Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System
Abstract The growth of compounds during energization heating at the interconnection between a Sn-based solder and a multilayer Pd/Ni/Cu conductor may be inhibited by the alloying of Pd with Ni. To examine such influence of Ni on the compound growth, the kinetics of solid-state reactive diffusion in...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Hashiba, M. [verfasserIn] |
|---|
| Format: |
E-Artikel |
|---|---|
| Sprache: |
Englisch |
| Erschienen: |
2011 |
|---|
| Schlagwörter: |
|---|
| Anmerkung: |
© TMS 2011 |
|---|
| Übergeordnetes Werk: |
Enthalten in: Journal of electronic materials - Warrendale, Pa : TMS, 1972, 41(2011), 1 vom: 02. Sept., Seite 32-43 |
|---|---|
| Übergeordnetes Werk: |
volume:41 ; year:2011 ; number:1 ; day:02 ; month:09 ; pages:32-43 |
| Links: |
|---|
| DOI / URN: |
10.1007/s11664-011-1733-7 |
|---|
| Katalog-ID: |
SPR021499276 |
|---|
| LEADER | 01000caa a22002652 4500 | ||
|---|---|---|---|
| 001 | SPR021499276 | ||
| 003 | DE-627 | ||
| 005 | 20230331054918.0 | ||
| 007 | cr uuu---uuuuu | ||
| 008 | 201006s2011 xx |||||o 00| ||eng c | ||
| 024 | 7 | |a 10.1007/s11664-011-1733-7 |2 doi | |
| 035 | |a (DE-627)SPR021499276 | ||
| 035 | |a (SPR)s11664-011-1733-7-e | ||
| 040 | |a DE-627 |b ger |c DE-627 |e rakwb | ||
| 041 | |a eng | ||
| 100 | 1 | |a Hashiba, M. |e verfasserin |4 aut | |
| 245 | 1 | 0 | |a Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System |
| 264 | 1 | |c 2011 | |
| 336 | |a Text |b txt |2 rdacontent | ||
| 337 | |a Computermedien |b c |2 rdamedia | ||
| 338 | |a Online-Ressource |b cr |2 rdacarrier | ||
| 500 | |a © TMS 2011 | ||
| 520 | |a Abstract The growth of compounds during energization heating at the interconnection between a Sn-based solder and a multilayer Pd/Ni/Cu conductor may be inhibited by the alloying of Pd with Ni. To examine such influence of Ni on the compound growth, the kinetics of solid-state reactive diffusion in the (Pd-Ni)/Sn system was experimentally determined in the present study. Experiments were conducted using Sn/(Pd-Ni)/Sn diffusion couples with Ni mol fractions of y = 0.257, 0.505, and 0.746 which were prepared by a diffusion bonding technique. The diffusion couples were isothermally annealed in the temperature range of 433 K to 473 K for various times up to 771 h. During annealing, different compounds are formed as rather uniform layers at the interface in the diffusion couple. In all the annealed diffusion couples, (Pd,Ni)$ Sn_{4} $ was observed clearly. Furthermore, (Pd,Ni)$ Sn_{3} $ and (Pd,Ni)$ Sn_{2} $ were recognized for y = 0.257, and $ Ni_{3} %$ Sn_{4} $ was discerned for y = 0.746. However, no other compounds except (Pd,Ni)$ Sn_{4} $ were detected for y = 0.505. The total thickness of the compound layers is proportional to a power function of the annealing time. The exponent of the power function is rather close to 0.5 for y = 0.257 and 0.505 but smaller than 0.5 for y = 0.746. Thus, volume diffusion is the rate-controlling process of the compound growth for y = 0.257 and 0.505, but boundary diffusion contributes to the rate-controlling process for y = 0.746. At the experimental annealing times, the overall growth rate of the compound layers is insensitive to y at y < 0.5 but decreases monotonically with increasing value of y at y > 0.5. Consequently, the compound growth is actually decelerated by the addition of Ni into Pd with y > 0.5 in the multilayer Pd/Ni/Cu conductor. | ||
| 650 | 4 | |a Metallization |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a solder |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a conductor |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a intermetallic compounds |7 (dpeaa)DE-He213 | |
| 700 | 1 | |a Shinmei, W. |4 aut | |
| 700 | 1 | |a Kajihara, M. |4 aut | |
| 773 | 0 | 8 | |i Enthalten in |t Journal of electronic materials |d Warrendale, Pa : TMS, 1972 |g 41(2011), 1 vom: 02. Sept., Seite 32-43 |w (DE-627)324918739 |w (DE-600)2032868-0 |x 1543-186X |7 nnns |
| 773 | 1 | 8 | |g volume:41 |g year:2011 |g number:1 |g day:02 |g month:09 |g pages:32-43 |
| 856 | 4 | 0 | |u https://dx.doi.org/10.1007/s11664-011-1733-7 |z lizenzpflichtig |3 Volltext |
| 912 | |a GBV_USEFLAG_A | ||
| 912 | |a SYSFLAG_A | ||
| 912 | |a GBV_SPRINGER | ||
| 912 | |a GBV_ILN_11 | ||
| 912 | |a GBV_ILN_20 | ||
| 912 | |a GBV_ILN_22 | ||
| 912 | |a GBV_ILN_23 | ||
| 912 | |a GBV_ILN_24 | ||
| 912 | |a GBV_ILN_31 | ||
| 912 | |a GBV_ILN_32 | ||
| 912 | |a GBV_ILN_39 | ||
| 912 | |a GBV_ILN_40 | ||
| 912 | |a GBV_ILN_60 | ||
| 912 | |a GBV_ILN_62 | ||
| 912 | |a GBV_ILN_63 | ||
| 912 | |a GBV_ILN_65 | ||
| 912 | |a GBV_ILN_69 | ||
| 912 | |a GBV_ILN_70 | ||
| 912 | |a GBV_ILN_73 | ||
| 912 | |a GBV_ILN_74 | ||
| 912 | |a GBV_ILN_90 | ||
| 912 | |a GBV_ILN_95 | ||
| 912 | |a GBV_ILN_100 | ||
| 912 | |a GBV_ILN_105 | ||
| 912 | |a GBV_ILN_110 | ||
| 912 | |a GBV_ILN_120 | ||
| 912 | |a GBV_ILN_138 | ||
| 912 | |a GBV_ILN_150 | ||
| 912 | |a GBV_ILN_151 | ||
| 912 | |a GBV_ILN_152 | ||
| 912 | |a GBV_ILN_161 | ||
| 912 | |a GBV_ILN_170 | ||
| 912 | |a GBV_ILN_171 | ||
| 912 | |a GBV_ILN_187 | ||
| 912 | |a GBV_ILN_213 | ||
| 912 | |a GBV_ILN_224 | ||
| 912 | |a GBV_ILN_230 | ||
| 912 | |a GBV_ILN_250 | ||
| 912 | |a GBV_ILN_281 | ||
| 912 | |a GBV_ILN_285 | ||
| 912 | |a GBV_ILN_293 | ||
| 912 | |a GBV_ILN_370 | ||
| 912 | |a GBV_ILN_602 | ||
| 912 | |a GBV_ILN_636 | ||
| 912 | |a GBV_ILN_702 | ||
| 912 | |a GBV_ILN_2001 | ||
| 912 | |a GBV_ILN_2003 | ||
| 912 | |a GBV_ILN_2004 | ||
| 912 | |a GBV_ILN_2005 | ||
| 912 | |a GBV_ILN_2006 | ||
| 912 | |a GBV_ILN_2007 | ||
| 912 | |a GBV_ILN_2008 | ||
| 912 | |a GBV_ILN_2009 | ||
| 912 | |a GBV_ILN_2010 | ||
| 912 | |a GBV_ILN_2011 | ||
| 912 | |a GBV_ILN_2014 | ||
| 912 | |a GBV_ILN_2015 | ||
| 912 | |a GBV_ILN_2020 | ||
| 912 | |a GBV_ILN_2021 | ||
| 912 | |a GBV_ILN_2025 | ||
| 912 | |a GBV_ILN_2026 | ||
| 912 | |a GBV_ILN_2027 | ||
| 912 | |a GBV_ILN_2031 | ||
| 912 | |a GBV_ILN_2034 | ||
| 912 | |a GBV_ILN_2037 | ||
| 912 | |a GBV_ILN_2038 | ||
| 912 | |a GBV_ILN_2039 | ||
| 912 | |a GBV_ILN_2044 | ||
| 912 | |a GBV_ILN_2048 | ||
| 912 | |a GBV_ILN_2049 | ||
| 912 | |a GBV_ILN_2050 | ||
| 912 | |a GBV_ILN_2055 | ||
| 912 | |a GBV_ILN_2057 | ||
| 912 | |a GBV_ILN_2059 | ||
| 912 | |a GBV_ILN_2061 | ||
| 912 | |a GBV_ILN_2064 | ||
| 912 | |a GBV_ILN_2065 | ||
| 912 | |a GBV_ILN_2068 | ||
| 912 | |a GBV_ILN_2070 | ||
| 912 | |a GBV_ILN_2086 | ||
| 912 | |a GBV_ILN_2088 | ||
| 912 | |a GBV_ILN_2093 | ||
| 912 | |a GBV_ILN_2106 | ||
| 912 | |a GBV_ILN_2107 | ||
| 912 | |a GBV_ILN_2108 | ||
| 912 | |a GBV_ILN_2110 | ||
| 912 | |a GBV_ILN_2111 | ||
| 912 | |a GBV_ILN_2112 | ||
| 912 | |a GBV_ILN_2113 | ||
| 912 | |a GBV_ILN_2116 | ||
| 912 | |a GBV_ILN_2118 | ||
| 912 | |a GBV_ILN_2119 | ||
