Preparation of Ag-Ni-Cu Composite Material by Ultrasonic Arc Spray Forming and Accumulative Roll Bonding and the Evolution of Its Microstructure
Abstract We prepared a layered composite material by subjecting a deposition billet of $ AgNiCu_{15-5} $ formed by ultrasonic arc spray forming (UASF) to extrusion at 773 K (500 °C), rolling at 673 K (400 °C), and accumulative roll bonding (ARB). The evolution of the microstructure of the formed $ A...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Zhang, Ke [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2014 |
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| Schlagwörter: |
Accumulative Roll Bonding Process |
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| Anmerkung: |
© The Minerals, Metals & Materials Society and ASM International 2014 |
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| Übergeordnetes Werk: |
Enthalten in: Metallurgical and materials transactions - Boston : Springer, 1975, 46(2014), 2 vom: 04. Nov., Seite 880-886 |
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| Übergeordnetes Werk: |
volume:46 ; year:2014 ; number:2 ; day:04 ; month:11 ; pages:880-886 |
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| DOI / URN: |
10.1007/s11661-014-2642-1 |
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| Katalog-ID: |
SPR021404348 |
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| 520 | |a Abstract We prepared a layered composite material by subjecting a deposition billet of $ AgNiCu_{15-5} $ formed by ultrasonic arc spray forming (UASF) to extrusion at 773 K (500 °C), rolling at 673 K (400 °C), and accumulative roll bonding (ARB). The evolution of the microstructure of the formed $ AgNiCu_{15-5} $ strips was analyzed through X-ray diffraction analysis, scanning electron microscopy, and energy-dispersive spectrometry. The deposition billet had a rapid solidification microstructure consisting of β-Ni particles dispersed in α-Ag matrix. ARB significantly refined the microstructure of the $ AgNiCu_{15-5} $ samples. There was no further decrease in the grain size after the 9th ARB cycle. Thus, UASF combined with extrusion and ARB is suitable for producing high-performance $ AgNiCu_{15-5} $-based electrical contact materials efficiently and economically. | ||
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| 650 | 4 | |a Metastable Solid Solution |7 (dpeaa)DE-He213 | |
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| 700 | 1 | |a Xu, Si-Yong |4 aut | |
| 700 | 1 | |a Guo, Jin-Xin |4 aut | |
| 700 | 1 | |a Ma, Guang |4 aut | |
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10.1007/s11661-014-2642-1 doi (DE-627)SPR021404348 (SPR)s11661-014-2642-1-e DE-627 ger DE-627 rakwb eng Zhang, Ke verfasserin aut Preparation of Ag-Ni-Cu Composite Material by Ultrasonic Arc Spray Forming and Accumulative Roll Bonding and the Evolution of Its Microstructure 2014 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society and ASM International 2014 Abstract We prepared a layered composite material by subjecting a deposition billet of $ AgNiCu_{15-5} $ formed by ultrasonic arc spray forming (UASF) to extrusion at 773 K (500 °C), rolling at 673 K (400 °C), and accumulative roll bonding (ARB). The evolution of the microstructure of the formed $ AgNiCu_{15-5} $ strips was analyzed through X-ray diffraction analysis, scanning electron microscopy, and energy-dispersive spectrometry. The deposition billet had a rapid solidification microstructure consisting of β-Ni particles dispersed in α-Ag matrix. ARB significantly refined the microstructure of the $ AgNiCu_{15-5} $ samples. There was no further decrease in the grain size after the 9th ARB cycle. Thus, UASF combined with extrusion and ARB is suitable for producing high-performance $ AgNiCu_{15-5} $-based electrical contact materials efficiently and economically. Accumulative Roll Bonding (dpeaa)DE-He213 Metal Droplet (dpeaa)DE-He213 Accumulative Roll Bonding Process (dpeaa)DE-He213 Accumulative Roll Bonding Cycle (dpeaa)DE-He213 Metastable Solid Solution (dpeaa)DE-He213 Qin, Guo-Yi aut Xu, Si-Yong aut Guo, Jin-Xin aut Ma, Guang aut Enthalten in Metallurgical and materials transactions Boston : Springer, 1975 46(2014), 2 vom: 04. Nov., Seite 880-886 (DE-627)325571996 (DE-600)2037517-7 1543-1940 nnns volume:46 year:2014 number:2 day:04 month:11 pages:880-886 https://dx.doi.org/10.1007/s11661-014-2642-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_266 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 46 2014 2 04 11 880-886 |
