Modeling Material Properties of Lead-Free Solder Alloys
Abstract A full set of physical and thermophysical properties for lead-free solder (LFS) alloys have been calculated, including liquidus/solidus temperatures, fraction solid, density, coefficient of thermal expansion, thermal conductivity, Young’s modulus, viscosity, and liquid surface tension, all...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Guo, Zhanli [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2007 |
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| Schlagwörter: |
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| Anmerkung: |
© TMS 2007 |
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| Übergeordnetes Werk: |
Enthalten in: Journal of electronic materials - Warrendale, Pa : TMS, 1972, 37(2007), 1 vom: 11. Sept., Seite 23-31 |
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| Übergeordnetes Werk: |
volume:37 ; year:2007 ; number:1 ; day:11 ; month:09 ; pages:23-31 |
| Links: |
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| DOI / URN: |
10.1007/s11664-007-0218-1 |
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| Katalog-ID: |
SPR021482829 |
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| 520 | |a Abstract A full set of physical and thermophysical properties for lead-free solder (LFS) alloys have been calculated, including liquidus/solidus temperatures, fraction solid, density, coefficient of thermal expansion, thermal conductivity, Young’s modulus, viscosity, and liquid surface tension, all as a function of composition and temperature (extending into the liquid state). The results have been extensively validated against data available in the literature. A detailed comparison of the properties of two LFS alloys Sn-20In-2.8Ag and Sn-5.5Zn-4.5In-3.5Bi with Sn-37Pb has been made to show the utility and need for calculations that cover a wide range of properties, including the need to consider the effect of nonequilibrium cooling. The modeling of many of these properties follows well-established procedures previously used in JMatPro software for a range of structural alloys. This paper describes an additional procedure for the calculation of the liquid surface tension for multicomponent systems, based on the Butler equation. Future software developments are reviewed, including the addition of mechanical properties, but the present calculations can already make a useful contribution to the selection of appropriate new LFS alloys. | ||
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| 650 | 4 | |a thermodynamics |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a lead-free solder alloys |7 (dpeaa)DE-He213 | |
| 700 | 1 | |a Saunders, Nigel |4 aut | |
| 700 | 1 | |a Miodownik, Peter |4 aut | |
| 700 | 1 | |a Schillé, Jean-Philippe |4 aut | |
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10.1007/s11664-007-0218-1 doi (DE-627)SPR021482829 (SPR)s11664-007-0218-1-e DE-627 ger DE-627 rakwb eng Guo, Zhanli verfasserin aut Modeling Material Properties of Lead-Free Solder Alloys 2007 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © TMS 2007 Abstract A full set of physical and thermophysical properties for lead-free solder (LFS) alloys have been calculated, including liquidus/solidus temperatures, fraction solid, density, coefficient of thermal expansion, thermal conductivity, Young’s modulus, viscosity, and liquid surface tension, all as a function of composition and temperature (extending into the liquid state). The results have been extensively validated against data available in the literature. A detailed comparison of the properties of two LFS alloys Sn-20In-2.8Ag and Sn-5.5Zn-4.5In-3.5Bi with Sn-37Pb has been made to show the utility and need for calculations that cover a wide range of properties, including the need to consider the effect of nonequilibrium cooling. The modeling of many of these properties follows well-established procedures previously used in JMatPro software for a range of structural alloys. This paper describes an additional procedure for the calculation of the liquid surface tension for multicomponent systems, based on the Butler equation. Future software developments are reviewed, including the addition of mechanical properties, but the present calculations can already make a useful contribution to the selection of appropriate new LFS alloys. Material properties (dpeaa)DE-He213 modeling (dpeaa)DE-He213 alloy design (dpeaa)DE-He213 thermodynamics (dpeaa)DE-He213 lead-free solder alloys (dpeaa)DE-He213 Saunders, Nigel aut Miodownik, Peter aut Schillé, Jean-Philippe aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 37(2007), 1 vom: 11. Sept., Seite 23-31 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:37 year:2007 number:1 day:11 month:09 pages:23-31 https://dx.doi.org/10.1007/s11664-007-0218-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 37 2007 1 11 09 23-31 |