| 912 | |a GBV_ILN_2122 | ||
| 912 | |a GBV_ILN_2129 | ||
| 912 | |a GBV_ILN_2143 | ||
| 912 | |a GBV_ILN_2144 | ||
| 912 | |a GBV_ILN_2147 | ||
| 912 | |a GBV_ILN_2148 | ||
| 912 | |a GBV_ILN_2152 | ||
| 912 | |a GBV_ILN_2153 | ||
| 912 | |a GBV_ILN_2188 | ||
| 912 | |a GBV_ILN_2190 | ||
| 912 | |a GBV_ILN_2232 | ||
| 912 | |a GBV_ILN_2336 | ||
| 912 | |a GBV_ILN_2446 | ||
| 912 | |a GBV_ILN_2470 | ||
| 912 | |a GBV_ILN_2472 | ||
| 912 | |a GBV_ILN_2507 | ||
| 912 | |a GBV_ILN_2522 | ||
| 912 | |a GBV_ILN_2548 | ||
| 912 | |a GBV_ILN_4035 | ||
| 912 | |a GBV_ILN_4037 | ||
| 912 | |a GBV_ILN_4046 | ||
| 912 | |a GBV_ILN_4112 | ||
| 912 | |a GBV_ILN_4125 | ||
| 912 | |a GBV_ILN_4242 | ||
| 912 | |a GBV_ILN_4246 | ||
| 912 | |a GBV_ILN_4249 | ||
| 912 | |a GBV_ILN_4251 | ||
| 912 | |a GBV_ILN_4305 | ||
| 912 | |a GBV_ILN_4306 | ||
| 912 | |a GBV_ILN_4307 | ||
| 912 | |a GBV_ILN_4313 | ||
| 912 | |a GBV_ILN_4322 | ||
| 912 | |a GBV_ILN_4323 | ||
| 912 | |a GBV_ILN_4324 | ||
| 912 | |a GBV_ILN_4325 | ||
| 912 | |a GBV_ILN_4326 | ||
| 912 | |a GBV_ILN_4328 | ||
| 912 | |a GBV_ILN_4333 | ||
| 912 | |a GBV_ILN_4334 | ||
| 912 | |a GBV_ILN_4335 | ||
| 912 | |a GBV_ILN_4336 | ||
| 912 | |a GBV_ILN_4338 | ||
| 912 | |a GBV_ILN_4393 | ||
| 912 | |a GBV_ILN_4700 | ||
| 951 | |a AR | ||
| 952 | |d 41 |j 2011 |e 1 |b 02 |c 09 |h 32-43 | ||
| author_variant |
m h mh w s ws m k mk |
|---|---|
| matchkey_str |
article:1543186X:2011----::ieisfoisaeecieifsoi |
| hierarchy_sort_str |
2011 |
| publishDate |
2011 |
| allfields |
10.1007/s11664-011-1733-7 doi (DE-627)SPR021499276 (SPR)s11664-011-1733-7-e DE-627 ger DE-627 rakwb eng Hashiba, M. verfasserin aut Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System 2011 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © TMS 2011 Abstract The growth of compounds during energization heating at the interconnection between a Sn-based solder and a multilayer Pd/Ni/Cu conductor may be inhibited by the alloying of Pd with Ni. To examine such influence of Ni on the compound growth, the kinetics of solid-state reactive diffusion in the (Pd-Ni)/Sn system was experimentally determined in the present study. Experiments were conducted using Sn/(Pd-Ni)/Sn diffusion couples with Ni mol fractions of y = 0.257, 0.505, and 0.746 which were prepared by a diffusion bonding technique. The diffusion couples were isothermally annealed in the temperature range of 433 K to 473 K for various times up to 771 h. During annealing, different compounds are formed as rather uniform layers at the interface in the diffusion couple. In all the annealed diffusion couples, (Pd,Ni)$ Sn_{4} $ was observed clearly. Furthermore, (Pd,Ni)$ Sn_{3} $ and (Pd,Ni)$ Sn_{2} $ were recognized for y = 0.257, and $ Ni_{3} %$ Sn_{4} $ was discerned for y = 0.746. However, no other compounds except (Pd,Ni)$ Sn_{4} $ were detected for y = 0.505. The total thickness of the compound layers is proportional to a power function of the annealing time. The exponent of the power function is rather close to 0.5 for y = 0.257 and 0.505 but smaller than 0.5 for y = 0.746. Thus, volume diffusion is the rate-controlling process of the compound growth for y = 0.257 and 0.505, but boundary diffusion contributes to the rate-controlling process for y = 0.746. At the experimental annealing times, the overall growth rate of the compound layers is insensitive to y at y < 0.5 but decreases monotonically with increasing value of y at y > 0.5. Consequently, the compound growth is actually decelerated by the addition of Ni into Pd with y > 0.5 in the multilayer Pd/Ni/Cu conductor. Metallization (dpeaa)DE-He213 solder (dpeaa)DE-He213 conductor (dpeaa)DE-He213 intermetallic compounds (dpeaa)DE-He213 Shinmei, W. aut Kajihara, M. aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 41(2011), 1 vom: 02. Sept., Seite 32-43 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:41 year:2011 number:1 day:02 month:09 pages:32-43 https://dx.doi.org/10.1007/s11664-011-1733-7 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 41 2011 1 02 09 32-43 |
| spelling |
10.1007/s11664-011-1733-7 doi (DE-627)SPR021499276 (SPR)s11664-011-1733-7-e DE-627 ger DE-627 rakwb eng Hashiba, M. verfasserin aut Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System 2011 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © TMS 2011 Abstract The growth of compounds during energization heating at the interconnection between a Sn-based solder and a multilayer Pd/Ni/Cu conductor may be inhibited by the alloying of Pd with Ni. To examine such influence of Ni on the compound growth, the kinetics of solid-state reactive diffusion in the (Pd-Ni)/Sn system was experimentally determined in the present study. Experiments were conducted using Sn/(Pd-Ni)/Sn diffusion couples with Ni mol fractions of y = 0.257, 0.505, and 0.746 which were prepared by a diffusion bonding technique. The diffusion couples were isothermally annealed in the temperature range of 433 K to 473 K for various times up to 771 h. During annealing, different compounds are formed as rather uniform layers at the interface in the diffusion couple. In all the annealed diffusion couples, (Pd,Ni)$ Sn_{4} $ was observed clearly. Furthermore, (Pd,Ni)$ Sn_{3} $ and (Pd,Ni)$ Sn_{2} $ were recognized for y = 0.257, and $ Ni_{3} %$ Sn_{4} $ was discerned for y = 0.746. However, no other compounds except (Pd,Ni)$ Sn_{4} $ were detected for y = 0.505. The total thickness of the compound layers is proportional to a power function of the annealing time. The exponent of the power function is rather close to 0.5 for y = 0.257 and 0.505 but smaller than 0.5 for y = 0.746. Thus, volume diffusion is the rate-controlling process of the compound growth for y = 0.257 and 0.505, but boundary diffusion contributes to the rate-controlling process for y = 0.746. At the experimental annealing times, the overall growth rate of the compound layers is insensitive to y at y < 0.5 but decreases monotonically with increasing value of y at y > 0.5. Consequently, the compound growth is actually decelerated by the addition of Ni into Pd with y > 0.5 in the multilayer Pd/Ni/Cu conductor. Metallization (dpeaa)DE-He213 solder (dpeaa)DE-He213 conductor (dpeaa)DE-He213 intermetallic compounds (dpeaa)DE-He213 Shinmei, W. aut Kajihara, M. aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 41(2011), 1 vom: 02. Sept., Seite 32-43 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:41 year:2011 number:1 day:02 month:09 pages:32-43 https://dx.doi.org/10.1007/s11664-011-1733-7 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 41 2011 1 02 09 32-43 |
| allfields_unstemmed |