| spelling |
10.1007/s11661-014-2642-1 doi (DE-627)SPR021404348 (SPR)s11661-014-2642-1-e DE-627 ger DE-627 rakwb eng Zhang, Ke verfasserin aut Preparation of Ag-Ni-Cu Composite Material by Ultrasonic Arc Spray Forming and Accumulative Roll Bonding and the Evolution of Its Microstructure 2014 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society and ASM International 2014 Abstract We prepared a layered composite material by subjecting a deposition billet of $ AgNiCu_{15-5} $ formed by ultrasonic arc spray forming (UASF) to extrusion at 773 K (500 °C), rolling at 673 K (400 °C), and accumulative roll bonding (ARB). The evolution of the microstructure of the formed $ AgNiCu_{15-5} $ strips was analyzed through X-ray diffraction analysis, scanning electron microscopy, and energy-dispersive spectrometry. The deposition billet had a rapid solidification microstructure consisting of β-Ni particles dispersed in α-Ag matrix. ARB significantly refined the microstructure of the $ AgNiCu_{15-5} $ samples. There was no further decrease in the grain size after the 9th ARB cycle. Thus, UASF combined with extrusion and ARB is suitable for producing high-performance $ AgNiCu_{15-5} $-based electrical contact materials efficiently and economically. Accumulative Roll Bonding (dpeaa)DE-He213 Metal Droplet (dpeaa)DE-He213 Accumulative Roll Bonding Process (dpeaa)DE-He213 Accumulative Roll Bonding Cycle (dpeaa)DE-He213 Metastable Solid Solution (dpeaa)DE-He213 Qin, Guo-Yi aut Xu, Si-Yong aut Guo, Jin-Xin aut Ma, Guang aut Enthalten in Metallurgical and materials transactions Boston : Springer, 1975 46(2014), 2 vom: 04. Nov., Seite 880-886 (DE-627)325571996 (DE-600)2037517-7 1543-1940 nnns volume:46 year:2014 number:2 day:04 month:11 pages:880-886 https://dx.doi.org/10.1007/s11661-014-2642-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_266 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 46 2014 2 04 11 880-886 |
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10.1007/s11661-014-2642-1 doi (DE-627)SPR021404348 (SPR)s11661-014-2642-1-e DE-627 ger DE-627 rakwb eng Zhang, Ke verfasserin aut Preparation of Ag-Ni-Cu Composite Material by Ultrasonic Arc Spray Forming and Accumulative Roll Bonding and the Evolution of Its Microstructure 2014 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society and ASM International 2014 Abstract We prepared a layered composite material by subjecting a deposition billet of $ AgNiCu_{15-5} $ formed by ultrasonic arc spray forming (UASF) to extrusion at 773 K (500 °C), rolling at 673 K (400 °C), and accumulative roll bonding (ARB). The evolution of the microstructure of the formed $ AgNiCu_{15-5} $ strips was analyzed through X-ray diffraction analysis, scanning electron microscopy, and energy-dispersive spectrometry. The deposition billet had a rapid solidification microstructure consisting of β-Ni particles dispersed in α-Ag matrix. ARB significantly refined the microstructure of the $ AgNiCu_{15-5} $ samples. There was no further decrease in the grain size after the 9th ARB cycle. Thus, UASF combined with extrusion and ARB is suitable for producing high-performance $ AgNiCu_{15-5} $-based electrical contact materials efficiently and economically. Accumulative Roll Bonding (dpeaa)DE-He213 Metal Droplet (dpeaa)DE-He213 Accumulative Roll Bonding Process (dpeaa)DE-He213 Accumulative Roll Bonding Cycle (dpeaa)DE-He213 Metastable Solid Solution (dpeaa)DE-He213 Qin, Guo-Yi aut Xu, Si-Yong aut Guo, Jin-Xin aut Ma, Guang aut Enthalten in Metallurgical and materials transactions Boston : Springer, 1975 46(2014), 2 vom: 04. Nov., Seite 880-886 (DE-627)325571996 (DE-600)2037517-7 1543-1940 nnns volume:46 year:2014 number:2 day:04 month:11 pages:880-886 https://dx.doi.org/10.1007/s11661-014-2642-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_266 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 46 2014 2 04 11 880-886 |
