The application of highly soluble amine-terminated aromatic polyimides with pendent tert-butyl groups as a tougher for epoxy resin
Abstract Polyimides (PIs) with various molecular weights synthesized via the reaction of aromatic diamine monomer containing tert-butyl groups with aromatic dianhydride were highly soluble in common organic solvents and some epoxy resins at room temperature. These PIs can be incorporated in the abse...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Zhao, Qing [verfasserIn] Wang, Xing-yi [verfasserIn] Hu, Yan-hong [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2015 |
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| Schlagwörter: |
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| Übergeordnetes Werk: |
Enthalten in: Chinese Journal of Polymer Science - Chinese Chemical Society and Institute of Chemistry, CAS, 2009, 33(2015), 10 vom: 19. Aug., Seite 1359-1372 |
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| Übergeordnetes Werk: |
volume:33 ; year:2015 ; number:10 ; day:19 ; month:08 ; pages:1359-1372 |
| Links: |
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| DOI / URN: |
10.1007/s10118-015-1685-0 |
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| Katalog-ID: |
SPR009227482 |
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| 245 | 1 | 4 | |a The application of highly soluble amine-terminated aromatic polyimides with pendent tert-butyl groups as a tougher for epoxy resin |
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| 520 | |a Abstract Polyimides (PIs) with various molecular weights synthesized via the reaction of aromatic diamine monomer containing tert-butyl groups with aromatic dianhydride were highly soluble in common organic solvents and some epoxy resins at room temperature. These PIs can be incorporated in the absence of organic solvent into epoxy resin E51 with the loading below 2 wt% forming EP-PI composites. No phase separation is observed by SEM on cryogenically fractured surfaces of EP-PI composites. The PI can improve mechanical properties, especially impact strength. Adding 2 wt% PI-1.5W, the impact strength reaches to 55 kJ/$ m^{2} $ with the increase in tensile and flexural strengths by 14% and 3%, respectively. SEM analyses for the fracture surface suggest that PI reduces the crosslink density, improves the plasticity of epoxy resin and changes the mode of fracture from fragile to ductile. Moreover, the glass transition temperature of EP-PI composites was found to increase to a significant extent. | ||
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| 650 | 4 | |a Solubility |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a Impact strength |7 (dpeaa)DE-He213 | |
| 700 | 1 | |a Wang, Xing-yi |e verfasserin |4 aut | |
| 700 | 1 | |a Hu, Yan-hong |e verfasserin |4 aut | |
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10.1007/s10118-015-1685-0 doi (DE-627)SPR009227482 (SPR)s10118-015-1685-0-e DE-627 ger DE-627 rakwb eng Zhao, Qing verfasserin aut The application of highly soluble amine-terminated aromatic polyimides with pendent tert-butyl groups as a tougher for epoxy resin 2015 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Polyimides (PIs) with various molecular weights synthesized via the reaction of aromatic diamine monomer containing tert-butyl groups with aromatic dianhydride were highly soluble in common organic solvents and some epoxy resins at room temperature. These PIs can be incorporated in the absence of organic solvent into epoxy resin E51 with the loading below 2 wt% forming EP-PI composites. No phase separation is observed by SEM on cryogenically fractured surfaces of EP-PI composites. The PI can improve mechanical properties, especially impact strength. Adding 2 wt% PI-1.5W, the impact strength reaches to 55 kJ/$ m^{2} $ with the increase in tensile and flexural strengths by 14% and 3%, respectively. SEM analyses for the fracture surface suggest that PI reduces the crosslink density, improves the plasticity of epoxy resin and changes the mode of fracture from fragile to ductile. Moreover, the glass transition temperature of EP-PI composites was found to increase to a significant extent. Polyimide (dpeaa)DE-He213 Epoxy resin (dpeaa)DE-He213 Solubility (dpeaa)DE-He213 Impact strength (dpeaa)DE-He213 Wang, Xing-yi verfasserin aut Hu, Yan-hong verfasserin aut Enthalten in Chinese Journal of Polymer Science Chinese Chemical Society and Institute of Chemistry, CAS, 2009 33(2015), 10 vom: 19. Aug., Seite 1359-1372 (DE-627)356885143 (DE-600)2093161-X 1439-6203 nnns volume:33 year:2015 number:10 day:19 month:08 pages:1359-1372 https://dx.doi.org/10.1007/s10118-015-1685-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_165 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 33 2015 10 19 08 1359-1372 |