10.1007/s11664-011-1733-7 doi (DE-627)SPR021499276 (SPR)s11664-011-1733-7-e DE-627 ger DE-627 rakwb eng Hashiba, M. verfasserin aut Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System 2011 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © TMS 2011 Abstract The growth of compounds during energization heating at the interconnection between a Sn-based solder and a multilayer Pd/Ni/Cu conductor may be inhibited by the alloying of Pd with Ni. To examine such influence of Ni on the compound growth, the kinetics of solid-state reactive diffusion in the (Pd-Ni)/Sn system was experimentally determined in the present study. Experiments were conducted using Sn/(Pd-Ni)/Sn diffusion couples with Ni mol fractions of y = 0.257, 0.505, and 0.746 which were prepared by a diffusion bonding technique. The diffusion couples were isothermally annealed in the temperature range of 433 K to 473 K for various times up to 771 h. During annealing, different compounds are formed as rather uniform layers at the interface in the diffusion couple. In all the annealed diffusion couples, (Pd,Ni)$ Sn_{4} $ was observed clearly. Furthermore, (Pd,Ni)$ Sn_{3} $ and (Pd,Ni)$ Sn_{2} $ were recognized for y = 0.257, and $ Ni_{3} %$ Sn_{4} $ was discerned for y = 0.746. However, no other compounds except (Pd,Ni)$ Sn_{4} $ were detected for y = 0.505. The total thickness of the compound layers is proportional to a power function of the annealing time. The exponent of the power function is rather close to 0.5 for y = 0.257 and 0.505 but smaller than 0.5 for y = 0.746. Thus, volume diffusion is the rate-controlling process of the compound growth for y = 0.257 and 0.505, but boundary diffusion contributes to the rate-controlling process for y = 0.746. At the experimental annealing times, the overall growth rate of the compound layers is insensitive to y at y < 0.5 but decreases monotonically with increasing value of y at y > 0.5. Consequently, the compound growth is actually decelerated by the addition of Ni into Pd with y > 0.5 in the multilayer Pd/Ni/Cu conductor. Metallization (dpeaa)DE-He213 solder (dpeaa)DE-He213 conductor (dpeaa)DE-He213 intermetallic compounds (dpeaa)DE-He213 Shinmei, W. aut Kajihara, M. aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 41(2011), 1 vom: 02. Sept., Seite 32-43 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:41 year:2011 number:1 day:02 month:09 pages:32-43 https://dx.doi.org/10.1007/s11664-011-1733-7 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 41 2011 1 02 09 32-43 |
| allfieldsGer |
10.1007/s11664-011-1733-7 doi (DE-627)SPR021499276 (SPR)s11664-011-1733-7-e DE-627 ger DE-627 rakwb eng Hashiba, M. verfasserin aut Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System 2011 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © TMS 2011 Abstract The growth of compounds during energization heating at the interconnection between a Sn-based solder and a multilayer Pd/Ni/Cu conductor may be inhibited by the alloying of Pd with Ni. To examine such influence of Ni on the compound growth, the kinetics of solid-state reactive diffusion in the (Pd-Ni)/Sn system was experimentally determined in the present study. Experiments were conducted using Sn/(Pd-Ni)/Sn diffusion couples with Ni mol fractions of y = 0.257, 0.505, and 0.746 which were prepared by a diffusion bonding technique. The diffusion couples were isothermally annealed in the temperature range of 433 K to 473 K for various times up to 771 h. During annealing, different compounds are formed as rather uniform layers at the interface in the diffusion couple. In all the annealed diffusion couples, (Pd,Ni)$ Sn_{4} $ was observed clearly. Furthermore, (Pd,Ni)$ Sn_{3} $ and (Pd,Ni)$ Sn_{2} $ were recognized for y = 0.257, and $ Ni_{3} %$ Sn_{4} $ was discerned for y = 0.746. However, no other compounds except (Pd,Ni)$ Sn_{4} $ were detected for y = 0.505. The total thickness of the compound layers is proportional to a power function of the annealing time. The exponent of the power function is rather close to 0.5 for y = 0.257 and 0.505 but smaller than 0.5 for y = 0.746. Thus, volume diffusion is the rate-controlling process of the compound growth for y = 0.257 and 0.505, but boundary diffusion contributes to the rate-controlling process for y = 0.746. At the experimental annealing times, the overall growth rate of the compound layers is insensitive to y at y < 0.5 but decreases monotonically with increasing value of y at y > 0.5. Consequently, the compound growth is actually decelerated by the addition of Ni into Pd with y > 0.5 in the multilayer Pd/Ni/Cu conductor. Metallization (dpeaa)DE-He213 solder (dpeaa)DE-He213 conductor (dpeaa)DE-He213 intermetallic compounds (dpeaa)DE-He213 Shinmei, W. aut Kajihara, M. aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 41(2011), 1 vom: 02. Sept., Seite 32-43 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:41 year:2011 number:1 day:02 month:09 pages:32-43 https://dx.doi.org/10.1007/s11664-011-1733-7 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 41 2011 1 02 09 32-43 |
| allfieldsSound |
10.1007/s11664-011-1733-7 doi (DE-627)SPR021499276 (SPR)s11664-011-1733-7-e DE-627 ger DE-627 rakwb eng Hashiba, M. verfasserin aut Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System 2011 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © TMS 2011 Abstract The growth of compounds during energization heating at the interconnection between a Sn-based solder and a multilayer Pd/Ni/Cu conductor may be inhibited by the alloying of Pd with Ni. To examine such influence of Ni on the compound growth, the kinetics of solid-state reactive diffusion in the (Pd-Ni)/Sn system was experimentally determined in the present study. Experiments were conducted using Sn/(Pd-Ni)/Sn diffusion couples with Ni mol fractions of y = 0.257, 0.505, and 0.746 which were prepared by a diffusion bonding technique. The diffusion couples were isothermally annealed in the temperature range of 433 K to 473 K for various times up to 771 h. During annealing, different compounds are formed as rather uniform layers at the interface in the diffusion couple. In all the annealed diffusion couples, (Pd,Ni)$ Sn_{4} $ was observed clearly. Furthermore, (Pd,Ni)$ Sn_{3} $ and (Pd,Ni)$ Sn_{2} $ were recognized for y = 0.257, and $ Ni_{3} %$ Sn_{4} $ was discerned for y = 0.746. However, no other compounds except (Pd,Ni)$ Sn_{4} $ were detected for y = 0.505. The total thickness of the compound layers is proportional to a power function of the annealing time. The exponent of the power function is rather close to 0.5 for y = 0.257 and 0.505 but smaller than 0.5 for y = 0.746. Thus, volume diffusion is the rate-controlling process of the compound growth for y = 0.257 and 0.505, but boundary diffusion contributes to the rate-controlling process for y = 0.746. At the experimental annealing times, the overall growth rate of the compound layers is insensitive to y at y < 0.5 but decreases monotonically with increasing value of y at y > 0.5. Consequently, the compound growth is actually decelerated by the addition of Ni into Pd with y > 0.5 in the multilayer Pd/Ni/Cu conductor. Metallization (dpeaa)DE-He213 solder (dpeaa)DE-He213 conductor (dpeaa)DE-He213 intermetallic compounds (dpeaa)DE-He213 Shinmei, W. aut Kajihara, M. aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 41(2011), 1 vom: 02. Sept., Seite 32-43 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:41 year:2011 number:1 day:02 month:09 pages:32-43 https://dx.doi.org/10.1007/s11664-011-1733-7 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 41 2011 1 02 09 32-43 |