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10.1007/s11664-007-0218-1 doi (DE-627)SPR021482829 (SPR)s11664-007-0218-1-e DE-627 ger DE-627 rakwb eng Guo, Zhanli verfasserin aut Modeling Material Properties of Lead-Free Solder Alloys 2007 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © TMS 2007 Abstract A full set of physical and thermophysical properties for lead-free solder (LFS) alloys have been calculated, including liquidus/solidus temperatures, fraction solid, density, coefficient of thermal expansion, thermal conductivity, Young’s modulus, viscosity, and liquid surface tension, all as a function of composition and temperature (extending into the liquid state). The results have been extensively validated against data available in the literature. A detailed comparison of the properties of two LFS alloys Sn-20In-2.8Ag and Sn-5.5Zn-4.5In-3.5Bi with Sn-37Pb has been made to show the utility and need for calculations that cover a wide range of properties, including the need to consider the effect of nonequilibrium cooling. The modeling of many of these properties follows well-established procedures previously used in JMatPro software for a range of structural alloys. This paper describes an additional procedure for the calculation of the liquid surface tension for multicomponent systems, based on the Butler equation. Future software developments are reviewed, including the addition of mechanical properties, but the present calculations can already make a useful contribution to the selection of appropriate new LFS alloys. Material properties (dpeaa)DE-He213 modeling (dpeaa)DE-He213 alloy design (dpeaa)DE-He213 thermodynamics (dpeaa)DE-He213 lead-free solder alloys (dpeaa)DE-He213 Saunders, Nigel aut Miodownik, Peter aut Schillé, Jean-Philippe aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 37(2007), 1 vom: 11. Sept., Seite 23-31 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:37 year:2007 number:1 day:11 month:09 pages:23-31 https://dx.doi.org/10.1007/s11664-007-0218-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 37 2007 1 11 09 23-31 |
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10.1007/s11664-007-0218-1 doi (DE-627)SPR021482829 (SPR)s11664-007-0218-1-e DE-627 ger DE-627 rakwb eng Guo, Zhanli verfasserin aut Modeling Material Properties of Lead-Free Solder Alloys 2007 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © TMS 2007 Abstract A full set of physical and thermophysical properties for lead-free solder (LFS) alloys have been calculated, including liquidus/solidus temperatures, fraction solid, density, coefficient of thermal expansion, thermal conductivity, Young’s modulus, viscosity, and liquid surface tension, all as a function of composition and temperature (extending into the liquid state). The results have been extensively validated against data available in the literature. A detailed comparison of the properties of two LFS alloys Sn-20In-2.8Ag and Sn-5.5Zn-4.5In-3.5Bi with Sn-37Pb has been made to show the utility and need for calculations that cover a wide range of properties, including the need to consider the effect of nonequilibrium cooling. The modeling of many of these properties follows well-established procedures previously used in JMatPro software for a range of structural alloys. This paper describes an additional procedure for the calculation of the liquid surface tension for multicomponent systems, based on the Butler equation. Future software developments are reviewed, including the addition of mechanical properties, but the present calculations can already make a useful contribution to the selection of appropriate new LFS alloys. Material properties (dpeaa)DE-He213 modeling (dpeaa)DE-He213 alloy design (dpeaa)DE-He213 thermodynamics (dpeaa)DE-He213 lead-free solder alloys (dpeaa)DE-He213 Saunders, Nigel aut Miodownik, Peter aut Schillé, Jean-Philippe aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 37(2007), 1 vom: 11. Sept., Seite 23-31 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:37 year:2007 number:1 day:11 month:09 pages:23-31 https://dx.doi.org/10.1007/s11664-007-0218-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 37 2007 1 11 09 23-31 |
