Physical properties of thermally evaporated silicon films nitrided at different rf plasma-processing time

Abstract Nitrided surfaces and composition gradients in thin films exhibit interesting mechanical, electrical, and optical properties. Therefore, amorphous hydrogen-free silicon (a-Si) thin films were deposited by electron beam evaporation and subsequently nitrided by an inductively coupled rf plasm...
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Autor*in:	Mohamed, S. H. [verfasserIn] Raaif, M. [verfasserIn] Abd El-Rahman, A. M. [verfasserIn]

Format:	E-Artikel
Sprache:	Englisch

Erschienen:	2011

Schlagwörter:	Silicon Nitride Electron Beam Evaporation Nitrogen Plasma Silicon Thin Film Nitride Thin Film

Übergeordnetes Werk:	Enthalten in: Journal of materials science - Dordrecht [u.a.] : Springer Science + Business Media B.V, 1966, 47(2011), 6 vom: 23. Nov., Seite 2875-2881
Übergeordnetes Werk:	volume:47 ; year:2011 ; number:6 ; day:23 ; month:11 ; pages:2875-2881

Links:	Volltext

DOI / URN:	10.1007/s10853-011-6117-0

Katalog-ID:	SPR013878514

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520			\|a Abstract Nitrided surfaces and composition gradients in thin films exhibit interesting mechanical, electrical, and optical properties. Therefore, amorphous hydrogen-free silicon (a-Si) thin films were deposited by electron beam evaporation and subsequently nitrided by an inductively coupled rf plasma. The effects of successive plasma-processing cyclic time on structural and optical properties as well as electrical resistivity were examined by different characterization techniques. It was found that the rf plasma treatment has a massive effect on the physical properties of the Si films. The Si thin films were transformed gradually into nitrides compound and the amount of nitrogen in the film increased with increasing the rf plasma-processing time. The Si nitrided films showed structural, optical, and electrical properties dependent on the plasma-nitriding time. Increasing the rf plasma-processing time reduced the thickness, increased transmittance, increased resistivity, and decreased the reflectance of the nitrided Si films. The electrical resistivity increased to about nine orders of magnitude when the film was nitrided at a plasma-processing time of 25 min. The optical band gap increased from 2.42 to 3.52 eV with increasing the plasma-processing time from 10 to 35 min. The decrease in the refractive index with the increase in the plasma-processing time is attributed to the possible change in the bucking density as well as to the increase in the band gap.
650		4	\|a Silicon Nitride \|7 (dpeaa)DE-He213
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650		4	\|a Nitride Thin Film \|7 (dpeaa)DE-He213
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700	1		\|a Abd El-Rahman, A. M. \|e verfasserin \|4 aut
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matchkey_str	article:15734803:2011----::hsclrprisfhraleaoaeslcnimntieadfee
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allfields	10.1007/s10853-011-6117-0 doi (DE-627)SPR013878514 (SPR)s10853-011-6117-0-e DE-627 ger DE-627 rakwb eng 670 ASE 51.00 bkl Mohamed, S. H. verfasserin aut Physical properties of thermally evaporated silicon films nitrided at different rf plasma-processing time 2011 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Nitrided surfaces and composition gradients in thin films exhibit interesting mechanical, electrical, and optical properties. Therefore, amorphous hydrogen-free silicon (a-Si) thin films were deposited by electron beam evaporation and subsequently nitrided by an inductively coupled rf plasma. The effects of successive plasma-processing cyclic time on structural and optical properties as well as electrical resistivity were examined by different characterization techniques. It was found that the rf plasma treatment has a massive effect on the physical properties of the Si films. The Si thin films were transformed gradually into