			\|a GBV_ILN_74
912			\|a GBV_ILN_90
912			\|a GBV_ILN_95
912			\|a GBV_ILN_100
912			\|a GBV_ILN_101
912			\|a GBV_ILN_105
912			\|a GBV_ILN_110
912			\|a GBV_ILN_120
912			\|a GBV_ILN_138
912			\|a GBV_ILN_150
912			\|a GBV_ILN_151
912			\|a GBV_ILN_152
912			\|a GBV_ILN_161
912			\|a GBV_ILN_170
912			\|a GBV_ILN_171
912			\|a GBV_ILN_187
912			\|a GBV_ILN_213
912			\|a GBV_ILN_224
912			\|a GBV_ILN_230
912			\|a GBV_ILN_250
912			\|a GBV_ILN_267
912			\|a GBV_ILN_281
912			\|a GBV_ILN_285
912			\|a GBV_ILN_293
912			\|a GBV_ILN_370
912			\|a GBV_ILN_602
912			\|a GBV_ILN_636
912			\|a GBV_ILN_702
912			\|a GBV_ILN_2001
912			\|a GBV_ILN_2003
912			\|a GBV_ILN_2004
912			\|a GBV_ILN_2005
912			\|a GBV_ILN_2006
912			\|a GBV_ILN_2007
912			\|a GBV_ILN_2009
912			\|a GBV_ILN_2010
912			\|a GBV_ILN_2011
912			\|a GBV_ILN_2014
912			\|a GBV_ILN_2015
912			\|a GBV_ILN_2020
912			\|a GBV_ILN_2021
912			\|a GBV_ILN_2025
912			\|a GBV_ILN_2026
912			\|a GBV_ILN_2027
912			\|a GBV_ILN_2031
912			\|a GBV_ILN_2034
912			\|a GBV_ILN_2037
912			\|a GBV_ILN_2038
912			\|a GBV_ILN_2039
912			\|a GBV_ILN_2044
912			\|a GBV_ILN_2048
912			\|a GBV_ILN_2049
912			\|a GBV_ILN_2050
912			\|a GBV_ILN_2055
912			\|a GBV_ILN_2057
912			\|a GBV_ILN_2059
912			\|a GBV_ILN_2061
912			\|a GBV_ILN_2064
912			\|a GBV_ILN_2065
912			\|a GBV_ILN_2068
912			\|a GBV_ILN_2070
912			\|a GBV_ILN_2086
912			\|a GBV_ILN_2088
912			\|a GBV_ILN_2093
912			\|a GBV_ILN_2106
912			\|a GBV_ILN_2107
912			\|a GBV_ILN_2108
912			\|a GBV_ILN_2110
912			\|a GBV_ILN_2111
912			\|a GBV_ILN_2112
912			\|a GBV_ILN_2113
912			\|a GBV_ILN_2116
912			\|a GBV_ILN_2118
912			\|a GBV_ILN_2119
912			\|a GBV_ILN_2122
912			\|a GBV_ILN_2129
912			\|a GBV_ILN_2143
912			\|a GBV_ILN_2144
912			\|a GBV_ILN_2147
912			\|a GBV_ILN_2148
912			\|a GBV_ILN_2152
912			\|a GBV_ILN_2153
912			\|a GBV_ILN_2188
912			\|a GBV_ILN_2190
912			\|a GBV_ILN_2232
912			\|a GBV_ILN_2336
912			\|a GBV_ILN_2446
912			\|a GBV_ILN_2470
912			\|a GBV_ILN_2472
912			\|a GBV_ILN_2507
912			\|a GBV_ILN_2522
912			\|a GBV_ILN_2548
912			\|a GBV_ILN_4012
912			\|a GBV_ILN_4035
912			\|a GBV_ILN_4037
912			\|a GBV_ILN_4046
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912			\|a GBV_ILN_4333
912			\|a GBV_ILN_4334
912			\|a GBV_ILN_4335
912			\|a GBV_ILN_4336
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publishDate	2016
allfields	10.1007/s00366-016-0487-5 doi (DE-627)SPR004523784 (SPR)s00366-016-0487-5-e DE-627 ger DE-627 rakwb eng Bloomfield, Max O. verfasserin aut Component-based workflows for parallel thermomechanical analysis of arrayed geometries 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Springer-Verlag London 2016 Abstract Component-based simulation workflows can increase the agility of the design process by streamlining adaptation of new simulation methods. We present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in the thermomechanical analysis of an array of solder joints used in microelectronics fabrication. We automate the simulation process from problem specification to the solution of the underlying PDEs, including problem setup, domain definition, and mesh generation. We establish the utility of the proposed approach by demonstrating that qualitatively different stress concentrations are seen in solder joints near the center of such an array and a solder joint seen at the edge of the same array. Component-based workflow (dpeaa)DE-He213 Inelastic mechanics (dpeaa)DE-He213 Automated problem setup (dpeaa)DE-He213 Li, Zhen aut Granzow, Brian aut Ibanez, Daniel A. aut Oberai, Assad A. aut Hansen, Glen A. aut Liu, Xiao Hu aut Shephard, Mark S. aut Enthalten in Engineering with computers London : Springer, 1985 33(2016), 3 vom: 21. Nov., Seite 509-517 (DE-627)253722551 (DE-600)1459031-1 1435-5663 nnns volume:33 year:2016 number:3 day:21 month:11 pages:509-517 https://dx.doi.org/10.1007/s00366-016-0487-5 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_267 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 33 2016 3 21 11 509-517