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10.1007/s11664-007-0218-1 doi (DE-627)SPR021482829 (SPR)s11664-007-0218-1-e DE-627 ger DE-627 rakwb eng Guo, Zhanli verfasserin aut Modeling Material Properties of Lead-Free Solder Alloys 2007 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © TMS 2007 Abstract A full set of physical and thermophysical properties for lead-free solder (LFS) alloys have been calculated, including liquidus/solidus temperatures, fraction solid, density, coefficient of thermal expansion, thermal conductivity, Young’s modulus, viscosity, and liquid surface tension, all as a function of composition and temperature (extending into the liquid state). The results have been extensively validated against data available in the literature. A detailed comparison of the properties of two LFS alloys Sn-20In-2.8Ag and Sn-5.5Zn-4.5In-3.5Bi with Sn-37Pb has been made to show the utility and need for calculations that cover a wide range of properties, including the need to consider the effect of nonequilibrium cooling. The modeling of many of these properties follows well-established procedures previously used in JMatPro software for a range of structural alloys. This paper describes an additional procedure for the calculation of the liquid surface tension for multicomponent systems, based on the Butler equation. Future software developments are reviewed, including the addition of mechanical properties, but the present calculations can already make a useful contribution to the selection of appropriate new LFS alloys. Material properties (dpeaa)DE-He213 modeling (dpeaa)DE-He213 alloy design (dpeaa)DE-He213 thermodynamics (dpeaa)DE-He213 lead-free solder alloys (dpeaa)DE-He213 Saunders, Nigel aut Miodownik, Peter aut Schillé, Jean-Philippe aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 37(2007), 1 vom: 11. Sept., Seite 23-31 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:37 year:2007 number:1 day:11 month:09 pages:23-31 https://dx.doi.org/10.1007/s11664-007-0218-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 37 2007 1 11 09 23-31 |
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10.1007/s11664-007-0218-1 doi (DE-627)SPR021482829 (SPR)s11664-007-0218-1-e DE-627 ger DE-627 rakwb eng Guo, Zhanli verfasserin aut Modeling Material Properties of Lead-Free Solder Alloys 2007 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © TMS 2007 Abstract A full set of physical and thermophysical properties for lead-free solder (LFS) alloys have been calculated, including liquidus/solidus temperatures, fraction solid, density, coefficient of thermal expansion, thermal conductivity, Young’s modulus, viscosity, and liquid surface tension, all as a function of composition and temperature (extending into the liquid state). The results have been extensively validated against data available in the literature. A detailed comparison of the properties of two LFS alloys Sn-20In-2.8Ag and Sn-5.5Zn-4.5In-3.5Bi with Sn-37Pb has been made to show the utility and need for calculations that cover a wide range of properties, including the need to consider the effect of nonequilibrium cooling. The modeling of many of these properties follows well-established procedures previously used in JMatPro software for a range of structural alloys. This paper describes an additional procedure for the calculation of the liquid surface tension for multicomponent systems, based on the Butler equation. Future software developments are reviewed, including the addition of mechanical properties, but the present calculations can already make a useful contribution to the selection of appropriate new LFS alloys. Material properties (dpeaa)DE-He213 modeling (dpeaa)DE-He213 alloy design (dpeaa)DE-He213 thermodynamics (dpeaa)DE-He213 lead-free solder alloys (dpeaa)DE-He213 Saunders, Nigel aut Miodownik, Peter aut Schillé, Jean-Philippe aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 37(2007), 1 vom: 11. Sept., Seite 23-31 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:37 year:2007 number:1 day:11 month:09 pages:23-31 https://dx.doi.org/10.1007/s11664-007-0218-1 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 37 2007 1 11 09 23-31 |
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Enthalten in Journal of electronic materials 37(2007), 1 vom: 11. Sept., Seite 23-31 volume:37 year:2007 number:1 day:11 month:09 pages:23-31 |
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Enthalten in Journal of electronic materials 37(2007), 1 vom: 11. Sept., Seite 23-31 volume:37 year:2007 number:1 day:11 month:09 pages:23-31 |
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Guo, Zhanli @@aut@@ Saunders, Nigel @@aut@@ Miodownik, Peter @@aut@@ Schillé, Jean-Philippe @@aut@@ |
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Guo, Zhanli |
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Modeling Material Properties of Lead-Free Solder Alloys Material properties (dpeaa)DE-He213 modeling (dpeaa)DE-He213 alloy design (dpeaa)DE-He213 thermodynamics (dpeaa)DE-He213 lead-free solder alloys (dpeaa)DE-He213 |
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Modeling Material Properties of Lead-Free Solder Alloys |