nitrides compound and the amount of nitrogen in the film increased with increasing the rf plasma-processing time. The Si nitrided films showed structural, optical, and electrical properties dependent on the plasma-nitriding time. Increasing the rf plasma-processing time reduced the thickness, increased transmittance, increased resistivity, and decreased the reflectance of the nitrided Si films. The electrical resistivity increased to about nine orders of magnitude when the film was nitrided at a plasma-processing time of 25 min. The optical band gap increased from 2.42 to 3.52 eV with increasing the plasma-processing time from 10 to 35 min. The decrease in the refractive index with the increase in the plasma-processing time is attributed to the possible change in the bucking density as well as to the increase in the band gap. Silicon Nitride (dpeaa)DE-He213 Electron Beam Evaporation (dpeaa)DE-He213 Nitrogen Plasma (dpeaa)DE-He213 Silicon Thin Film (dpeaa)DE-He213 Nitride Thin Film (dpeaa)DE-He213 Raaif, M. verfasserin aut Abd El-Rahman, A. M. verfasserin aut Enthalten in Journal of materials science Dordrecht [u.a.] : Springer Science + Business Media B.V, 1966 47(2011), 6 vom: 23. Nov., Seite 2875-2881 (DE-627)315293969 (DE-600)2015305-3 1573-4803 nnns volume:47 year:2011 number:6 day:23 month:11 pages:2875-2881 https://dx.doi.org/10.1007/s10853-011-6117-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.00 ASE AR 47 2011 6 23 11 2875-2881
spelling	10.1007/s10853-011-6117-0 doi (DE-627)SPR013878514 (SPR)s10853-011-6117-0-e DE-627 ger DE-627 rakwb eng 670 ASE 51.00 bkl Mohamed, S. H. verfasserin aut Physical properties of thermally evaporated silicon films nitrided at different rf plasma-processing time 2011 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Nitrided surfaces and composition gradients in thin films exhibit interesting mechanical, electrical, and optical properties. Therefore, amorphous hydrogen-free silicon (a-Si) thin films were deposited by electron beam evaporation and subsequently nitrided by an inductively coupled rf plasma. The effects of successive plasma-processing cyclic time on structural and optical properties as well as electrical resistivity were examined by different characterization techniques. It was found that the rf plasma treatment has a massive effect on the physical properties of the Si films. The Si thin films were transformed gradually into nitrides compound and the amount of nitrogen in the film increased with increasing the rf plasma-processing time. The Si nitrided films showed structural, optical, and electrical properties dependent on the plasma-nitriding time. Increasing the rf plasma-processing time reduced the thickness, increased transmittance, increased resistivity, and decreased the reflectance of the nitrided Si films. The electrical resistivity increased to about nine orders of magnitude when the film was nitrided at a plasma-processing time of 25 min. The optical band gap increased from 2.42 to 3.52 eV with increasing the plasma-processing time from 10 to 35 min. The decrease in the refractive index with the increase in the plasma-processing time is attributed to the possible change in the bucking density as well as to the increase in the band gap. Silicon Nitride (dpeaa)DE-He213 Electron Beam Evaporation (dpeaa)DE-He213 Nitrogen Plasma (dpeaa)DE-He213 Silicon Thin Film (dpeaa)DE-He213 Nitride Thin Film (dpeaa)DE-He213 Raaif, M. verfasserin aut Abd El-Rahman, A. M. verfasserin aut Enthalten in Journal of materials science Dordrecht [u.a.] : Springer Science + Business Media B.V, 1966 47(2011), 6 vom: 23. Nov., Seite 2875-2881 (DE-627)315293969 (DE-600)2015305-3 1573-4803 nnns volume:47 year:2011 number:6 day:23 month:11 pages:2875-2881 https://dx.doi.org/10.1007/s10853-011-6117-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.00 ASE AR 47 2011 6 23 11 2875-2881
