Ultra-high ON/OFF ratio and multi-storage on NiO resistive switching device
Abstract Inserting ultra-thin Ta films into a NiO resistive switching device enabled the achievement of an ultra-high ON/OFF ratio in the order of $ 10^{6} $ and a 4-order higher resistance than normal binary oxide resistive random access memory device. Observations confirmed that the interface play...
Ausführliche Beschreibung
Autor*in: |
Ma, Guokun [verfasserIn] Tang, Xiaoli [verfasserIn] Zhang, Huaiwu [verfasserIn] Zhong, Zhiyong [verfasserIn] Li, Xia [verfasserIn] Li, Jie [verfasserIn] Su, Hua [verfasserIn] |
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Format: |
E-Artikel |
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Sprache: |
Englisch |
Erschienen: |
2016 |
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Schlagwörter: |
Resistive Random Access Memory |
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Übergeordnetes Werk: |
Enthalten in: Journal of materials science - Dordrecht [u.a.] : Springer Science + Business Media B.V, 1966, 52(2016), 1 vom: 01. Sept., Seite 238-246 |
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Übergeordnetes Werk: |
volume:52 ; year:2016 ; number:1 ; day:01 ; month:09 ; pages:238-246 |
Links: |
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DOI / URN: |
10.1007/s10853-016-0326-5 |
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Katalog-ID: |
SPR013919008 |
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520 | |a Abstract Inserting ultra-thin Ta films into a NiO resistive switching device enabled the achievement of an ultra-high ON/OFF ratio in the order of $ 10^{6} $ and a 4-order higher resistance than normal binary oxide resistive random access memory device. Observations confirmed that the interface played an important role in controlling resistive switching properties and the microanalysis revealed the oxygen diffused into the Ta layer, serving as an oxygen scavenging effect. Based on the achieving high ON/OFF ratio, a multi-storage device with five stable resistive states was fabricated. The storage density has increased exponentially through this protocol compared with the traditional binary storage. | ||
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700 | 1 | |a Li, Jie |e verfasserin |4 aut | |
700 | 1 | |a Su, Hua |e verfasserin |4 aut | |
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10.1007/s10853-016-0326-5 doi (DE-627)SPR013919008 (SPR)s10853-016-0326-5-e DE-627 ger DE-627 rakwb eng 670 ASE 51.00 bkl Ma, Guokun verfasserin aut Ultra-high ON/OFF ratio and multi-storage on NiO resistive switching device 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Inserting ultra-thin Ta films into a NiO resistive switching device enabled the achievement of an ultra-high ON/OFF ratio in the order of $ 10^{6} $ and a 4-order higher resistance than normal binary oxide resistive random access memory device. Observations confirmed that the interface played an important role in controlling resistive switching properties and the microanalysis revealed the oxygen diffused into the Ta layer, serving as an oxygen scavenging effect. Based on the achieving high ON/OFF ratio, a multi-storage device with five stable resistive states was fabricated. The storage density has increased exponentially through this protocol compared with the traditional binary storage. Resistive Switching (dpeaa)DE-He213 High Resistance State (dpeaa)DE-He213 Resistive Random Access Memory (dpeaa)DE-He213 Resistive Random Access Memory Device (dpeaa)DE-He213 Reset Voltage (dpeaa)DE-He213 Tang, Xiaoli verfasserin aut Zhang, Huaiwu verfasserin aut Zhong, Zhiyong verfasserin aut Li, Xia verfasserin aut Li, Jie verfasserin aut Su, Hua verfasserin aut Enthalten in Journal of materials science Dordrecht [u.a.] : Springer Science + Business Media B.V, 1966 52(2016), 1 vom: 01. Sept., Seite 238-246 (DE-627)315293969 (DE-600)2015305-3 1573-4803 nnns volume:52 year:2016 number:1 day:01 month:09 pages:238-246 https://dx.doi.org/10.1007/s10853-016-0326-5 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.00 ASE AR 52 2016 1 01 09 238-246 |
spelling |