spelling	10.1007/s00366-016-0487-5 doi (DE-627)SPR004523784 (SPR)s00366-016-0487-5-e DE-627 ger DE-627 rakwb eng Bloomfield, Max O. verfasserin aut Component-based workflows for parallel thermomechanical analysis of arrayed geometries 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Springer-Verlag London 2016 Abstract Component-based simulation workflows can increase the agility of the design process by streamlining adaptation of new simulation methods. We present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in the thermomechanical analysis of an array of solder joints used in microelectronics fabrication. We automate the simulation process from problem specification to the solution of the underlying PDEs, including problem setup, domain definition, and mesh generation. We establish the utility of the proposed approach by demonstrating that qualitatively different stress concentrations are seen in solder joints near the center of such an array and a solder joint seen at the edge of the same array. Component-based workflow (dpeaa)DE-He213 Inelastic mechanics (dpeaa)DE-He213 Automated problem setup (dpeaa)DE-He213 Li, Zhen aut Granzow, Brian aut Ibanez, Daniel A. aut Oberai, Assad A. aut Hansen, Glen A. aut Liu, Xiao Hu aut Shephard, Mark S. aut Enthalten in Engineering with computers London : Springer, 1985 33(2016), 3 vom: 21. Nov., Seite 509-517 (DE-627)253722551 (DE-600)1459031-1 1435-5663 nnns volume:33 year:2016 number:3 day:21 month:11 pages:509-517 https://dx.doi.org/10.1007/s00366-016-0487-5 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_267 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 33 2016 3 21 11 509-517
allfields_unstemmed	10.1007/s00366-016-0487-5 doi (DE-627)SPR004523784 (SPR)s00366-016-0487-5-e DE-627 ger DE-627 rakwb eng Bloomfield, Max O. verfasserin aut Component-based workflows for parallel thermomechanical analysis of arrayed geometries 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Springer-Verlag London 2016 Abstract Component-based simulation workflows can increase the agility of the design process by streamlining adaptation of new simulation methods. We present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in the thermomechanical analysis of an array of solder joints used in microelectronics fabrication. We automate the simulation process from problem specification to the solution of the underlying PDEs, including problem setup, domain definition, and mesh generation. We establish the utility of the proposed approach by demonstrating that qualitatively different stress concentrations are seen in solder joints near the center of such an array and a solder joint seen at the edge of the same array. Component-based workflow (dpeaa)DE-He213 Inelastic mechanics (dpeaa)DE-He213 Automated problem setup (dpeaa)DE-He213 Li, Zhen aut Granzow, Brian aut Ibanez, Daniel A. aut Oberai, Assad A. aut Hansen, Glen A. aut Liu, Xiao Hu aut Shephard, Mark S. aut Enthalten in Engineering with computers London : Springer, 1985 33(2016), 3 vom: 21. Nov., Seite 509-517 (DE-627)253722551 (DE-600)1459031-1 1435-5663 nnns volume:33 year:2016 number:3 day:21 month:11 pages:509-517 https://dx.doi.org/10.1007/s00366-016-0487-5 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_267 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 33 2016 3 21 11 509-517