| language |
English |
| source |
Enthalten in Journal of electronic materials 41(2011), 1 vom: 02. Sept., Seite 32-43 volume:41 year:2011 number:1 day:02 month:09 pages:32-43 |
| sourceStr |
Enthalten in Journal of electronic materials 41(2011), 1 vom: 02. Sept., Seite 32-43 volume:41 year:2011 number:1 day:02 month:09 pages:32-43 |
| format_phy_str_mv |
Article |
| institution |
findex.gbv.de |
| topic_facet |
Metallization solder conductor intermetallic compounds |
| isfreeaccess_bool |
false |
| container_title |
Journal of electronic materials |
| authorswithroles_txt_mv |
Hashiba, M. @@aut@@ Shinmei, W. @@aut@@ Kajihara, M. @@aut@@ |
| publishDateDaySort_date |
2011-09-02T00:00:00Z |
| hierarchy_top_id |
324918739 |
| id |
SPR021499276 |
| language_de |
englisch |
| fullrecord |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">SPR021499276</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230331054918.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">201006s2011 xx |||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/s11664-011-1733-7</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)SPR021499276</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(SPR)s11664-011-1733-7-e</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Hashiba, M.</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2011</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">Computermedien</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Online-Ressource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© TMS 2011</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract The growth of compounds during energization heating at the interconnection between a Sn-based solder and a multilayer Pd/Ni/Cu conductor may be inhibited by the alloying of Pd with Ni. To examine such influence of Ni on the compound growth, the kinetics of solid-state reactive diffusion in the (Pd-Ni)/Sn system was experimentally determined in the present study. Experiments were conducted using Sn/(Pd-Ni)/Sn diffusion couples with Ni mol fractions of y = 0.257, 0.505, and 0.746 which were prepared by a diffusion bonding technique. The diffusion couples were isothermally annealed in the temperature range of 433 K to 473 K for various times up to 771 h. During annealing, different compounds are formed as rather uniform layers at the interface in the diffusion couple. In all the annealed diffusion couples, (Pd,Ni)$ Sn_{4} $ was observed clearly. Furthermore, (Pd,Ni)$ Sn_{3} $ and (Pd,Ni)$ Sn_{2} $ were recognized for y = 0.257, and $ Ni_{3} %$ Sn_{4} $ was discerned for y = 0.746. However, no other compounds except (Pd,Ni)$ Sn_{4} $ were detected for y = 0.505. The total thickness of the compound layers is proportional to a power function of the annealing time. The exponent of the power function is rather close to 0.5 for y = 0.257 and 0.505 but smaller than 0.5 for y = 0.746. Thus, volume diffusion is the rate-controlling process of the compound growth for y = 0.257 and 0.505, but boundary diffusion contributes to the rate-controlling process for y = 0.746. At the experimental annealing times, the overall growth rate of the compound layers is insensitive to y at y < 0.5 but decreases monotonically with increasing value of y at y > 0.5. Consequently, the compound growth is actually decelerated by the addition of Ni into Pd with y > 0.5 in the multilayer Pd/Ni/Cu conductor.</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Metallization</subfield><subfield code="7">(dpeaa)DE-He213</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">solder</subfield><subfield code="7">(dpeaa)DE-He213</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">conductor</subfield><subfield code="7">(dpeaa)DE-He213</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">intermetallic compounds</subfield><subfield code="7">(dpeaa)DE-He213</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Shinmei, W.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Kajihara, M.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Journal of electronic materials</subfield><subfield code="d">Warrendale, Pa : TMS, 1972</subfield><subfield code="g">41(2011), 1 vom: 02. Sept., Seite 32-43</subfield><subfield code="w">(DE-627)324918739</subfield><subfield code="w">(DE-600)2032868-0</subfield><subfield code="x">1543-186X</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:41</subfield><subfield code="g">year:2011</subfield><subfield code="g">number:1</subfield><subfield code="g">day:02</subfield><subfield code="g">month:09</subfield><subfield code="g">pages:32-43</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://dx.doi.org/10.1007/s11664-011-1733-7</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_SPRINGER</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_11</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_20</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_22</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_23</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_24</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_31</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_32</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_39</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_40</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_60</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_62</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_63</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_65</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_69</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_73</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_74</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_90</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_95</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_100</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_105</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_110</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_120</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_138</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_150</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_151</