Swelling of SU-8 structure in Ni mold fabrication by UV-LIGA technique
Abstract UV-LIGA technique is used to fabricate hot embossing mold of PMMA microfluidic chip. Pre-polished Ni plate serves as electroforming substrate and the micro channel is the only structure to be electroformed in the fabricated mold. The precision of the micro channel strongly depends on the pr...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Yi, Luo [verfasserIn] Xiaodong, Wang [verfasserIn] Chong, Liu [verfasserIn] Zhifeng, Lou [verfasserIn] Denan, Chu [verfasserIn] Dehui, Yu [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2005 |
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| Schlagwörter: |
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| Übergeordnetes Werk: |
Enthalten in: Microsystem technologies - Berlin : Springer, 1994, 11(2005), 12 vom: 07. Juli, Seite 1272-1275 |
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| Übergeordnetes Werk: |
volume:11 ; year:2005 ; number:12 ; day:07 ; month:07 ; pages:1272-1275 |
| Links: |
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| DOI / URN: |
10.1007/s00542-005-0604-7 |
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| Katalog-ID: |
SPR006806481 |
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| 245 | 1 | 0 | |a Swelling of SU-8 structure in Ni mold fabrication by UV-LIGA technique |
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| 520 | |a Abstract UV-LIGA technique is used to fabricate hot embossing mold of PMMA microfluidic chip. Pre-polished Ni plate serves as electroforming substrate and the micro channel is the only structure to be electroformed in the fabricated mold. The precision of the micro channel strongly depends on the process parameters. Experiments show that the width of micro channel varies with the electroforming time. With the electroforming time of 108, 140 and 160 min, the width of micro channel reduces to 89, 86 and 82% of patterned SU-8 mold respectively, which is caused by swelling of SU-8 in acidic, high temperature electroforming solution. This swelling is the key answer to the slope of the sidewalls of the electroformed structure. This study is beneficial to optimizing microfluidic chip mold design. | ||
| 650 | 4 | |a Microfluidic Chip |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a Sulphamate |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a Mold Fabrication |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a Slope Sidewall |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a Demolding Force |7 (dpeaa)DE-He213 | |
| 700 | 1 | |a Xiaodong, Wang |e verfasserin |4 aut | |
| 700 | 1 | |a Chong, Liu |e verfasserin |4 aut | |
| 700 | 1 | |a Zhifeng, Lou |e verfasserin |4 aut | |
| 700 | 1 | |a Denan, Chu |e verfasserin |4 aut | |
| 700 | 1 | |a Dehui, Yu |e verfasserin |4 aut | |
| 773 | 0 | 8 | |i Enthalten in |t Microsystem technologies |d Berlin : Springer, 1994 |g 11(2005), 12 vom: 07. Juli, Seite 1272-1275 |w (DE-627)270128182 |w (DE-600)1476561-5 |x 1432-1858 |7 nnns |
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10.1007/s00542-005-0604-7 doi (DE-627)SPR006806481 (SPR)s00542-005-0604-7-e DE-627 ger DE-627 rakwb eng 510 ASE 50.94 bkl Yi, Luo verfasserin aut Swelling of SU-8 structure in Ni mold fabrication by UV-LIGA technique 2005 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract UV-LIGA technique is used to fabricate hot embossing mold of PMMA microfluidic chip. Pre-polished Ni plate serves as electroforming substrate and the micro channel is the only structure to be electroformed in the fabricated mold. The precision of the micro channel strongly depends on the process parameters. Experiments show that the width of micro channel varies with the electroforming time. With the electroforming time of 108, 140 and 160 min, the width of micro channel reduces to 89, 86 and 82% of patterned SU-8 mold respectively, which is caused by swelling of SU-8 in acidic, high temperature electroforming solution. This swelling is the key answer to the slope of the sidewalls of the electroformed structure. This study is beneficial to optimizing microfluidic chip mold design. Microfluidic Chip (dpeaa)DE-He213 Sulphamate (dpeaa)DE-He213 Mold Fabrication (dpeaa)DE-He213 Slope Sidewall (dpeaa)DE-He213 Demolding Force (dpeaa)DE-He213 Xiaodong, Wang verfasserin aut Chong, Liu verfasserin aut Zhifeng, Lou verfasserin aut Denan, Chu verfasserin aut Dehui, Yu verfasserin aut Enthalten in Microsystem technologies Berlin : Springer, 1994 11(2005), 12 vom: 07. Juli, Seite 1272-1275 (DE-627)270128182 (DE-600)1476561-5 1432-1858 nnns volume:11 year:2005 number:12 day:07 month:07 pages:1272-1275 https://dx.doi.org/10.1007/s00542-005-0604-7 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OPC-MAT SSG-OPC-ASE GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_266 GBV_ILN_267 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 50.94 ASE AR 11 2005 12 07 07 1272-1275 |