allfieldsGer	10.1007/s00366-016-0487-5 doi (DE-627)SPR004523784 (SPR)s00366-016-0487-5-e DE-627 ger DE-627 rakwb eng Bloomfield, Max O. verfasserin aut Component-based workflows for parallel thermomechanical analysis of arrayed geometries 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Springer-Verlag London 2016 Abstract Component-based simulation workflows can increase the agility of the design process by streamlining adaptation of new simulation methods. We present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in the thermomechanical analysis of an array of solder joints used in microelectronics fabrication. We automate the simulation process from problem specification to the solution of the underlying PDEs, including problem setup, domain definition, and mesh generation. We establish the utility of the proposed approach by demonstrating that qualitatively different stress concentrations are seen in solder joints near the center of such an array and a solder joint seen at the edge of the same array. Component-based workflow (dpeaa)DE-He213 Inelastic mechanics (dpeaa)DE-He213 Automated problem setup (dpeaa)DE-He213 Li, Zhen aut Granzow, Brian aut Ibanez, Daniel A. aut Oberai, Assad A. aut Hansen, Glen A. aut Liu, Xiao Hu aut Shephard, Mark S. aut Enthalten in Engineering with computers London : Springer, 1985 33(2016), 3 vom: 21. Nov., Seite 509-517 (DE-627)253722551 (DE-600)1459031-1 1435-5663 nnns volume:33 year:2016 number:3 day:21 month:11 pages:509-517 https://dx.doi.org/10.1007/s00366-016-0487-5 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_267 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 33 2016 3 21 11 509-517
allfieldsSound	10.1007/s00366-016-0487-5 doi (DE-627)SPR004523784 (SPR)s00366-016-0487-5-e DE-627 ger DE-627 rakwb eng Bloomfield, Max O. verfasserin aut Component-based workflows for parallel thermomechanical analysis of arrayed geometries 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © Springer-Verlag London 2016 Abstract Component-based simulation workflows can increase the agility of the design process by streamlining adaptation of new simulation methods. We present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in the thermomechanical analysis of an array of solder joints used in microelectronics fabrication. We automate the simulation process from problem specification to the solution of the underlying PDEs, including problem setup, domain definition, and mesh generation. We establish the utility of the proposed approach by demonstrating that qualitatively different stress concentrations are seen in solder joints near the center of such an array and a solder joint seen at the edge of the same array. Component-based workflow (dpeaa)DE-He213 Inelastic mechanics (dpeaa)DE-He213 Automated problem setup (dpeaa)DE-He213 Li, Zhen aut Granzow, Brian aut Ibanez, Daniel A. aut Oberai, Assad A. aut Hansen, Glen A. aut Liu, Xiao Hu aut Shephard, Mark S. aut Enthalten in Engineering with computers London : Springer, 1985 33(2016), 3 vom: 21. Nov., Seite 509-517 (DE-627)253722551 (DE-600)1459031-1 1435-5663 nnns volume:33 year:2016 number:3 day:21 month:11 pages:509-517 https://dx.doi.org/10.1007/s00366-016-0487-5 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_267 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 33 2016 3 21 11 509-517
language	English
source	Enthalten in Engineering with computers 33(2016), 3 vom: 21. Nov., Seite 509-517 volume:33 year:2016 number:3 day:21 month:11 pages:509-517
sourceStr	Enthalten in Engineering with computers 33(2016), 3 vom: 21. Nov., Seite 509-517 volume:33 year:2016 number:3 day:21 month:11 pages:509-517
format_phy_str_mv	Article
institution	findex.gbv.de
topic_facet	Component-based workflow Inelastic mechanics Automated problem setup
isfreeaccess_bool	false
container_title	Engineering with computers
authorswithroles_txt_mv	Bloomfield, Max O. @@aut@@ Li, Zhen @@aut@@ Granzow, Brian @@aut@@ Ibanez, Daniel A. @@aut@@ Oberai, Assad A. @@aut@@ Hansen, Glen A. @@aut@@ Liu, Xiao Hu @@aut@@ Shephard, Mark S. @@aut@@
publishDateDaySort_date	2016-11-21T00:00:00Z
hierarchy_top_id	253722551
id	SPR004523784
language_de	englisch
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author	Bloomfield, Max O.
