Numerical Modeling of Multimaterial Thermoelectric Devices Under Static and Cyclic Thermal Loading
Abstract Selection of materials for thermoelectric devices is generally based on a figure of merit that is a function of the Seebeck coefficient, electrical conductivity, and thermal conductivity. While this figure of merit is a useful metric for comparing materials, the relative importance of the c...
Ausführliche Beschreibung
Gespeichert in:
| Autor*in: |
Fergus, Jeffrey W. [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2013 |
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| Schlagwörter: |
Thermoelectric figure of merit cascaded thermoelectric devices |
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| Anmerkung: |
© TMS 2013 |
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| Übergeordnetes Werk: |
Enthalten in: Journal of electronic materials - Warrendale, Pa : TMS, 1972, 43(2013), 2 vom: 26. Nov., Seite 393-403 |
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| Übergeordnetes Werk: |
volume:43 ; year:2013 ; number:2 ; day:26 ; month:11 ; pages:393-403 |
| Links: |
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| DOI / URN: |
10.1007/s11664-013-2858-7 |
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SPR021512086 |
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| 520 | |a Abstract Selection of materials for thermoelectric devices is generally based on a figure of merit that is a function of the Seebeck coefficient, electrical conductivity, and thermal conductivity. While this figure of merit is a useful metric for comparing materials, the relative importance of the constituent properties depends on the particular application and conditions. In addition, multiple materials can be used together to improve the performance or extend the operating range, and determining the performance of such multimaterial combinations requires analysis beyond simply averaging the properties of the constituent materials. In this paper, finite-element numerical simulations under static and cyclic thermal loadings are used to investigate how device performance can be improved by judicious location of the different materials within the device. The results show that the performance of a device with two different materials can be better than that of either of the individual materials. The greatest improvement in performance occurs with cyclic heating, where the overall performance is strongly influenced by the behavior under transient conditions during heating and cooling. | ||
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| 650 | 4 | |a cascaded thermoelectric devices |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a multistage thermoelectric elements |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a segmented thermoelectric elements |7 (dpeaa)DE-He213 | |
| 700 | 1 | |a Yerkes, Kirk |4 aut | |
| 700 | 1 | |a Yost, Kevin |4 aut | |
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10.1007/s11664-013-2858-7 doi (DE-627)SPR021512086 (SPR)s11664-013-2858-7-e DE-627 ger DE-627 rakwb eng Fergus, Jeffrey W. verfasserin aut Numerical Modeling of Multimaterial Thermoelectric Devices Under Static and Cyclic Thermal Loading 2013 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © TMS 2013 Abstract Selection of materials for thermoelectric devices is generally based on a figure of merit that is a function of the Seebeck coefficient, electrical conductivity, and thermal conductivity. While this figure of merit is a useful metric for comparing materials, the relative importance of the constituent properties depends on the particular application and conditions. In addition, multiple materials can be used together to improve the performance or extend the operating range, and determining the performance of such multimaterial combinations requires analysis beyond simply averaging the properties of the constituent materials. In this paper, finite-element numerical simulations under static and cyclic thermal loadings are used to investigate how device performance can be improved by judicious location of the different materials within the device. The results show that the performance of a device with two different materials can be better than that of either of the individual materials. The greatest improvement in performance occurs with cyclic heating, where the overall performance is strongly influenced by the behavior under transient conditions during heating and cooling. Thermoelectric figure of merit (dpeaa)DE-He213 cascaded thermoelectric devices (dpeaa)DE-He213 multistage thermoelectric elements (dpeaa)DE-He213 segmented thermoelectric elements (dpeaa)DE-He213 Yerkes, Kirk aut Yost, Kevin aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 43(2013), 2 vom: 26. Nov., Seite 393-403 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:43 year:2013 number:2 day:26 month:11 pages:393-403 https://dx.doi.org/10.1007/s11664-013-2858-7 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 43 2013 2 26 11 393-403 |
| spelling |
10.1007/s11664-013-2858-7 doi (DE-627)SPR021512086 (SPR)s11664-013-2858-7-e DE-627 ger DE-627 rakwb eng Fergus, Jeffrey W. verfasserin aut Numerical Modeling of Multimaterial Thermoelectric Devices Under Static and Cyclic Thermal Loading 2013 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © TMS 2013 Abstract Selection of materials for thermoelectric devices is generally based on a figure of merit that is a function of the Seebeck coefficient, electrical conductivity, and thermal conductivity. While this figure of merit is a useful metric for comparing materials, the relative importance of the constituent properties depends on the particular application and conditions. In addition, multiple materials can be used together to improve the performance or extend the operating range, and determining the performance of such multimaterial combinations requires analysis beyond simply averaging the properties of the constituent materials. In this paper, finite-element numerical simulations under static and cyclic thermal loadings are used to investigate how device performance can be improved by judicious location of the different materials within the device. The results show that the performance of a device with two different materials can be better than that of either of the individual materials. The greatest improvement in performance occurs with cyclic heating, where the overall performance is strongly influenced by the behavior under transient conditions during heating and cooling. Thermoelectric figure of merit (dpeaa)DE-He213 cascaded thermoelectric devices (dpeaa)DE-He213 multistage thermoelectric elements (dpeaa)DE-He213 segmented thermoelectric elements (dpeaa)DE-He213 Yerkes, Kirk aut Yost, Kevin aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 43(2013), 2 vom: 26. Nov., Seite 393-403 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:43 year:2013 number:2 day:26 month:11 pages:393-403 https://dx.doi.org/10.1007/s11664-013-2858-7 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 43 2013 2 26 11 393-403 |