allfields_unstemmed	10.1007/s10853-011-6117-0 doi (DE-627)SPR013878514 (SPR)s10853-011-6117-0-e DE-627 ger DE-627 rakwb eng 670 ASE 51.00 bkl Mohamed, S. H. verfasserin aut Physical properties of thermally evaporated silicon films nitrided at different rf plasma-processing time 2011 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Nitrided surfaces and composition gradients in thin films exhibit interesting mechanical, electrical, and optical properties. Therefore, amorphous hydrogen-free silicon (a-Si) thin films were deposited by electron beam evaporation and subsequently nitrided by an inductively coupled rf plasma. The effects of successive plasma-processing cyclic time on structural and optical properties as well as electrical resistivity were examined by different characterization techniques. It was found that the rf plasma treatment has a massive effect on the physical properties of the Si films. The Si thin films were transformed gradually into nitrides compound and the amount of nitrogen in the film increased with increasing the rf plasma-processing time. The Si nitrided films showed structural, optical, and electrical properties dependent on the plasma-nitriding time. Increasing the rf plasma-processing time reduced the thickness, increased transmittance, increased resistivity, and decreased the reflectance of the nitrided Si films. The electrical resistivity increased to about nine orders of magnitude when the film was nitrided at a plasma-processing time of 25 min. The optical band gap increased from 2.42 to 3.52 eV with increasing the plasma-processing time from 10 to 35 min. The decrease in the refractive index with the increase in the plasma-processing time is attributed to the possible change in the bucking density as well as to the increase in the band gap. Silicon Nitride (dpeaa)DE-He213 Electron Beam Evaporation (dpeaa)DE-He213 Nitrogen Plasma (dpeaa)DE-He213 Silicon Thin Film (dpeaa)DE-He213 Nitride Thin Film (dpeaa)DE-He213 Raaif, M. verfasserin aut Abd El-Rahman, A. M. verfasserin aut Enthalten in Journal of materials science Dordrecht [u.a.] : Springer Science + Business Media B.V, 1966 47(2011), 6 vom: 23. Nov., Seite 2875-2881 (DE-627)315293969 (DE-600)2015305-3 1573-4803 nnns volume:47 year:2011 number:6 day:23 month:11 pages:2875-2881 https://dx.doi.org/10.1007/s10853-011-6117-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.00 ASE AR 47 2011 6 23 11 2875-2881
allfieldsGer	10.1007/s10853-011-6117-0 doi (DE-627)SPR013878514 (SPR)s10853-011-6117-0-e DE-627 ger DE-627 rakwb eng 670 ASE 51.00 bkl Mohamed, S. H. verfasserin aut Physical properties of thermally evaporated silicon films nitrided at different rf plasma-processing time 2011 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Nitrided surfaces and composition gradients in thin films exhibit interesting mechanical, electrical, and optical properties. Therefore, amorphous hydrogen-free silicon (a-Si) thin films were deposited by electron beam evaporation and subsequently nitrided by an inductively coupled rf plasma. The effects of successive plasma-processing cyclic time on structural and optical properties as well as electrical resistivity were examined by different characterization techniques. It was found that the rf plasma treatment has a massive effect on the physical properties of the Si films. The Si thin films were transformed gradually into nitrides compound and the amount of nitrogen in the film increased with increasing the rf plasma-processing time. The Si nitrided films showed structural, optical, and electrical properties dependent on the plasma-nitriding time. Increasing the rf plasma-processing time reduced the thickness, increased transmittance, increased resistivity, and decreased the reflectance of the nitrided Si films. The electrical resistivity increased to about nine orders of magnitude when the film was nitrided at a plasma-processing time of 25 min. The optical band gap increased from 2.42 to 3.52 eV with increasing the plasma-processing time from 10 to 35 min. The decrease in the refractive index with the increase in the plasma-processing time is attributed