Composite lead-free electronic solders

Abstract Composite approaches have been developed in lead-free solder research in an effort to improve the service temperature capabilities and thermal stability of the solder joints. This article overviews the background for composite lead-free solder development, the roles of reinforcements and th...
Ausführliche Beschreibung

Gespeichert in:

Autor*in:	Guo, Fu [verfasserIn]

Format:	E-Artikel
Sprache:	Englisch

Erschienen:	2006

Schlagwörter:	Solder Joint Solder Alloy Intermetallic Layer Reinforcement Particle Composite Solder

Übergeordnetes Werk:	Enthalten in: Journal of materials science - Dordrecht [u.a.] : Springer Science + Business Media B.V, 1990, 18(2006), 1-3 vom: 22. Sept., Seite 129-145
Übergeordnetes Werk:	volume:18 ; year:2006 ; number:1-3 ; day:22 ; month:09 ; pages:129-145

Links:	Volltext

DOI / URN:	10.1007/s10854-006-9019-1

Katalog-ID:	SPR013960709

Internformat


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520			\|a Abstract Composite approaches have been developed in lead-free solder research in an effort to improve the service temperature capabilities and thermal stability of the solder joints. This article overviews the background for composite lead-free solder development, the roles of reinforcements and their requirements, composite solder processing techniques, as well as current status of composite solder research. Examples of several representative lead-free composite solders produced with various methods and reinforcement types are presented. The effects of reinforcement addition on processing and mechanical properties are analyzed. Difficulties and problems that exist in composite solder research are proposed and tentative solutions are attempted with examples of newly emerging novel lead-free composite solders.
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author_variant	f g fg
matchkey_str	article:1573482X:2006----::opstlafeeeto
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bklnumber	33.61 51.10 51.40 53.09
publishDate	2006
allfields	10.1007/s10854-006-9019-1 doi (DE-627)SPR013960709 (SPR)s10854-006-9019-1-e DE-627 ger DE-627 rakwb eng 600 670 620 ASE 33.61 bkl 51.10 bkl 51.40 bkl 53.09 bkl Guo, Fu verfasserin aut Composite lead-free electronic solders 2006 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Composite approaches have been developed in lead-free solder research in an effort to improve the service temperature capabilities and thermal stability of the solder joints. This article overviews the background for composite lead-free solder development, the roles of reinforcements and their requirements, composite solder processing techniques, as well as current status of composite solder research. Examples of several representative lead-free composite solders produced with various methods and reinforcement types are presented. The effects of reinforcement addition on processing and mechanical properties are analyzed. Difficulties and problems that exist in composite solder research are proposed and tentative solutions are attempted with examples of newly emerging novel lead-free composite solders. Solder Joint (dpeaa)DE-He213 Solder Alloy (dpeaa)DE-He213 Intermetallic Layer (dpeaa)DE-He213 Reinforcement Particle (dpeaa)DE-He213 Composite Solder (dpeaa)DE-He213 Enthalten in Journal of materials science Dordrecht [u.a.] : Springer Science + Business Media B.V, 1990 18(2006), 1-3 vom: 22. Sept., Seite 129-145 (DE-627)317827154 (DE-600)2016994-2 1573-482X nnns volume:18 year:2006 number:1-3 day:22 month:09 pages:129-145 https://dx.doi.org/10.1007/s10854-006-9019-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 33.61 ASE 51.10 ASE 51.40 ASE 53.09 ASE AR 18 2006 1-3 22 09 129-145
spelling	10.1007/s10854-006-9019-1 doi (DE-627)SPR013960709 (SPR)s10854-006-9019-1-e DE-627 ger DE-627 rakwb eng 600 670 620 ASE 33.61 bkl 51.10 bkl 51.40 bkl 53.09 bkl Guo, Fu verfasserin aut Composite lead-free electronic solders 2006 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Composite approaches have been developed in lead-free solder research in an effort to improve the service temperature capabilities and thermal stability of the solder joints. This article overviews the background for composite lead-free solder development, the roles of reinforcements and their requirements, composite solder processing techniques, as well as current status of composite solder research. Examples of several representative lead-free composite solders produced with various methods and reinforcement types are presented. The effects of reinforcement addition on processing and mechanical properties are analyzed. Difficulties and problems that exist in composite solder research are proposed and tentative solutions are attempted with examples of newly emerging novel lead-free composite solders. Solder Joint (dpeaa)DE-He213 Solder Alloy (dpeaa)DE-He213 Intermetallic Layer (dpeaa)DE-He213 Reinforcement Particle (dpeaa)DE-He213 Composite Solder (dpeaa)DE-He213 Enthalten in Journal of materials science Dordrecht [u.a.] : Springer Science + Business Media B.V, 1990 18(2006), 1-3 vom: 22. Sept., Seite 129-145 (DE-627)317827154 (DE-600)2016994-2 1573-482X nnns volume:18 year:2006 number:1-3 day:22 month:09 pages:129-145 https://dx.doi.org/10.1007/s10854-006-9019-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 33.61 ASE 51.10 ASE 51.40 ASE 53.09 ASE AR 18 2006 1-3 22 09 129-145