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10.1007/s11664-013-2858-7 doi (DE-627)SPR021512086 (SPR)s11664-013-2858-7-e DE-627 ger DE-627 rakwb eng Fergus, Jeffrey W. verfasserin aut Numerical Modeling of Multimaterial Thermoelectric Devices Under Static and Cyclic Thermal Loading 2013 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © TMS 2013 Abstract Selection of materials for thermoelectric devices is generally based on a figure of merit that is a function of the Seebeck coefficient, electrical conductivity, and thermal conductivity. While this figure of merit is a useful metric for comparing materials, the relative importance of the constituent properties depends on the particular application and conditions. In addition, multiple materials can be used together to improve the performance or extend the operating range, and determining the performance of such multimaterial combinations requires analysis beyond simply averaging the properties of the constituent materials. In this paper, finite-element numerical simulations under static and cyclic thermal loadings are used to investigate how device performance can be improved by judicious location of the different materials within the device. The results show that the performance of a device with two different materials can be better than that of either of the individual materials. The greatest improvement in performance occurs with cyclic heating, where the overall performance is strongly influenced by the behavior under transient conditions during heating and cooling. Thermoelectric figure of merit (dpeaa)DE-He213 cascaded thermoelectric devices (dpeaa)DE-He213 multistage thermoelectric elements (dpeaa)DE-He213 segmented thermoelectric elements (dpeaa)DE-He213 Yerkes, Kirk aut Yost, Kevin aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 43(2013), 2 vom: 26. Nov., Seite 393-403 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:43 year:2013 number:2 day:26 month:11 pages:393-403 https://dx.doi.org/10.1007/s11664-013-2858-7 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 43 2013 2 26 11 393-403 |
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10.1007/s11664-013-2858-7 doi (DE-627)SPR021512086 (SPR)s11664-013-2858-7-e DE-627 ger DE-627 rakwb eng Fergus, Jeffrey W. verfasserin aut Numerical Modeling of Multimaterial Thermoelectric Devices Under Static and Cyclic Thermal Loading 2013 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © TMS 2013 Abstract Selection of materials for thermoelectric devices is generally based on a figure of merit that is a function of the Seebeck coefficient, electrical conductivity, and thermal conductivity. While this figure of merit is a useful metric for comparing materials, the relative importance of the constituent properties depends on the particular application and conditions. In addition, multiple materials can be used together to improve the performance or extend the operating range, and determining the performance of such multimaterial combinations requires analysis beyond simply averaging the properties of the constituent materials. In this paper, finite-element numerical simulations under static and cyclic thermal loadings are used to investigate how device performance can be improved by judicious location of the different materials within the device. The results show that the performance of a device with two different materials can be better than that of either of the individual materials. The greatest improvement in performance occurs with cyclic heating, where the overall performance is strongly influenced by the behavior under transient conditions during heating and cooling. Thermoelectric figure of merit (dpeaa)DE-He213 cascaded thermoelectric devices (dpeaa)DE-He213 multistage thermoelectric elements (dpeaa)DE-He213 segmented thermoelectric elements (dpeaa)DE-He213 Yerkes, Kirk aut Yost, Kevin aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 43(2013), 2 vom: 26. Nov., Seite 393-403 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:43 year:2013 number:2 day:26 month:11 pages:393-403 https://dx.doi.org/10.1007/s11664-013-2858-7 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 43 2013 2 26 11 393-403 |
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10.1007/s11664-013-2858-7 doi (DE-627)SPR021512086 (SPR)s11664-013-2858-7-e DE-627 ger DE-627 rakwb eng Fergus, Jeffrey W. verfasserin aut Numerical Modeling of Multimaterial Thermoelectric Devices Under Static and Cyclic Thermal Loading 2013 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © TMS 2013 Abstract Selection of materials for thermoelectric devices is generally based on a figure of merit that is a function of the Seebeck coefficient, electrical conductivity, and thermal conductivity. While this figure of merit is a useful metric for comparing materials, the relative importance of the constituent properties depends on the particular application and conditions. In addition, multiple materials can be used together to improve the performance or extend the operating range, and determining the performance of such multimaterial combinations requires analysis beyond simply averaging the properties of the constituent materials. In this paper, finite-element numerical simulations under static and cyclic thermal loadings are used to investigate how device performance can be improved by judicious location of the different materials within the device. The results show that the performance of a device with two different materials can be better than that of either of the individual materials. The greatest improvement in performance occurs with cyclic heating, where the overall performance is strongly influenced by the behavior under transient conditions during heating and cooling. Thermoelectric figure of merit (dpeaa)DE-He213 cascaded thermoelectric devices (dpeaa)DE-He213 multistage thermoelectric elements (dpeaa)DE-He213 segmented thermoelectric elements (dpeaa)DE-He213 Yerkes, Kirk aut Yost, Kevin aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 43(2013), 2 vom: 26. Nov., Seite 393-403 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:43 year:2013 number:2 day:26 month:11 pages:393-403 https://dx.doi.org/10.1007/s11664-013-2858-7 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 43 2013 2 26 11 393-403 |