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10.1007/s11661-014-2642-1 doi (DE-627)SPR021404348 (SPR)s11661-014-2642-1-e DE-627 ger DE-627 rakwb eng Zhang, Ke verfasserin aut Preparation of Ag-Ni-Cu Composite Material by Ultrasonic Arc Spray Forming and Accumulative Roll Bonding and the Evolution of Its Microstructure 2014 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society and ASM International 2014 Abstract We prepared a layered composite material by subjecting a deposition billet of $ AgNiCu_{15-5} $ formed by ultrasonic arc spray forming (UASF) to extrusion at 773 K (500 °C), rolling at 673 K (400 °C), and accumulative roll bonding (ARB). The evolution of the microstructure of the formed $ AgNiCu_{15-5} $ strips was analyzed through X-ray diffraction analysis, scanning electron microscopy, and energy-dispersive spectrometry. The deposition billet had a rapid solidification microstructure consisting of β-Ni particles dispersed in α-Ag matrix. ARB significantly refined the microstructure of the $ AgNiCu_{15-5} $ samples. There was no further decrease in the grain size after the 9th ARB cycle. Thus, UASF combined with extrusion and ARB is suitable for producing high-performance $ AgNiCu_{15-5} $-based electrical contact materials efficiently and economically. Accumulative Roll Bonding (dpeaa)DE-He213 Metal Droplet (dpeaa)DE-He213 Accumulative Roll Bonding Process (dpeaa)DE-He213 Accumulative Roll Bonding Cycle (dpeaa)DE-He213 Metastable Solid Solution (dpeaa)DE-He213 Qin, Guo-Yi aut Xu, Si-Yong aut Guo, Jin-Xin aut Ma, Guang aut Enthalten in Metallurgical and materials transactions Boston : Springer, 1975 46(2014), 2 vom: 04. Nov., Seite 880-886 (DE-627)325571996 (DE-600)2037517-7 1543-1940 nnns volume:46 year:2014 number:2 day:04 month:11 pages:880-886 https://dx.doi.org/10.1007/s11661-014-2642-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_266 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 46 2014 2 04 11 880-886 |
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10.1007/s11661-014-2642-1 doi (DE-627)SPR021404348 (SPR)s11661-014-2642-1-e DE-627 ger DE-627 rakwb eng Zhang, Ke verfasserin aut Preparation of Ag-Ni-Cu Composite Material by Ultrasonic Arc Spray Forming and Accumulative Roll Bonding and the Evolution of Its Microstructure 2014 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society and ASM International 2014 Abstract We prepared a layered composite material by subjecting a deposition billet of $ AgNiCu_{15-5} $ formed by ultrasonic arc spray forming (UASF) to extrusion at 773 K (500 °C), rolling at 673 K (400 °C), and accumulative roll bonding (ARB). The evolution of the microstructure of the formed $ AgNiCu_{15-5} $ strips was analyzed through X-ray diffraction analysis, scanning electron microscopy, and energy-dispersive spectrometry. The deposition billet had a rapid solidification microstructure consisting of β-Ni particles dispersed in α-Ag matrix. ARB significantly refined the microstructure of the $ AgNiCu_{15-5} $ samples. There was no further decrease in the grain size after the 9th ARB cycle. Thus, UASF combined with extrusion and ARB is suitable for producing high-performance $ AgNiCu_{15-5} $-based electrical contact materials efficiently and economically. Accumulative Roll Bonding (dpeaa)DE-He213 Metal Droplet (dpeaa)DE-He213 Accumulative Roll Bonding Process (dpeaa)DE-He213 Accumulative Roll Bonding Cycle (dpeaa)DE-He213 Metastable Solid Solution (dpeaa)DE-He213 Qin, Guo-Yi aut Xu, Si-Yong aut Guo, Jin-Xin aut Ma, Guang aut Enthalten in Metallurgical and materials transactions Boston : Springer, 1975 46(2014), 2 vom: 04. Nov., Seite 880-886 (DE-627)325571996 (DE-600)2037517-7 1543-1940 nnns volume:46 year:2014 number:2 day:04 month:11 pages:880-886 https://dx.doi.org/10.1007/s11661-014-2642-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_101 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_266 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4012 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4126 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 46 2014 2 04 11 880-886 |