allfields_unstemmed	10.1007/s10854-006-9019-1 doi (DE-627)SPR013960709 (SPR)s10854-006-9019-1-e DE-627 ger DE-627 rakwb eng 600 670 620 ASE 33.61 bkl 51.10 bkl 51.40 bkl 53.09 bkl Guo, Fu verfasserin aut Composite lead-free electronic solders 2006 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Composite approaches have been developed in lead-free solder research in an effort to improve the service temperature capabilities and thermal stability of the solder joints. This article overviews the background for composite lead-free solder development, the roles of reinforcements and their requirements, composite solder processing techniques, as well as current status of composite solder research. Examples of several representative lead-free composite solders produced with various methods and reinforcement types are presented. The effects of reinforcement addition on processing and mechanical properties are analyzed. Difficulties and problems that exist in composite solder research are proposed and tentative solutions are attempted with examples of newly emerging novel lead-free composite solders. Solder Joint (dpeaa)DE-He213 Solder Alloy (dpeaa)DE-He213 Intermetallic Layer (dpeaa)DE-He213 Reinforcement Particle (dpeaa)DE-He213 Composite Solder (dpeaa)DE-He213 Enthalten in Journal of materials science Dordrecht [u.a.] : Springer Science + Business Media B.V, 1990 18(2006), 1-3 vom: 22. Sept., Seite 129-145 (DE-627)317827154 (DE-600)2016994-2 1573-482X nnns volume:18 year:2006 number:1-3 day:22 month:09 pages:129-145 https://dx.doi.org/10.1007/s10854-006-9019-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 33.61 ASE 51.10 ASE 51.40 ASE 53.09 ASE AR 18 2006 1-3 22 09 129-145
allfieldsGer	10.1007/s10854-006-9019-1 doi (DE-627)SPR013960709 (SPR)s10854-006-9019-1-e DE-627 ger DE-627 rakwb eng 600 670 620 ASE 33.61 bkl 51.10 bkl 51.40 bkl 53.09 bkl Guo, Fu verfasserin aut Composite lead-free electronic solders 2006 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Composite approaches have been developed in lead-free solder research in an effort to improve the service temperature capabilities and thermal stability of the solder joints. This article overviews the background for composite lead-free solder development, the roles of reinforcements and their requirements, composite solder processing techniques, as well as current status of composite solder research. Examples of several representative lead-free composite solders produced with various methods and reinforcement types are presented. The effects of reinforcement addition on processing and mechanical properties are analyzed. Difficulties and problems that exist in composite solder research are proposed and tentative solutions are attempted with examples of newly emerging novel lead-free composite solders. Solder Joint (dpeaa)DE-He213 Solder Alloy (dpeaa)DE-He213 Intermetallic Layer (dpeaa)DE-He213 Reinforcement Particle (dpeaa)DE-He213 Composite Solder (dpeaa)DE-He213 Enthalten in Journal of materials science Dordrecht [u.a.] : Springer Science + Business Media B.V, 1990 18(2006), 1-3 vom: 22. Sept., Seite 129-145 (DE-627)317827154 (DE-600)2016994-2 1573-482X nnns volume:18 year:2006 number:1-3 day:22 month:09 pages:129-145 https://dx.doi.org/10.1007/s10854-006-9019-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 33.61 ASE 51.10 ASE 51.40 ASE 53.09 ASE AR 18 2006 1-3 22 09 129-145
allfieldsSound	10.1007/s10854-006-9019-1 doi (DE-627)SPR013960709 (SPR)s10854-006-9019-1-e DE-627 ger DE-627 rakwb eng 600 670 620 ASE 33.61 bkl 51.10 bkl 51.40 bkl 53.09 bkl Guo, Fu verfasserin aut Composite lead-free electronic solders 2006 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier Abstract Composite approaches have been developed in lead-free solder research in an effort to improve the service temperature capabilities and thermal stability of the solder joints. This article overviews the background for composite lead-free solder development, the roles of reinforcements and their requirements, composite solder processing techniques, as well as current status of composite solder research. Examples of several representative lead-free composite solders produced with various methods and reinforcement types are presented. The effects of reinforcement addition on processing and mechanical properties are analyzed. Difficulties and problems that exist in composite solder research are proposed and tentative solutions are attempted with examples of newly emerging novel lead-free composite solders. Solder Joint (dpeaa)DE-He213 Solder Alloy (dpeaa)DE-He213 Intermetallic Layer (dpeaa)DE-He213 Reinforcement Particle (dpeaa)DE-He213 Composite Solder (dpeaa)DE-He213 Enthalten in Journal of materials science Dordrecht [u.a.] : Springer Science + Business Media B.V, 1990 18(2006), 1-3 vom: 22. Sept., Seite 129-145 (DE-627)317827154 (DE-600)2016994-2 1573-482X nnns volume:18 year:2006 number:1-3 day:22 month:09 pages:129-145 https://dx.doi.org/10.1007/s10854-006-9019-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 33.61 ASE 51.10 ASE 51.40 ASE 53.09 ASE AR 18 2006 1-3 22 09 129-145
