Effect of Zn and Sb Additions on the Impression Creep Behavior of Lead-Free Sn-3.5Ag Solder Alloy
Abstract The effect of separate additions of 1.5 wt.% Zn and 1.5 wt.% Sb on the creep behavior of Sn-3.5 wt.% Ag lead-free solder alloy was investigated by impression testing. The tests were carried out under constant punching stresses in the range of 60–120 MPa and at temperatures in the range of 2...
Ausführliche Beschreibung
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| Autor*in: |
Pourmajidian, M. [verfasserIn] |
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| Format: |
E-Artikel |
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| Sprache: |
Englisch |
| Erschienen: |
2015 |
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| Schlagwörter: |
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| Anmerkung: |
© The Minerals, Metals & Materials Society 2015 |
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| Übergeordnetes Werk: |
Enthalten in: Journal of electronic materials - Warrendale, Pa : TMS, 1972, 45(2015), 1 vom: 17. Nov., Seite 764-770 |
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| Übergeordnetes Werk: |
volume:45 ; year:2015 ; number:1 ; day:17 ; month:11 ; pages:764-770 |
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| DOI / URN: |
10.1007/s11664-015-4197-3 |
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SPR021525285 |
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| 520 | |a Abstract The effect of separate additions of 1.5 wt.% Zn and 1.5 wt.% Sb on the creep behavior of Sn-3.5 wt.% Ag lead-free solder alloy was investigated by impression testing. The tests were carried out under constant punching stresses in the range of 60–120 MPa and at temperatures in the range of 298–370 K. Both of the ternary alloys showed creep resistances higher than that of the eutectic binary Sn-3.5Ag alloy. The superior creep resistance of the ternary Sn-3.5Ag-1.5Sb alloy is attributed to the strong solid solutioning effect of antimony in the tin matrix, while the formation of AgZn particles and refinement of the $ Ag_{3} $Sn precipitates account for the higher creep resistance of the Sn-3.5Ag-1.5Zn alloy. The average stress exponents of 8.2, 8.5, and 8.6 and activation energies of 47.4 kJ $ mol^{−1} $, 45.3 kJ $ mol^{−1,} $ , and 43.3 kJ $ mol^{−1} $ were obtained for Sn-3.5Ag, Sn-3.5Ag-1.5Zn, and Sn-3.5Ag-1.5Sb, respectively. These activation energies are close to 46 kJ $ mol^{−1} $ for dislocation pipe diffusion of tin. This, together with the stress exponents of 8.2–8.6, suggests that dislocation climb controlled by dislocation pipe diffusion is the predominant creep mechanism in these alloys. | ||
| 650 | 4 | |a Lead-free solder |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a impression creep |7 (dpeaa)DE-He213 | |
| 650 | 4 | |a creep mechanism |7 (dpeaa)DE-He213 | |
| 700 | 1 | |a Mahmudi, R. |4 aut | |
| 700 | 1 | |a Geranmayeh, A. R. |4 aut | |
| 700 | 1 | |a Hashemizadeh, S. |4 aut | |
| 700 | 1 | |a Gorgannejad, S. |4 aut | |
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10.1007/s11664-015-4197-3 doi (DE-627)SPR021525285 (SPR)s11664-015-4197-3-e DE-627 ger DE-627 rakwb eng Pourmajidian, M. verfasserin aut Effect of Zn and Sb Additions on the Impression Creep Behavior of Lead-Free Sn-3.5Ag Solder Alloy 2015 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society 2015 Abstract The effect of separate additions of 1.5 wt.% Zn and 1.5 wt.% Sb on the creep behavior of Sn-3.5 wt.