| spelling |
10.1007/s00542-005-0604-7 doi (DE-627)SPR006806481 (SPR)s00542-005-0604-7-e DE-627 ger DE-627 rakwb eng 510 ASE 50.94 bkl Yi, Luo verfasserin aut Swelling of SU-8 structure in Ni mold fabrication by UV-LIGA technique 2005 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract UV-LIGA technique is used to fabricate hot embossing mold of PMMA microfluidic chip. Pre-polished Ni plate serves as electroforming substrate and the micro channel is the only structure to be electroformed in the fabricated mold. The precision of the micro channel strongly depends on the process parameters. Experiments show that the width of micro channel varies with the electroforming time. With the electroforming time of 108, 140 and 160 min, the width of micro channel reduces to 89, 86 and 82% of patterned SU-8 mold respectively, which is caused by swelling of SU-8 in acidic, high temperature electroforming solution. This swelling is the key answer to the slope of the sidewalls of the electroformed structure. This study is beneficial to optimizing microfluidic chip mold design. Microfluidic Chip (dpeaa)DE-He213 Sulphamate (dpeaa)DE-He213 Mold Fabrication (dpeaa)DE-He213 Slope Sidewall (dpeaa)DE-He213 Demolding Force (dpeaa)DE-He213 Xiaodong, Wang verfasserin aut Chong, Liu verfasserin aut Zhifeng, Lou verfasserin aut Denan, Chu verfasserin aut Dehui, Yu verfasserin aut Enthalten in Microsystem technologies Berlin : Springer, 1994 11(2005), 12 vom: 07. Juli, Seite 1272-1275 (DE-627)270128182 (DE-600)1476561-5 1432-1858 nnns volume:11 year:2005 number:12 day:07 month:07 pages:1272-1275 https://dx.doi.org/10.1007/s00542-005-0604-7 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OPC-MAT SSG-OPC-ASE GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_266 GBV_ILN_267 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 50.94 ASE AR 11 2005 12 07 07 1272-1275 |
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10.1007/s00542-005-0604-7 doi (DE-627)SPR006806481 (SPR)s00542-005-0604-7-e DE-627 ger DE-627 rakwb eng 510 ASE 50.94 bkl Yi, Luo verfasserin aut Swelling of SU-8 structure in Ni mold fabrication by UV-LIGA technique 2005 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract UV-LIGA technique is used to fabricate hot embossing mold of PMMA microfluidic chip. Pre-polished Ni plate serves as electroforming substrate and the micro channel is the only structure to be electroformed in the fabricated mold. The precision of the micro channel strongly depends on the process parameters. Experiments show that the width of micro channel varies with the electroforming time. With the electroforming time of 108, 140 and 160 min, the width of micro channel reduces to 89, 86 and 82% of patterned SU-8 mold respectively, which is caused by swelling of SU-8 in acidic, high temperature electroforming solution. This swelling is the key answer to the slope of the sidewalls of the electroformed structure. This study is beneficial to optimizing microfluidic chip mold design. Microfluidic Chip (dpeaa)DE-He213 Sulphamate (dpeaa)DE-He213 Mold Fabrication (dpeaa)DE-He213 Slope Sidewall (dpeaa)DE-He213 Demolding Force (dpeaa)DE-He213 Xiaodong, Wang verfasserin aut Chong, Liu verfasserin aut Zhifeng, Lou verfasserin aut Denan, Chu verfasserin aut Dehui, Yu verfasserin aut Enthalten in Microsystem technologies Berlin : Springer, 1994 11(2005), 12 vom: 07. Juli, Seite 1272-1275 (DE-627)270128182 (DE-600)1476561-5 1432-1858 nnns volume:11 year:2005 number:12 day:07 month:07 pages:1272-1275 https://dx.doi.org/10.1007/s00542-005-0604-7 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OPC-MAT SSG-OPC-ASE GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_266 GBV_ILN_267 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 50.94 ASE AR 11 2005 12 07 07 1272-1275 |
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10.1007/s00542-005-0604-7 doi (DE-627)SPR006806481 (SPR)s00542-005-0604-7-e DE-627 ger DE-627 rakwb eng 510 ASE 50.94 bkl Yi, Luo verfasserin aut Swelling of SU-8 structure in Ni mold fabrication by UV-LIGA technique 2005 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract UV-LIGA technique is used to fabricate hot embossing mold of PMMA microfluidic chip. Pre-polished Ni plate serves as electroforming substrate and the micro channel is the only structure to be electroformed in the fabricated mold. The precision of the micro channel strongly depends on the process parameters. Experiments show that the width of micro channel varies with the electroforming time. With the electroforming time of 108, 140 and 160 min, the width of micro channel reduces to 89, 86 and 82% of patterned SU-8 mold respectively, which is caused by swelling of SU-8 in acidic, high temperature electroforming solution. This swelling is the key answer to the slope of the sidewalls of the electroformed structure. This study is beneficial to optimizing microfluidic chip mold design. Microfluidic Chip (dpeaa)DE-He213 Sulphamate (dpeaa)DE-He213 Mold Fabrication (dpeaa)DE-He213 Slope Sidewall (dpeaa)DE-He213 Demolding Force (dpeaa)DE-He213 Xiaodong, Wang verfasserin aut Chong, Liu verfasserin aut Zhifeng, Lou verfasserin aut Denan, Chu verfasserin aut Dehui, Yu verfasserin aut Enthalten in Microsystem technologies Berlin : Springer, 1994 11(2005), 12 vom: 07. Juli, Seite 1272-1275 (DE-627)270128182 (DE-600)1476561-5 1432-1858 nnns volume:11 year:2005 number:12 day:07 month:07 pages:1272-1275 https://dx.doi.org/10.1007/s00542-005-0604-7 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OPC-MAT SSG-OPC-ASE GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_266 GBV_ILN_267 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 50.94 ASE AR 11 2005 12 07 07 1272-1275 |
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10.1007/s00542-005-0604-7 doi (DE-627)SPR006806481 (SPR)s00542-005-0604-7-e DE-627 ger DE-627 rakwb eng 510 ASE 50.94 bkl Yi, Luo verfasserin aut Swelling of SU-8 structure in Ni mold fabrication by UV-LIGA technique 2005 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract UV-LIGA technique is used to fabricate hot embossing mold of PMMA microfluidic chip. Pre-polished Ni plate serves as electroforming substrate and the micro channel is the only structure to be electroformed in the fabricated mold. The precision of the micro channel strongly depends on the process parameters. Experiments show that the width of micro channel varies with the electroforming time. With the electroforming time of 108, 140 and 160 min, the width of micro channel reduces to 89, 86 and 82% of patterned SU-8 mold respectively, which is caused by swelling of SU-8 in acidic, high temperature electroforming solution. This swelling is the key answer to the slope of the sidewalls of the electroformed structure. This study is beneficial to optimizing microfluidic chip mold design. Microfluidic Chip (dpeaa)DE-He213 Sulphamate (dpeaa)DE-He213 Mold Fabrication (dpeaa)DE-He213 Slope Sidewall (dpeaa)DE-He213 Demolding Force (dpeaa)DE-He213 Xiaodong, Wang verfasserin aut Chong, Liu verfasserin aut Zhifeng, Lou verfasserin aut Denan, Chu verfasserin aut Dehui, Yu verfasserin aut Enthalten in Microsystem technologies Berlin : Springer, 1994 11(2005), 12 vom: 07. Juli, Seite 1272-1275 (DE-627)270128182 (DE-600)1476561-5 1432-1858 nnns volume:11 year:2005 number:12 day:07 month:07 pages:1272-1275 https://dx.doi.org/10.1007/s00542-005-0604-7 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER SSG-OPC-MAT SSG-OPC-ASE GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_266 GBV_ILN_267 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 50.94 ASE AR 11 2005 12 07 07 1272-1275 |
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Enthalten in Microsystem technologies 11(2005), 12 vom: 07. Juli, Seite 1272-1275 volume:11 year:2005 number:12 day:07 month:07 pages:1272-1275 |
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Enthalten in Microsystem technologies 11(2005), 12 vom: 07. Juli, Seite 1272-1275 volume:11 year:2005 number:12 day:07 month:07 pages:1272-1275 |
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Microfluidic Chip Sulphamate Mold Fabrication Slope Sidewall Demolding Force |
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Microsystem technologies |
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Yi, Luo @@aut@@ Xiaodong, Wang @@aut@@ Chong, Liu @@aut@@ Zhifeng, Lou @@aut@@ Denan, Chu @@aut@@ Dehui, Yu @@aut@@ |
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2005-07-07T00:00:00Z |
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<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">SPR006806481</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20220110191807.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">201005s2005 xx |||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/s00542-005-0604-7</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)SPR006806481</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(SPR)s00542-005-0604-7-e</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">510</subfield><subfield code="q">ASE</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">50.94</subfield><subfield code="2">bkl</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Yi, Luo</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Swelling of SU-8 structure in Ni mold fabrication by UV-LIGA technique</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2005</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">Computermedien</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Online-Ressource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract UV-LIGA technique is used to fabricate hot embossing mold of PMMA microfluidic chip. Pre-polished Ni plate serves as electroforming substrate and the micro channel is the only structure to be electroformed in the fabricated mold. The precision of the micro channel strongly depends on the process parameters. Experiments show that the width of micro channel varies with the electroforming time. With the electroforming time of 108, 140 and 160 min, the width of micro channel reduces to 89, 86 and 82% of patterned SU-8 mold respectively, which is caused by swelling of SU-8 in acidic, high temperature electroforming solution. This swelling is the key answer to the slope of the sidewalls of the electroformed structure. 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Yi, Luo |