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_152</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_161</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_170</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_171</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_187</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_213</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_224</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_230</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_250</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_281</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_285</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_293</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_370</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_602</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_636</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_702</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2001</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2003</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2004</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2005</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2006</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2007</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2008</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2009</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2010</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2011</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2014</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2015</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2020</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2021</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2025</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2026</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2027</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2031</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2034</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2037</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2038</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2039</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2044</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2048</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2049</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2050</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2055</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2057</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2059</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2061</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2064</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2065</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2068</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2070</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2086</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2088</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2093</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2106</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2107</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2108</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2110</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2111</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2112</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2113</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2116</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2118</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2119</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2122</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2129</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2143</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2144</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2147</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2148</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2152</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2153</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2188</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2190</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2232</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2336</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2446</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2470</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2472</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2507</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2522</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2548</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4035</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4037</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4046</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4112</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4125</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4242</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4246</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4249</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4251</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4305</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4306</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4307</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4313</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4322</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4323</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4324</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4325</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4326</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4328</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4333</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4334</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4335</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4336</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4338</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4393</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4700</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">41</subfield><subfield code="j">2011</subfield><subfield code="e">1</subfield><subfield code="b">02</subfield><subfield code="c">09</subfield><subfield code="h">32-43</subfield></datafield></record></collection>
|
| author |
Hashiba, M. |
| spellingShingle |
Hashiba, M. misc Metallization misc solder misc conductor misc intermetallic compounds Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System |
| authorStr |
Hashiba, M. |
| ppnlink_with_tag_str_mv |
@@773@@(DE-627)324918739 |