% Ag lead-free solder alloy was investigated by impression testing. The tests were carried out under constant punching stresses in the range of 60–120 MPa and at temperatures in the range of 298–370 K. Both of the ternary alloys showed creep resistances higher than that of the eutectic binary Sn-3.5Ag alloy. The superior creep resistance of the ternary Sn-3.5Ag-1.5Sb alloy is attributed to the strong solid solutioning effect of antimony in the tin matrix, while the formation of AgZn particles and refinement of the $ Ag_{3} $Sn precipitates account for the higher creep resistance of the Sn-3.5Ag-1.5Zn alloy. The average stress exponents of 8.2, 8.5, and 8.6 and activation energies of 47.4 kJ $ mol^{−1} $, 45.3 kJ $ mol^{−1,} $ , and 43.3 kJ $ mol^{−1} $ were obtained for Sn-3.5Ag, Sn-3.5Ag-1.5Zn, and Sn-3.5Ag-1.5Sb, respectively. These activation energies are close to 46 kJ $ mol^{−1} $ for dislocation pipe diffusion of tin. This, together with the stress exponents of 8.2–8.6, suggests that dislocation climb controlled by dislocation pipe diffusion is the predominant creep mechanism in these alloys. Lead-free solder (dpeaa)DE-He213 impression creep (dpeaa)DE-He213 creep mechanism (dpeaa)DE-He213 Mahmudi, R. aut Geranmayeh, A. R. aut Hashemizadeh, S. aut Gorgannejad, S. aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 45(2015), 1 vom: 17. Nov., Seite 764-770 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:45 year:2015 number:1 day:17 month:11 pages:764-770 https://dx.doi.org/10.1007/s11664-015-4197-3 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 45 2015 1 17 11 764-770 |
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10.1007/s11664-015-4197-3 doi (DE-627)SPR021525285 (SPR)s11664-015-4197-3-e DE-627 ger DE-627 rakwb eng Pourmajidian, M. verfasserin aut Effect of Zn and Sb Additions on the Impression Creep Behavior of Lead-Free Sn-3.5Ag Solder Alloy 2015 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society 2015 Abstract The effect of separate additions of 1.5 wt.% Zn and 1.5 wt.% Sb on the creep behavior of Sn-3.5 wt.% Ag lead-free solder alloy was investigated by impression testing. The tests were carried out under constant punching stresses in the range of 60–120 MPa and at temperatures in the range of 298–370 K. Both of the ternary alloys showed creep resistances higher than that of the eutectic binary Sn-3.5Ag alloy. The superior creep resistance of the ternary Sn-3.5Ag-1.5Sb alloy is attributed to the strong solid solutioning effect of antimony in the tin matrix, while the formation of AgZn particles and refinement of the $ Ag_{3} $Sn precipitates account for the higher creep resistance of the Sn-3.5Ag-1.5Zn alloy. The average stress exponents of 8.2, 8.5, and 8.6 and activation energies of 47.4 kJ $ mol^{−1} $, 45.3 kJ $ mol^{−1,} $ , and 43.3 kJ $ mol^{−1} $ were obtained for Sn-3.5Ag, Sn-3.5Ag-1.5Zn, and Sn-3.5Ag-1.5Sb, respectively. These activation energies are close to 46 kJ $ mol^{−1} $ for dislocation pipe diffusion of tin. This, together with the stress exponents of 8.2–8.6, suggests that dislocation climb controlled by dislocation pipe diffusion is the predominant creep mechanism in these alloys. Lead-free solder (dpeaa)DE-He213 impression creep (dpeaa)DE-He213 creep mechanism (dpeaa)DE-He213 Mahmudi, R. aut Geranmayeh, A. R. aut Hashemizadeh, S. aut Gorgannejad, S. aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 45(2015), 1 vom: 17. Nov., Seite 764-770 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:45 year:2015 number:1 day:17 month:11 pages:764-770 https://dx.doi.org/10.1007/s11664-015-4197-3 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 45 2015 1 17 11 764-770 |
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10.1007/s11664-015-4197-3 doi (DE-627)SPR021525285 (SPR)s11664-015-4197-3-e DE-627 ger DE-627 rakwb eng Pourmajidian, M. verfasserin aut Effect of Zn and Sb Additions on the Impression Creep Behavior of Lead-Free Sn-3.5Ag Solder Alloy 2015 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society 2015 Abstract The effect of separate additions of 1.5 wt.% Zn and 1.5 wt.% Sb on the creep behavior of Sn-3.5 wt.