language	English
source	Enthalten in Journal of materials science 18(2006), 1-3 vom: 22. Sept., Seite 129-145 volume:18 year:2006 number:1-3 day:22 month:09 pages:129-145
sourceStr	Enthalten in Journal of materials science 18(2006), 1-3 vom: 22. Sept., Seite 129-145 volume:18 year:2006 number:1-3 day:22 month:09 pages:129-145
format_phy_str_mv	Article
institution	findex.gbv.de
topic_facet	Solder Joint Solder Alloy Intermetallic Layer Reinforcement Particle Composite Solder
dewey-raw	600
isfreeaccess_bool	false
container_title	Journal of materials science
authorswithroles_txt_mv	Guo, Fu @@aut@@
publishDateDaySort_date	2006-09-22T00:00:00Z
hierarchy_top_id	317827154
dewey-sort	3600
id	SPR013960709
language_de	englisch
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author	Guo, Fu
spellingShingle	Guo, Fu ddc 600 bkl 33.61 bkl 51.10 bkl 51.40 bkl 53.09 misc Solder Joint misc Solder Alloy misc Intermetallic Layer misc Reinforcement Particle misc Composite Solder Composite lead-free electronic solders
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topic_title	600 670 620 ASE 33.61 bkl 51.10 bkl 51.40 bkl 53.09 bkl Composite lead-free electronic solders Solder Joint (dpeaa)DE-He213 Solder Alloy (dpeaa)DE-He213 Intermetallic Layer (dpeaa)DE-He213 Reinforcement Particle (dpeaa)DE-He213 Composite Solder (dpeaa)DE-He213
topic	ddc 600 bkl 33.61 bkl 51.10 bkl 51.40 bkl 53.09 misc Solder Joint misc Solder Alloy misc Intermetallic Layer misc Reinforcement Particle misc Composite Solder
topic_unstemmed	ddc 600 bkl 33.61 bkl 51.10 bkl 51.40 bkl 53.09 misc Solder Joint misc Solder Alloy misc Intermetallic Layer misc Reinforcement Particle misc Composite Solder
topic_browse	ddc 600 bkl 33.61 bkl 51.10 bkl 51.40 bkl 53.09 misc Solder Joint misc Solder Alloy misc Intermetallic Layer misc Reinforcement Particle misc Composite Solder
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title	Composite lead-free electronic solders
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title_full	Composite lead-free electronic solders
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title_sort	composite lead-free electronic solders
title_auth	Composite lead-free electronic solders
abstract	Abstract Composite approaches have been developed in lead-free solder research in an effort to improve the service temperature capabilities and thermal stability of the solder joints. This article overviews the background for composite lead-free solder development, the roles of reinforcements and their requirements, composite solder processing techniques, as well as current status of composite solder research. Examples of several representative lead-free composite solders produced with various methods and reinforcement types are presented. The effects of reinforcement addition on processing and mechanical properties are analyzed. Difficulties and problems that exist in composite solder research are proposed and tentative solutions are attempted with examples of newly emerging novel lead-free composite solders.
abstractGer	Abstract Composite approaches have been developed in lead-free solder research in an effort to improve the service temperature capabilities and thermal stability of the solder joints. This article overviews the background for composite lead-free solder development, the roles of reinforcements and their requirements, composite solder processing techniques, as well as current status of composite solder research. Examples of several representative lead-free composite solders produced with various methods and reinforcement types are presented. The effects of reinforcement addition on processing and mechanical properties are analyzed. Difficulties and problems that exist in composite solder research are proposed and tentative solutions are attempted with examples of newly emerging novel lead-free composite solders.
abstract_unstemmed	Abstract Composite approaches have been developed in lead-free solder research in an effort to improve the service temperature capabilities and thermal stability of the solder joints. This article overviews the background for composite lead-free solder development, the roles of reinforcements and their requirements, composite solder processing techniques, as well as current status of composite solder research. Examples of several representative lead-free composite solders produced with various methods and reinforcement types are presented. The effects of reinforcement addition on processing and mechanical properties are analyzed. Difficulties and problems that exist in composite solder research are proposed and tentative solutions are attempted with examples of newly emerging novel lead-free composite solders.
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title_short	Composite lead-free electronic solders
url	https://dx.doi.org/10.1007/s10854-006-9019-1
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up_date	2024-07-03T23:17:10.219Z
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