10.1007/s10853-016-0326-5 doi (DE-627)SPR013919008 (SPR)s10853-016-0326-5-e DE-627 ger DE-627 rakwb eng 670 ASE 51.00 bkl Ma, Guokun verfasserin aut Ultra-high ON/OFF ratio and multi-storage on NiO resistive switching device 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Inserting ultra-thin Ta films into a NiO resistive switching device enabled the achievement of an ultra-high ON/OFF ratio in the order of $ 10^{6} $ and a 4-order higher resistance than normal binary oxide resistive random access memory device. Observations confirmed that the interface played an important role in controlling resistive switching properties and the microanalysis revealed the oxygen diffused into the Ta layer, serving as an oxygen scavenging effect. Based on the achieving high ON/OFF ratio, a multi-storage device with five stable resistive states was fabricated. The storage density has increased exponentially through this protocol compared with the traditional binary storage. Resistive Switching (dpeaa)DE-He213 High Resistance State (dpeaa)DE-He213 Resistive Random Access Memory (dpeaa)DE-He213 Resistive Random Access Memory Device (dpeaa)DE-He213 Reset Voltage (dpeaa)DE-He213 Tang, Xiaoli verfasserin aut Zhang, Huaiwu verfasserin aut Zhong, Zhiyong verfasserin aut Li, Xia verfasserin aut Li, Jie verfasserin aut Su, Hua verfasserin aut Enthalten in Journal of materials science Dordrecht [u.a.] : Springer Science + Business Media B.V, 1966 52(2016), 1 vom: 01. Sept., Seite 238-246 (DE-627)315293969 (DE-600)2015305-3 1573-4803 nnns volume:52 year:2016 number:1 day:01 month:09 pages:238-246 https://dx.doi.org/10.1007/s10853-016-0326-5 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.00 ASE AR 52 2016 1 01 09 238-246 |
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10.1007/s10853-016-0326-5 doi (DE-627)SPR013919008 (SPR)s10853-016-0326-5-e DE-627 ger DE-627 rakwb eng 670 ASE 51.00 bkl Ma, Guokun verfasserin aut Ultra-high ON/OFF ratio and multi-storage on NiO resistive switching device 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Inserting ultra-thin Ta films into a NiO resistive switching device enabled the achievement of an ultra-high ON/OFF ratio in the order of $ 10^{6} $ and a 4-order higher resistance than normal binary oxide resistive random access memory device. Observations confirmed that the interface played an important role in controlling resistive switching properties and the microanalysis revealed the oxygen diffused into the Ta layer, serving as an oxygen scavenging effect. Based on the achieving high ON/OFF ratio, a multi-storage device with five stable resistive states was fabricated. The storage density has increased exponentially through this protocol compared with the traditional binary storage. Resistive Switching (dpeaa)DE-He213 High Resistance State (dpeaa)DE-He213 Resistive Random Access Memory (dpeaa)DE-He213 Resistive Random Access Memory Device (dpeaa)DE-He213 Reset Voltage (dpeaa)DE-He213 Tang, Xiaoli verfasserin aut Zhang, Huaiwu verfasserin aut Zhong, Zhiyong verfasserin aut Li, Xia verfasserin aut Li, Jie verfasserin aut Su, Hua verfasserin aut Enthalten in Journal of materials science Dordrecht [u.a.] : Springer Science + Business Media B.V, 1966 52(2016), 1 vom: 01. Sept., Seite 238-246 (DE-627)315293969 (DE-600)2015305-3 1573-4803 nnns volume:52 year:2016 number:1 day:01 month:09 pages:238-246 https://dx.doi.org/10.1007/s10853-016-0326-5 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.00 ASE AR 52 2016 1 01 09 238-246 |
allfieldsGer |
10.1007/s10853-016-0326-5 doi (DE-627)SPR013919008 (SPR)s10853-016-0326-5-e DE-627 ger DE-627 rakwb eng 670 ASE 51.00 bkl Ma, Guokun verfasserin aut Ultra-high ON/OFF ratio and multi-storage on NiO resistive switching device 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Inserting ultra-thin Ta films into a NiO resistive switching device enabled the achievement of an ultra-high ON/OFF ratio in the order of $ 10^{6} $ and a 4-order higher resistance than normal binary oxide resistive random access memory device. Observations confirmed that the interface played an important role in controlling resistive switching properties and the microanalysis revealed the oxygen diffused into the Ta layer, serving as an oxygen scavenging effect. Based on the achieving high ON/OFF ratio, a multi-storage device with five stable resistive states was fabricated. The storage density has increased exponentially through this protocol compared with the traditional binary storage. Resistive Switching (dpeaa)DE-He213 High Resistance State (dpeaa)DE-He213 Resistive Random Access Memory (dpeaa)DE-He213 Resistive Random Access Memory Device (dpeaa)DE-He213 Reset Voltage (dpeaa)DE-He213 Tang, Xiaoli verfasserin aut Zhang, Huaiwu verfasserin aut Zhong, Zhiyong verfasserin aut Li, Xia verfasserin aut Li, Jie verfasserin aut Su, Hua verfasserin aut Enthalten in Journal of materials science Dordrecht [u.a.] : Springer Science + Business Media B.V, 1966 52(2016), 1 vom: 01. Sept., Seite 238-246 (DE-627)315293969 (DE-600)2015305-3 1573-4803 nnns volume:52 year:2016 number:1 day:01 month:09 pages:238-246 https://dx.doi.org/10.1007/s10853-016-0326-5 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.00 ASE AR 52 2016 1 01 09 238-246 |