% Ag lead-free solder alloy was investigated by impression testing. The tests were carried out under constant punching stresses in the range of 60–120 MPa and at temperatures in the range of 298–370 K. Both of the ternary alloys showed creep resistances higher than that of the eutectic binary Sn-3.5Ag alloy. The superior creep resistance of the ternary Sn-3.5Ag-1.5Sb alloy is attributed to the strong solid solutioning effect of antimony in the tin matrix, while the formation of AgZn particles and refinement of the $ Ag_{3} $Sn precipitates account for the higher creep resistance of the Sn-3.5Ag-1.5Zn alloy. The average stress exponents of 8.2, 8.5, and 8.6 and activation energies of 47.4 kJ $ mol^{−1} $, 45.3 kJ $ mol^{−1,} $ , and 43.3 kJ $ mol^{−1} $ were obtained for Sn-3.5Ag, Sn-3.5Ag-1.5Zn, and Sn-3.5Ag-1.5Sb, respectively. These activation energies are close to 46 kJ $ mol^{−1} $ for dislocation pipe diffusion of tin. This, together with the stress exponents of 8.2–8.6, suggests that dislocation climb controlled by dislocation pipe diffusion is the predominant creep mechanism in these alloys. Lead-free solder (dpeaa)DE-He213 impression creep (dpeaa)DE-He213 creep mechanism (dpeaa)DE-He213 Mahmudi, R. aut Geranmayeh, A. R. aut Hashemizadeh, S. aut Gorgannejad, S. aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 45(2015), 1 vom: 17. Nov., Seite 764-770 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:45 year:2015 number:1 day:17 month:11 pages:764-770 https://dx.doi.org/10.1007/s11664-015-4197-3 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 45 2015 1 17 11 764-770 |
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10.1007/s11664-015-4197-3 doi (DE-627)SPR021525285 (SPR)s11664-015-4197-3-e DE-627 ger DE-627 rakwb eng Pourmajidian, M. verfasserin aut Effect of Zn and Sb Additions on the Impression Creep Behavior of Lead-Free Sn-3.5Ag Solder Alloy 2015 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society 2015 Abstract The effect of separate additions of 1.5 wt.% Zn and 1.5 wt.% Sb on the creep behavior of Sn-3.5 wt.% Ag lead-free solder alloy was investigated by impression testing. The tests were carried out under constant punching stresses in the range of 60–120 MPa and at temperatures in the range of 298–370 K. Both of the ternary alloys showed creep resistances higher than that of the eutectic binary Sn-3.5Ag alloy. The superior creep resistance of the ternary Sn-3.5Ag-1.5Sb alloy is attributed to the strong solid solutioning effect of antimony in the tin matrix, while the formation of AgZn particles and refinement of the $ Ag_{3} $Sn precipitates account for the higher creep resistance of the Sn-3.5Ag-1.5Zn alloy. The average stress exponents of 8.2, 8.5, and 8.6 and activation energies of 47.4 kJ $ mol^{−1} $, 45.3 kJ $ mol^{−1,} $ , and 43.3 kJ $ mol^{−1} $ were obtained for Sn-3.5Ag, Sn-3.5Ag-1.5Zn, and Sn-3.5Ag-1.5Sb, respectively. These activation energies are close to 46 kJ $ mol^{−1} $ for dislocation pipe diffusion of tin. This, together with the stress exponents of 8.2–8.6, suggests that dislocation climb controlled by dislocation pipe diffusion is the predominant creep mechanism in these alloys. Lead-free solder (dpeaa)DE-He213 impression creep (dpeaa)DE-He213 creep mechanism (dpeaa)DE-He213 Mahmudi, R. aut Geranmayeh, A. R. aut Hashemizadeh, S. aut Gorgannejad, S. aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 45(2015), 1 vom: 17. Nov., Seite 764-770 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:45 year:2015 number:1 day:17 month:11 pages:764-770 https://dx.doi.org/10.1007/s11664-015-4197-3 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 45 2015 1 17 11 764-770 |