| format |
electronic Article |
| delete_txt_mv |
keep |
| author_role |
aut aut aut |
| collection |
springer |
| remote_str |
true |
| illustrated |
Not Illustrated |
| issn |
1543-186X |
| topic_title |
Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System Metallization (dpeaa)DE-He213 solder (dpeaa)DE-He213 conductor (dpeaa)DE-He213 intermetallic compounds (dpeaa)DE-He213 |
| topic |
misc Metallization misc solder misc conductor misc intermetallic compounds |
| topic_unstemmed |
misc Metallization misc solder misc conductor misc intermetallic compounds |
| topic_browse |
misc Metallization misc solder misc conductor misc intermetallic compounds |
| format_facet |
Elektronische Aufsätze Aufsätze Elektronische Ressource |
| format_main_str_mv |
Text Zeitschrift/Artikel |
| carriertype_str_mv |
cr |
| hierarchy_parent_title |
Journal of electronic materials |
| hierarchy_parent_id |
324918739 |
| hierarchy_top_title |
Journal of electronic materials |
| isfreeaccess_txt |
false |
| familylinks_str_mv |
(DE-627)324918739 (DE-600)2032868-0 |
| title |
Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System |
| ctrlnum |
(DE-627)SPR021499276 (SPR)s11664-011-1733-7-e |
| title_full |
Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System |
| author_sort |
Hashiba, M. |
| journal |
Journal of electronic materials |
| journalStr |
Journal of electronic materials |
| lang_code |
eng |
| isOA_bool |
false |
| recordtype |
marc |
| publishDateSort |
2011 |
| contenttype_str_mv |
txt |
| container_start_page |
32 |
| author_browse |
Hashiba, M. Shinmei, W. Kajihara, M. |
| container_volume |
41 |
| format_se |
Elektronische Aufsätze |
| author-letter |
Hashiba, M. |
| doi_str_mv |
10.1007/s11664-011-1733-7 |
| title_sort |
kinetics of solid-state reactive diffusion in the (pd-ni)/sn system |
| title_auth |
Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System |
| abstract |
Abstract The growth of compounds during energization heating at the interconnection between a Sn-based solder and a multilayer Pd/Ni/Cu conductor may be inhibited by the alloying of Pd with Ni. To examine such influence of Ni on the compound growth, the kinetics of solid-state reactive diffusion in the (Pd-Ni)/Sn system was experimentally determined in the present study. Experiments were conducted using Sn/(Pd-Ni)/Sn diffusion couples with Ni mol fractions of y = 0.257, 0.505, and 0.746 which were prepared by a diffusion bonding technique. The diffusion couples were isothermally annealed in the temperature range of 433 K to 473 K for various times up to 771 h. During annealing, different compounds are formed as rather uniform layers at the interface in the diffusion couple. In all the annealed diffusion couples, (Pd,Ni)$ Sn_{4} $ was observed clearly. Furthermore, (Pd,Ni)$ Sn_{3} $ and (Pd,Ni)$ Sn_{2} $ were recognized for y = 0.257, and $ Ni_{3} %$ Sn_{4} $ was discerned for y = 0.746. However, no other compounds except (Pd,Ni)$ Sn_{4} $ were detected for y = 0.505. The total thickness of the compound layers is proportional to a power function of the annealing time. The exponent of the power function is rather close to 0.5 for y = 0.257 and 0.505 but smaller than 0.5 for y = 0.746. Thus, volume diffusion is the rate-controlling process of the compound growth for y = 0.257 and 0.505, but boundary diffusion contributes to the rate-controlling process for y = 0.746. At the experimental annealing times, the overall growth rate of the compound layers is insensitive to y at y < 0.5 but decreases monotonically with increasing value of y at y > 0.5. Consequently, the compound growth is actually decelerated by the addition of Ni into Pd with y > 0.5 in the multilayer Pd/Ni/Cu conductor. © TMS 2011 |
| abstractGer |
Abstract The growth of compounds during energization heating at the interconnection between a Sn-based solder and a multilayer Pd/Ni/Cu conductor may be inhibited by the alloying of Pd with Ni. To examine such influence of Ni on the compound growth, the kinetics of solid-state reactive diffusion in the (Pd-Ni)/Sn system was experimentally determined in the present study. Experiments were conducted using Sn/(Pd-Ni)/Sn diffusion couples with Ni mol fractions of y = 0.257, 0.505, and 0.746 which were prepared by a diffusion bonding technique. The diffusion couples were isothermally annealed in the temperature range of 433 K to 473 K for various times up to 771 h. During annealing, different compounds are formed as rather uniform layers at the interface in the diffusion couple. In all the annealed diffusion couples, (Pd,Ni)$ Sn_{4} $ was observed clearly. Furthermore, (Pd,Ni)$ Sn_{3} $ and (Pd,Ni)$ Sn_{2} $ were recognized for y = 0.257, and $ Ni_{3} %$ Sn_{4} $ was discerned for y = 0.746. However, no other compounds except (Pd,Ni)$ Sn_{4} $ were detected for y = 0.505. The total thickness of the compound layers is proportional to a power function of the annealing time. The exponent of the power function is rather close to 0.5 for y = 0.257 and 0.505 but smaller than 0.5 for y = 0.746. Thus, volume diffusion is the rate-controlling process of the compound growth for y = 0.257 and 0.505, but boundary diffusion contributes to the rate-controlling process for y = 0.746. At the experimental annealing times, the overall growth rate of the compound layers is insensitive to y at y < 0.5 but decreases monotonically with increasing value of y at y > 0.5. Consequently, the compound growth is actually decelerated by the addition of Ni into Pd with y > 0.5 in the multilayer Pd/Ni/Cu conductor. © TMS 2011 |
| abstract_unstemmed |
Abstract The growth of compounds during energization heating at the interconnection between a Sn-based solder and a multilayer Pd/Ni/Cu conductor may be inhibited by the alloying of Pd with Ni. To examine such influence of Ni on the compound growth, the kinetics of solid-state reactive diffusion in the (Pd-Ni)/Sn system was experimentally determined in the present study. Experiments were conducted using Sn/(Pd-Ni)/Sn diffusion couples with Ni mol fractions of y = 0.257, 0.505, and 0.746 which were prepared by a diffusion bonding technique. The diffusion couples were isothermally annealed in the temperature range of 433 K to 473 K for various times up to 771 h. During annealing, different compounds are formed as rather uniform layers at the interface in the diffusion couple. In all the annealed diffusion couples, (Pd,Ni)$ Sn_{4} $ was observed clearly. Furthermore, (Pd,Ni)$ Sn_{3} $ and (Pd,Ni)$ Sn_{2} $ were recognized for y = 0.257, and $ Ni_{3} %$ Sn_{4} $ was discerned for y = 0.746. However, no other compounds except (Pd,Ni)$ Sn_{4} $ were detected for y = 0.505. The total thickness of the compound layers is proportional to a power function of the annealing time. The exponent of the power function is rather close to 0.5 for y = 0.257 and 0.505 but smaller than 0.5 for y = 0.746. Thus, volume diffusion is the rate-controlling process of the compound growth for y = 0.257 and 0.505, but boundary diffusion contributes to the rate-controlling process for y = 0.746. At the experimental annealing times, the overall growth rate of the compound layers is insensitive to y at y < 0.5 but decreases monotonically with increasing value of y at y > 0.5. Consequently, the compound growth is actually decelerated by the addition of Ni into Pd with y > 0.5 in the multilayer Pd/Ni/Cu conductor. © TMS 2011 |