to the possible change in the bucking density as well as to the increase in the band gap. Silicon Nitride (dpeaa)DE-He213 Electron Beam Evaporation (dpeaa)DE-He213 Nitrogen Plasma (dpeaa)DE-He213 Silicon Thin Film (dpeaa)DE-He213 Nitride Thin Film (dpeaa)DE-He213 Raaif, M. verfasserin aut Abd El-Rahman, A. M. verfasserin aut Enthalten in Journal of materials science Dordrecht [u.a.] : Springer Science + Business Media B.V, 1966 47(2011), 6 vom: 23. Nov., Seite 2875-2881 (DE-627)315293969 (DE-600)2015305-3 1573-4803 nnns volume:47 year:2011 number:6 day:23 month:11 pages:2875-2881 https://dx.doi.org/10.1007/s10853-011-6117-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.00 ASE AR 47 2011 6 23 11 2875-2881
allfieldsSound	10.1007/s10853-011-6117-0 doi (DE-627)SPR013878514 (SPR)s10853-011-6117-0-e DE-627 ger DE-627 rakwb eng 670 ASE 51.00 bkl Mohamed, S. H. verfasserin aut Physical properties of thermally evaporated silicon films nitrided at different rf plasma-processing time 2011 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Nitrided surfaces and composition gradients in thin films exhibit interesting mechanical, electrical, and optical properties. Therefore, amorphous hydrogen-free silicon (a-Si) thin films were deposited by electron beam evaporation and subsequently nitrided by an inductively coupled rf plasma. The effects of successive plasma-processing cyclic time on structural and optical properties as well as electrical resistivity were examined by different characterization techniques. It was found that the rf plasma treatment has a massive effect on the physical properties of the Si films. The Si thin films were transformed gradually into nitrides compound and the amount of nitrogen in the film increased with increasing the rf plasma-processing time. The Si nitrided films showed structural, optical, and electrical properties dependent on the plasma-nitriding time. Increasing the rf plasma-processing time reduced the thickness, increased transmittance, increased resistivity, and decreased the reflectance of the nitrided Si films. The electrical resistivity increased to about nine orders of magnitude when the film was nitrided at a plasma-processing time of 25 min. The optical band gap increased from 2.42 to 3.52 eV with increasing the plasma-processing time from 10 to 35 min. The decrease in the refractive index with the increase in the plasma-processing time is attributed to the possible change in the bucking density as well as to the increase in the band gap. Silicon Nitride (dpeaa)DE-He213 Electron Beam Evaporation (dpeaa)DE-He213 Nitrogen Plasma (dpeaa)DE-He213 Silicon Thin Film (dpeaa)DE-He213 Nitride Thin Film (dpeaa)DE-He213 Raaif, M. verfasserin aut Abd El-Rahman, A. M. verfasserin aut Enthalten in Journal of materials science Dordrecht [u.a.] : Springer Science + Business Media B.V, 1966 47(2011), 6 vom: 23. Nov., Seite 2875-2881 (DE-627)315293969 (DE-600)2015305-3 1573-4803 nnns volume:47 year:2011 number:6 day:23 month:11 pages:2875-2881 https://dx.doi.org/10.1007/s10853-011-6117-0 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.00 ASE AR 47 2011 6 23 11 2875-2881
language	English
source	Enthalten in Journal of materials science 47(2011), 6 vom: 23. Nov., Seite 2875-2881 volume:47 year:2011 number:6 day:23 month:11 pages:2875-2881
sourceStr	Enthalten in Journal of materials science 47(2011), 6 vom: 23. Nov., Seite 2875-2881 volume:47 year:2011 number:6 day:23 month:11 pages:2875-2881
format_phy_str_mv	Article
institution	findex.gbv.de
topic_facet	Silicon Nitride Electron Beam Evaporation Nitrogen Plasma Silicon Thin Film Nitride Thin Film
dewey-raw	670
isfreeaccess_bool	false
container_title	Journal of materials science
authorswithroles_txt_mv	Mohamed, S. H. @@aut@@ Raaif, M. @@aut@@ Abd El-Rahman, A. M. @@aut@@
publishDateDaySort_date	2011-11-23T00:00:00Z
hierarchy_top_id	315293969
dewey-sort	3670
id	SPR013878514
language_de	englisch
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author	Mohamed, S. H.