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Yi, Luo ddc 510 bkl 50.94 misc Microfluidic Chip misc Sulphamate misc Mold Fabrication misc Slope Sidewall misc Demolding Force Swelling of SU-8 structure in Ni mold fabrication by UV-LIGA technique |
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510 ASE 50.94 bkl Swelling of SU-8 structure in Ni mold fabrication by UV-LIGA technique Microfluidic Chip (dpeaa)DE-He213 Sulphamate (dpeaa)DE-He213 Mold Fabrication (dpeaa)DE-He213 Slope Sidewall (dpeaa)DE-He213 Demolding Force (dpeaa)DE-He213 |
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ddc 510 bkl 50.94 misc Microfluidic Chip misc Sulphamate misc Mold Fabrication misc Slope Sidewall misc Demolding Force |
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Swelling of SU-8 structure in Ni mold fabrication by UV-LIGA technique |
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Swelling of SU-8 structure in Ni mold fabrication by UV-LIGA technique |
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Yi, Luo |
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Yi, Luo Xiaodong, Wang Chong, Liu Zhifeng, Lou Denan, Chu Dehui, Yu |
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swelling of su-8 structure in ni mold fabrication by uv-liga technique |
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Swelling of SU-8 structure in Ni mold fabrication by UV-LIGA technique |
| abstract |
Abstract UV-LIGA technique is used to fabricate hot embossing mold of PMMA microfluidic chip. Pre-polished Ni plate serves as electroforming substrate and the micro channel is the only structure to be electroformed in the fabricated mold. The precision of the micro channel strongly depends on the process parameters. Experiments show that the width of micro channel varies with the electroforming time. With the electroforming time of 108, 140 and 160 min, the width of micro channel reduces to 89, 86 and 82% of patterned SU-8 mold respectively, which is caused by swelling of SU-8 in acidic, high temperature electroforming solution. This swelling is the key answer to the slope of the sidewalls of the electroformed structure. This study is beneficial to optimizing microfluidic chip mold design. |
| abstractGer |
Abstract UV-LIGA technique is used to fabricate hot embossing mold of PMMA microfluidic chip. Pre-polished Ni plate serves as electroforming substrate and the micro channel is the only structure to be electroformed in the fabricated mold. The precision of the micro channel strongly depends on the process parameters. Experiments show that the width of micro channel varies with the electroforming time. With the electroforming time of 108, 140 and 160 min, the width of micro channel reduces to 89, 86 and 82% of patterned SU-8 mold respectively, which is caused by swelling of SU-8 in acidic, high temperature electroforming solution. This swelling is the key answer to the slope of the sidewalls of the electroformed structure. This study is beneficial to optimizing microfluidic chip mold design. |
| abstract_unstemmed |
Abstract UV-LIGA technique is used to fabricate hot embossing mold of PMMA microfluidic chip. Pre-polished Ni plate serves as electroforming substrate and the micro channel is the only structure to be electroformed in the fabricated mold. The precision of the micro channel strongly depends on the process parameters. Experiments show that the width of micro channel varies with the electroforming time. With the electroforming time of 108, 140 and 160 min, the width of micro channel reduces to 89, 86 and 82% of patterned SU-8 mold respectively, which is caused by swelling of SU-8 in acidic, high temperature electroforming solution. This swelling is the key answer to the slope of the sidewalls of the electroformed structure. This study is beneficial to optimizing microfluidic chip mold design. |
| collection_details |
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| container_issue |
12 |
| title_short |
Swelling of SU-8 structure in Ni mold fabrication by UV-LIGA technique |
| url |
https://dx.doi.org/10.1007/s00542-005-0604-7 |
| remote_bool |
true |
| author2 |
Xiaodong, Wang Chong, Liu Zhifeng, Lou Denan, Chu Dehui, Yu |
| author2Str |
Xiaodong, Wang Chong, Liu Zhifeng, Lou Denan, Chu Dehui, Yu |
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| doi_str |
10.1007/s00542-005-0604-7 |
| up_date |
2024-07-04T00:45:45.057Z |
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| score |
7.401574 |