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| author |
Fergus, Jeffrey W. |
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Fergus, Jeffrey W. misc Thermoelectric figure of merit misc cascaded thermoelectric devices misc multistage thermoelectric elements misc segmented thermoelectric elements Numerical Modeling of Multimaterial Thermoelectric Devices Under Static and Cyclic Thermal Loading |
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Numerical Modeling of Multimaterial Thermoelectric Devices Under Static and Cyclic Thermal Loading Thermoelectric figure of merit (dpeaa)DE-He213 cascaded thermoelectric devices (dpeaa)DE-He213 multistage thermoelectric elements (dpeaa)DE-He213 segmented thermoelectric elements (dpeaa)DE-He213 |
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misc Thermoelectric figure of merit misc cascaded thermoelectric devices misc multistage thermoelectric elements misc segmented thermoelectric elements |
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misc Thermoelectric figure of merit misc cascaded thermoelectric devices misc multistage thermoelectric elements misc segmented thermoelectric elements |
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Numerical Modeling of Multimaterial Thermoelectric Devices Under Static and Cyclic Thermal Loading |
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Numerical Modeling of Multimaterial Thermoelectric Devices Under Static and Cyclic Thermal Loading |
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Fergus, Jeffrey W. |
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10.1007/s11664-013-2858-7 |
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numerical modeling of multimaterial thermoelectric devices under static and cyclic thermal loading |
| title_auth |
Numerical Modeling of Multimaterial Thermoelectric Devices Under Static and Cyclic Thermal Loading |
| abstract |
Abstract Selection of materials for thermoelectric devices is generally based on a figure of merit that is a function of the Seebeck coefficient, electrical conductivity, and thermal conductivity. While this figure of merit is a useful metric for comparing materials, the relative importance of the constituent properties depends on the particular application and conditions. In addition, multiple materials can be used together to improve the performance or extend the operating range, and determining the performance of such multimaterial combinations requires analysis beyond simply averaging the properties of the constituent materials. In this paper, finite-element numerical simulations under static and cyclic thermal loadings are used to investigate how device performance can be improved by judicious location of the different materials within the device. The results show that the performance of a device with two different materials can be better than that of either of the individual materials. The greatest improvement in performance occurs with cyclic heating, where the overall performance is strongly influenced by the behavior under transient conditions during heating and cooling. © TMS 2013 |
| abstractGer |
Abstract Selection of materials for thermoelectric devices is generally based on a figure of merit that is a function of the Seebeck coefficient, electrical conductivity, and thermal conductivity. While this figure of merit is a useful metric for comparing materials, the relative importance of the constituent properties depends on the particular application and conditions. In addition, multiple materials can be used together to improve the performance or extend the operating range, and determining the performance of such multimaterial combinations requires analysis beyond simply averaging the properties of the constituent materials. In this paper, finite-element numerical simulations under static and cyclic thermal loadings are used to investigate how device performance can be improved by judicious location of the different materials within the device. The results show that the performance of a device with two different materials can be better than that of either of the individual materials. The greatest improvement in performance occurs with cyclic heating, where the overall performance is strongly influenced by the behavior under transient conditions during heating and cooling. © TMS 2013 |
| abstract_unstemmed |
Abstract Selection of materials for thermoelectric devices is generally based on a figure of merit that is a function of the Seebeck coefficient, electrical conductivity, and thermal conductivity. While this figure of merit is a useful metric for comparing materials, the relative importance of the constituent properties depends on the particular application and conditions. In addition, multiple materials can be used together to improve the performance or extend the operating range, and determining the performance of such multimaterial combinations requires analysis beyond simply averaging the properties of the constituent materials. In this paper, finite-element numerical simulations under static and cyclic thermal loadings are used to investigate how device performance can be improved by judicious location of the different materials within the device. The results show that the performance of a device with two different materials can be better than that of either of the individual materials. The greatest improvement in performance occurs with cyclic heating, where the overall performance is strongly influenced by the behavior under transient conditions during heating and cooling. © TMS 2013 |
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Numerical Modeling of Multimaterial Thermoelectric Devices Under Static and Cyclic Thermal Loading |
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