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10.1007/s11664-015-4197-3 doi (DE-627)SPR021525285 (SPR)s11664-015-4197-3-e DE-627 ger DE-627 rakwb eng Pourmajidian, M. verfasserin aut Effect of Zn and Sb Additions on the Impression Creep Behavior of Lead-Free Sn-3.5Ag Solder Alloy 2015 Text txt rdacontent Computermedien c rdamedia Online-Ressource cr rdacarrier © The Minerals, Metals & Materials Society 2015 Abstract The effect of separate additions of 1.5 wt.% Zn and 1.5 wt.% Sb on the creep behavior of Sn-3.5 wt.% Ag lead-free solder alloy was investigated by impression testing. The tests were carried out under constant punching stresses in the range of 60–120 MPa and at temperatures in the range of 298–370 K. Both of the ternary alloys showed creep resistances higher than that of the eutectic binary Sn-3.5Ag alloy. The superior creep resistance of the ternary Sn-3.5Ag-1.5Sb alloy is attributed to the strong solid solutioning effect of antimony in the tin matrix, while the formation of AgZn particles and refinement of the $ Ag_{3} $Sn precipitates account for the higher creep resistance of the Sn-3.5Ag-1.5Zn alloy. The average stress exponents of 8.2, 8.5, and 8.6 and activation energies of 47.4 kJ $ mol^{−1} $, 45.3 kJ $ mol^{−1,} $ , and 43.3 kJ $ mol^{−1} $ were obtained for Sn-3.5Ag, Sn-3.5Ag-1.5Zn, and Sn-3.5Ag-1.5Sb, respectively. These activation energies are close to 46 kJ $ mol^{−1} $ for dislocation pipe diffusion of tin. This, together with the stress exponents of 8.2–8.6, suggests that dislocation climb controlled by dislocation pipe diffusion is the predominant creep mechanism in these alloys. Lead-free solder (dpeaa)DE-He213 impression creep (dpeaa)DE-He213 creep mechanism (dpeaa)DE-He213 Mahmudi, R. aut Geranmayeh, A. R. aut Hashemizadeh, S. aut Gorgannejad, S. aut Enthalten in Journal of electronic materials Warrendale, Pa : TMS, 1972 45(2015), 1 vom: 17. Nov., Seite 764-770 (DE-627)324918739 (DE-600)2032868-0 1543-186X nnns volume:45 year:2015 number:1 day:17 month:11 pages:764-770 https://dx.doi.org/10.1007/s11664-015-4197-3 lizenzpflichtig Volltext GBV_USEFLAG_A SYSFLAG_A GBV_SPRINGER GBV_ILN_11 GBV_ILN_20 GBV_ILN_22 GBV_ILN_23 GBV_ILN_24 GBV_ILN_31 GBV_ILN_32 GBV_ILN_39 GBV_ILN_40 GBV_ILN_60 GBV_ILN_62 GBV_ILN_63 GBV_ILN_65 GBV_ILN_69 GBV_ILN_70 GBV_ILN_73 GBV_ILN_74 GBV_ILN_90 GBV_ILN_95 GBV_ILN_100 GBV_ILN_105 GBV_ILN_110 GBV_ILN_120 GBV_ILN_138 GBV_ILN_150 GBV_ILN_151 GBV_ILN_152 GBV_ILN_161 GBV_ILN_170 GBV_ILN_171 GBV_ILN_187 GBV_ILN_213 GBV_ILN_224 GBV_ILN_230 GBV_ILN_250 GBV_ILN_281 GBV_ILN_285 GBV_ILN_293 GBV_ILN_370 GBV_ILN_602 GBV_ILN_636 GBV_ILN_702 GBV_ILN_2001 GBV_ILN_2003 GBV_ILN_2004 GBV_ILN_2005 GBV_ILN_2006 GBV_ILN_2007 GBV_ILN_2008 GBV_ILN_2009 GBV_ILN_2010 GBV_ILN_2011 GBV_ILN_2014 GBV_ILN_2015 GBV_ILN_2020 GBV_ILN_2021 GBV_ILN_2025 GBV_ILN_2026 GBV_ILN_2027 GBV_ILN_2031 GBV_ILN_2034 GBV_ILN_2037 GBV_ILN_2038 GBV_ILN_2039 GBV_ILN_2044 GBV_ILN_2048 GBV_ILN_2049 GBV_ILN_2050 GBV_ILN_2055 GBV_ILN_2057 GBV_ILN_2059 GBV_ILN_2061 GBV_ILN_2064 GBV_ILN_2065 GBV_ILN_2068 GBV_ILN_2070 GBV_ILN_2086 GBV_ILN_2088 GBV_ILN_2093 GBV_ILN_2106 GBV_ILN_2107 GBV_ILN_2108 GBV_ILN_2110 GBV_ILN_2111 GBV_ILN_2112 GBV_ILN_2113 GBV_ILN_2116 GBV_ILN_2118 GBV_ILN_2119 GBV_ILN_2122 GBV_ILN_2129 GBV_ILN_2143 GBV_ILN_2144 GBV_ILN_2147 GBV_ILN_2148 GBV_ILN_2152 GBV_ILN_2153 GBV_ILN_2188 GBV_ILN_2190 GBV_ILN_2232 GBV_ILN_2336 GBV_ILN_2446 GBV_ILN_2470 GBV_ILN_2472 GBV_ILN_2507 GBV_ILN_2522 GBV_ILN_2548 GBV_ILN_4035 GBV_ILN_4037 GBV_ILN_4046 GBV_ILN_4112 GBV_ILN_4125 GBV_ILN_4242 GBV_ILN_4246 GBV_ILN_4249 GBV_ILN_4251 GBV_ILN_4305 GBV_ILN_4306 GBV_ILN_4307 GBV_ILN_4313 GBV_ILN_4322 GBV_ILN_4323 GBV_ILN_4324 GBV_ILN_4325 GBV_ILN_4326 GBV_ILN_4328 GBV_ILN_4333 GBV_ILN_4334 GBV_ILN_4335 GBV_ILN_4336 GBV_ILN_4338 GBV_ILN_4393 GBV_ILN_4700 AR 45 2015 1 17 11 764-770 |
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Pourmajidian, M. @@aut@@ Mahmudi, R. @@aut@@ Geranmayeh, A. R. @@aut@@ Hashemizadeh, S. @@aut@@ Gorgannejad, S. @@aut@@ |