| spelling |
10.1007/s10118-015-1685-0 doi (DE-627)SPR009227482 (SPR)s10118-015-1685-0-e DE-627 ger DE-627 rakwb eng Zhao, Qing verfasserin aut The application of highly soluble amine-terminated aromatic polyimides with pendent tert-butyl groups as a tougher for epoxy resin 2015 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Polyimides (PIs) with various molecular weights synthesized via the reaction of aromatic diamine monomer containing tert-butyl groups with aromatic dianhydride were highly soluble in common organic solvents and some epoxy resins at room temperature. These PIs can be incorporated in the absence of organic solvent into epoxy resin E51 with the loading below 2 wt% forming EP-PI composites. No phase separation is observed by SEM on cryogenically fractured surfaces of EP-PI composites. The PI can improve mechanical properties, especially impact strength. Adding 2 wt% PI-1.5W, the impact strength reaches to 55 kJ/$ m^{2} $ with the increase in tensile and flexural strengths by 14% and 3%, respectively. SEM analyses for the fracture surface suggest that PI reduces the crosslink density, improves the plasticity of epoxy resin and changes the mode of fracture from fragile to ductile. Moreover, the glass transition temperature of EP-PI composites was found to increase to a significant extent. Polyimide (dpeaa)DE-He213 Epoxy resin (dpeaa)DE-He213 Solubility (dpeaa)DE-He213 Impact strength (dpeaa)DE-He213 Wang, Xing-yi verfasserin aut Hu, Yan-hong verfasserin aut Enthalten in Chinese Journal of Polymer Science Chinese Chemical Society and Institute of Chemistry, CAS, 2009 33(2015), 10 vom: 19. Aug., Seite 1359-1372 (DE-627)356885143 (DE-600)2093161-X 1439-6203 nnns volume:33 year:2015 number:10 day:19 month:08 pages:1359-1372 https://dx.doi.org/10.1007/s10118-015-1685-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_165 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 33 2015 10 19 08 1359-1372 |
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10.1007/s10118-015-1685-0 doi (DE-627)SPR009227482 (SPR)s10118-015-1685-0-e DE-627 ger DE-627 rakwb eng Zhao, Qing verfasserin aut The application of highly soluble amine-terminated aromatic polyimides with pendent tert-butyl groups as a tougher for epoxy resin 2015 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Polyimides (PIs) with various molecular weights synthesized via the reaction of aromatic diamine monomer containing tert-butyl groups with aromatic dianhydride were highly soluble in common organic solvents and some epoxy resins at room temperature. These PIs can be incorporated in the absence of organic solvent into epoxy resin E51 with the loading below 2 wt% forming EP-PI composites. No phase separation is observed by SEM on cryogenically fractured surfaces of EP-PI composites. The PI can improve mechanical properties, especially impact strength. Adding 2 wt% PI-1.5W, the impact strength reaches to 55 kJ/$ m^{2} $ with the increase in tensile and flexural strengths by 14% and 3%, respectively. SEM analyses for the fracture surface suggest that PI reduces the crosslink density, improves the plasticity of epoxy resin and changes the mode of fracture from fragile to ductile. Moreover, the glass transition temperature of EP-PI composites was found to increase to a significant extent. Polyimide (dpeaa)DE-He213 Epoxy resin (dpeaa)DE-He213 Solubility (dpeaa)DE-He213 Impact strength (dpeaa)DE-He213 Wang, Xing-yi verfasserin aut Hu, Yan-hong verfasserin aut Enthalten in Chinese Journal of Polymer Science Chinese Chemical Society and Institute of Chemistry, CAS, 2009 33(2015), 10 vom: 19. Aug., Seite 1359-1372 (DE-627)356885143 (DE-600)2093161-X 1439-6203 nnns volume:33 year:2015 number:10 day:19 month:08 pages:1359-1372 https://dx.doi.org/10.1007/s10118-015-1685-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_165 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 33 2015 10 19 08 1359-1372 |