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Enthalten in Metallurgical and materials transactions 46(2014), 2 vom: 04. Nov., Seite 880-886 volume:46 year:2014 number:2 day:04 month:11 pages:880-886 |
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Accumulative Roll Bonding Metal Droplet Accumulative Roll Bonding Process Accumulative Roll Bonding Cycle Metastable Solid Solution |
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Zhang, Ke @@aut@@ Qin, Guo-Yi @@aut@@ Xu, Si-Yong @@aut@@ Guo, Jin-Xin @@aut@@ Ma, Guang @@aut@@ |
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<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">SPR021404348</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230331080437.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">201006s2014 xx |||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/s11661-014-2642-1</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)SPR021404348</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(SPR)s11661-014-2642-1-e</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Zhang, Ke</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Preparation of Ag-Ni-Cu Composite Material by Ultrasonic Arc Spray Forming and Accumulative Roll Bonding and the Evolution of Its Microstructure</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2014</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">Computermedien</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Online-Ressource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© The Minerals, Metals & Materials Society and ASM International 2014</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract We prepared a layered composite material by subjecting a deposition billet of $ AgNiCu_{15-5} $ formed by ultrasonic arc spray forming (UASF) to extrusion at 773 K (500 °C), rolling at 673 K (400 °C), and accumulative roll bonding (ARB). The evolution of the microstructure of the formed $ AgNiCu_{15-5} $ strips was analyzed through X-ray diffraction analysis, scanning electron microscopy, and energy-dispersive spectrometry. The deposition billet had a rapid solidification microstructure consisting of β-Ni particles dispersed in α-Ag matrix. ARB significantly refined the microstructure of the $ AgNiCu_{15-5} $ samples. There was no further decrease in the grain size after the 9th ARB cycle. 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Zhang, Ke |
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Zhang, Ke misc Accumulative Roll Bonding misc Metal Droplet misc Accumulative Roll Bonding Process misc Accumulative Roll Bonding Cycle misc Metastable Solid Solution Preparation of Ag-Ni-Cu Composite Material by Ultrasonic Arc Spray Forming and Accumulative Roll Bonding and the Evolution of Its Microstructure |
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Preparation of Ag-Ni-Cu Composite Material by Ultrasonic Arc Spray Forming and Accumulative Roll Bonding and the Evolution of Its Microstructure Accumulative Roll Bonding (dpeaa)DE-He213 Metal Droplet (dpeaa)DE-He213 Accumulative Roll Bonding Process (dpeaa)DE-He213 Accumulative Roll Bonding Cycle (dpeaa)DE-He213 Metastable Solid Solution (dpeaa)DE-He213 |
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Preparation of Ag-Ni-Cu Composite Material by Ultrasonic Arc Spray Forming and Accumulative Roll Bonding and the Evolution of Its Microstructure |
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Zhang, Ke Qin, Guo-Yi Xu, Si-Yong Guo, Jin-Xin Ma, Guang |
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Zhang, Ke |
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10.1007/s11661-014-2642-1 |