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<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01000caa a22002652 4500</leader><controlfield tag="001">SPR021525285</controlfield><controlfield tag="003">DE-627</controlfield><controlfield tag="005">20230331055119.0</controlfield><controlfield tag="007">cr uuu---uuuuu</controlfield><controlfield tag="008">201006s2015 xx |||||o 00| ||eng c</controlfield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/s11664-015-4197-3</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-627)SPR021525285</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(SPR)s11664-015-4197-3-e</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-627</subfield><subfield code="b">ger</subfield><subfield code="c">DE-627</subfield><subfield code="e">rakwb</subfield></datafield><datafield tag="041" ind1=" " ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Pourmajidian, M.</subfield><subfield code="e">verfasserin</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Effect of Zn and Sb Additions on the Impression Creep Behavior of Lead-Free Sn-3.5Ag Solder Alloy</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="c">2015</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="a">Text</subfield><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="a">Computermedien</subfield><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="a">Online-Ressource</subfield><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">© The Minerals, Metals & Materials Society 2015</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Abstract The effect of separate additions of 1.5 wt.% Zn and 1.5 wt.% Sb on the creep behavior of Sn-3.5 wt.% Ag lead-free solder alloy was investigated by impression testing. The tests were carried out under constant punching stresses in the range of 60–120 MPa and at temperatures in the range of 298–370 K. Both of the ternary alloys showed creep resistances higher than that of the eutectic binary Sn-3.5Ag alloy. The superior creep resistance of the ternary Sn-3.5Ag-1.5Sb alloy is attributed to the strong solid solutioning effect of antimony in the tin matrix, while the formation of AgZn particles and refinement of the $ Ag_{3} $Sn precipitates account for the higher creep resistance of the Sn-3.5Ag-1.5Zn alloy. The average stress exponents of 8.2, 8.5, and 8.6 and activation energies of 47.4 kJ $ mol^{−1} $, 45.3 kJ $ mol^{−1,} $ , and 43.3 kJ $ mol^{−1} $ were obtained for Sn-3.5Ag, Sn-3.5Ag-1.5Zn, and Sn-3.5Ag-1.5Sb, respectively. These activation energies are close to 46 kJ $ mol^{−1} $ for dislocation pipe diffusion of tin. 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Pourmajidian, M. |
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Pourmajidian, M. misc Lead-free solder misc impression creep misc creep mechanism Effect of Zn and Sb Additions on the Impression Creep Behavior of Lead-Free Sn-3.5Ag Solder Alloy |
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Effect of Zn and Sb Additions on the Impression Creep Behavior of Lead-Free Sn-3.5Ag Solder Alloy Lead-free solder (dpeaa)DE-He213 impression creep (dpeaa)DE-He213 creep mechanism (dpeaa)DE-He213 |
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Effect of Zn and Sb Additions on the Impression Creep Behavior of Lead-Free Sn-3.5Ag Solder Alloy |
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Effect of Zn and Sb Additions on the Impression Creep Behavior of Lead-Free Sn-3.5Ag Solder Alloy |
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Pourmajidian, M. Mahmudi, R. Geranmayeh, A. R. Hashemizadeh, S. Gorgannejad, S. |
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Pourmajidian, M. |
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10.1007/s11664-015-4197-3 |
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effect of zn and sb additions on the impression creep behavior of lead-free sn-3.5ag solder alloy |
| title_auth |
Effect of Zn and Sb Additions on the Impression Creep Behavior of Lead-Free Sn-3.5Ag Solder Alloy |
| abstract |