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10.1007/s10118-015-1685-0 doi (DE-627)SPR009227482 (SPR)s10118-015-1685-0-e DE-627 ger DE-627 rakwb eng Zhao, Qing verfasserin aut The application of highly soluble amine-terminated aromatic polyimides with pendent tert-butyl groups as a tougher for epoxy resin 2015 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Polyimides (PIs) with various molecular weights synthesized via the reaction of aromatic diamine monomer containing tert-butyl groups with aromatic dianhydride were highly soluble in common organic solvents and some epoxy resins at room temperature. These PIs can be incorporated in the absence of organic solvent into epoxy resin E51 with the loading below 2 wt% forming EP-PI composites. No phase separation is observed by SEM on cryogenically fractured surfaces of EP-PI composites. The PI can improve mechanical properties, especially impact strength. Adding 2 wt% PI-1.5W, the impact strength reaches to 55 kJ/$ m^{2} $ with the increase in tensile and flexural strengths by 14% and 3%, respectively. SEM analyses for the fracture surface suggest that PI reduces the crosslink density, improves the plasticity of epoxy resin and changes the mode of fracture from fragile to ductile. Moreover, the glass transition temperature of EP-PI composites was found to increase to a significant extent. Polyimide (dpeaa)DE-He213 Epoxy resin (dpeaa)DE-He213 Solubility (dpeaa)DE-He213 Impact strength (dpeaa)DE-He213 Wang, Xing-yi verfasserin aut Hu, Yan-hong verfasserin aut Enthalten in Chinese Journal of Polymer Science Chinese Chemical Society and Institute of Chemistry, CAS, 2009 33(2015), 10 vom: 19. Aug., Seite 1359-1372 (DE-627)356885143 (DE-600)2093161-X 1439-6203 nnns volume:33 year:2015 number:10 day:19 month:08 pages:1359-1372 https://dx.doi.org/10.1007/s10118-015-1685-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_165 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 33 2015 10 19 08 1359-1372 |
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10.1007/s10118-015-1685-0 doi (DE-627)SPR009227482 (SPR)s10118-015-1685-0-e DE-627 ger DE-627 rakwb eng Zhao, Qing verfasserin aut The application of highly soluble amine-terminated aromatic polyimides with pendent tert-butyl groups as a tougher for epoxy resin 2015 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Polyimides (PIs) with various molecular weights synthesized via the reaction of aromatic diamine monomer containing tert-butyl groups with aromatic dianhydride were highly soluble in common organic solvents and some epoxy resins at room temperature. These PIs can be incorporated in the absence of organic solvent into epoxy resin E51 with the loading below 2 wt% forming EP-PI composites. No phase separation is observed by SEM on cryogenically fractured surfaces of EP-PI composites. The PI can improve mechanical properties, especially impact strength. Adding 2 wt% PI-1.5W, the impact strength reaches to 55 kJ/$ m^{2} $ with the increase in tensile and flexural strengths by 14% and 3%, respectively. SEM analyses for the fracture surface suggest that PI reduces the crosslink density, improves the plasticity of epoxy resin and changes the mode of fracture from fragile to ductile. Moreover, the glass transition temperature of EP-PI composites was found to increase to a significant extent. Polyimide (dpeaa)DE-He213 Epoxy resin (dpeaa)DE-He213 Solubility (dpeaa)DE-He213 Impact strength (dpeaa)DE-He213 Wang, Xing-yi verfasserin aut Hu, Yan-hong verfasserin aut Enthalten in Chinese Journal of Polymer Science Chinese Chemical Society and Institute of Chemistry, CAS, 2009 33(2015), 10 vom: 19. Aug., Seite 1359-1372 (DE-627)356885143 (DE-600)2093161-X 1439-6203 nnns volume:33 year:2015 number:10 day:19 month:08 pages:1359-1372 https://dx.doi.org/10.1007/s10118-015-1685-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_165 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 33 2015 10 19 08 1359-1372 |
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| author |
Zhao, Qing |
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Zhao, Qing misc Polyimide misc Epoxy resin misc Solubility misc Impact strength The application of highly soluble amine-terminated aromatic polyimides with pendent tert-butyl groups as a tougher for epoxy resin |
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The application of highly soluble amine-terminated aromatic polyimides with pendent tert-butyl groups as a tougher for epoxy resin Polyimide (dpeaa)DE-He213 Epoxy resin (dpeaa)DE-He213 Solubility (dpeaa)DE-He213 Impact strength (dpeaa)DE-He213 |
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misc Polyimide misc Epoxy resin misc Solubility misc Impact strength |
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misc Polyimide misc Epoxy resin misc Solubility misc Impact strength |
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misc Polyimide misc Epoxy resin misc Solubility misc Impact strength |