spellingShingle	Bloomfield, Max O. misc Component-based workflow misc Inelastic mechanics misc Automated problem setup Component-based workflows for parallel thermomechanical analysis of arrayed geometries
authorStr	Bloomfield, Max O.
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topic_title	Component-based workflows for parallel thermomechanical analysis of arrayed geometries Component-based workflow (dpeaa)DE-He213 Inelastic mechanics (dpeaa)DE-He213 Automated problem setup (dpeaa)DE-He213
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title	Component-based workflows for parallel thermomechanical analysis of arrayed geometries
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title_full	Component-based workflows for parallel thermomechanical analysis of arrayed geometries
author_sort	Bloomfield, Max O.
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author_browse	Bloomfield, Max O. Li, Zhen Granzow, Brian Ibanez, Daniel A. Oberai, Assad A. Hansen, Glen A. Liu, Xiao Hu Shephard, Mark S.
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author-letter	Bloomfield, Max O.
doi_str_mv	10.1007/s00366-016-0487-5
title_sort	component-based workflows for parallel thermomechanical analysis of arrayed geometries
title_auth	Component-based workflows for parallel thermomechanical analysis of arrayed geometries
abstract	Abstract Component-based simulation workflows can increase the agility of the design process by streamlining adaptation of new simulation methods. We present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in the thermomechanical analysis of an array of solder joints used in microelectronics fabrication. We automate the simulation process from problem specification to the solution of the underlying PDEs, including problem setup, domain definition, and mesh generation. We establish the utility of the proposed approach by demonstrating that qualitatively different stress concentrations are seen in solder joints near the center of such an array and a solder joint seen at the edge of the same array. © Springer-Verlag London 2016
abstractGer	Abstract Component-based simulation workflows can increase the agility of the design process by streamlining adaptation of new simulation methods. We present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in the thermomechanical analysis of an array of solder joints used in microelectronics fabrication. We automate the simulation process from problem specification to the solution of the underlying PDEs, including problem setup, domain definition, and mesh generation. We establish the utility of the proposed approach by demonstrating that qualitatively different stress concentrations are seen in solder joints near the center of such an array and a solder joint seen at the edge of the same array. © Springer-Verlag London 2016
abstract_unstemmed	Abstract Component-based simulation workflows can increase the agility of the design process by streamlining adaptation of new simulation methods. We present one such workflow for parallel unstructured mesh-based simulations and demonstrate its usefulness in the thermomechanical analysis of an array of solder joints used in microelectronics fabrication. We automate the simulation process from problem specification to the solution of the underlying PDEs, including problem setup, domain definition, and mesh generation. We establish the utility of the proposed approach by demonstrating that qualitatively different stress concentrations are seen in solder joints near the center of such an array and a solder joint seen at the edge of the same array. © Springer-Verlag London 2016
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title_short	Component-based workflows for parallel thermomechanical analysis of arrayed geometries
url	https://dx.doi.org/10.1007/s00366-016-0487-5
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author2	Li, Zhen Granzow, Brian Ibanez, Daniel A. Oberai, Assad A. Hansen, Glen A. Liu, Xiao Hu Shephard, Mark S.
author2Str	Li, Zhen Granzow, Brian Ibanez, Daniel A. Oberai, Assad A. Hansen, Glen A. Liu, Xiao Hu Shephard, Mark S.
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doi_str	10.1007/s00366-016-0487-5
up_date	2024-07-04T01:27:15.731Z
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