| collection_details |
GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 |
| container_issue |
1 |
| title_short |
Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System |
| url |
https://dx.doi.org/10.1007/s11664-011-1733-7 |
| remote_bool |
true |
| author2 |
Shinmei, W. Kajihara, M. |
| author2Str |
Shinmei, W. Kajihara, M. |
| ppnlink |
324918739 |
| mediatype_str_mv |
c |
| isOA_txt |
false |
| hochschulschrift_bool |
false |
| doi_str |
10.1007/s11664-011-1733-7 |
| up_date |
2024-07-03T22:56:08.955Z |
| _version_ |
1803600389952503808 |
| fullrecord_marcxml |
<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">SPR021499276</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230331054918.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">201006s2011 xx |||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/s11664-011-1733-7</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)SPR021499276</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(SPR)s11664-011-1733-7-e</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Hashiba, M.</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2011</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">Computermedien</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Online-Ressource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© TMS 2011</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract The growth of compounds during energization heating at the interconnection between a Sn-based solder and a multilayer Pd/Ni/Cu conductor may be inhibited by the alloying of Pd with Ni. To examine such influence of Ni on the compound growth, the kinetics of solid-state reactive diffusion in the (Pd-Ni)/Sn system was experimentally determined in the present study. Experiments were conducted using Sn/(Pd-Ni)/Sn diffusion couples with Ni mol fractions of y = 0.257, 0.505, and 0.746 which were prepared by a diffusion bonding technique. The diffusion couples were isothermally annealed in the temperature range of 433 K to 473 K for various times up to 771 h. During annealing, different compounds are formed as rather uniform layers at the interface in the diffusion couple. In all the annealed diffusion couples, (Pd,Ni)$ Sn_{4} $ was observed clearly. Furthermore, (Pd,Ni)$ Sn_{3} $ and (Pd,Ni)$ Sn_{2} $ were recognized for y = 0.257, and $ Ni_{3} %$ Sn_{4} $ was discerned for y = 0.746. However, no other compounds except (Pd,Ni)$ Sn_{4} $ were detected for y = 0.505. The total thickness of the compound layers is proportional to a power function of the annealing time. The exponent of the power function is rather close to 0.5 for y = 0.257 and 0.505 but smaller than 0.5 for y = 0.746. Thus, volume diffusion is the rate-controlling process of the compound growth for y = 0.257 and 0.505, but boundary diffusion contributes to the rate-controlling process for y = 0.746. At the experimental annealing times, the overall growth rate of the compound layers is insensitive to y at y < 0.5 but decreases monotonically with increasing value of y at y > 0.5. Consequently, the compound growth is actually decelerated by the addition of Ni into Pd with y > 0.5 in the multilayer Pd/Ni/Cu conductor.</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Metallization</subfield><subfield code="7">(dpeaa)DE-He213</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">solder</subfield><subfield code="7">(dpeaa)DE-He213</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">conductor</subfield><subfield code="7">(dpeaa)DE-He213</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">intermetallic compounds</subfield><subfield code="7">(dpeaa)DE-He213</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Shinmei, W.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Kajihara, M.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="773" ind1="0" ind2="8"><subfield code="i">Enthalten in</subfield><subfield code="t">Journal of electronic materials</subfield><subfield code="d">Warrendale, Pa : TMS, 1972</subfield><subfield code="g">41(2011), 1 vom: 02. Sept., Seite 32-43</subfield><subfield code="w">(DE-627)324918739</subfield><subfield code="w">(DE-600)2032868-0</subfield><subfield code="x">1543-186X</subfield><subfield code="7">nnns</subfield></datafield><datafield tag="773" ind1="1" ind2="8"><subfield code="g">volume:41</subfield><subfield code="g">year:2011</subfield><subfield code="g">number:1</subfield><subfield code="g">day:02</subfield><subfield code="g">month:09</subfield><subfield code="g">pages:32-43</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://dx.doi.org/10.1007/s11664-011-1733-7</subfield><subfield code="z">lizenzpflichtig</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_USEFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">SYSFLAG_A</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_SPRINGER</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_11</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_20</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_22</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_23</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_24</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_31</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_32</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_39</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_40</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_60</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_62</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_63</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_65</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_69</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_70</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_73</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_74</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_90</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_95</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_100</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_105</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_110</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_120</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_138