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modeling material properties of lead-free solder alloys |
| title_auth |
Modeling Material Properties of Lead-Free Solder Alloys |
| abstract |
Abstract A full set of physical and thermophysical properties for lead-free solder (LFS) alloys have been calculated, including liquidus/solidus temperatures, fraction solid, density, coefficient of thermal expansion, thermal conductivity, Young’s modulus, viscosity, and liquid surface tension, all as a function of composition and temperature (extending into the liquid state). The results have been extensively validated against data available in the literature. A detailed comparison of the properties of two LFS alloys Sn-20In-2.8Ag and Sn-5.5Zn-4.5In-3.5Bi with Sn-37Pb has been made to show the utility and need for calculations that cover a wide range of properties, including the need to consider the effect of nonequilibrium cooling. The modeling of many of these properties follows well-established procedures previously used in JMatPro software for a range of structural alloys. This paper describes an additional procedure for the calculation of the liquid surface tension for multicomponent systems, based on the Butler equation. Future software developments are reviewed, including the addition of mechanical properties, but the present calculations can already make a useful contribution to the selection of appropriate new LFS alloys. © TMS 2007 |
| abstractGer |
Abstract A full set of physical and thermophysical properties for lead-free solder (LFS) alloys have been calculated, including liquidus/solidus temperatures, fraction solid, density, coefficient of thermal expansion, thermal conductivity, Young’s modulus, viscosity, and liquid surface tension, all as a function of composition and temperature (extending into the liquid state). The results have been extensively validated against data available in the literature. A detailed comparison of the properties of two LFS alloys Sn-20In-2.8Ag and Sn-5.5Zn-4.5In-3.5Bi with Sn-37Pb has been made to show the utility and need for calculations that cover a wide range of properties, including the need to consider the effect of nonequilibrium cooling. The modeling of many of these properties follows well-established procedures previously used in JMatPro software for a range of structural alloys. This paper describes an additional procedure for the calculation of the liquid surface tension for multicomponent systems, based on the Butler equation. Future software developments are reviewed, including the addition of mechanical properties, but the present calculations can already make a useful contribution to the selection of appropriate new LFS alloys. © TMS 2007 |
| abstract_unstemmed |
Abstract A full set of physical and thermophysical properties for lead-free solder (LFS) alloys have been calculated, including liquidus/solidus temperatures, fraction solid, density, coefficient of thermal expansion, thermal conductivity, Young’s modulus, viscosity, and liquid surface tension, all as a function of composition and temperature (extending into the liquid state). The results have been extensively validated against data available in the literature. A detailed comparison of the properties of two LFS alloys Sn-20In-2.8Ag and Sn-5.5Zn-4.5In-3.5Bi with Sn-37Pb has been made to show the utility and need for calculations that cover a wide range of properties, including the need to consider the effect of nonequilibrium cooling. The modeling of many of these properties follows well-established procedures previously used in JMatPro software for a range of structural alloys. This paper describes an additional procedure for the calculation of the liquid surface tension for multicomponent systems, based on the Butler equation. Future software developments are reviewed, including the addition of mechanical properties, but the present calculations can already make a useful contribution to the selection of appropriate new LFS alloys. © TMS 2007 |
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| title_short |
Modeling Material Properties of Lead-Free Solder Alloys |
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https://dx.doi.org/10.1007/s11664-007-0218-1 |
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| author2 |
Saunders, Nigel Miodownik, Peter Schillé, Jean-Philippe |
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Saunders, Nigel Miodownik, Peter Schillé, Jean-Philippe |
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| doi_str |
10.1007/s11664-007-0218-1 |
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2024-07-03T22:49:59.263Z |
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| score |
7.3994503 |