spellingShingle	Mohamed, S. H. ddc 670 bkl 51.00 misc Silicon Nitride misc Electron Beam Evaporation misc Nitrogen Plasma misc Silicon Thin Film misc Nitride Thin Film Physical properties of thermally evaporated silicon films nitrided at different rf plasma-processing time
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topic_title	670 ASE 51.00 bkl Physical properties of thermally evaporated silicon films nitrided at different rf plasma-processing time Silicon Nitride (dpeaa)DE-He213 Electron Beam Evaporation (dpeaa)DE-He213 Nitrogen Plasma (dpeaa)DE-He213 Silicon Thin Film (dpeaa)DE-He213 Nitride Thin Film (dpeaa)DE-He213
topic	ddc 670 bkl 51.00 misc Silicon Nitride misc Electron Beam Evaporation misc Nitrogen Plasma misc Silicon Thin Film misc Nitride Thin Film
topic_unstemmed	ddc 670 bkl 51.00 misc Silicon Nitride misc Electron Beam Evaporation misc Nitrogen Plasma misc Silicon Thin Film misc Nitride Thin Film
topic_browse	ddc 670 bkl 51.00 misc Silicon Nitride misc Electron Beam Evaporation misc Nitrogen Plasma misc Silicon Thin Film misc Nitride Thin Film
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title	Physical properties of thermally evaporated silicon films nitrided at different rf plasma-processing time
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title_full	Physical properties of thermally evaporated silicon films nitrided at different rf plasma-processing time
author_sort	Mohamed, S. H.
journal	Journal of materials science
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author_browse	Mohamed, S. H. Raaif, M. Abd El-Rahman, A. M.
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title_sort	physical properties of thermally evaporated silicon films nitrided at different rf plasma-processing time
title_auth	Physical properties of thermally evaporated silicon films nitrided at different rf plasma-processing time
abstract	Abstract Nitrided surfaces and composition gradients in thin films exhibit interesting mechanical, electrical, and optical properties. Therefore, amorphous hydrogen-free silicon (a-Si) thin films were deposited by electron beam evaporation and subsequently nitrided by an inductively coupled rf plasma. The effects of successive plasma-processing cyclic time on structural and optical properties as well as electrical resistivity were examined by different characterization techniques. It was found that the rf plasma treatment has a massive effect on the physical properties of the Si films. The Si thin films were transformed gradually into nitrides compound and the amount of nitrogen in the film increased with increasing the rf plasma-processing time. The Si nitrided films showed structural, optical, and electrical properties dependent on the plasma-nitriding time. Increasing the rf plasma-processing time reduced the thickness, increased transmittance, increased resistivity, and decreased the reflectance of the nitrided Si films. The electrical resistivity increased to about nine orders of magnitude when the film was nitrided at a plasma-processing time of 25 min. The optical band gap increased from 2.42 to 3.52 eV with increasing the plasma-processing time from 10 to 35 min. The decrease in the refractive index with the increase in the plasma-processing time is attributed to the possible change in the bucking density as well as to the increase in the band gap.
abstractGer	Abstract Nitrided surfaces and composition gradients in thin films exhibit interesting mechanical, electrical, and optical properties. Therefore, amorphous hydrogen-free silicon (a-Si) thin films were deposited by electron beam evaporation and subsequently nitrided by an inductively coupled rf plasma. The effects of successive plasma-processing cyclic time on structural and optical properties as well as electrical resistivity were examined by different characterization techniques. It was found that the rf plasma treatment has a massive effect on the physical properties of the Si films. The Si thin films were transformed gradually into nitrides compound and the amount of nitrogen in the film increased with increasing the rf plasma-processing time. The Si nitrided films showed structural, optical, and electrical properties dependent on the plasma-nitriding time. Increasing the rf plasma-processing time reduced the thickness, increased transmittance, increased resistivity, and decreased the reflectance of the nitrided Si films. The electrical resistivity increased to about nine orders of magnitude when the film was nitrided at a plasma-processing time of 25 min. The optical band gap increased from 2.42 to 3.52 eV with increasing the plasma-processing time from 10 to 35 min. The decrease in the refractive index with the increase in the plasma-processing time is attributed to the possible change in the bucking density as well as to the increase in the band gap.