</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_150</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_151</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_152</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_161</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_170</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_171</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_187</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_213</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_224</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_230</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_250</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_281</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_285</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_293</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_370</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_602</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_636</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_702</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2001</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2003</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2004</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2005</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2006</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2007</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2008</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2009</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2010</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2011</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2014</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2015</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2020</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2021</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2025</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2026</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2027</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2031</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2034</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2037</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2038</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2039</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2044</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2048</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2049</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2050</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2055</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2057</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2059</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2061</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2064</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2065</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2068</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2070</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2086</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2088</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2093</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2106</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2107</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2108</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2110</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2111</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2112</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2113</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2116</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2118</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2119</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2122</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2129</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2143</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2144</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2147</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2148</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2152</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2153</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2188</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2190</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2232</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2336</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2446</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2470</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2472</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2507</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2522</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_2548</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4035</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4037</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4046</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4112</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4125</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4242</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4246</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4249</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4251</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4305</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4306</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4307</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4313</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4322</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4323</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4324</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4325</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4326</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4328</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4333</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4334</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4335</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4336</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4338</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4393</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">GBV_ILN_4700</subfield></datafield><datafield tag="951" ind1=" " ind2=" "><subfield code="a">AR</subfield></datafield><datafield tag="952" ind1=" " ind2=" "><subfield code="d">41</subfield><subfield code="j">2011</subfield><subfield code="e">1</subfield><subfield code="b">02</subfield><subfield code="c">09</subfield><subfield code="h">32-43</subfield></datafield></record></collection>
|
| score |
7.399951 |