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preparation of ag-ni-cu composite material by ultrasonic arc spray forming and accumulative roll bonding and the evolution of its microstructure |
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Preparation of Ag-Ni-Cu Composite Material by Ultrasonic Arc Spray Forming and Accumulative Roll Bonding and the Evolution of Its Microstructure |
| abstract |
Abstract We prepared a layered composite material by subjecting a deposition billet of $ AgNiCu_{15-5} $ formed by ultrasonic arc spray forming (UASF) to extrusion at 773 K (500 °C), rolling at 673 K (400 °C), and accumulative roll bonding (ARB). The evolution of the microstructure of the formed $ AgNiCu_{15-5} $ strips was analyzed through X-ray diffraction analysis, scanning electron microscopy, and energy-dispersive spectrometry. The deposition billet had a rapid solidification microstructure consisting of β-Ni particles dispersed in α-Ag matrix. ARB significantly refined the microstructure of the $ AgNiCu_{15-5} $ samples. There was no further decrease in the grain size after the 9th ARB cycle. Thus, UASF combined with extrusion and ARB is suitable for producing high-performance $ AgNiCu_{15-5} $-based electrical contact materials efficiently and economically. © The Minerals, Metals & Materials Society and ASM International 2014 |
| abstractGer |
Abstract We prepared a layered composite material by subjecting a deposition billet of $ AgNiCu_{15-5} $ formed by ultrasonic arc spray forming (UASF) to extrusion at 773 K (500 °C), rolling at 673 K (400 °C), and accumulative roll bonding (ARB). The evolution of the microstructure of the formed $ AgNiCu_{15-5} $ strips was analyzed through X-ray diffraction analysis, scanning electron microscopy, and energy-dispersive spectrometry. The deposition billet had a rapid solidification microstructure consisting of β-Ni particles dispersed in α-Ag matrix. ARB significantly refined the microstructure of the $ AgNiCu_{15-5} $ samples. There was no further decrease in the grain size after the 9th ARB cycle. Thus, UASF combined with extrusion and ARB is suitable for producing high-performance $ AgNiCu_{15-5} $-based electrical contact materials efficiently and economically. © The Minerals, Metals & Materials Society and ASM International 2014 |
| abstract_unstemmed |
Abstract We prepared a layered composite material by subjecting a deposition billet of $ AgNiCu_{15-5} $ formed by ultrasonic arc spray forming (UASF) to extrusion at 773 K (500 °C), rolling at 673 K (400 °C), and accumulative roll bonding (ARB). The evolution of the microstructure of the formed $ AgNiCu_{15-5} $ strips was analyzed through X-ray diffraction analysis, scanning electron microscopy, and energy-dispersive spectrometry. The deposition billet had a rapid solidification microstructure consisting of β-Ni particles dispersed in α-Ag matrix. ARB significantly refined the microstructure of the $ AgNiCu_{15-5} $ samples. There was no further decrease in the grain size after the 9th ARB cycle. Thus, UASF combined with extrusion and ARB is suitable for producing high-performance $ AgNiCu_{15-5} $-based electrical contact materials efficiently and economically. © The Minerals, Metals & Materials Society and ASM International 2014 |
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| title_short |
Preparation of Ag-Ni-Cu Composite Material by Ultrasonic Arc Spray Forming and Accumulative Roll Bonding and the Evolution of Its Microstructure |
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https://dx.doi.org/10.1007/s11661-014-2642-1 |
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Qin, Guo-Yi Xu, Si-Yong Guo, Jin-Xin Ma, Guang |
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Qin, Guo-Yi Xu, Si-Yong Guo, Jin-Xin Ma, Guang |
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10.1007/s11661-014-2642-1 |
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2024-07-03T22:21:34.641Z |
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| score |
7.4009256 |