allfieldsSound |
10.1007/s10853-016-0326-5 doi (DE-627)SPR013919008 (SPR)s10853-016-0326-5-e DE-627 ger DE-627 rakwb eng 670 ASE 51.00 bkl Ma, Guokun verfasserin aut Ultra-high ON/OFF ratio and multi-storage on NiO resistive switching device 2016 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Inserting ultra-thin Ta films into a NiO resistive switching device enabled the achievement of an ultra-high ON/OFF ratio in the order of $ 10^{6} $ and a 4-order higher resistance than normal binary oxide resistive random access memory device. Observations confirmed that the interface played an important role in controlling resistive switching properties and the microanalysis revealed the oxygen diffused into the Ta layer, serving as an oxygen scavenging effect. Based on the achieving high ON/OFF ratio, a multi-storage device with five stable resistive states was fabricated. The storage density has increased exponentially through this protocol compared with the traditional binary storage. Resistive Switching (dpeaa)DE-He213 High Resistance State (dpeaa)DE-He213 Resistive Random Access Memory (dpeaa)DE-He213 Resistive Random Access Memory Device (dpeaa)DE-He213 Reset Voltage (dpeaa)DE-He213 Tang, Xiaoli verfasserin aut Zhang, Huaiwu verfasserin aut Zhong, Zhiyong verfasserin aut Li, Xia verfasserin aut Li, Jie verfasserin aut Su, Hua verfasserin aut Enthalten in Journal of materials science Dordrecht [u.a.] : Springer Science + Business Media B.V, 1966 52(2016), 1 vom: 01. Sept., Seite 238-246 (DE-627)315293969 (DE-600)2015305-3 1573-4803 nnns volume:52 year:2016 number:1 day:01 month:09 pages:238-246 https://dx.doi.org/10.1007/s10853-016-0326-5 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_206 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2056 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 51.00 ASE AR 52 2016 1 01 09 238-246 |
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Enthalten in Journal of materials science 52(2016), 1 vom: 01. Sept., Seite 238-246 volume:52 year:2016 number:1 day:01 month:09 pages:238-246 |
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Resistive Switching High Resistance State Resistive Random Access Memory Resistive Random Access Memory Device Reset Voltage |
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Ma, Guokun @@aut@@ Tang, Xiaoli @@aut@@ Zhang, Huaiwu @@aut@@ Zhong, Zhiyong @@aut@@ Li, Xia @@aut@@ Li, Jie @@aut@@ Su, Hua @@aut@@ |
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<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">SPR013919008</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20220111004141.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">201006s2016 xx |||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/s10853-016-0326-5</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)SPR013919008</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(SPR)s10853-016-0326-5-e</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2="4"><subfield code="a">670</subfield><subfield code="q">ASE</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">51.00</subfield><subfield code="2">bkl</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Ma, Guokun</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Ultra-high ON/OFF ratio and multi-storage on NiO resistive switching device</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2016</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">Computermedien</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Online-Ressource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract Inserting ultra-thin Ta films into a NiO resistive switching device enabled the achievement of an ultra-high ON/OFF ratio in the order of $ 10^{6} $ and a 4-order higher resistance than normal binary oxide resistive random access memory device. Observations confirmed that the interface played an important role in controlling resistive switching properties and the microanalysis revealed the oxygen diffused into the Ta layer, serving as an oxygen scavenging effect. Based on the achieving high ON/OFF ratio, a multi-storage device with five stable resistive states was fabricated. 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Ma, Guokun |