Abstract The effect of separate additions of 1.5 wt.% Zn and 1.5 wt.% Sb on the creep behavior of Sn-3.5 wt.% Ag lead-free solder alloy was investigated by impression testing. The tests were carried out under constant punching stresses in the range of 60–120 MPa and at temperatures in the range of 298–370 K. Both of the ternary alloys showed creep resistances higher than that of the eutectic binary Sn-3.5Ag alloy. The superior creep resistance of the ternary Sn-3.5Ag-1.5Sb alloy is attributed to the strong solid solutioning effect of antimony in the tin matrix, while the formation of AgZn particles and refinement of the $ Ag_{3} $Sn precipitates account for the higher creep resistance of the Sn-3.5Ag-1.5Zn alloy. The average stress exponents of 8.2, 8.5, and 8.6 and activation energies of 47.4 kJ $ mol^{−1} $, 45.3 kJ $ mol^{−1,} $ , and 43.3 kJ $ mol^{−1} $ were obtained for Sn-3.5Ag, Sn-3.5Ag-1.5Zn, and Sn-3.5Ag-1.5Sb, respectively. These activation energies are close to 46 kJ $ mol^{−1} $ for dislocation pipe diffusion of tin. This, together with the stress exponents of 8.2–8.6, suggests that dislocation climb controlled by dislocation pipe diffusion is the predominant creep mechanism in these alloys. © The Minerals, Metals & Materials Society 2015 |
| abstractGer |
Abstract The effect of separate additions of 1.5 wt.% Zn and 1.5 wt.% Sb on the creep behavior of Sn-3.5 wt.% Ag lead-free solder alloy was investigated by impression testing. The tests were carried out under constant punching stresses in the range of 60–120 MPa and at temperatures in the range of 298–370 K. Both of the ternary alloys showed creep resistances higher than that of the eutectic binary Sn-3.5Ag alloy. The superior creep resistance of the ternary Sn-3.5Ag-1.5Sb alloy is attributed to the strong solid solutioning effect of antimony in the tin matrix, while the formation of AgZn particles and refinement of the $ Ag_{3} $Sn precipitates account for the higher creep resistance of the Sn-3.5Ag-1.5Zn alloy. The average stress exponents of 8.2, 8.5, and 8.6 and activation energies of 47.4 kJ $ mol^{−1} $, 45.3 kJ $ mol^{−1,} $ , and 43.3 kJ $ mol^{−1} $ were obtained for Sn-3.5Ag, Sn-3.5Ag-1.5Zn, and Sn-3.5Ag-1.5Sb, respectively. These activation energies are close to 46 kJ $ mol^{−1} $ for dislocation pipe diffusion of tin. This, together with the stress exponents of 8.2–8.6, suggests that dislocation climb controlled by dislocation pipe diffusion is the predominant creep mechanism in these alloys. © The Minerals, Metals & Materials Society 2015 |
| abstract_unstemmed |
Abstract The effect of separate additions of 1.5 wt.% Zn and 1.5 wt.% Sb on the creep behavior of Sn-3.5 wt.% Ag lead-free solder alloy was investigated by impression testing. The tests were carried out under constant punching stresses in the range of 60–120 MPa and at temperatures in the range of 298–370 K. Both of the ternary alloys showed creep resistances higher than that of the eutectic binary Sn-3.5Ag alloy. The superior creep resistance of the ternary Sn-3.5Ag-1.5Sb alloy is attributed to the strong solid solutioning effect of antimony in the tin matrix, while the formation of AgZn particles and refinement of the $ Ag_{3} $Sn precipitates account for the higher creep resistance of the Sn-3.5Ag-1.5Zn alloy. The average stress exponents of 8.2, 8.5, and 8.6 and activation energies of 47.4 kJ $ mol^{−1} $, 45.3 kJ $ mol^{−1,} $ , and 43.3 kJ $ mol^{−1} $ were obtained for Sn-3.5Ag, Sn-3.5Ag-1.5Zn, and Sn-3.5Ag-1.5Sb, respectively. These activation energies are close to 46 kJ $ mol^{−1} $ for dislocation pipe diffusion of tin. This, together with the stress exponents of 8.2–8.6, suggests that dislocation climb controlled by dislocation pipe diffusion is the predominant creep mechanism in these alloys. © The Minerals, Metals & Materials Society 2015 |
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Effect of Zn and Sb Additions on the Impression Creep Behavior of Lead-Free Sn-3.5Ag Solder Alloy |
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https://dx.doi.org/10.1007/s11664-015-4197-3 |
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Mahmudi, R. Geranmayeh, A. R. Hashemizadeh, S. Gorgannejad, S. |
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10.1007/s11664-015-4197-3 |
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| score |
7.3985004 |