abstract_unstemmed	Abstract Nitrided surfaces and composition gradients in thin films exhibit interesting mechanical, electrical, and optical properties. Therefore, amorphous hydrogen-free silicon (a-Si) thin films were deposited by electron beam evaporation and subsequently nitrided by an inductively coupled rf plasma. The effects of successive plasma-processing cyclic time on structural and optical properties as well as electrical resistivity were examined by different characterization techniques. It was found that the rf plasma treatment has a massive effect on the physical properties of the Si films. The Si thin films were transformed gradually into nitrides compound and the amount of nitrogen in the film increased with increasing the rf plasma-processing time. The Si nitrided films showed structural, optical, and electrical properties dependent on the plasma-nitriding time. Increasing the rf plasma-processing time reduced the thickness, increased transmittance, increased resistivity, and decreased the reflectance of the nitrided Si films. The electrical resistivity increased to about nine orders of magnitude when the film was nitrided at a plasma-processing time of 25 min. The optical band gap increased from 2.42 to 3.52 eV with increasing the plasma-processing time from 10 to 35 min. The decrease in the refractive index with the increase in the plasma-processing time is attributed to the possible change in the bucking density as well as to the increase in the band gap.
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title_short	Physical properties of thermally evaporated silicon films nitrided at different rf plasma-processing time
url	https://dx.doi.org/10.1007/s10853-011-6117-0
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author2	Raaif, M. Abd El-Rahman, A. M.
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doi_str	10.1007/s10853-011-6117-0
up_date	2024-07-03T22:44:27.866Z
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fullrecord_marcxml	<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">SPR013878514</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20220111004010.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">201006s2011 xx \|\|\|\|\|o 00\| \|\|eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/s10853-011-6117-0</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)SPR013878514</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(SPR)s10853-011-6117-0-e</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">670</subfield><subfield code="q">ASE</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">51.00</subfield><subfield code="2">bkl</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Mohamed, S. H.</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Physical properties of thermally evaporated silicon films nitrided at different rf plasma-processing time</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2011</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">Computermedien</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Online-Ressource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract Nitrided surfaces and composition gradients in thin films exhibit interesting mechanical, electrical, and optical properties. Therefore, amorphous hydrogen-free silicon (a-Si) thin films were deposited by electron beam evaporation and subsequently nitrided by an inductively coupled rf plasma. The effects of successive plasma-processing cyclic time on structural and optical properties as well as electrical resistivity were examined by different characterization techniques. It was found that the rf plasma treatment has a massive effect on the physical properties of the Si films. The Si thin films were transformed gradually into nitrides compound and the amount of nitrogen in the film increased with increasing the rf plasma-processing time. The Si nitrided films showed structural, optical, and electrical properties dependent on the plasma-nitriding time. Increasing the rf plasma-processing time reduced the thickness, increased transmittance, increased resistivity, and decreased the reflectance of the nitrided Si films. The electrical resistivity increased to about nine orders of magnitude when the film was nitrided at a plasma-processing time of 25 min. The optical band gap increased from 2.42 to 3.52 eV with increasing the plasma-processing time from 10 to 35 min. The decrease in the refractive index with the increase in the plasma-processing time is attributed to the possible change in the bucking density as well as to the increase in the band gap.</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Silicon Nitride</subfield><subfield code="7">(dpeaa)DE-He213</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electron Beam Evaporation</subfield><subfield code="7">(dpeaa)DE-He213</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Nitrogen Plasma</subfield><subfield code="7">(dpeaa)DE-He213</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Silicon Thin Film</subfield><subfield code="7">(dpeaa)DE-He213</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Nitride Thin Film</subfield><subfield code="7">(dpeaa)DE-He213</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Raaif, M.</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Abd El-Rahman, A. 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Physical properties of thermally evaporated silicon films nitrided at different rf plasma-processing time

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