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Ma, Guokun ddc 670 bkl 51.00 misc Resistive Switching misc High Resistance State misc Resistive Random Access Memory misc Resistive Random Access Memory Device misc Reset Voltage Ultra-high ON/OFF ratio and multi-storage on NiO resistive switching device |
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670 ASE 51.00 bkl Ultra-high ON/OFF ratio and multi-storage on NiO resistive switching device Resistive Switching (dpeaa)DE-He213 High Resistance State (dpeaa)DE-He213 Resistive Random Access Memory (dpeaa)DE-He213 Resistive Random Access Memory Device (dpeaa)DE-He213 Reset Voltage (dpeaa)DE-He213 |
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Ma, Guokun Tang, Xiaoli Zhang, Huaiwu Zhong, Zhiyong Li, Xia Li, Jie Su, Hua |
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ultra-high on/off ratio and multi-storage on nio resistive switching device |
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Ultra-high ON/OFF ratio and multi-storage on NiO resistive switching device |
abstract |
Abstract Inserting ultra-thin Ta films into a NiO resistive switching device enabled the achievement of an ultra-high ON/OFF ratio in the order of $ 10^{6} $ and a 4-order higher resistance than normal binary oxide resistive random access memory device. Observations confirmed that the interface played an important role in controlling resistive switching properties and the microanalysis revealed the oxygen diffused into the Ta layer, serving as an oxygen scavenging effect. Based on the achieving high ON/OFF ratio, a multi-storage device with five stable resistive states was fabricated. The storage density has increased exponentially through this protocol compared with the traditional binary storage. |
abstractGer |
Abstract Inserting ultra-thin Ta films into a NiO resistive switching device enabled the achievement of an ultra-high ON/OFF ratio in the order of $ 10^{6} $ and a 4-order higher resistance than normal binary oxide resistive random access memory device. Observations confirmed that the interface played an important role in controlling resistive switching properties and the microanalysis revealed the oxygen diffused into the Ta layer, serving as an oxygen scavenging effect. Based on the achieving high ON/OFF ratio, a multi-storage device with five stable resistive states was fabricated. The storage density has increased exponentially through this protocol compared with the traditional binary storage. |
abstract_unstemmed |
Abstract Inserting ultra-thin Ta films into a NiO resistive switching device enabled the achievement of an ultra-high ON/OFF ratio in the order of $ 10^{6} $ and a 4-order higher resistance than normal binary oxide resistive random access memory device. Observations confirmed that the interface played an important role in controlling resistive switching properties and the microanalysis revealed the oxygen diffused into the Ta layer, serving as an oxygen scavenging effect. Based on the achieving high ON/OFF ratio, a multi-storage device with five stable resistive states was fabricated. The storage density has increased exponentially through this protocol compared with the traditional binary storage. |
collection_details |
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container_issue |
1 |
title_short |
Ultra-high ON/OFF ratio and multi-storage on NiO resistive switching device |
url |
https://dx.doi.org/10.1007/s10853-016-0326-5 |
remote_bool |
true |
author2 |
Tang, Xiaoli Zhang, Huaiwu Zhong, Zhiyong Li, Xia Li, Jie Su, Hua |
author2Str |
Tang, Xiaoli Zhang, Huaiwu Zhong, Zhiyong Li, Xia Li, Jie Su, Hua |
ppnlink |
315293969 |
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hochschulschrift_bool |
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doi_str |
10.1007/s10853-016-0326-5 |
up_date |
2024-07-03T23:00:56.143Z |
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score |
7.400222 |