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The application of highly soluble amine-terminated aromatic polyimides with pendent tert-butyl groups as a tougher for epoxy resin |
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The application of highly soluble amine-terminated aromatic polyimides with pendent tert-butyl groups as a tougher for epoxy resin |
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Zhao, Qing |
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Chinese Journal of Polymer Science |
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Zhao, Qing Wang, Xing-yi Hu, Yan-hong |
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application of highly soluble amine-terminated aromatic polyimides with pendent tert-butyl groups as a tougher for epoxy resin |
| title_auth |
The application of highly soluble amine-terminated aromatic polyimides with pendent tert-butyl groups as a tougher for epoxy resin |
| abstract |
Abstract Polyimides (PIs) with various molecular weights synthesized via the reaction of aromatic diamine monomer containing tert-butyl groups with aromatic dianhydride were highly soluble in common organic solvents and some epoxy resins at room temperature. These PIs can be incorporated in the absence of organic solvent into epoxy resin E51 with the loading below 2 wt% forming EP-PI composites. No phase separation is observed by SEM on cryogenically fractured surfaces of EP-PI composites. The PI can improve mechanical properties, especially impact strength. Adding 2 wt% PI-1.5W, the impact strength reaches to 55 kJ/$ m^{2} $ with the increase in tensile and flexural strengths by 14% and 3%, respectively. SEM analyses for the fracture surface suggest that PI reduces the crosslink density, improves the plasticity of epoxy resin and changes the mode of fracture from fragile to ductile. Moreover, the glass transition temperature of EP-PI composites was found to increase to a significant extent. |
| abstractGer |
Abstract Polyimides (PIs) with various molecular weights synthesized via the reaction of aromatic diamine monomer containing tert-butyl groups with aromatic dianhydride were highly soluble in common organic solvents and some epoxy resins at room temperature. These PIs can be incorporated in the absence of organic solvent into epoxy resin E51 with the loading below 2 wt% forming EP-PI composites. No phase separation is observed by SEM on cryogenically fractured surfaces of EP-PI composites. The PI can improve mechanical properties, especially impact strength. Adding 2 wt% PI-1.5W, the impact strength reaches to 55 kJ/$ m^{2} $ with the increase in tensile and flexural strengths by 14% and 3%, respectively. SEM analyses for the fracture surface suggest that PI reduces the crosslink density, improves the plasticity of epoxy resin and changes the mode of fracture from fragile to ductile. Moreover, the glass transition temperature of EP-PI composites was found to increase to a significant extent. |
| abstract_unstemmed |
Abstract Polyimides (PIs) with various molecular weights synthesized via the reaction of aromatic diamine monomer containing tert-butyl groups with aromatic dianhydride were highly soluble in common organic solvents and some epoxy resins at room temperature. These PIs can be incorporated in the absence of organic solvent into epoxy resin E51 with the loading below 2 wt% forming EP-PI composites. No phase separation is observed by SEM on cryogenically fractured surfaces of EP-PI composites. The PI can improve mechanical properties, especially impact strength. Adding 2 wt% PI-1.5W, the impact strength reaches to 55 kJ/$ m^{2} $ with the increase in tensile and flexural strengths by 14% and 3%, respectively. SEM analyses for the fracture surface suggest that PI reduces the crosslink density, improves the plasticity of epoxy resin and changes the mode of fracture from fragile to ductile. Moreover, the glass transition temperature of EP-PI composites was found to increase to a significant extent. |
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10 |
| title_short |
The application of highly soluble amine-terminated aromatic polyimides with pendent tert-butyl groups as a tougher for epoxy resin |
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https://dx.doi.org/10.1007/s10118-015-1685-0 |
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Wang, Xing-yi Hu, Yan-hong |
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| doi_str |
10.1007/s10118-015-1685-0 |
| up_date |
2024-07-04T01:12:35.104Z |
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